JP4692024B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
- Publication number
- JP4692024B2 JP4692024B2 JP2005060129A JP2005060129A JP4692024B2 JP 4692024 B2 JP4692024 B2 JP 4692024B2 JP 2005060129 A JP2005060129 A JP 2005060129A JP 2005060129 A JP2005060129 A JP 2005060129A JP 4692024 B2 JP4692024 B2 JP 4692024B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric substrate
- electrode
- acoustic wave
- surface acoustic
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 5
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
以下、実施の形態1を用いて、本発明について説明する。
12 櫛形電極
13 パッド
14 蓋体
15 金属層
16 スルーホール
17 外部端子
21 第1の基板
22 櫛形電極
23 パッド
24 第2の基板
25a 第1の金属層
25b 第2の金属層
26 スルーホール
27 外部端子
28a、28b ダミーパターン
Claims (2)
- 異方性単結晶よりなる圧電基板と、この圧電基板上に設けられた櫛型電極およびパッド電極と、このパッド電極の直下において前記圧電基板を貫通して設けられたスルーホールと、このスルーホールに接続された外部端子と、前記圧電基板上において前記櫛形電極と前記パッド電極を囲む包囲層と、前記櫛型電極の上方に振動空間を隔て、前記包囲層を介して前記圧電基板に接合された蓋体とを備え、前記蓋体の材質は圧電基板と同じものを用い、前記蓋体の前記パッド電極に対面する位置に電極を設け、この電極と前記パッド電極とを接合した弾性表面波デバイス。
- スルーホールを設けた圧電基板の厚さを蓋体の厚さよりも薄くした請求項1記載の弾性表面波デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005060129A JP4692024B2 (ja) | 2005-03-04 | 2005-03-04 | 弾性表面波デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005060129A JP4692024B2 (ja) | 2005-03-04 | 2005-03-04 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006246112A JP2006246112A (ja) | 2006-09-14 |
JP4692024B2 true JP4692024B2 (ja) | 2011-06-01 |
Family
ID=37052038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005060129A Active JP4692024B2 (ja) | 2005-03-04 | 2005-03-04 | 弾性表面波デバイス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4692024B2 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009278422A (ja) * | 2008-05-15 | 2009-11-26 | Hitachi Media Electoronics Co Ltd | 弾性表面波デバイス及びその製造方法 |
JP4664397B2 (ja) | 2008-06-24 | 2011-04-06 | 日本電波工業株式会社 | 圧電部品及びその製造方法 |
JP4689704B2 (ja) | 2008-07-23 | 2011-05-25 | 日本電波工業株式会社 | 圧電部品及びその製造方法 |
JP4638530B2 (ja) * | 2008-08-19 | 2011-02-23 | 日本電波工業株式会社 | 圧電部品及びその製造方法 |
JP5338396B2 (ja) * | 2009-03-12 | 2013-11-13 | パナソニック株式会社 | 弾性表面波デバイスの製造方法 |
JP5406108B2 (ja) * | 2010-04-12 | 2014-02-05 | 太陽誘電株式会社 | 弾性波デバイス及びその製造方法 |
CN103824932A (zh) | 2012-11-15 | 2014-05-28 | 日本电波工业株式会社 | 压电零件 |
CN105448869A (zh) | 2014-07-31 | 2016-03-30 | 天工方案公司 | 多层瞬态液相接合 |
JP6397352B2 (ja) | 2015-02-19 | 2018-09-26 | 太陽誘電株式会社 | 弾性波デバイス |
JP6544153B2 (ja) * | 2015-09-02 | 2019-07-17 | 株式会社村田製作所 | 電子部品素子及び電子部品 |
JP6509147B2 (ja) | 2016-02-29 | 2019-05-08 | 太陽誘電株式会社 | 電子デバイス |
JP6315716B2 (ja) | 2016-03-17 | 2018-04-25 | 太陽誘電株式会社 | 弾性波デバイス |
JP6454299B2 (ja) | 2016-05-13 | 2019-01-16 | 太陽誘電株式会社 | 弾性波デバイス |
US10965269B2 (en) * | 2016-12-02 | 2021-03-30 | Skyworks Solutions, Inc. | Electronic devices formed in a cavity between substrates and including a via |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094388A (ja) * | 1999-09-17 | 2001-04-06 | Seiko Epson Corp | Sawデバイス及びその製造方法 |
JP2001102905A (ja) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | 弾性表面波装置 |
JP2002290193A (ja) * | 2001-03-26 | 2002-10-04 | Seiko Epson Corp | 弾性表面波装置とその製造方法 |
JP2003188294A (ja) * | 2001-12-21 | 2003-07-04 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JP2004080221A (ja) * | 2002-08-13 | 2004-03-11 | Fujitsu Media Device Kk | 弾性波デバイス及びその製造方法 |
JP2004214469A (ja) * | 2003-01-07 | 2004-07-29 | Hitachi Ltd | 電子デバイスおよびその製造方法 |
JP2004304622A (ja) * | 2003-03-31 | 2004-10-28 | Fujitsu Media Device Kk | 弾性表面波デバイス及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6438821A (en) * | 1987-08-05 | 1989-02-09 | Nec Corp | Magnetic card reader |
JPH0349310A (ja) * | 1989-07-17 | 1991-03-04 | Murata Mfg Co Ltd | 弾性表面波デバイス |
JPH04293310A (ja) * | 1991-03-22 | 1992-10-16 | Murata Mfg Co Ltd | 弾性表面波装置 |
JPH06350376A (ja) * | 1993-01-25 | 1994-12-22 | Matsushita Electric Ind Co Ltd | 気密封止された圧電デバイスおよび気密封止パッケージ |
JPH09246906A (ja) * | 1996-03-12 | 1997-09-19 | Seiko Epson Corp | 弾性表面波素子及びその周波数調整方法並びに電子機器 |
JPH10163789A (ja) * | 1996-11-25 | 1998-06-19 | Sanyo Electric Co Ltd | 弾性表面波素子 |
-
2005
- 2005-03-04 JP JP2005060129A patent/JP4692024B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094388A (ja) * | 1999-09-17 | 2001-04-06 | Seiko Epson Corp | Sawデバイス及びその製造方法 |
JP2001102905A (ja) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | 弾性表面波装置 |
JP2002290193A (ja) * | 2001-03-26 | 2002-10-04 | Seiko Epson Corp | 弾性表面波装置とその製造方法 |
JP2003188294A (ja) * | 2001-12-21 | 2003-07-04 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JP2004080221A (ja) * | 2002-08-13 | 2004-03-11 | Fujitsu Media Device Kk | 弾性波デバイス及びその製造方法 |
JP2004214469A (ja) * | 2003-01-07 | 2004-07-29 | Hitachi Ltd | 電子デバイスおよびその製造方法 |
JP2004304622A (ja) * | 2003-03-31 | 2004-10-28 | Fujitsu Media Device Kk | 弾性表面波デバイス及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006246112A (ja) | 2006-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4692024B2 (ja) | 弾性表面波デバイス | |
JP4460612B2 (ja) | 弾性表面波デバイス及びその製造方法 | |
JP6242597B2 (ja) | 弾性波デバイス及びその製造方法 | |
JP5056837B2 (ja) | 圧電デバイスの製造方法 | |
JP4697232B2 (ja) | 弾性表面波装置の製造方法及び弾性表面波装置 | |
JP2008060382A (ja) | 電子部品及びその製造方法 | |
JP6397352B2 (ja) | 弾性波デバイス | |
JP5538974B2 (ja) | 電子デバイスパッケージの製造方法及び電子デバイスパッケージ | |
WO2004012331A1 (ja) | 圧電部品およびその製造方法 | |
JP2006339943A (ja) | 圧電デバイス | |
JP2009117544A (ja) | 電子部品 | |
JP5269301B2 (ja) | 弾性表面波装置 | |
JP4554398B2 (ja) | 弾性表面波デバイス及び弾性表面波デバイスの製造方法 | |
TWI538268B (zh) | 用來連接一第一電子元件及一第二元件之方法 | |
JP2006245994A5 (ja) | ||
JP2009130665A (ja) | 圧電発振器 | |
JP4496652B2 (ja) | 弾性表面波装置とその製造方法 | |
US7550902B2 (en) | Electronic component device | |
JP4724518B2 (ja) | 圧電発振器 | |
JP5252007B2 (ja) | 電子部品の製造方法 | |
JP2006311310A (ja) | 圧電振動子 | |
JP2009159001A (ja) | 弾性表面波デバイス | |
JP2001257236A (ja) | 電子デバイスの製造方法 | |
JP2000353934A (ja) | 弾性表面波装置 | |
WO2021100506A1 (ja) | 電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080121 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20080213 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20091120 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100816 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100824 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101004 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101224 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110125 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110207 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140304 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4692024 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |