JP2018085413A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2018085413A JP2018085413A JP2016227019A JP2016227019A JP2018085413A JP 2018085413 A JP2018085413 A JP 2018085413A JP 2016227019 A JP2016227019 A JP 2016227019A JP 2016227019 A JP2016227019 A JP 2016227019A JP 2018085413 A JP2018085413 A JP 2018085413A
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Abstract
Description
2 半導体基板
2A 表面
2B 半導体層
3 半導体素子
4,22,24 第1金属層
6,23,25 絶縁膜層(無機物絶縁層)
7,26 有機物層(有機物絶縁層)
8,27 第2金属層(外部接続用)
10,29,31,32 パッチ部
10A,29A 底面
10B,29B 上面
Claims (4)
- 半導体基板の表面に第1金属層、無機物絶縁層、有機物絶縁層および第2金属層が積層された半導体装置において、
前記有機物絶縁層には、スルーホールまたは有底穴からなる凹部が形成され、
前記半導体基板の表面から前記有機物絶縁層の凹部までの厚さ方向のいずれかの部位には、前記凹部の底面を隆起させるパッチ部が形成され、
前記パッチ部は、底面の面積が上面の面積よりも大きい断面台形状に形成されたことを特徴とする半導体装置。 - 前記パッチ部は、断面台形状の底辺と斜辺とがなす傾斜角度が20°以上で70°以下に設定されてなる請求項1に記載の半導体装置。
- 前記凹部はスルーホールによって形成され、
前記パッチ部は、前記スルーホールの開口面積よりも大きな面積をもった底面を有してなる請求項1または2に記載の半導体装置。 - 前記第2金属層は、前記有機物絶縁層の凹部と対応した位置で表面側が露出した電極パッドを有してなる請求項1ないし3のいずれかに記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016227019A JP6690509B2 (ja) | 2016-11-22 | 2016-11-22 | 半導体装置 |
TW106139320A TWI653689B (zh) | 2016-11-22 | 2017-11-14 | 半導體裝置 |
US15/814,833 US10121746B2 (en) | 2016-11-22 | 2017-11-16 | Semiconductor device |
CN201711172097.4A CN108091628B (zh) | 2016-11-22 | 2017-11-22 | 半导体装置 |
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JP2016227019A JP6690509B2 (ja) | 2016-11-22 | 2016-11-22 | 半導体装置 |
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JP2018085413A true JP2018085413A (ja) | 2018-05-31 |
JP6690509B2 JP6690509B2 (ja) | 2020-04-28 |
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JP2016227019A Active JP6690509B2 (ja) | 2016-11-22 | 2016-11-22 | 半導体装置 |
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US (1) | US10121746B2 (ja) |
JP (1) | JP6690509B2 (ja) |
CN (1) | CN108091628B (ja) |
TW (1) | TWI653689B (ja) |
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JP7226472B2 (ja) * | 2020-05-26 | 2023-02-21 | 株式会社村田製作所 | 部品相互接続要素を備えた電子部品 |
US11469195B2 (en) * | 2020-09-24 | 2022-10-11 | Nanya Technology Corporation | Semiconductor device with tilted insulating layers and method for fabricating the same |
Citations (10)
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JPS6342144A (ja) * | 1986-08-08 | 1988-02-23 | Hitachi Ltd | 多層配線構造体 |
JPS6352444A (ja) * | 1986-08-22 | 1988-03-05 | Toshiba Corp | 半導体集積回路装置とその製造方法 |
JPH04127452A (ja) * | 1989-06-30 | 1992-04-28 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JPH06204277A (ja) * | 1992-09-10 | 1994-07-22 | Texas Instr Inc <Ti> | ワイヤボンディングの方法およびそれにより作られた集積回路デバイス |
JPH08139094A (ja) * | 1994-11-14 | 1996-05-31 | Citizen Watch Co Ltd | 半導体装置の製造方法 |
JPH08255833A (ja) * | 1995-03-15 | 1996-10-01 | Sony Corp | 半導体装置の製造方法 |
JP2004282034A (ja) * | 2003-02-28 | 2004-10-07 | Seiko Epson Corp | 半導体装置及びその製造方法 |
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US10121746B2 (en) | 2018-11-06 |
CN108091628A (zh) | 2018-05-29 |
US20180145028A1 (en) | 2018-05-24 |
TWI653689B (zh) | 2019-03-11 |
CN108091628B (zh) | 2021-10-08 |
JP6690509B2 (ja) | 2020-04-28 |
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