JP2018012837A - 難燃性樹脂組成物、熱硬化性樹脂組成物、複合金属基板及び難燃性電子材料 - Google Patents
難燃性樹脂組成物、熱硬化性樹脂組成物、複合金属基板及び難燃性電子材料 Download PDFInfo
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Abstract
Description
Claims (10)
- 硫黄含有難燃剤、リン含有難燃剤及び/又は窒素含有難燃剤、及びノンハロゲンエポキシ樹脂を含むことを特徴とする難燃性樹脂組成物。
- 前記難燃性樹脂組成物における硫黄元素の含有量が5重量%以下、好ましくは0.5〜2重量%であり、
好ましくは、前記難燃性樹脂組成物におけるリン元素の含有量が0.1重量%以上、好ましくは0.2〜1重量%であり、
好ましくは、前記難燃性樹脂組成物における窒素元素の含有量が0.1重量%以上、好ましくは0.5〜1重量%であり、
好ましくは、前記硫黄含有難燃剤は、p−ベンゼンジチオール及び/又は4,4’−ジアミノジフェニルジスルフィド、好ましくはp−ベンゼンジチオールであり、
好ましくは、前記リン含有難燃剤は、DOPOエーテル化ビスフェノールA、DOPO変性エポキシ樹脂、トリス(2,6−ジメチルフェニル)ホスフィン、テトラ−(2,6−キシリル)レゾルシノールジホスフェート、レゾルシノールテトラフェニルジホスフェート、リン酸トリフェニル、ビスフェノールAビス(ジフェニルホスフェート)、ホスファゼン難燃剤、10−(2,5−ジヒドロキシフェニル)−10−ヒドロ−9−オキサ−10−フォスファフェナンスレン−10−オキサイド、10−(2,5−ジヒドロキシナフチル)−10−ヒドロ−9−オキサ−10−フォスファフェナンスレン−10−オキサイド又は9,10−ジヒドロ−9−オキサ−10−フォスファフェナンスレン−10−オキサイド難燃剤から選ばれる任意の1種又は少なくとも2種の混合物であり、
好ましくは、前記窒素含有難燃剤は、ビウレア、メラミン又はメラミンリン酸塩のうちの任意の1種又は少なくとも2種の組み合わせである、ことを特徴とする請求項1に記載の難燃性樹脂組成物。 - 前記難燃性樹脂組成物は、その他の難燃性材料を更に含み、
好ましくは、前記その他の難燃性材料は、シリコーン難燃剤、塩素含有有機難燃剤又は無機難燃剤から選ばれる任意の1種又は少なくとも2種の組み合わせであり、
好ましくは、前記シリコーン難燃剤はシリコーンオイル、シリコーンゴム、シランカップリング剤、ポリシロキサン又はシリコーンアルカノールアミドのうちの任意の1種又は少なくとも2種の組み合わせであり、
好ましくは、前記塩素含有有機難燃剤は、テトラクロロフタル酸ジオクチル、無水クロレンド酸、クロレンド酸又はテトラクロロビスフェノールAのうちの任意の1種又は少なくとも2種の組み合わせであり、
好ましくは、前記無機難燃剤は、水酸化アルミニウム、水酸化マグネシウム、三酸化アンチモン又はホウ酸亜鉛のうちの任意の1種又は少なくとも2種の組み合わせである、ことを特徴とする請求項1又は2に記載の難燃性樹脂組成物。 - 前記ノンハロゲンエポキシ樹脂は、ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、オルトクレゾールノボラック型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、イソシアネートエポキシ樹脂又はビフェニル型エポキシ樹脂のうちの少なくとも任意の1種又は少なくとも2種の混合物であり、
好ましくは、前記ノンハロゲンエポキシ樹脂の含有量が70〜95質量%である、ことを特徴とする請求項1〜3のいずれか1項に記載の難燃性樹脂組成物。 - 請求項1〜4のいずれか1項に記載の難燃性樹脂組成物を含むことを特徴とする熱硬化性樹脂組成物。
- 前記熱硬化性樹脂組成物は硬化剤を更に含み、
好ましくは、前記硬化剤はジシアンジアミド、フェノール樹脂、芳香族アミン、酸無水物、活性エステル系硬化剤又は活性フェノール系硬化剤から選ばれる任意の1種又は少なくとも2種の組み合わせであり、
好ましくは、前記熱硬化性樹脂組成物は硬化促進剤を更に含み、
好ましくは、前記硬化促進剤はイミダゾール系硬化促進剤、有機ホスフィン硬化促進剤又は第三級アミン硬化促進剤から選ばれる任意の1種又は少なくとも2種の混合物であり、
好ましくは、前記イミダゾール系化合物は、2−メチルイミダゾール、2−エチル−4メチルイミダゾール、2−フェニルイミダゾール、2−ウンデシルイミダゾール、1−ベンジル−2−メチルイミダゾール、2−ヘプタデシルイミダゾール、2−イソプロピルイミダゾール、2−フェニル−4−メチルイミダゾール、2−ドデシルイミダゾール又は1−シアノエチル−2−メチルイミダゾールから選ばれる任意の1種又は少なくとも2種の混合物、好ましくは2−メチルイミダゾールである、ことを特徴とする請求項5に記載の熱硬化性樹脂組成物。 - 請求項5又は6に記載の熱硬化性樹脂組成物を基板に含浸又は塗布してなり、
好ましくは、前記基板はガラス繊維基板、ポリエステル基板、ポリイミド基板、セラミック基板又は炭素繊維基板のうちの任意の1種である、ことを特徴とするプリプレグ。 - 少なくとも一枚の請求項7に記載のプリプレグに対して、表面金属層被覆、積層、ラミネートを順に行ってなり、
好ましくは、前記表面被覆金属層の材質はアルミニウム、銅、鉄及びそれらを任意に組み合わせた合金であり、
好ましくは、前記複合金属基板はCEM−1銅張積層板、CEM−3銅張積層板、FR−4銅張積層板、FR−5銅張積層板、CEM−1アルミ基板、CEM−3アルミ基板、FR−4アルミ基板又はFR−5アルミ基板のうちの任意の1種である、ことを特徴とする複合金属基板。 - 請求項8に記載の複合金属基板の表面に配線を加工してなることを特徴とする回路基板。
- 請求項1〜4のいずれか1項に記載の難燃性樹脂組成物を含有し、
好ましくは、前記難燃性電子材料は、成分として、請求項1〜4のいずれか1項に記載の難燃性樹脂組成物70〜90重量部、シリコーンフィラー15〜25重量部、硬化剤5〜10重量部、硬化促進剤1〜3重量部、希釈剤2〜8重量部及び消泡剤1〜3重量部を含有し、
好ましくは、前記シリコーンフィラーはN−(β−アミノエチル)−γ−アミノプロピルトリエトキシシラン及び/又はグリシジルオキシプロピルトリメトキシシランであり、
好ましくは、前記硬化剤は4,4−ジアミノジフェニルエーテル、4,4−ジアミノジフェニルスルホン、メチルテトラヒドロフタル酸無水物又はメチルヘキサヒドロフタル酸無水物のうちの任意の1種又は少なくとも2種の組み合わせであり、
好ましくは、前記硬化促進剤は2−メチルイミダゾール、レゾルシノール、ジメチルベンジルアミン又は2−エチル−4−メチルイミダゾールのうちの任意の1種又は少なくとも2種の組み合わせである、ことを特徴とする難燃性電子材料。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018012838A (ja) * | 2016-07-21 | 2018-01-25 | 広東広山新材料有限公司 | 難燃性樹脂組成物、熱硬化性樹脂組成物、難燃性エンジニアリングプラスチック及び複合金属基板 |
KR20190116635A (ko) * | 2018-04-05 | 2019-10-15 | 주식회사 제일화성 | 난연성이 우수한 구조용 접착제 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108335771B (zh) * | 2017-12-26 | 2022-01-11 | 中广核研究院有限公司 | 中子屏蔽材料及其制备方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000239525A (ja) * | 1999-02-16 | 2000-09-05 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物及び層間絶縁接着剤 |
JP2003055537A (ja) * | 2001-08-21 | 2003-02-26 | Japan Epoxy Resin Kk | プリント配線板用樹脂組成物及びプリント配線板 |
JP2003138105A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2007002053A (ja) * | 2005-06-22 | 2007-01-11 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及びその硬化物 |
JP2014506280A (ja) * | 2010-12-27 | 2014-03-13 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤系 |
JP2018012838A (ja) * | 2016-07-21 | 2018-01-25 | 広東広山新材料有限公司 | 難燃性樹脂組成物、熱硬化性樹脂組成物、難燃性エンジニアリングプラスチック及び複合金属基板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004072179A1 (en) * | 2003-02-06 | 2004-08-26 | Dow Global Technologies Inc. | Halogen free ignition resistant thermoplastic resin compositions |
CN102558505A (zh) * | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | 热固性树脂组合物及用其形成的预浸料及层叠板 |
US20110281795A1 (en) * | 2009-01-28 | 2011-11-17 | Songnian Lin | Glucagon receptor antagonist compounds, compositions containing such compounds and methods of use |
CN101643570B (zh) * | 2009-08-24 | 2011-08-10 | 广东生益科技股份有限公司 | 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板 |
ES2523351T3 (es) * | 2009-09-24 | 2014-11-25 | Sunpor Kunststoff Gmbh | Polímeros de estireno expandibles |
US8558310B2 (en) * | 2009-12-18 | 2013-10-15 | Texas Instruments Incorporated | Indium, carbon and halogen doping for PMOS transistors |
US20130289187A1 (en) * | 2010-10-19 | 2013-10-31 | Sumitomo Bakelite Company Limited | Resin composition for encapsulation and electronic component device |
CN102093670B (zh) * | 2010-12-23 | 2013-01-23 | 广东生益科技股份有限公司 | 无卤阻燃环氧树脂组合物及使用其制作的覆铜板 |
BR112013018628A2 (pt) * | 2011-01-26 | 2017-07-18 | Novo Nordisk As | derivados da leptina |
CN102432836B (zh) * | 2011-08-16 | 2013-06-19 | 苏州生益科技有限公司 | 无卤热固性树脂组合物及使用其制作的预浸料及层压板 |
EP2574614B1 (de) * | 2011-09-30 | 2019-05-01 | Basf Se | Flammgeschützte Polymerschaumstoffe mit halogenfreien, phosphorhaltigen Flammschutzmitteln auf Zuckerbasis |
DE102011118490B4 (de) * | 2011-11-11 | 2014-05-15 | Schill + Seilacher "Struktol" Gmbh | Halogenfreie, flammfeste Epoxidharz-Zusammensetzungen und deren Verwendung |
CN103421186A (zh) * | 2012-05-18 | 2013-12-04 | 上海杰事杰新材料(集团)股份有限公司 | 一种阻燃性半芳香族聚酰胺及其制备方法 |
CN103013046B (zh) * | 2012-12-13 | 2014-07-16 | 广东生益科技股份有限公司 | 一种无卤阻燃树脂组合物及其用途 |
KR101671877B1 (ko) * | 2013-08-23 | 2016-11-03 | 엘리트 일렉트로닉 메터리얼 (쿤샨) 컴퍼니 리미티드 | 수지조성물, 이를 사용한 동박기판 및 인쇄회로 |
CN103788580B (zh) * | 2014-01-27 | 2016-08-17 | 苏州生益科技有限公司 | 一种无卤苯并恶嗪树脂组合物及使用其制作的半固化片及层压板 |
CN104497493A (zh) * | 2015-01-15 | 2015-04-08 | 江苏恒神纤维材料有限公司 | 一种无卤低烟低毒阻燃环氧树脂体系 |
CN104610704A (zh) * | 2015-01-28 | 2015-05-13 | 清远市普塞呋磷化学有限公司 | 一种无卤阻燃酸酐固化环氧树脂组合物 |
CN105733024B (zh) * | 2016-01-27 | 2018-07-24 | 厦门大学 | 一种含磷氮硫元素的阻燃剂及其制备方法 |
-
2016
- 2016-07-21 CN CN201610580587.7A patent/CN107254142A/zh active Pending
-
2017
- 2017-05-19 US US15/600,177 patent/US20180022899A1/en not_active Abandoned
- 2017-05-31 EP EP17173778.6A patent/EP3272795B1/en active Active
- 2017-06-07 KR KR1020170070816A patent/KR101904661B1/ko active IP Right Grant
- 2017-06-09 TW TW106119354A patent/TWI639646B/zh active
- 2017-07-18 JP JP2017138758A patent/JP6564819B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000239525A (ja) * | 1999-02-16 | 2000-09-05 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物及び層間絶縁接着剤 |
JP2003055537A (ja) * | 2001-08-21 | 2003-02-26 | Japan Epoxy Resin Kk | プリント配線板用樹脂組成物及びプリント配線板 |
JP2003138105A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2007002053A (ja) * | 2005-06-22 | 2007-01-11 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及びその硬化物 |
JP2014506280A (ja) * | 2010-12-27 | 2014-03-13 | ビーエーエスエフ ソシエタス・ヨーロピア | 難燃剤系 |
JP2018012838A (ja) * | 2016-07-21 | 2018-01-25 | 広東広山新材料有限公司 | 難燃性樹脂組成物、熱硬化性樹脂組成物、難燃性エンジニアリングプラスチック及び複合金属基板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018012838A (ja) * | 2016-07-21 | 2018-01-25 | 広東広山新材料有限公司 | 難燃性樹脂組成物、熱硬化性樹脂組成物、難燃性エンジニアリングプラスチック及び複合金属基板 |
KR20190116635A (ko) * | 2018-04-05 | 2019-10-15 | 주식회사 제일화성 | 난연성이 우수한 구조용 접착제 |
KR102094329B1 (ko) * | 2018-04-05 | 2020-03-27 | 주식회사 제일화성 | 난연성이 우수한 구조용 접착제 |
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