JP2017515935A - 有機エレクトロニクスデバイスをカプセル化するための接着テープ - Google Patents
有機エレクトロニクスデバイスをカプセル化するための接着テープ Download PDFInfo
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- JP2017515935A JP2017515935A JP2016561706A JP2016561706A JP2017515935A JP 2017515935 A JP2017515935 A JP 2017515935A JP 2016561706 A JP2016561706 A JP 2016561706A JP 2016561706 A JP2016561706 A JP 2016561706A JP 2017515935 A JP2017515935 A JP 2017515935A
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- 239000002390 adhesive tape Substances 0.000 title claims description 81
- 230000001070 adhesive effect Effects 0.000 claims abstract description 306
- 239000000853 adhesive Substances 0.000 claims abstract description 301
- 229920000642 polymer Polymers 0.000 claims abstract description 75
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 95
- 239000010410 layer Substances 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 57
- 239000000945 filler Substances 0.000 claims description 41
- 239000002245 particle Substances 0.000 claims description 41
- -1 Fluorinated ethylene propylene poly (pentadecafluorooctyl acrylate Chemical compound 0.000 claims description 38
- 230000004888 barrier function Effects 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 27
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 21
- 238000000149 argon plasma sintering Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 17
- 239000006185 dispersion Substances 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 5
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 5
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- ADTHJEKIUIOLBX-UHFFFAOYSA-N 1,1,3,4,4,5,5,6,6,6-decafluoro-3-(trifluoromethyl)hex-1-ene Chemical compound FC(C(F)(F)F)(C(C(C(F)(F)F)(C=C(F)F)F)(F)F)F ADTHJEKIUIOLBX-UHFFFAOYSA-N 0.000 claims description 3
- 229920001780 ECTFE Polymers 0.000 claims description 3
- 239000004815 dispersion polymer Substances 0.000 claims description 3
- PGFXOWRDDHCDTE-UHFFFAOYSA-N hexafluoropropylene oxide Chemical compound FC(F)(F)C1(F)OC1(F)F PGFXOWRDDHCDTE-UHFFFAOYSA-N 0.000 claims description 3
- 239000004200 microcrystalline wax Substances 0.000 claims description 3
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 2
- 229920001774 Perfluoroether Polymers 0.000 claims description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 2
- 238000001228 spectrum Methods 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims 2
- WSZQNZRTSRYAHA-UHFFFAOYSA-N 1,1,1-trifluoropropan-2-yl 2-methylprop-2-enoate Chemical compound FC(F)(F)C(C)OC(=O)C(C)=C WSZQNZRTSRYAHA-UHFFFAOYSA-N 0.000 claims 1
- PIVZSKMBNTYESR-UHFFFAOYSA-N 1,1,2-trifluoropropan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(F)C(F)F PIVZSKMBNTYESR-UHFFFAOYSA-N 0.000 claims 1
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 claims 1
- JDVGNKIUXZQTFD-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)COC(=O)C=C JDVGNKIUXZQTFD-UHFFFAOYSA-N 0.000 claims 1
- PLXOUIVCSUBZIX-UHFFFAOYSA-N 2,2,3,3,4,4,4-heptafluorobutyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)COC(=O)C=C PLXOUIVCSUBZIX-UHFFFAOYSA-N 0.000 claims 1
- YVWNCSBTHLSBPZ-UHFFFAOYSA-N 2-(2,2,2-trifluoroethoxy)ethyl prop-2-enoate Chemical compound FC(F)(F)COCCOC(=O)C=C YVWNCSBTHLSBPZ-UHFFFAOYSA-N 0.000 claims 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims 1
- ZBGRMWIREQJHPK-UHFFFAOYSA-N ethenyl 2,2,2-trifluoroacetate Chemical compound FC(F)(F)C(=O)OC=C ZBGRMWIREQJHPK-UHFFFAOYSA-N 0.000 claims 1
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 claims 1
- 229920013653 perfluoroalkoxyethylene Polymers 0.000 claims 1
- 229920000205 poly(isobutyl methacrylate) Polymers 0.000 claims 1
- 229920000438 poly[methyl(3,3,3-trifluoropropyl)siloxane] polymer Polymers 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 239000012071 phase Substances 0.000 description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 33
- 238000012546 transfer Methods 0.000 description 33
- 239000012466 permeate Substances 0.000 description 30
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 239000000203 mixture Substances 0.000 description 21
- 229920001400 block copolymer Polymers 0.000 description 20
- 239000011575 calcium Substances 0.000 description 20
- 238000005259 measurement Methods 0.000 description 20
- 230000005693 optoelectronics Effects 0.000 description 20
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 19
- 229910052791 calcium Inorganic materials 0.000 description 19
- 230000000694 effects Effects 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229920000098 polyolefin Polymers 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 241000894007 species Species 0.000 description 14
- 239000000377 silicon dioxide Substances 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 230000006870 function Effects 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 229920002554 vinyl polymer Polymers 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 11
- 239000000654 additive Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 239000007800 oxidant agent Substances 0.000 description 10
- 239000001993 wax Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- 101000771640 Homo sapiens WD repeat and coiled-coil-containing protein Proteins 0.000 description 8
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 8
- 102100029476 WD repeat and coiled-coil-containing protein Human genes 0.000 description 8
- 150000001875 compounds Chemical group 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 239000004831 Hot glue Substances 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002250 absorbent Substances 0.000 description 6
- 230000002745 absorbent Effects 0.000 description 6
- 238000007792 addition Methods 0.000 description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000003711 photoprotective effect Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000010457 zeolite Substances 0.000 description 6
- 239000006057 Non-nutritive feed additive Substances 0.000 description 5
- 229910021536 Zeolite Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000004840 adhesive resin Substances 0.000 description 5
- 229920006223 adhesive resin Polymers 0.000 description 5
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005984 hydrogenation reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000001110 calcium chloride Substances 0.000 description 4
- 229910001628 calcium chloride Inorganic materials 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 150000002118 epoxides Chemical class 0.000 description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229910052938 sodium sulfate Inorganic materials 0.000 description 4
- 235000011152 sodium sulphate Nutrition 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 4
- 229920006132 styrene block copolymer Polymers 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920006216 polyvinyl aromatic Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- ZGLFRTJDWWKIAK-UHFFFAOYSA-M [2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]-triphenylphosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC(=O)OC(C)(C)C)C1=CC=CC=C1 ZGLFRTJDWWKIAK-UHFFFAOYSA-M 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 235000010323 ascorbic acid Nutrition 0.000 description 2
- 239000011668 ascorbic acid Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 2
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 description 2
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 2
- 229910001622 calcium bromide Inorganic materials 0.000 description 2
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 150000001718 carbodiimides Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 2
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 2
- 229940044175 cobalt sulfate Drugs 0.000 description 2
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 2
- 230000009969 flowable effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229940074391 gallic acid Drugs 0.000 description 2
- 235000004515 gallic acid Nutrition 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000008103 glucose Substances 0.000 description 2
- 235000001727 glucose Nutrition 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000001976 improved effect Effects 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000012280 lithium aluminium hydride Substances 0.000 description 2
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 2
- 229910001950 potassium oxide Inorganic materials 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000012312 sodium hydride Substances 0.000 description 2
- 229910000104 sodium hydride Inorganic materials 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000348 titanium sulfate Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910052723 transition metal Chemical class 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 235000021081 unsaturated fats Nutrition 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- VNDYJBBGRKZCSX-UHFFFAOYSA-L zinc bromide Chemical compound Br[Zn]Br VNDYJBBGRKZCSX-UHFFFAOYSA-L 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- QWOVEJBDMKHZQK-UHFFFAOYSA-N 1,3,5-tris(3-trimethoxysilylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CO[Si](OC)(OC)CCCN1C(=O)N(CCC[Si](OC)(OC)OC)C(=O)N(CCC[Si](OC)(OC)OC)C1=O QWOVEJBDMKHZQK-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- LLVWLCAZSOLOTF-UHFFFAOYSA-N 1-methyl-4-[1,4,4-tris(4-methylphenyl)buta-1,3-dienyl]benzene Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(C)=CC=1)=CC=C(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 LLVWLCAZSOLOTF-UHFFFAOYSA-N 0.000 description 1
- KIJDMKUPUUYDLN-UHFFFAOYSA-N 2,2-dimethyl-4-trimethoxysilylbutan-1-amine Chemical compound CO[Si](OC)(OC)CCC(C)(C)CN KIJDMKUPUUYDLN-UHFFFAOYSA-N 0.000 description 1
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 1
- XCMNYMOUDNGMQP-UHFFFAOYSA-N 2-[[[diethoxy(pentan-2-yloxy)silyl]amino]-diethoxysilyl]oxypentane Chemical compound CCCC(C)O[Si](OCC)(OCC)N[Si](OCC)(OCC)OC(C)CCC XCMNYMOUDNGMQP-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- GXDMUOPCQNLBCZ-UHFFFAOYSA-N 3-(3-triethoxysilylpropyl)oxolane-2,5-dione Chemical compound CCO[Si](OCC)(OCC)CCCC1CC(=O)OC1=O GXDMUOPCQNLBCZ-UHFFFAOYSA-N 0.000 description 1
- BQQGVSONEPNPAB-UHFFFAOYSA-N 3-(diethoxymethylsilyl)propyl 2-methylprop-2-enoate Chemical compound CCOC(OCC)[SiH2]CCCOC(=O)C(C)=C BQQGVSONEPNPAB-UHFFFAOYSA-N 0.000 description 1
- LOOUJXUUGIUEBC-UHFFFAOYSA-N 3-(dimethoxymethylsilyl)propane-1-thiol Chemical compound COC(OC)[SiH2]CCCS LOOUJXUUGIUEBC-UHFFFAOYSA-N 0.000 description 1
- VLZDYNDUVLBNLD-UHFFFAOYSA-N 3-(dimethoxymethylsilyl)propyl 2-methylprop-2-enoate Chemical compound COC(OC)[SiH2]CCCOC(=O)C(C)=C VLZDYNDUVLBNLD-UHFFFAOYSA-N 0.000 description 1
- REJCMJWGZVIVSD-UHFFFAOYSA-N 3-[3-(benzylamino)propoxy-dimethoxysilyl]propan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCNCC1=CC=CC=C1 REJCMJWGZVIVSD-UHFFFAOYSA-N 0.000 description 1
- GHWPPBZDJQYMDI-UHFFFAOYSA-N 3-[3-[benzyl(ethenyl)amino]propoxy-dimethoxysilyl]propan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN(C=C)CC1=CC=CC=C1 GHWPPBZDJQYMDI-UHFFFAOYSA-N 0.000 description 1
- NUTIWQFRVFJKMB-UHFFFAOYSA-N 3-[3-[benzyl(ethenyl)amino]propoxy-dimethoxysilyl]propan-1-amine hydrochloride Chemical compound Cl.C(C1=CC=CC=C1)N(C=C)CCCO[Si](OC)(OC)CCCN NUTIWQFRVFJKMB-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- CHPNMYQJQQGAJS-UHFFFAOYSA-N 3-tri(propan-2-yloxy)silylpropyl 2-methylprop-2-enoate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCOC(=O)C(C)=C CHPNMYQJQQGAJS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- CSDQQAQKBAQLLE-UHFFFAOYSA-N 4-(4-chlorophenyl)-4,5,6,7-tetrahydrothieno[3,2-c]pyridine Chemical compound C1=CC(Cl)=CC=C1C1C(C=CS2)=C2CCN1 CSDQQAQKBAQLLE-UHFFFAOYSA-N 0.000 description 1
- RSCUJJZVNRPPQH-UHFFFAOYSA-N 4-(dimethoxymethylsilyl)-2,2-dimethylbutan-1-amine Chemical compound COC(OC)[SiH2]CCC(C)(C)CN RSCUJJZVNRPPQH-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- SJEYUMGTRHPJFH-UHFFFAOYSA-N C(C)O[Si](CCCSSSSCCC[Si](OCC)(OCC)OCC)(OCC)OCC.C(C)O[Si](CCCSSCCC[Si](OCC)(OCC)OCC)(OCC)OCC Chemical compound C(C)O[Si](CCCSSSSCCC[Si](OCC)(OCC)OCC)(OCC)OCC.C(C)O[Si](CCCSSCCC[Si](OCC)(OCC)OCC)(OCC)OCC SJEYUMGTRHPJFH-UHFFFAOYSA-N 0.000 description 1
- RZDVFMIIDZPLQK-UHFFFAOYSA-N COC(OC)[SiH2]C.N=C=O Chemical compound COC(OC)[SiH2]C.N=C=O RZDVFMIIDZPLQK-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241000723347 Cinnamomum Species 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920004142 LEXAN™ Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004418 Lexan Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004614 Process Aid Substances 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- CCGWVKHKHWKOIQ-UHFFFAOYSA-N [2-hydroxy-4-(3-triethoxysilylpropoxy)phenyl]-phenylmethanone Chemical compound OC1=CC(OCCC[Si](OCC)(OCC)OCC)=CC=C1C(=O)C1=CC=CC=C1 CCGWVKHKHWKOIQ-UHFFFAOYSA-N 0.000 description 1
- QRVXSAFBIRNGEX-UHFFFAOYSA-N [4-(3-chloro-3-dimethylsilylpropoxy)phenyl]-phenylmethanone Chemical compound ClC(CCOC1=CC=C(C(=O)C2=CC=CC=C2)C=C1)[SiH](C)C QRVXSAFBIRNGEX-UHFFFAOYSA-N 0.000 description 1
- CMPNPRUFRJFQIB-UHFFFAOYSA-N [N].[Cu] Chemical compound [N].[Cu] CMPNPRUFRJFQIB-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- ZLLYKJWRVATEKK-UHFFFAOYSA-N acetyl acetate;propanoyl propanoate Chemical compound CC(=O)OC(C)=O.CCC(=O)OC(=O)CC ZLLYKJWRVATEKK-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 229940072107 ascorbate Drugs 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- ZOMBKNNSYQHRCA-UHFFFAOYSA-J calcium sulfate hemihydrate Chemical compound O.[Ca+2].[Ca+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZOMBKNNSYQHRCA-UHFFFAOYSA-J 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 235000017803 cinnamon Nutrition 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- FWCBQAXNMWDAFK-UHFFFAOYSA-N cyclopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C1CC1 FWCBQAXNMWDAFK-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- JAPXJEHHGIVARY-UHFFFAOYSA-N diethoxymethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCOC(OCC)[SiH2]CCCOCC1CO1 JAPXJEHHGIVARY-UHFFFAOYSA-N 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ILIMZIMIYICHGQ-UHFFFAOYSA-M dimethyl-(octadecylamino)-(3-trimethoxysilylpropyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCCN[N+](C)(C)CCC[Si](OC)(OC)OC ILIMZIMIYICHGQ-UHFFFAOYSA-M 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229960001031 glucose Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000003988 headspace gas chromatography Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 239000007970 homogeneous dispersion Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 229940093474 manganese carbonate Drugs 0.000 description 1
- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- WHIVNJATOVLWBW-SNAWJCMRSA-N methylethyl ketone oxime Chemical compound CC\C(C)=N\O WHIVNJATOVLWBW-SNAWJCMRSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MNJJTHFKDZQVKH-UHFFFAOYSA-N n'-[3-(diethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound CCOC(OCC)[SiH2]CCCNCCN MNJJTHFKDZQVKH-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 1
- QRANWKHEGLJBQC-UHFFFAOYSA-N n-(trimethoxysilylmethyl)cyclohexanamine Chemical compound CO[Si](OC)(OC)CNC1CCCCC1 QRANWKHEGLJBQC-UHFFFAOYSA-N 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FRDNYWXDODPUJV-UHFFFAOYSA-N n-ethyl-2-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CCNCC(C)C[Si](OC)(OC)OC FRDNYWXDODPUJV-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 229910052615 phyllosilicate Inorganic materials 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000011092 plastic-coated paper Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229910000057 polysulfane Inorganic materials 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229940068984 polyvinyl alcohol Drugs 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical group CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
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- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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Abstract
Description
・45〜70℃の範囲の融点及び225〜500の分子量を有するパラフィンワックス、
・60〜95℃の範囲の融点を有する微晶質ワックス;さらに、線状の炭化水素、さらに、分岐状及び環状の炭化水素も存在する、
・100〜115℃の範囲の融点を有する合成のフィッシャー・トロプシュワックス、
・85〜140℃の融点及び500〜3500g/モルの範囲の分子量を有するポリエチレンワックス。
・組織化された基板及びカバー層
・高い屈折率を有する基板又はカバー
・アンカップリングフィルム
・ホログラム層又は屈折層又は多層系
・発光又は吸光スタックに直接隣接した追加的な薄層(例えば、反射層、光散乱層)
・該スタック自体中の光学的な層
−1.45超の屈折率及び
−100g/m2d未満の水蒸気に対する透過率を有し、かつ、
該分散領域が、
−0.1μm〜50μの寸法範囲に存在し、かつ、
−10重量%以下の重量割合で該接着剤中に含有される、
該接着剤であって、
−該分散領域がポリマー性であり、1.45未満の屈折率を有し、かつ、100g/m2d未満の水蒸気透過率を有することを特徴とする。
・少なくとも40℃の融点、
・比較的低い溶融粘度及び多くの樹脂とは対照的に糸状ではない。
・増加する溶解度及び高温での化学分解がない。
該領域の屈折率が小さい場合、つまり、例えば、1.40未満である場合、多くの用途について、十分の光散乱を達成するために、好ましい割合は1〜5重量%である。該領域の屈折率が1.45に近い場合、好ましい割合は5〜10重量%である
N−(2−アミノエチル)−3−アミノプロピルトリメトキシシラン、N−(2−アミノエチル)−3−アミノプロピルトリエトキシシラン、3−アミノプロピルトリメトキシシラン、3−アミノプロピルトリエトキシシラン、3−アミノプロピルジエトキシメチルシラン、N−(2−アミノエチル)−3−アミノプロピルジエトキシメチルシラン、(N−ブチル)−3−アミノプロピルトリメトキシシラン、3−(N−エチルアミノ)−2−メチルプロピルトリメトキシシラン、4−アミノ−3,3−ジメチルブチルトリメトキシシラン、4−アミノ−3,3−ジメチルブチルジメトキシメチルシラン、(N−シクロヘキシル)−アミノメチルジメとキシメチルシラン、(N−シクロヘキシル)−アミノメチルトリメトキシシラン、(N−フェニル)−3−アミノプロピルトリメトキシシラン、(N−フェニル)−アミノメチルジメとキシメチルシラン、(N−ベンジル−2−アミノエチル)−3−アミノプロピルトリメトキシシラン、[2−(N−ベンジル−N−ビニルアミノ)−エチル]−3−アミノプロピルトリメトキシシラン塩化水素、[2−(N−ベンジル−N−ビニルアミノ)−エチル]−3−アミノプロピルトリメトキシシラン、ビス−(3−プロピルトリエトキシシリル)−アミン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニル−トリ(2−メトキシエトキシ)−シラン、ビニルトリイソプロポキシシラン、ビニルジメとキシメチルシラン、ビニルトリアセトキシシラン、3−トリエトキシシリルプロピルコハク酸無水物、3−グリシジルオキシプロピルトリメトキシシラン、3−グリシジルオキシプロピルトリエトキシシラン、2−(3,4−エポキシシクロヘキシル)−エチルトリエトキシシラン、3−グリシジルオキシプロピルジエトキシメチルシラン、3−メタクリロイルオキシプロピルトリメトキシシラン、3−メタクリロイルオキシプロピルトリエトキシシラン、3−メタクリロイルオキシプロピルトリイソプロポキシシラン、3−メタクリロイルオキシプロピルジメトキシメチルシラン、3−メタクリロイルオキシプロピルジエトキシメチルシラン、3−クロロプロピルトリメトキシシラン、3−クロロプロピルトリエトキシシラン、3−イソシアネートプロピルトリメトキシシラン、3−イソシアネートプロピルトリエトキシシラン、イソシアネートメチルトリメトキシシラン、イソシアネートメチルジメトキシメチルシラン、トリス−[3−(トリメトキシシリル)−プロピル]−イソシアヌレート、3−ウレイドプロピルトリメトキシシラン、3−ウレイドプロピルトリエトキシシラン、2−ヒドロキシ−4−(3−トリエトキシシリルプロポキシ)−ベンゾフェノン、4−(3’−クロロジメチルシリルプロポキシ)−ベンゾフェノン、3−メルカプトプロピルトリメトキシシラン、3−メルカプトプロピルジメトキシメチルシラン、ビス−(3−トリエトキシシリルプロピル)−ジスルファン、ビス−(3−トリエトキシシリルプロピル)−テトラスルファン、ビス−(トリエトキシシリルプロピル)−ポリスルファン及びオクタデシルアミノジメチルトリメトキシシリルプロピルアンモニウムクロリド。
−ビニル芳香族ブロックコポリマーをベースとする接着剤
・特に、例えば、ドイツ国特許出願公開第10 2008 047 964 A号明細書(特許文献19)に記載されているようなもの。これは、特に粘着剤である。有利な実施形態において、そのような粘着在は、ビニル芳香族、特にスチレンから形成されたポリマーブロックを含み、さらに、これは、有利に、1,3−ジエン、特にブタジエン及び/又はイソプレンのポリマーから形成されたポリマーブロック、及び/又は、特別に又は完全に水素化されたポリマーブロックである。該ブロックコポリマーのポリビニル芳香族の割合は、有利に10重量%〜35重量%である。好ましいやり方において、該粘着剤は、少なくとも20重量%、好ましくは、少なくとも30重量%、さらに好ましくは、少なくとも35重量%のビニル芳香族ブロックコポリマーの割合を有する。及び/又は該粘着剤は、最大80重量%、好ましくは、最大65重量%、さらに好ましくは、最大60重量%のビニル芳香族ブロックコポリマーの割合を有する。該粘着剤は、一種又は二種以上の樹脂又は多数の樹脂混合物を含むことができ、好ましくは、少なくとも90%、さらに好ましくは、少なくとも95%の水素化度を有する水素化樹脂である。好ましい変法において、該粘着剤は、30℃超のDACP−値及び50℃未満のMMAP−値、好ましくは、37℃未満のDACP−値及び60℃未満のMMAP−値を有する少なくとも一種の樹脂を含有し、及び/又は該粘着剤は、95℃未満、特に100℃未満の軟化点を有する、少なくとも一種の樹脂を含有する。一種又は二種以上の添加剤を含むことができ、該添加剤は、好ましくは、軟化剤、一次酸化剤、二次酸化剤、プロセス安定剤、光保護剤、加工助剤、エンドブロック強化樹脂、ポリマー、特に、エラストマー性のものからなる群から選択される。該粘着剤が、特に架橋後に、少なくとも20%の伸長率を有する場合、とりわけ、例えば、ドイツ国特許出願公開第10 2009 036 970 A号明細書(特許文献20)に記載されているものが有利である。酸変性又は酸無水物変性ビニル芳香族ブロックコポリマーをベースとする、部分的に架橋した粘着剤が特に挙げられる。非常に有利には、該粘着剤は、ビニル芳香族、特に、スチレンから形成されたポリマーブロックを含有する。1,3−ジエン、特にブタジエン及び/又はイソプレン、及び/又はアミン及び/又はエポキシ樹脂及び/又は金属キレートによって特異的又は完全に水素化されたポリマーブロックを含有する、酸変性又は酸無水物変性ビニル芳香族ブロックコポリマーをベースとするような粘着剤はさらに有利である。この粘着剤は、アミン及び/又はエポキシ樹脂及び/又は金属キレートによって有利に架橋させることができる。金属キレートとしては、式(R1O)nM(XR2Y)m(式中、Mは第2、第3、第4及び第5主族の金属又は繊維金属であり;R1はメチル、エチル、ブチル、イソプロピル又はベンジルのようなアルキル基又はアリール基であり;nは0又は1以上の整数であり、X及びYは酸素又は窒素であり、それぞれ、二重結合を介してR2に結合することができ;R2は、X及びYに結合しているアルキレン基であり、分岐することができるか、又は酸素又はその他のヘテロ原子をその鎖中に含むこともでき;mは、整数であるが、少なくとも1である。)で表すことのできるようなものが好ましく使用できる。有利に、キレートはアセチルアセトネート、特に、アルミニウムアセチルアセトネートであることができる。有利な実施形態において、ブロックコポリマーは、10重量%〜35重量%のポリビニル芳香族割合を有する。粘着剤におけるビニル芳香族ブロックコポリマーの割合は、とりわけ少なくとも30重量%、好ましくは少なくともお40重量%、より好ましくは少なくとも45重量%である。有利には、接着剤中のビニル芳香族ブロックコポリマーの割合は80重量%、好ましくは70重量%を超えない。該粘着剤は、樹脂又は樹脂混合物を含むことができ、好ましくは、少なくとも90%、さらに好ましくは少なくとも95%の水素化度を有する水素化樹脂であることができる。該粘着剤は、好ましくは、一次酸化剤、二次酸化剤、プロセス安定剤、光保護剤、加工助剤、エンドブロック強化樹脂、ポリマー、特に、エラストマー性のものを含む群から選択される一種又は二種以上の添加剤を含むことができる。該粘着剤は、ナノスケールの充填剤、透明な充填剤のような充填剤を一種又は二種以上含有することができる。該充填剤は、有利には、少なくとも1つの次元においてナノスケールに形成されている。
30℃超のDACP−値及び50℃超のMMAP−値、好ましくは37℃超のDACP−値及び60℃超のMMAP−値を有する樹脂;
少なくとも一つのエポキシド基又は少なくとも一つのオキセタン基を有する反応性樹脂;
脂肪族又は脂環式の性質の反応性樹脂;
350nmを下回るUV光を吸収し、かつ、カチオン性の硬化を可能にする、特に、スルホニウムベース、ヨードニウムベース及びメタロセンベースの系の、光開始剤;
250nmを下回るかつ350nmを下回るUV光を吸収する光開始剤;
軟化剤;
一次酸化剤;
二次酸化剤;
プロセス助剤;
光保護剤;
加工助剤;
ポリマー、特にエラストマー性のもの;
充填剤、好ましくは、ナノスケールの充填剤、透明な充填剤及び/又はゲッタ充填剤及び/又はスカベンジャー充填剤。
測定は、23±1℃及び50±5%の相対湿度の試験環境で遂行される。
ヘイズ値は、前方から奥へ照射され、試料を通過した後に散乱した光の割合である。それにより、ヘイズ値は、クリアな視界を妨害する層の不透明な特性を定量化する。
屈折率は、ISO 489(方法A、測定波長589nm)に準拠して、20℃の温度及び50%の相対湿度で測定する。この圧力及び温度を使って、粒子から成形体を製造した。その測定時の接触流体としてシナモンを使用した。
WVTRは、ASTM F−1249に従い、38℃及び90%の相対湿度におけるものである。それぞれの場合において、二重測定を行い、そして平均値を算出する。所与の値は、50μmの厚さに対して標準化され/測定する試料のそれぞれの厚さに基づく。
エレクトロニクス構造体の耐用寿命の測定のための尺度として、カルシウム試験を用いた。これは、図4に示されている。そのために、10×10mm2大の、薄いカルシウム層23をガラスプレート21上に真空中で施用し、その後、窒素雰囲気下で貯蔵する。カルシウム層23の厚さは約100nmである。そのカルシウム層23をカプセル化するために、試験する接着剤22及び支持材料としての透過性ガラス薄片24(30μm、Schott社)を有する接着テープ(23×23mm2)を使用する。安定化させるために、光学的に透過性の高いアクリレート系粘着剤の、50μm厚の転写用接着テープ25を使い、そのガラス薄片を100μmの厚さのPETフィルム26でラミネートする。全ての側部においてカルシウムミラーから6.5mm(A−A)はみ出している縁部をその接着剤22が覆うように、該接着剤22をガラスプレート21上に適用する。非透過性のガラス支持体24により、粘着剤を通るか、又はその境界面に沿って透過性だけを測定する。
MMAPは、混合メチルシクロヘキサン−アニリン−曇り点であり、これは、変更したASTM C 611法を使用して測定される。標準試験法において使用されるヘプタンのためにメチルシクロヘキサンを使用する。該方法は、樹脂/アニリン/メチルシクロヘキサンを1/2/1(5g/10ml/5ml)の比で使用し、そして、曇り点は、加熱した、透明なそれら三成分の混合物を、完全な曇りが始まる正にその時点まで冷却することによって測定する。
ガラスに対する接着力は、ISO 29862(方法3)に類似して、23℃及び50%の相対湿度において、30mm/分の引き剥がし速度及び180°の引き剥がし角度で測定した。Coverme社(イタリア国)から得られるような36μmの厚さを有する、エッチングしたPETフィルムを強化フィルムとして使用した。その際、試料片の接着は、巻き取り装置を使って23℃の温度で行った。接着テープは、施用直後に剥がした。測定値(N/cm)は、三回の個々の測定の平均値として与えた。
コポリマー、硬質ブロック、軟質ブロック、及び未硬化の反応性樹脂の軟化温度を、DIN 53765:1994−03に準拠した示差走査熱量測定(DSC)によって熱量分析的に測定する。10K/分の加熱速度で加熱曲線を得る。穿孔した蓋を備えるAlるつぼ中で、かつ、窒素雰囲気中で試料を測定する。第二の加熱曲線を分析評価する。アモルファス材料の場合ガラス遷移温度が現れ、(半)結晶性材料の場合融解温度が現れる。ガラス遷移温度は、熱グラフにおいて段階としてわかる。ガラス遷移温度は、この段階の中心点として分析評価される。融解温度は、熱グラフにおけるピークとしてわかる。融解温度としてそれぞれの温度が記され、その際に最も高い熱効果が現れる。
重量平均分子料MW及び数平均分子量Mnの分子量測定は、ゲル浸透クロマトグラフィー(GPC)を使って行った。溶離剤として、THF(テトラヒドロフラン)を0.1体積%のトリフルオロ酢酸と共に使用した。測定は、25℃で行った。プレカラムとして、PSS−SDV、5μ、103Å、ID 8.0mm×50mmを使用した。分離のために、カラムPSS−SDV、5μ、103並びに105及び106(いずれもID 8.0mm×300mm)を使用した。サンプル濃度は4g/lであり、流量は1分当たり1.0mlであった。ポリスチレン−標準に対して測定した。
伸長率は、ISO 29864(方法A、20mmの試験片幅)に準拠して、23℃及び50%の相対湿度で測定する。試験は、500μmの厚さの、接着剤の試料に対して行う。
別途示さない限り、以下の実施例における全ての量は、光開始剤を含まない、全組成物に基づく重量%又は重量割合である。その光開始剤の量は、使用したエポキシ樹脂の量に関連する。
Claims (31)
- 少なくとも一つの連続相並びに分散して分布した領域を含む半透明の多層型接着剤であって、その際、該少なくとも一つの連続相が、
・1.45超の屈折率、及び
・100g/m2未満の水蒸気に対する透過率を有し、
かつ、該分散領域が、
・0.1μm〜50μmの寸法範囲内の平均径を有し、
・該接着剤中に10重量%以下の重量割合で含有されている該接着剤であって、並びに、
前記分散領域が、ポリマーの性質であり、100g/m2d未満のWVTR及び1.45未満の屈折率を有することを特徴とする、上記の接着剤。 - 前記ポリマーの分散領域の平均径(d50)が、0.1μm〜50μmの寸法範囲内にあることを特徴とする、請求項1に記載の接着剤。
- 前記接着剤中における前記分散して分布したポリマー領域の重量割合が、1重量%超、特に、該領域の屈折率が1.40を下回る時に1〜5重量%であり、そして、特に、該領域の屈折率が1.45である時に5〜10重量%であることを特徴とする、請求項1又は2に記載の接着剤。
- 前記ポリマー分散領域が、1.41未満、好ましくは1.37未満の屈折率を有することを特徴とする、請求項1〜3のいずれか一つに記載の接着剤。
- 前記連続相が、可視光のスペクトル(400nm〜800nmまでの波長範囲)において70%超の透過率及び/又は5.0%未満、好ましくは2.5%未満のヘイズを示すことを特徴とする、請求項1〜4のいずれか一つに記載の接着剤。
- 前記接着剤が、50μmの層の厚さの時に、50g/(m2・d)未満の水蒸気透過率、及び/又は5000g/(m2・dバール)未満の酸素透過率を有することを特徴とする、請求項1〜5のいずれか一つに記載の接着剤。
- 50μmの厚さの層における接着剤が、70%超の光透過率及び10%超のヘイズを有する光散乱性接着剤であることを特徴とする、請求項1〜6のいずれか一つに記載の接着剤。
- 前記接着剤が、正確に一つの連続相であり、かつ、正確に一つの分散相を含むことを特徴とする、請求項1〜7のいずれか一つに記載の接着剤。
- 分散ポリマーの領域のポリマーが、フッ素を含む、好ましくは、該ポリマーの領域が、フッ素含有の微晶質ワックスとして存在していることを特徴とする、請求項1〜8のいずれか一つに記載の接着剤。
- 前記接着剤が連続した接着剤相及び分散した相として分布している粒子状充填剤からなることを特徴とする、請求項1〜9のいずれか一つに記載の接着剤。
- 前記充填剤が、該充填剤の最大1体積%が接着剤層の平均層厚を超えた粒度分布において粒子の形態で存在していることを特徴とする、請求項10に記載の接着剤。
- 前記連続した接着剤相が、粘着剤又は活性可能な接着剤、特に粘着剤であることを特徴とする、請求項10に記載の接着剤。
- 前記接着剤が、粘着剤又は活性可能な接着剤、特に、粘着剤であることを特徴とする、請求項1〜12のいずれか一つに記載の接着剤。
- 前記接着剤が、少なくとも一種の浸透性物質を吸収可能な、少なくとも一種のゲッタ材料を含有していることを特徴とする、請求項1〜13のいずれか一つに記載の接着剤。
- 前記接着剤におけるゲッタ材料の割合が、10重量%以下、好ましくは5重量%以下であり、かつ、同時に、少なくとも0.01重量%、好ましくは、少なくとも0.05重量%であることを特徴とする、請求項14に記載の接着剤。
- 前記ゲッタ材料が、特に、少なくとも一次元において膨張が500nm以下、好ましくは200nm以下、非常に好ましくは100nm以下であるようなナノスケールで存在することを特徴とする、請求項14又は15に記載の接着剤。
- 前記連続相の屈折率と分散領域の屈折率とが、0.8超の値、好ましくは0.12超の値、そして特に好ましくは0.16超の値だけ相違していることを特徴とする、請求項1〜16の少なくとも一つに記載の接着剤。
- 請求項1〜17の少なくとも一つに記載の接着剤の層を含む接着テープ。
- 前記接着テープが、該接着剤の層以外に、さらなる接着剤層、支持材料又はライナーのようなさらなる層を有することを特徴とする、請求項17に記載の接着テープ。
- 前記支持材料が、ポリマー支持材料であることを特徴とする、請求項18に記載の接着テープ。
- 前記支持材料が、少なくとも一つの無機バリア層を有することを特徴とする、請求項19に記載の接着テープ。
- 特に、基材上に配置された有機エレクトロニクスデバイスを保護する方法であって、
その際、前記エレクトロニクスデバイスが、カバーによって少なくとも部分的に覆われるように、該エレクトロニクスデバイス上にカバーが設けられ、
その際、さらに、前記カバーが、前記基材上及び/又は前記エレクトロニクスデバイス上に少なくとも部分的に接合し、
その際、該接合を、請求項1〜21の少なくとも一つに記載の接着剤の少なくとも一つの層を使って作用させる、上記の方法。 - 前記接着剤層が接着テープの層として存在していることを特徴とする、請求項21に記載の方法。
- 最初に、場合によっては、さらなる層を含む両面接着性の接着テープの構成部材としての前記接着層が、そして、後続の工程で、カバーが、前記基材及び/又はエレクトロニクスデバイス上に施用されることを特徴とする、請求項1〜23のいずれか一つに記載の方法。
- 前記接着剤層及び前記カバーが、一緒に、前記基材及び/又は前記エレクトロニクスデバイス上に施用されることを特徴とする、請求項1〜24のいずれか一つに記載の方法。
- 前記カバーが、前記エレクトロニクスデバイスを完全に覆うことを特徴とする、請求項1〜25のいずれか一つに記載の方法。
- 前記エレクトロニクスデバイスの周囲における前記基材の領域もまた、前記カバーによって完全に又は部分的に覆われていることを特徴とする、請求項1〜26のいずれか一つに記載の方法。
- 前記接着剤層が、前記エレクトロニクスデバイスを完全に覆うことを特徴とする、請求項1〜27のいずれか一つに記載の方法。
- 前記エレクトロニクスデバイスの周囲における前記基材の領域もまた、前記接着剤層によって完全に又は部分的に覆われていることを特徴とする、請求項1〜28のいずれか一つに記載の方法。
- 少なくとも一つの連続相、並びに、分散分布した領域を含む半透明の多相型接着剤であって、その際、該少なくとも一つの連続相が、
・1.45超の屈折率、及び
・100g/m2未満の水蒸気に対する透過率を有し、
かつ、該分散領域が、
・0.1μm〜50μmの寸法範囲内の平均径を有し、
・該接着剤中に10重量%以下の重量割合で含有されている、該接着剤であって、前記分散領域が、
ポリ(ヘキサフルオロプロピレンオキシド)
ポリ(テトラフルオロエチレン−コ−ヘキサフルオロプロピレン)
フッ素化エチレンプロピレン
ポリ(ペンタデカフルオロオクチルアクリレート)
ポリ(テトラフルオロ−3−(ヘプタフルオロプロポキシ)プロピルアクリレート)
ポリ(テトラフルオロ−3−(ペンタフルオロエトキシ)プロピルアクリレート)
ポリ(テトラフルオロエチレン)
テトラフルオロエチレンヘキサフルオロプロピレンフッ化ビニリデン
ポリ(ウンデカフルオロヘキシルアクリレート)
パーフルオロアルコキシ
エチレンテトラフルオロエチレン
ポリ(ノナフルオロペンチルアクリレート)
ポリ(テトラフルオロ−3−(トリフルオロメトキシ)プロピルアクリレート)
ポリ(ペンタフルオロビニルプロピオネート)
ポリ(ヘプタフルオロブチルアクリレート)
ポリ(トリフルオロ酢酸ビニル)
ポリ(オクタフルオロペンチルアクリレート)
ポリ(メチル3,3,3−トリフルオロプロピルシロキサン)
ポリ(ペンタフルオロプロピルアクリレート)
ポリ(2−ヘプタフルオロブトキシ)エチルアクリレート)
ポリ(クロロトリフルオロエチレン)
ポリ(2,2,3,4,4−ヘキサフルオロブチルアクリレート)
ポリ(トリフルオロエチルアクリレート)
ポリ(2−(1,1,2,2−テトラフルオロエトキシ)エチルアクリレート)
ポリ(トリフルオロイソプロピルメタクリレート)
ポリ(2,2,2−トリフルオロ−1−メチルエチルメタクリレート)
ポリ(2−トリフルオロエトキシエチルアクリレート)
ポリ(フッ化ビニリデン)
エチレンクロロトリフルオロエチレン
ポリ(トリフルオロエチルメタクリレート)
ポリ(イソブチルメタクリレート)
の群から選択されることを特徴とする、上記の接着剤。 - 少なくとも一つの連続相、並びに、分散分布した領域を含む半透明の多相型接着剤であって、その際、該少なくとも一つの連続相が、
・1.45超の屈折率、及び
・100g/m2未満の水蒸気に対する透過率を有し、
かつ、該分散領域が、
・0.1μm〜50μmの寸法範囲内の平均径を有し、
・該接着剤中に10重量%以下の重量割合で含有されている、該接着剤であって、前記分散領域が、
ポリ(ヘキサフルオロプロピレンオキシド)(PHFPO)、フッ素化エチレンプロピレンポリマー(FEP)、ポリ(テトラフルオロエチレン)(PTFE)、ポリ(テトラフルオロエチレンヘキサフルオロプロピレンフッ化ビニリデン)(THV)パーフルオロアルコキシポリマー(PFA)、ポリ(エチレンテトラフルオロエチレン)(ETFE)、ポリ(クロロトリフルオロエチレン)(PCTFE)、ポリ(フッ化ビニリデン)(PVDF)及びポリ(エチレンクロロトリフルオロエチレン)(ECTFE)並びにそれらのコポリマー及びターポリマー、
の群から選択されることを特徴とする、上記の接着剤。
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