JP2017160055A - ワークを分離するシステムおよびその方法 - Google Patents
ワークを分離するシステムおよびその方法 Download PDFInfo
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2814/00—Indexing codes relating to loading or unloading articles or bulk materials
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- B65G2814/0301—General arrangements
- B65G2814/0308—Destacking devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2814/00—Indexing codes relating to loading or unloading articles or bulk materials
- B65G2814/03—Loading or unloading means
- B65G2814/0301—General arrangements
- B65G2814/0308—Destacking devices
- B65G2814/031—Removing from the top
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Abstract
Description
1.保持ユニットおよびストッカーの少なくとも一方が、少なくとも一対のパッドがストッカーに蓄積された最上層のワークを保持するように、相対的に移動すること。
2.少なくとも一対のパッドが最上層のワークを保持した後に、保持ユニットおよびストッカーの少なくとも一方が、保持ユニットに対し、ストッカーが相対的に下方になるように移動して、1枚のワークを分離すること。
3.保持ユニットとストッカーとの間に搬送ユニットをセットすること。
4.少なくとも一対のパッドで保持した1枚のワークを解放すること。
5.搬送ユニットで解放された1枚のワークを搬送すること。
6.ストッカーと保持ユニットとの間から搬送ユニットを退避させること。
・ストッカーを保持ユニットの上方の複数のワークを積み上げる位置に移動すること。
・複数のワークが積み上げられたストッカーを保持ユニットの下方に移動すること。
10 ストッカー
20 保持ユニット、 22 一対のパッド
40 移動ユニット
50 搬送ユニット
Claims (11)
- 複数のワークが積層された状態で蓄積されるストッカーと、
1枚の前記ワークの両端をハの字型に挟み込んで把持する少なくとも一対のパッドを含む保持ユニットと、
前記保持ユニットおよび前記ストッカーの少なくとも一方を動かすことにより、前記少なくとも一対のパッドで前記1枚のワークを挟み込んだ状態の前記保持ユニットに対し、前記ストッカーを相対的に下に移動して前記1枚のワークを他のワークに対し分離する移動ユニットとを有するシステム。 - 請求項1において、
前記保持ユニットの下側に相対的に出入りして前記保持ユニットから解放された前記1枚のワークを搬送する搬送ユニットをさらに有するシステム。 - 請求項2において、
前記搬送ユニットは、前記保持ユニットと前記ストッカーとの間に出入りする、システム。 - 請求項2または3において、
前記搬送ユニットは、前記保持ユニットの下側で前記複数のワークの両端から外側に逃げた第1の位置と、前記1枚のワークの両端の下側が搭載されるように前記第1の位置から内側に出た第2の位置とに移動する一対の送りユニットを含む、システム。 - 請求項1ないし4のいずれかにおいて、
前記保持ユニットは、前記少なくとも一対のパッドを前記1枚のワークの両端に対し開閉する駆動ユニットを含む、システム。 - 請求項1ないし5のいずれかにおいて、
前記保持ユニットは、前記少なくとも一対のパッドの間隔が前記1枚のワークの両端に沿った前後で変わるように、前記少なくとも一対のパッドを前記1枚のワークの両端に向けて加圧した状態で支持する支持ユニットを含む、システム。 - 請求項6において、
前記保持ユニットは、複数対の前記パッドを含み、前記支持ユニットは、前記複数対のパッドをそれらの間隔が前記1枚のワークの両端に沿った前後で変わるように支持する、システム。 - 請求項1ないし7のいずれかにおいて、
前記移動ユニットは、前記ストッカーを前記保持ユニットに対し上方で前記複数のワークを積み上げる位置に移動する、システム。 - 複数の板状のワークが積層された状態で蓄積されるストッカーと、1枚の前記ワークの両端をハの字型に挟み込んで把持する少なくとも一対のパッドを含む保持ユニットとを有するシステムを用いてワークを分離することを有する方法であって、前記分離することは、
前記保持ユニットおよび前記ストッカーの少なくとも一方が、前記少なくとも一対のパッドが前記ストッカーに蓄積された最上層のワークを保持するように、相対的に移動することと、
前記少なくとも一対のパッドが前記最上層のワークを保持した後に、前記保持ユニットおよび前記ストッカーの少なくとも一方が、前記保持ユニットに対し、前記ストッカーが相対的に下方なるように移動して、前記1枚のワークを分離することとを含む方法。 - 請求項9において、
前記システムは、さらに、前記保持ユニットと前記ストッカーとの間に出入りして前記ワークを搬送する搬送ユニットを有し、
当該方法は、さらに、
前記保持ユニットと前記ストッカーとの間に前記搬送ユニットをセットすることと、
前記少なくとも一対のパッドで保持した前記1枚のワークを解放することと、
前記搬送ユニットで解放された前記1枚のワークを搬送することと、
前記ストッカーと前記保持ユニットとの間から前記搬送ユニットを退避させることとを有する、方法。 - 請求項9または10において、
当該方法は、さらに、
前記ストッカーを前記保持ユニットの上方の前記複数のワークを積み上げる位置に移動することと、
前記複数のワークが積み上げられた前記ストッカーを前記保持ユニットの下方に移動することとを有する、方法。
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JP2016042317 | 2016-03-04 | ||
JP2016042317 | 2016-03-04 |
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JP2017160055A true JP2017160055A (ja) | 2017-09-14 |
JP6343049B2 JP6343049B2 (ja) | 2018-06-13 |
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US (1) | US10412868B2 (ja) |
JP (1) | JP6343049B2 (ja) |
KR (1) | KR102043984B1 (ja) |
CN (1) | CN107150906B (ja) |
TW (1) | TWI643801B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101892041B1 (ko) * | 2018-04-26 | 2018-08-27 | 마하선 | 사이즈에 따른 인쇄 회로 기판 분배 시스템 |
WO2019039134A1 (ja) | 2017-08-23 | 2019-02-28 | Jfeスチール株式会社 | 金属板のせん断加工面での変形限界の評価方法、割れ予測方法およびプレス金型の設計方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107973132B (zh) * | 2017-11-16 | 2023-11-14 | 深圳市深精电科技有限公司 | 剥离装置 |
CN111300253B (zh) * | 2020-04-11 | 2021-03-30 | 成都四吉达新材料科技有限公司 | 一种铝单板的表面加工方法 |
CN113751633B (zh) * | 2020-06-04 | 2022-07-22 | 广东博智林机器人有限公司 | 工件放置装置及钢筋笼加工设备 |
CN113353631B (zh) * | 2021-06-24 | 2022-08-09 | 蓝思智能机器人(长沙)有限公司 | 一种分片上料装置 |
CN113636355B (zh) * | 2021-08-09 | 2023-02-14 | 安徽兆拓新能源科技有限公司 | 一种太阳能电池片上料装置 |
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- 2017-02-21 TW TW106105798A patent/TWI643801B/zh active
- 2017-02-27 JP JP2017035414A patent/JP6343049B2/ja active Active
- 2017-02-28 US US15/445,471 patent/US10412868B2/en active Active
- 2017-03-03 KR KR1020170027630A patent/KR102043984B1/ko active IP Right Grant
- 2017-03-06 CN CN201710129347.XA patent/CN107150906B/zh active Active
Patent Citations (5)
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JPS5074080U (ja) * | 1973-11-12 | 1975-06-28 | ||
JPS6072727A (ja) * | 1983-09-30 | 1985-04-24 | Pilot Pen Co Ltd:The | スクリ−ン印刷工程における積載薄板材料の搬送装置 |
JPH01164243U (ja) * | 1988-05-09 | 1989-11-16 | ||
JPH02155300A (ja) * | 1988-12-07 | 1990-06-14 | Matsushita Electric Ind Co Ltd | 基板の搬送装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019039134A1 (ja) | 2017-08-23 | 2019-02-28 | Jfeスチール株式会社 | 金属板のせん断加工面での変形限界の評価方法、割れ予測方法およびプレス金型の設計方法 |
KR101892041B1 (ko) * | 2018-04-26 | 2018-08-27 | 마하선 | 사이즈에 따른 인쇄 회로 기판 분배 시스템 |
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KR20170103694A (ko) | 2017-09-13 |
TW201731751A (zh) | 2017-09-16 |
JP6343049B2 (ja) | 2018-06-13 |
US10412868B2 (en) | 2019-09-10 |
US20170257989A1 (en) | 2017-09-07 |
TWI643801B (zh) | 2018-12-11 |
KR102043984B1 (ko) | 2019-11-12 |
CN107150906A (zh) | 2017-09-12 |
CN107150906B (zh) | 2020-08-07 |
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