JP2016509373A5 - - Google Patents

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Publication number
JP2016509373A5
JP2016509373A5 JP2015557138A JP2015557138A JP2016509373A5 JP 2016509373 A5 JP2016509373 A5 JP 2016509373A5 JP 2015557138 A JP2015557138 A JP 2015557138A JP 2015557138 A JP2015557138 A JP 2015557138A JP 2016509373 A5 JP2016509373 A5 JP 2016509373A5
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JP
Japan
Prior art keywords
substrate
ferromagnetic layer
package
guiding means
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015557138A
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English (en)
Japanese (ja)
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JP6476132B2 (ja
JP2016509373A (ja
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Publication date
Priority claimed from US13/794,558 external-priority patent/US20140225706A1/en
Application filed filed Critical
Publication of JP2016509373A publication Critical patent/JP2016509373A/ja
Publication of JP2016509373A5 publication Critical patent/JP2016509373A5/ja
Application granted granted Critical
Publication of JP6476132B2 publication Critical patent/JP6476132B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015557138A 2013-02-13 2014-02-07 基板内結合インダクタ構造 Expired - Fee Related JP6476132B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361764310P 2013-02-13 2013-02-13
US61/764,310 2013-02-13
US13/794,558 US20140225706A1 (en) 2013-02-13 2013-03-11 In substrate coupled inductor structure
US13/794,558 2013-03-11
PCT/US2014/015380 WO2014126812A1 (en) 2013-02-13 2014-02-07 In substrate coupled inductor structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018228062A Division JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Publications (3)

Publication Number Publication Date
JP2016509373A JP2016509373A (ja) 2016-03-24
JP2016509373A5 true JP2016509373A5 (enExample) 2017-03-02
JP6476132B2 JP6476132B2 (ja) 2019-02-27

Family

ID=51297099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015557138A Expired - Fee Related JP6476132B2 (ja) 2013-02-13 2014-02-07 基板内結合インダクタ構造
JP2018228062A Pending JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018228062A Pending JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Country Status (8)

Country Link
US (1) US20140225706A1 (enExample)
EP (1) EP2956948B1 (enExample)
JP (2) JP6476132B2 (enExample)
KR (1) KR102108707B1 (enExample)
CN (1) CN105009236A (enExample)
ES (1) ES2778872T3 (enExample)
HU (1) HUE049424T2 (enExample)
WO (1) WO2014126812A1 (enExample)

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US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure
US9129843B1 (en) * 2014-06-12 2015-09-08 Globalfoundries Inc. Integrated inductor
WO2016089917A2 (en) * 2014-12-01 2016-06-09 Endura Technologies LLC Switched power stage with integrated passive components
US10236209B2 (en) 2014-12-24 2019-03-19 Intel Corporation Passive components in vias in a stacked integrated circuit package
US9959964B2 (en) 2015-11-13 2018-05-01 Qualcomm Incorporated Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
US20170169934A1 (en) * 2015-12-15 2017-06-15 Globalfoundries Inc. Patterned magnetic shields for inductors and transformers
US10026546B2 (en) 2016-05-20 2018-07-17 Qualcomm Incorported Apparatus with 3D wirewound inductor integrated within a substrate
US10529795B2 (en) 2016-07-27 2020-01-07 Credo Technology Group Ltd. Enhanced inductors suitable for integrated multi-channel receivers
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
US10483910B2 (en) 2017-02-02 2019-11-19 Credo Technology Group Limited Multiport inductors for enhanced signal distribution
CN109314095B (zh) * 2017-04-10 2023-07-21 默升科技集团有限公司 笼式屏蔽中介层电感
US10784243B2 (en) 2018-06-04 2020-09-22 Globalfoundries Inc. Uniplanar (single layer) passive circuitry
KR102342732B1 (ko) 2021-03-15 2021-12-23 서울대학교산학협력단 주기적인 금속 패턴 구조를 이용하여 q 인자가 향상된 인덕터 소자

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US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure

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