ES2778872T3 - Estructura de inductor acoplada en sustrato - Google Patents

Estructura de inductor acoplada en sustrato Download PDF

Info

Publication number
ES2778872T3
ES2778872T3 ES14706428T ES14706428T ES2778872T3 ES 2778872 T3 ES2778872 T3 ES 2778872T3 ES 14706428 T ES14706428 T ES 14706428T ES 14706428 T ES14706428 T ES 14706428T ES 2778872 T3 ES2778872 T3 ES 2778872T3
Authority
ES
Spain
Prior art keywords
inductor
substrate
silicon substrate
implementations
inductor winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES14706428T
Other languages
English (en)
Spanish (es)
Inventor
James Thomas Doyle
Farsheed Mahmoudi
Arani Amirali Shayan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Application granted granted Critical
Publication of ES2778872T3 publication Critical patent/ES2778872T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2871—Pancake coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H10W44/501—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
    • H10W70/60—
    • H10W74/15—
    • H10W90/00—
    • H10W90/24—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES14706428T 2013-02-13 2014-02-07 Estructura de inductor acoplada en sustrato Active ES2778872T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361764310P 2013-02-13 2013-02-13
US13/794,558 US20140225706A1 (en) 2013-02-13 2013-03-11 In substrate coupled inductor structure
PCT/US2014/015380 WO2014126812A1 (en) 2013-02-13 2014-02-07 In substrate coupled inductor structure

Publications (1)

Publication Number Publication Date
ES2778872T3 true ES2778872T3 (es) 2020-08-12

Family

ID=51297099

Family Applications (1)

Application Number Title Priority Date Filing Date
ES14706428T Active ES2778872T3 (es) 2013-02-13 2014-02-07 Estructura de inductor acoplada en sustrato

Country Status (8)

Country Link
US (1) US20140225706A1 (enExample)
EP (1) EP2956948B1 (enExample)
JP (2) JP6476132B2 (enExample)
KR (1) KR102108707B1 (enExample)
CN (1) CN105009236A (enExample)
ES (1) ES2778872T3 (enExample)
HU (1) HUE049424T2 (enExample)
WO (1) WO2014126812A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure
US9129843B1 (en) * 2014-06-12 2015-09-08 Globalfoundries Inc. Integrated inductor
WO2016089917A2 (en) * 2014-12-01 2016-06-09 Endura Technologies LLC Switched power stage with integrated passive components
US10236209B2 (en) * 2014-12-24 2019-03-19 Intel Corporation Passive components in vias in a stacked integrated circuit package
US9959964B2 (en) 2015-11-13 2018-05-01 Qualcomm Incorporated Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
US20170169934A1 (en) * 2015-12-15 2017-06-15 Globalfoundries Inc. Patterned magnetic shields for inductors and transformers
US10026546B2 (en) 2016-05-20 2018-07-17 Qualcomm Incorported Apparatus with 3D wirewound inductor integrated within a substrate
CN108701525B (zh) 2016-07-27 2020-07-31 默升科技集团有限公司 适用于集成多信道接收器的增强型电感器
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
US10483910B2 (en) 2017-02-02 2019-11-19 Credo Technology Group Limited Multiport inductors for enhanced signal distribution
US10818608B2 (en) * 2017-04-10 2020-10-27 Credo Technology Group Limited Cage-shielded interposer inductances
US10784243B2 (en) 2018-06-04 2020-09-22 Globalfoundries Inc. Uniplanar (single layer) passive circuitry
KR102342732B1 (ko) 2021-03-15 2021-12-23 서울대학교산학협력단 주기적인 금속 패턴 구조를 이용하여 q 인자가 향상된 인덕터 소자

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206621A (en) * 1990-07-02 1993-04-27 General Electric Company Barrel-wound conductive film transformer
JP3102125B2 (ja) * 1992-02-28 2000-10-23 富士電機株式会社 薄膜磁気素子
JPH06267746A (ja) * 1993-03-09 1994-09-22 Murata Mfg Co Ltd ノイズ除去部品
US6252487B1 (en) * 1997-11-04 2001-06-26 Philips Electronics North America Corporation Planar magnetic component with transverse winding pattern
US6417753B1 (en) * 2000-02-17 2002-07-09 Koninklijke Philips Electronics N.V. Planar magnetic device without center core leg
US6512285B1 (en) * 2001-10-05 2003-01-28 Skyworks Solutions, Inc. High inductance inductor in a semiconductor package
US6794978B2 (en) * 2002-05-15 2004-09-21 John C. Tung Accurate multi-ground inductors for high-speed integrated circuits
JP2004319675A (ja) * 2003-04-15 2004-11-11 Matsushita Electric Ind Co Ltd カーボンナノチューブインダクタおよびその製造方法
GB0321658D0 (en) * 2003-09-16 2003-10-15 South Bank Univ Entpr Ltd Bifilar transformer
US7791440B2 (en) * 2004-06-09 2010-09-07 Agency For Science, Technology And Research Microfabricated system for magnetic field generation and focusing
US7569918B2 (en) * 2006-05-01 2009-08-04 Texas Instruments Incorporated Semiconductor package-on-package system including integrated passive components
JP2008103603A (ja) * 2006-10-20 2008-05-01 Seiko Epson Corp 電子基板および電子機器
US20080186123A1 (en) * 2007-02-07 2008-08-07 Industrial Technology Research Institute Inductor devices
US7841070B2 (en) * 2007-08-21 2010-11-30 Intel Corporation Method of fabricating a transformer device
US8149080B2 (en) * 2007-09-25 2012-04-03 Infineon Technologies Ag Integrated circuit including inductive device and ferromagnetic material
JP2009111036A (ja) * 2007-10-29 2009-05-21 Fuji Electric Device Technology Co Ltd 薄膜トランスおよびその製造方法
US7986209B2 (en) * 2007-11-20 2011-07-26 Intel Corporation Inductor using bulk metallic glass material
US8217748B2 (en) * 2007-11-23 2012-07-10 Alpha & Omega Semiconductor Inc. Compact inductive power electronics package
US7911313B2 (en) * 2008-07-02 2011-03-22 Intel Corporation Inductors for integrated circuit packages
US9190201B2 (en) * 2009-03-04 2015-11-17 Qualcomm Incorporated Magnetic film enhanced inductor
JP4654317B1 (ja) * 2009-07-16 2011-03-16 株式会社神戸製鋼所 リアクトル
US20110050334A1 (en) * 2009-09-02 2011-03-03 Qualcomm Incorporated Integrated Voltage Regulator with Embedded Passive Device(s)
WO2011033496A1 (en) * 2009-09-16 2011-03-24 Maradin Technologies Ltd. Micro coil apparatus and manufacturing methods therefor
CN101764128A (zh) * 2009-12-31 2010-06-30 锐迪科科技有限公司 半导体器件封装结构中的电感
JP5307105B2 (ja) * 2010-01-06 2013-10-02 株式会社神戸製鋼所 複合型巻線素子ならびにこれを用いた変圧器、変圧システムおよびノイズカットフィルタ用複合型巻線素子
WO2011103259A2 (en) * 2010-02-19 2011-08-25 University Of Florida Research Foundation, Inc. Power inductors in silicon
JP2012033764A (ja) * 2010-07-30 2012-02-16 Toshiba Corp 電磁シールドシートとその製造方法
US9287344B2 (en) * 2010-08-23 2016-03-15 The Hong Kong University Of Science And Technology Monolithic magnetic induction device
CN103430256B (zh) * 2011-01-04 2016-06-01 Aac微技术有限公司 包括平面线圈的线圈组件
KR101817159B1 (ko) * 2011-02-17 2018-02-22 삼성전자 주식회사 Ｔｓｖ를 가지는 인터포저를 포함하는 반도체 패키지 및 그 제조 방법
US9679863B2 (en) * 2011-09-23 2017-06-13 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming interconnect substrate for FO-WLCSP
US8963671B2 (en) * 2012-08-31 2015-02-24 Advanced Semiconductor Engineering, Inc. Semiconductor transformer device and method for manufacturing the same
US20140225706A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated In substrate coupled inductor structure

Also Published As

Publication number Publication date
WO2014126812A1 (en) 2014-08-21
KR20150119039A (ko) 2015-10-23
JP6476132B2 (ja) 2019-02-27
CN105009236A (zh) 2015-10-28
US20140225706A1 (en) 2014-08-14
JP2019062217A (ja) 2019-04-18
HUE049424T2 (hu) 2020-09-28
JP2016509373A (ja) 2016-03-24
EP2956948B1 (en) 2019-12-18
EP2956948A1 (en) 2015-12-23
KR102108707B1 (ko) 2020-05-28

Similar Documents

Publication Publication Date Title
ES2778872T3 (es) Estructura de inductor acoplada en sustrato
EP2954543B1 (en) Substrate-less discrete coupled inductor structure
ES2585118T3 (es) Bobina en placa de circuito impreso de baja resistencia en serie equivalente y alta circulación de corriente para aplicación de transferencia de potencia
EP2954555B1 (en) Small form factor magnetic shield for magnetoresistive random access memory (mram)
CN109427461A (zh) 电感器部件
ES2895077T3 (es) Inductor incorporado en un sustrato de encapsulado
JP6377178B2 (ja) 埋込型パッケージ基板コンデンサ
JP6280244B2 (ja) 構成可能／制御可能等価直列抵抗を有する埋込みパッケージ基板キャパシタ
US20140253279A1 (en) Coupled discrete inductor with flux concentration using high permeable material
US20170133148A1 (en) Solenoid inductor
TW201730902A (zh) 具有被形成在核心上的線圈之電子封裝體
JP2010237058A (ja) センサ装置およびその製造方法