JP2016152370A5 - - Google Patents
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- Publication number
- JP2016152370A5 JP2016152370A5 JP2015030213A JP2015030213A JP2016152370A5 JP 2016152370 A5 JP2016152370 A5 JP 2016152370A5 JP 2015030213 A JP2015030213 A JP 2015030213A JP 2015030213 A JP2015030213 A JP 2015030213A JP 2016152370 A5 JP2016152370 A5 JP 2016152370A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon wafer
- processed
- silicon
- producing
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 22
- 229910052710 silicon Inorganic materials 0.000 claims 22
- 239000010703 silicon Substances 0.000 claims 22
- 238000000034 method Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000013078 crystal Substances 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052724 xenon Inorganic materials 0.000 claims 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015030213A JP6044660B2 (ja) | 2015-02-19 | 2015-02-19 | シリコンウェーハの製造方法 |
| PCT/JP2016/000050 WO2016132661A1 (ja) | 2015-02-19 | 2016-01-07 | シリコンウェーハの製造方法 |
| KR1020177022568A KR102317547B1 (ko) | 2015-02-19 | 2016-01-07 | 실리콘 웨이퍼의 제조방법 |
| DE112016000465.6T DE112016000465B4 (de) | 2015-02-19 | 2016-01-07 | Verfahren zur Fertigung von Silicium-Wafern |
| CN201680006293.1A CN107210223B (zh) | 2015-02-19 | 2016-01-07 | 硅晶圆的制造方法 |
| US15/544,359 US10297463B2 (en) | 2015-02-19 | 2016-01-07 | Method for manufacturing silicon wafer |
| TW105100715A TWI625789B (zh) | 2015-02-19 | 2016-01-11 | 矽 Wafer manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015030213A JP6044660B2 (ja) | 2015-02-19 | 2015-02-19 | シリコンウェーハの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016152370A JP2016152370A (ja) | 2016-08-22 |
| JP2016152370A5 true JP2016152370A5 (enExample) | 2016-10-13 |
| JP6044660B2 JP6044660B2 (ja) | 2016-12-14 |
Family
ID=56689388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015030213A Active JP6044660B2 (ja) | 2015-02-19 | 2015-02-19 | シリコンウェーハの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10297463B2 (enExample) |
| JP (1) | JP6044660B2 (enExample) |
| KR (1) | KR102317547B1 (enExample) |
| CN (1) | CN107210223B (enExample) |
| DE (1) | DE112016000465B4 (enExample) |
| TW (1) | TWI625789B (enExample) |
| WO (1) | WO2016132661A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR112018004894B1 (pt) * | 2015-09-29 | 2021-03-16 | Kimberly-Clark Worldwide, Inc | substrato e método para sua fabricação |
| JP6810591B2 (ja) * | 2016-12-12 | 2021-01-06 | 株式会社Ｓｃｒｅｅｎホールディングス | シリコン基板の熱処理方法 |
| DE102016225138A1 (de) * | 2016-12-15 | 2018-06-21 | Siltronic Ag | Halbleiterscheibe aus einkristallinem Silizium und Verfahren zur Herstellung einer Halbleiterscheibe aus einkristallinem Silizium |
| JP6731161B2 (ja) * | 2017-04-26 | 2020-07-29 | 信越半導体株式会社 | シリコン単結晶の欠陥領域特定方法 |
| CN109576796A (zh) * | 2017-09-29 | 2019-04-05 | 胜高股份有限公司 | 硅外延晶片的制备方法 |
| CN109576795A (zh) * | 2017-09-29 | 2019-04-05 | 胜高股份有限公司 | 硅外延晶片的制备方法 |
| JP7057122B2 (ja) | 2017-12-22 | 2022-04-19 | グローバルウェーハズ・ジャパン株式会社 | 金属汚染評価方法 |
| JP6897598B2 (ja) * | 2018-02-16 | 2021-06-30 | 信越半導体株式会社 | シリコン単結晶ウェーハの熱処理方法 |
| DE102018203945B4 (de) | 2018-03-15 | 2023-08-10 | Siltronic Ag | Verfahren zur Herstellung von Halbleiterscheiben |
| KR102741720B1 (ko) * | 2019-04-16 | 2024-12-11 | 신에쯔 한도타이 가부시키가이샤 | 실리콘 단결정 웨이퍼의 제조방법 및 실리콘 단결정 웨이퍼 |
| JP7207204B2 (ja) * | 2019-07-02 | 2023-01-18 | 信越半導体株式会社 | 炭素ドープシリコン単結晶ウェーハの製造方法 |
| CN110571172A (zh) * | 2019-09-06 | 2019-12-13 | 大同新成新材料股份有限公司 | 一种硅晶圆制造方法及制造装置 |
| EP4151782B1 (de) * | 2021-09-16 | 2024-02-21 | Siltronic AG | Verfahren zur herstellung einer halbleiterscheibe aus einkristallinem silizium und halbleiterscheibe aus einkristallinem silizium |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503009B1 (enExample) | 1968-12-19 | 1975-01-30 | ||
| US6485807B1 (en) | 1997-02-13 | 2002-11-26 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects, and methods of preparing the same |
| DE69806369T2 (de) | 1997-04-09 | 2003-07-10 | Memc Electronic Materials, Inc. | Silicium mit niedriger fehlerdichte und idealem sauerstoffniederschlag |
| US5882989A (en) | 1997-09-22 | 1999-03-16 | Memc Electronic Materials, Inc. | Process for the preparation of silicon wafers having a controlled distribution of oxygen precipitate nucleation centers |
| KR100378184B1 (ko) | 1999-11-13 | 2003-03-29 | 삼성전자주식회사 | 제어된 결함 분포를 갖는 실리콘 웨이퍼, 그의 제조공정및 단결정 실리콘 잉곳의 제조를 위한 초크랄스키 풀러 |
| JP4720058B2 (ja) * | 2000-11-28 | 2011-07-13 | 株式会社Sumco | シリコンウェーハの製造方法 |
| JP2003297839A (ja) * | 2002-04-03 | 2003-10-17 | Sumitomo Mitsubishi Silicon Corp | シリコンウエーハの熱処理方法 |
| JP4699675B2 (ja) * | 2002-10-08 | 2011-06-15 | 信越半導体株式会社 | アニールウェーハの製造方法 |
| JP5239155B2 (ja) * | 2006-06-20 | 2013-07-17 | 信越半導体株式会社 | シリコンウエーハの製造方法 |
| JP5167654B2 (ja) | 2007-02-26 | 2013-03-21 | 信越半導体株式会社 | シリコン単結晶ウエーハの製造方法 |
| US20080292523A1 (en) | 2007-05-23 | 2008-11-27 | Sumco Corporation | Silicon single crystal wafer and the production method |
| JP5211550B2 (ja) * | 2007-05-25 | 2013-06-12 | 株式会社Ｓｕｍｃｏ | シリコン単結晶ウェーハの製造方法 |
| EP2722423B1 (en) | 2009-03-25 | 2017-01-11 | Sumco Corporation | Method of manufacturing a silicon wafer |
| JP5613994B2 (ja) * | 2009-04-14 | 2014-10-29 | 株式会社Sumco | シリコンウェーハおよびその製造方法 |
| KR101657970B1 (ko) * | 2009-04-13 | 2016-09-20 | 신에쯔 한도타이 가부시키가이샤 | 어닐 웨이퍼 및 어닐 웨이퍼의 제조방법, 그리고 디바이스의 제조방법 |
| JP5439305B2 (ja) * | 2010-07-14 | 2014-03-12 | 信越半導体株式会社 | シリコン基板の製造方法及びシリコン基板 |
| JP5572569B2 (ja) | 2011-02-24 | 2014-08-13 | 信越半導体株式会社 | シリコン基板の製造方法及びシリコン基板 |
-
2015
- 2015-02-19 JP JP2015030213A patent/JP6044660B2/ja active Active
-
2016
- 2016-01-07 CN CN201680006293.1A patent/CN107210223B/zh active Active
- 2016-01-07 DE DE112016000465.6T patent/DE112016000465B4/de active Active
- 2016-01-07 KR KR1020177022568A patent/KR102317547B1/ko active Active
- 2016-01-07 US US15/544,359 patent/US10297463B2/en active Active
- 2016-01-07 WO PCT/JP2016/000050 patent/WO2016132661A1/ja not_active Ceased
- 2016-01-11 TW TW105100715A patent/TWI625789B/zh active
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