JP2015521390A5 - - Google Patents
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- JP2015521390A5 JP2015521390A5 JP2014552415A JP2014552415A JP2015521390A5 JP 2015521390 A5 JP2015521390 A5 JP 2015521390A5 JP 2014552415 A JP2014552415 A JP 2014552415A JP 2014552415 A JP2014552415 A JP 2014552415A JP 2015521390 A5 JP2015521390 A5 JP 2015521390A5
- Authority
- JP
- Japan
- Prior art keywords
- converter
- output
- substrate
- unit
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 10
- 238000001514 detection method Methods 0.000 description 8
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261655237P | 2012-06-04 | 2012-06-04 | |
| US61/655,237 | 2012-06-04 | ||
| PCT/JP2013/003440 WO2013183266A2 (en) | 2012-06-04 | 2013-05-31 | Semiconductor device and sensing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015521390A JP2015521390A (ja) | 2015-07-27 |
| JP2015521390A5 true JP2015521390A5 (enExample) | 2016-06-30 |
Family
ID=48614093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014552415A Pending JP2015521390A (ja) | 2012-06-04 | 2013-05-31 | 半導体装置及び検出システム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9607971B2 (enExample) |
| EP (1) | EP2856750A2 (enExample) |
| JP (1) | JP2015521390A (enExample) |
| KR (1) | KR20150027061A (enExample) |
| CN (1) | CN104471925B (enExample) |
| TW (1) | TWI599015B (enExample) |
| WO (1) | WO2013183266A2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8427891B2 (en) * | 2007-04-17 | 2013-04-23 | Rambus Inc. | Hybrid volatile and non-volatile memory device with a shared interface circuit |
| US9478579B2 (en) * | 2012-10-16 | 2016-10-25 | Omnivision Technologies, Inc. | Stacked chip image sensor with light-sensitive circuit elements on the bottom chip |
| JP6494263B2 (ja) * | 2014-02-19 | 2019-04-03 | キヤノン株式会社 | 撮像素子及び電子機器 |
| TWI648986B (zh) | 2014-04-15 | 2019-01-21 | 日商新力股份有限公司 | 攝像元件、電子機器 |
| JP6539987B2 (ja) * | 2014-11-10 | 2019-07-10 | 株式会社ニコン | 撮像素子および撮像装置 |
| JP6218799B2 (ja) * | 2015-01-05 | 2017-10-25 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| US10070088B2 (en) | 2015-01-05 | 2018-09-04 | Canon Kabushiki Kaisha | Image sensor and image capturing apparatus for simultaneously performing focus detection and image generation |
| US10145942B2 (en) | 2015-03-27 | 2018-12-04 | Intel Corporation | Techniques for spatio-temporal compressed time of flight imaging |
| JP6272387B2 (ja) * | 2015-05-29 | 2018-01-31 | キヤノン株式会社 | 撮像素子および撮像装置 |
| JP6652285B2 (ja) * | 2015-08-03 | 2020-02-19 | キヤノン株式会社 | 固体撮像装置 |
| JP6265962B2 (ja) * | 2015-11-27 | 2018-01-24 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| KR102464716B1 (ko) | 2015-12-16 | 2022-11-07 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| JP2017174994A (ja) * | 2016-03-24 | 2017-09-28 | ソニー株式会社 | 撮像装置、電子機器 |
| JP2017175004A (ja) * | 2016-03-24 | 2017-09-28 | ソニー株式会社 | チップサイズパッケージ、製造方法、電子機器、および内視鏡 |
| JP6724980B2 (ja) * | 2016-03-29 | 2020-07-15 | 株式会社ニコン | 撮像素子および撮像装置 |
| JP6919154B2 (ja) * | 2016-03-31 | 2021-08-18 | ソニーグループ株式会社 | 固体撮像素子、撮像装置、および電子機器 |
| JP6779825B2 (ja) * | 2017-03-30 | 2020-11-04 | キヤノン株式会社 | 半導体装置および機器 |
| KR102275684B1 (ko) | 2017-04-18 | 2021-07-13 | 삼성전자주식회사 | 반도체 패키지 |
| JP7278209B2 (ja) * | 2017-04-25 | 2023-05-19 | ヌヴォトンテクノロジージャパン株式会社 | 固体撮像装置および撮像装置 |
| KR102477352B1 (ko) * | 2017-09-29 | 2022-12-15 | 삼성전자주식회사 | 반도체 패키지 및 이미지 센서 |
| JP6708620B2 (ja) * | 2017-12-15 | 2020-06-10 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| JP7527755B2 (ja) * | 2018-02-09 | 2024-08-05 | キヤノン株式会社 | 光電変換装置および撮像システム |
| KR102598041B1 (ko) | 2018-02-28 | 2023-11-07 | 삼성전자주식회사 | 이미지 센서 칩 |
| KR102765858B1 (ko) | 2019-02-08 | 2025-02-12 | 삼성전자주식회사 | 이미지 센서 장치 |
| KR102661820B1 (ko) | 2019-02-11 | 2024-05-02 | 삼성전자주식회사 | 이미지 센서 및 그것의 구동 방법 |
| US10672101B1 (en) * | 2019-03-04 | 2020-06-02 | Omnivision Technologies, Inc. | DRAM with simultaneous read and write for multiwafer image sensors |
| TW202127637A (zh) * | 2019-11-19 | 2021-07-16 | 日商索尼半導體解決方案公司 | 受光元件、測距模組 |
| EP4099684A4 (en) * | 2020-01-31 | 2023-07-05 | Sony Semiconductor Solutions Corporation | Imaging device and imaging method |
| CN116075943A (zh) * | 2020-09-25 | 2023-05-05 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
| US20240276105A1 (en) * | 2021-05-24 | 2024-08-15 | Nikon Corporation | Imaging element and imaging device |
| TW202308372A (zh) * | 2021-06-22 | 2023-02-16 | 美商元平台技術有限公司 | 多層堆疊的相機影像感測電路 |
| TW202320535A (zh) * | 2021-10-08 | 2023-05-16 | 日商索尼半導體解決方案公司 | 攝像裝置 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19732755A1 (de) | 1997-07-30 | 1998-02-05 | Sika Werke Gmbh | Mehrstufig reaktive Heißklebefolie zur Herstellung von flexiblen oder starren Mehrlagenschaltungen |
| US6177333B1 (en) * | 1999-01-14 | 2001-01-23 | Micron Technology, Inc. | Method for making a trench isolation for semiconductor devices |
| US6984571B1 (en) * | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
| JP2001127302A (ja) * | 1999-10-28 | 2001-05-11 | Hitachi Ltd | 半導体薄膜基板、半導体装置、半導体装置の製造方法および電子装置 |
| JP2001251610A (ja) | 2000-03-06 | 2001-09-14 | Canon Inc | 撮像システム、画像処理装置及び方法並びに記憶媒体 |
| RU2190251C2 (ru) | 2000-03-21 | 2002-09-27 | Леонтьев Владимир Васильевич | Устройство накопления и обработки информации |
| US7170049B2 (en) * | 2003-12-30 | 2007-01-30 | Dxray, Inc. | Pixelated cadmium zinc telluride based photon counting mode detector |
| JP2005235825A (ja) * | 2004-02-17 | 2005-09-02 | Renesas Technology Corp | 電子回路モジュール |
| TW201101476A (en) | 2005-06-02 | 2011-01-01 | Sony Corp | Semiconductor image sensor module and method of manufacturing the same |
| US7362583B2 (en) * | 2005-12-30 | 2008-04-22 | Ati Technologies Inc. | Thermal management device for multiple heat producing devices |
| JP4289377B2 (ja) * | 2006-08-21 | 2009-07-01 | ソニー株式会社 | 物理量検出装置及び撮像装置 |
| US7400505B2 (en) * | 2006-10-10 | 2008-07-15 | International Business Machines Corporation | Hybrid cooling system and method for a multi-component electronics system |
| US7408776B2 (en) * | 2006-10-10 | 2008-08-05 | International Business Machines Corporation | Conductive heat transport cooling system and method for a multi-component electronics system |
| JP2008193359A (ja) | 2007-02-02 | 2008-08-21 | Olympus Imaging Corp | 撮像モジュール及び撮像素子パッケージ |
| JP2009005262A (ja) | 2007-06-25 | 2009-01-08 | Olympus Imaging Corp | 半導体装置および撮像装置 |
| US7884457B2 (en) | 2007-06-26 | 2011-02-08 | Stats Chippac Ltd. | Integrated circuit package system with dual side connection |
| JP2009134828A (ja) | 2007-11-30 | 2009-06-18 | Toshiba Corp | 半導体装置 |
| JP2010283787A (ja) | 2009-06-08 | 2010-12-16 | Panasonic Corp | 撮像装置 |
| JP5685898B2 (ja) | 2010-01-08 | 2015-03-18 | ソニー株式会社 | 半導体装置、固体撮像装置、およびカメラシステム |
| KR20110124065A (ko) | 2010-05-10 | 2011-11-16 | 하나 마이크론(주) | 적층형 반도체 패키지 |
| JP5974425B2 (ja) * | 2010-05-20 | 2016-08-23 | ソニー株式会社 | 固体撮像装置及びその製造方法並びに電子機器 |
| JP5633323B2 (ja) * | 2010-11-11 | 2014-12-03 | ソニー株式会社 | 固体撮像装置及び電子機器 |
| CN102158787B (zh) * | 2011-03-15 | 2015-01-28 | 迈尔森电子(天津)有限公司 | Mems麦克风与压力集成传感器及其制作方法 |
| JP5907687B2 (ja) * | 2011-09-14 | 2016-04-26 | オリンパス株式会社 | 撮像装置および信号転送装置 |
| US8890047B2 (en) * | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
-
2013
- 2013-05-24 US US13/901,953 patent/US9607971B2/en not_active Expired - Fee Related
- 2013-05-28 TW TW102118830A patent/TWI599015B/zh not_active IP Right Cessation
- 2013-05-31 WO PCT/JP2013/003440 patent/WO2013183266A2/en not_active Ceased
- 2013-05-31 EP EP13728539.1A patent/EP2856750A2/en not_active Ceased
- 2013-05-31 CN CN201380027835.XA patent/CN104471925B/zh not_active Expired - Fee Related
- 2013-05-31 JP JP2014552415A patent/JP2015521390A/ja active Pending
- 2013-05-31 KR KR1020147033189A patent/KR20150027061A/ko not_active Ceased
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