JP2015516352A5 - - Google Patents

Download PDF

Info

Publication number
JP2015516352A5
JP2015516352A5 JP2014559989A JP2014559989A JP2015516352A5 JP 2015516352 A5 JP2015516352 A5 JP 2015516352A5 JP 2014559989 A JP2014559989 A JP 2014559989A JP 2014559989 A JP2014559989 A JP 2014559989A JP 2015516352 A5 JP2015516352 A5 JP 2015516352A5
Authority
JP
Japan
Prior art keywords
substrate
region
recess
compression
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2014559989A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015516352A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/028022 external-priority patent/WO2013130608A1/en
Publication of JP2015516352A publication Critical patent/JP2015516352A/ja
Publication of JP2015516352A5 publication Critical patent/JP2015516352A5/ja
Ceased legal-status Critical Current

Links

JP2014559989A 2012-02-29 2013-02-27 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品 Ceased JP2015516352A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261604544P 2012-02-29 2012-02-29
US61/604,544 2012-02-29
PCT/US2013/028022 WO2013130608A1 (en) 2012-02-29 2013-02-27 Methods and apparatus for machining strengthened glass and articles produced thereby

Publications (2)

Publication Number Publication Date
JP2015516352A JP2015516352A (ja) 2015-06-11
JP2015516352A5 true JP2015516352A5 (OSRAM) 2016-04-14

Family

ID=49003161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014559989A Ceased JP2015516352A (ja) 2012-02-29 2013-02-27 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品

Country Status (6)

Country Link
US (1) US9227868B2 (OSRAM)
JP (1) JP2015516352A (OSRAM)
KR (1) KR20140131520A (OSRAM)
CN (1) CN104114506B (OSRAM)
TW (1) TWI573186B (OSRAM)
WO (1) WO2013130608A1 (OSRAM)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) * 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
DE102013005136A1 (de) * 2013-03-26 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zurn Abtragen von sprödhartem Material mittels Laserstrahlung
US9328011B2 (en) * 2013-06-04 2016-05-03 Coherent, Inc. Laser-scribing of chemically strengthened glass
CN104513004B (zh) * 2013-09-30 2018-04-24 鸿富锦精密工业（深圳）有限公司 化学强化玻璃的切割方法
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
LT3169477T (lt) * 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
DE102015104802A1 (de) 2015-03-27 2016-09-29 Schott Ag Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis
US20160368086A1 (en) * 2015-06-16 2016-12-22 Electro Scientific Industries, Inc. Methods and apparatus for processing transparent materials
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US10442720B2 (en) * 2015-10-01 2019-10-15 AGC Inc. Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole
FR3050990B1 (fr) * 2016-05-03 2018-05-18 Saint-Gobain Glass France Faconnage de verre apres trempe
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN108381042A (zh) * 2018-03-23 2018-08-10 伊欧激光科技（苏州）有限公司 晶片加工系统及晶片加工方法
US11052490B2 (en) 2018-04-27 2021-07-06 The Boeing Company Inner barrel of an engine inlet with laser-machined acoustic perforations
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
CN109128513B (zh) * 2018-08-27 2020-09-29 蓝思科技（长沙）有限公司 一种盲孔的加工方法
JP7368110B2 (ja) * 2019-06-05 2023-10-24 株式会社ディスコ 切削ブレードの製造方法、及び切削ブレード

Family Cites Families (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4702042A (en) 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
US4828900A (en) 1987-12-23 1989-05-09 Ppg Industries, Inc. Discrete glass cutting and edge shaping
GB2227965B (en) 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
ATE199046T1 (de) 1990-05-09 2001-02-15 Canon Kk Erzeugung von mustern und herstellungsverfahren für halbleiteranordnungen mit diesem muster
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5637244A (en) 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
US5665134A (en) 1995-06-07 1997-09-09 Hughes Missile Systems Company Laser machining of glass-ceramic materials
US6373026B1 (en) 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
EP0847317B1 (en) 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
US6820330B1 (en) 1996-12-13 2004-11-23 Tessera, Inc. Method for forming a multi-layer circuit assembly
US5973290A (en) 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
JP3957010B2 (ja) 1997-06-04 2007-08-08 日本板硝子株式会社 微細孔を有するガラス基材
US6577472B2 (en) 1997-07-24 2003-06-10 Hitachi, Ltd. Glass substrate for a magnetic disk, a magnetic disk which can be formed with a stable texture
DE19741329C1 (de) 1997-09-19 1998-10-22 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Materialbearbeitung mit Plasma induzierender Hochenergiestrahlung
JPH11134645A (ja) 1997-10-30 1999-05-21 Hoya Corp 情報記録媒体用ガラス基板及びその製造方法
JP3449201B2 (ja) * 1997-11-28 2003-09-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
DE10029110B4 (de) 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren für die Materialbearbeitung und Verwendung desselben
US6795274B1 (en) 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
US6878900B2 (en) 2000-01-27 2005-04-12 National Research Council Of Canada Method and apparatus for repair of defects in materials with short laser pulses
US20010035447A1 (en) 2000-05-05 2001-11-01 Andreas Gartner Methods for laser cut initiation
JP2001354439A (ja) 2000-06-12 2001-12-25 Matsushita Electric Ind Co Ltd ガラス基板の加工方法および高周波回路の製作方法
JP4786783B2 (ja) * 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP3722731B2 (ja) 2000-09-13 2005-11-30 浜松ホトニクス株式会社 レーザ加工方法
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
AU2001249140A1 (en) 2000-09-20 2002-04-02 Electro Scientific Industries, Inc. Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
JP4150155B2 (ja) 2000-10-10 2008-09-17 株式会社日立製作所 情報記録媒体、情報の記録方法、再生方法、記録記録装置及び情報再生装置
US6962279B1 (en) 2000-10-18 2005-11-08 Ge Medical Systems Global Technology Company, Llc Apparatus and method for glass separation for flat panel displays
JP4512786B2 (ja) 2000-11-17 2010-07-28 独立行政法人産業技術総合研究所 ガラス基板の加工方法
US6812430B2 (en) 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
US20030044539A1 (en) 2001-02-06 2003-03-06 Oswald Robert S. Process for producing photovoltaic devices
JP2002241141A (ja) 2001-02-08 2002-08-28 Nippon Steel Techno Research Corp レーザによるガラスの加工方法及び装置
JP4631196B2 (ja) * 2001-04-04 2011-02-16 ソニー株式会社 ガラス基板の製造方法およびガラス基板の製造装置
WO2003002289A1 (en) 2001-06-28 2003-01-09 Electro Scientific Industries, Inc. Multistep laser processing of wafers supporting surface device layers
US6642476B2 (en) 2001-07-23 2003-11-04 Siemens Automative Corporation Apparatus and method of forming orifices and chamfers for uniform orifice coefficient and surface properties by laser
US6521862B1 (en) 2001-10-09 2003-02-18 International Business Machines Corporation Apparatus and method for improving chamfer quality of disk edge surfaces with laser treatment
US6642477B1 (en) 2001-10-23 2003-11-04 Imra America, Inc. Method for laser drilling a counter-tapered through-hole in a material
US7553390B2 (en) * 2001-11-08 2009-06-30 Sharp Kabushiki Kaisha Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device
JP2003160348A (ja) 2001-11-21 2003-06-03 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
US6720519B2 (en) 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
JP2003226551A (ja) 2002-02-05 2003-08-12 Nippon Sheet Glass Co Ltd 微細孔を有するガラス板およびその製造方法
RU2226183C2 (ru) 2002-02-21 2004-03-27 Алексеев Андрей Михайлович Способ резки прозрачных неметаллических материалов
JP4267240B2 (ja) 2002-02-22 2009-05-27 日本板硝子株式会社 ガラス構造物の製造方法
US6756563B2 (en) 2002-03-07 2004-06-29 Orbotech Ltd. System and method for forming holes in substrates containing glass
FR2839508B1 (fr) * 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
US6809291B1 (en) 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
KR100497820B1 (ko) 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
CA2424442C (en) 2003-03-31 2011-09-20 Institut National D'optique Method for engraving materials using laser etched v-grooves
JP2004299969A (ja) 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
JP2004343008A (ja) 2003-05-19 2004-12-02 Disco Abrasive Syst Ltd レーザ光線を利用した被加工物分割方法
US6949449B2 (en) * 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
US20050087522A1 (en) 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
JP2005268752A (ja) 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ
FI120082B (fi) 2004-03-18 2009-06-30 Antti Salminen Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä
DE102004020737A1 (de) 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
DE102004024475A1 (de) 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
US7060933B2 (en) 2004-06-08 2006-06-13 Igor Troitski Method and laser system for production of laser-induced images inside and on the surface of transparent material
JP4916312B2 (ja) 2004-07-30 2012-04-11 三星ダイヤモンド工業株式会社 基板の垂直クラック形成方法および垂直クラック形成装置
US7598167B2 (en) 2004-08-24 2009-10-06 Micron Technology, Inc. Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
US7378342B2 (en) 2004-08-27 2008-05-27 Micron Technology, Inc. Methods for forming vias varying lateral dimensions
US7528342B2 (en) 2005-02-03 2009-05-05 Laserfacturing, Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
US20070012665A1 (en) 2005-07-12 2007-01-18 Hewlett-Packard Development Company Lp Laser ablation
JP2007283318A (ja) 2006-04-13 2007-11-01 Seiko Epson Corp 基体の製造方法、レーザ加工装置、表示装置、電気光学装置、電子機器
JP2007290011A (ja) 2006-04-26 2007-11-08 Seiko Epson Corp 基板ならびに基板の分断方法、電気光学装置、電子機器
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20070272666A1 (en) 2006-05-25 2007-11-29 O'brien James N Infrared laser wafer scribing using short pulses
JP2007319881A (ja) 2006-05-31 2007-12-13 Seiko Epson Corp 基体の製造方法、レーザ加工装置、表示装置、電気光学装置、電子機器
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US20080093775A1 (en) 2006-08-19 2008-04-24 Colorado State University Research Foundation Nanometer-scale ablation using focused, coherent extreme ultraviolet/soft x-ray light
DE102006046313B3 (de) 2006-09-29 2008-01-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Anordnung zum Strukturieren einer lichtleitenden Faser entlang deren Längsachse (longitudinale Strukturierung) basierend auf der nicht-linearen Absorption von Laserstrahlung
US8530784B2 (en) 2007-02-01 2013-09-10 Orbotech Ltd. Method and system of machining using a beam of photons
DE102007009786B4 (de) 2007-02-27 2013-09-05 Schott Ag Beschichtetes vorgespanntes Glas, Verfahren zu dessen Herstellung und dessen Verwendung
US7982162B2 (en) 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US20080290077A1 (en) 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
US8710402B2 (en) 2007-06-01 2014-04-29 Electro Scientific Industries, Inc. Method of and apparatus for laser drilling holes with improved taper
US20090020511A1 (en) 2007-07-17 2009-01-22 Kommera Swaroop K Ablation
US20090045179A1 (en) 2007-08-15 2009-02-19 Ellen Marie Kosik Williams Method and system for cutting solid materials using short pulsed laser
JP2009061462A (ja) 2007-09-05 2009-03-26 Sumitomo Electric Ind Ltd 基板の製造方法および基板
KR101235617B1 (ko) 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 ｕ자 형상 홈 가공 방법 및 이것을 사용한 제거 가공 방법 및 도려내기 가공 방법 및 모따기 방법
KR101512213B1 (ko) * 2007-12-18 2015-04-14 호야 가부시키가이샤 휴대 단말기용 커버 글래스 및 그 제조 방법, 및 휴대 단말 장치
DE602008005402D1 (de) 2008-02-26 2011-04-21 Rioglass Solar Sa Reflektorelement für einen Sonnenwärmereflektor und Verfahren zu seiner Herstellung
CN102006964B (zh) 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
JP2009280452A (ja) 2008-05-23 2009-12-03 Central Glass Co Ltd ガラス基板及び製造方法
KR20180015272A (ko) 2008-08-08 2018-02-12 코닝 인코포레이티드 강화 유리 제품 및 제조방법
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8347651B2 (en) 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US9685186B2 (en) 2009-02-27 2017-06-20 Applied Materials, Inc. HDD pattern implant system
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
US8350187B2 (en) 2009-03-28 2013-01-08 Electro Scientific Industries, Inc. Method and apparatus for laser machining
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
KR20120073249A (ko) * 2009-08-28 2012-07-04 코닝 인코포레이티드 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
JP5565659B2 (ja) * 2009-10-22 2014-08-06 株式会社ブイ・テクノロジー レーザ加工装置
EP2724993B1 (en) * 2009-11-30 2016-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US20110127242A1 (en) 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
JP5451443B2 (ja) * 2010-02-15 2014-03-26 株式会社ジャパンディスプレイ 電気的固体装置の製造方法
US8743165B2 (en) 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
TWI494284B (zh) 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
DE102010012265B4 (de) 2010-03-22 2012-09-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Heraustrennen von Einzelscheiben aus einer Verbundglastafel und Verwendung einer Vorrichtung dafür
JP5693705B2 (ja) 2010-03-30 2015-04-01 イムラ アメリカ インコーポレイテッド レーザベースの材料加工装置及び方法
EP2371778A1 (en) 2010-03-30 2011-10-05 Linde Aktiengesellschaft Method for producing toughened flat glass with anti-reflective properties
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
JP2011230940A (ja) 2010-04-26 2011-11-17 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
JP2011251879A (ja) 2010-06-02 2011-12-15 Asahi Glass Co Ltd 化学強化ガラスの切断方法および切断装置
JP5664470B2 (ja) * 2010-06-28 2015-02-04 信越化学工業株式会社 ナノインプリント用合成石英ガラス基板の製造方法
JP2012031018A (ja) * 2010-07-30 2012-02-16 Asahi Glass Co Ltd 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法
US8393175B2 (en) * 2010-08-26 2013-03-12 Corning Incorporated Methods for extracting strengthened glass substrates from glass sheets
US8584354B2 (en) * 2010-08-26 2013-11-19 Corning Incorporated Method for making glass interposer panels
US8607590B2 (en) * 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
US8616024B2 (en) * 2010-11-30 2013-12-31 Corning Incorporated Methods for forming grooves and separating strengthened glass substrate sheets
US20120168412A1 (en) * 2011-01-05 2012-07-05 Electro Scientific Industries, Inc Apparatus and method for forming an aperture in a substrate
US8539794B2 (en) 2011-02-01 2013-09-24 Corning Incorporated Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
US8635887B2 (en) * 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
JP2013043795A (ja) * 2011-08-23 2013-03-04 Nippon Electric Glass Co Ltd 強化ガラス及びその製造方法
JP4932059B1 (ja) * 2011-12-16 2012-05-16 株式会社ミクロ技術研究所 強化ガラス、タッチパネル、及び強化ガラスの製造方法
KR20140138134A (ko) 2012-02-28 2014-12-03 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
WO2013130581A1 (en) 2012-02-28 2013-09-06 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby

Similar Documents

Publication Publication Date Title
JP2015516352A5 (OSRAM)
JP2015511571A5 (OSRAM)
CN104114506B (zh) 加工强化玻璃的方法和装置及藉此制造的物品
JP6705014B2 (ja) サファイアを切断するための方法及び装置
CN104703748B (zh) 用于加工工件的方法及设备
CN105531072B (zh) 借助脉冲激光射线对工件进行去料切割的方法
CN104136967B (zh) 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品
US10074565B2 (en) Method of laser processing for substrate cleaving or dicing through forming “spike-like” shaped damage structures
KR101688001B1 (ko) 얇은 반도체 기판들을 다이싱하는 방법
JP2015529161A5 (OSRAM)
JP2013524521A5 (OSRAM)
WO2015094898A3 (en) Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US11904410B2 (en) Laser surface preparation of coated substrate
JP2012187618A (ja) ガラス基板のレーザ加工装置
JP2016515944A5 (OSRAM)
JP2006167804A5 (OSRAM)
TW200721285A (en) Laser processing method for wafer
JP2016516584A5 (OSRAM)
JP2013528109A5 (OSRAM)
JP2004268104A5 (OSRAM)
CN105461203A (zh) 分割方法及分割装置
JP2016516516A5 (OSRAM)
KR20170067141A (ko) 웨이퍼의 가공 방법
TW202120447A (zh) 基板之加工方法及加工裝置
JP2017171530A (ja) 断面端部不加工鏡面切断法