JP2014514450A5 - - Google Patents

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Publication number
JP2014514450A5
JP2014514450A5 JP2014503119A JP2014503119A JP2014514450A5 JP 2014514450 A5 JP2014514450 A5 JP 2014514450A5 JP 2014503119 A JP2014503119 A JP 2014503119A JP 2014503119 A JP2014503119 A JP 2014503119A JP 2014514450 A5 JP2014514450 A5 JP 2014514450A5
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JP
Japan
Prior art keywords
measurement
detector
evaporator
substrate
measurement system
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JP2014503119A
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English (en)
Japanese (ja)
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JP2014514450A (ja
JP6140681B2 (ja
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Priority claimed from EP11161343.6A external-priority patent/EP2508645B1/en
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Publication of JP2014514450A publication Critical patent/JP2014514450A/ja
Publication of JP2014514450A5 publication Critical patent/JP2014514450A5/ja
Application granted granted Critical
Publication of JP6140681B2 publication Critical patent/JP6140681B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014503119A 2011-04-06 2012-04-03 測定ユニットを備えた蒸発システム Expired - Fee Related JP6140681B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11161343.6A EP2508645B1 (en) 2011-04-06 2011-04-06 Evaporation system with measurement unit
EP11161343.6 2011-04-06
PCT/EP2012/056107 WO2012136673A1 (en) 2011-04-06 2012-04-03 Evaporation system with measurement unit

Publications (3)

Publication Number Publication Date
JP2014514450A JP2014514450A (ja) 2014-06-19
JP2014514450A5 true JP2014514450A5 (enExample) 2015-05-28
JP6140681B2 JP6140681B2 (ja) 2017-05-31

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ID=44533347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014503119A Expired - Fee Related JP6140681B2 (ja) 2011-04-06 2012-04-03 測定ユニットを備えた蒸発システム

Country Status (6)

Country Link
US (2) US20120258239A1 (enExample)
EP (1) EP2508645B1 (enExample)
JP (1) JP6140681B2 (enExample)
KR (1) KR101877458B1 (enExample)
CN (1) CN103476964B (enExample)
WO (1) WO2012136673A1 (enExample)

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US10100410B2 (en) * 2016-08-05 2018-10-16 Industrial Technology Research Institute Film thickness monitoring system and method using the same
KR102188702B1 (ko) * 2016-12-14 2020-12-08 어플라이드 머티어리얼스, 인코포레이티드 증착 시스템
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KR102245087B1 (ko) * 2019-07-08 2021-04-28 엘지전자 주식회사 증착 장비용 박막 두께 측정장치
EP3869534A1 (en) * 2020-02-20 2021-08-25 Bühler Alzenau GmbH In-situ etch rate or deposition rate measurement system
WO2021230859A1 (en) * 2020-05-12 2021-11-18 Applied Materials, Inc. Evaporation source, evaporation system, and method of monitoring material deposition on a substrate
CN111549319B (zh) * 2020-05-20 2022-03-29 武汉天马微电子有限公司 一种真空蒸镀系统及真空蒸镀方法
JP2023534105A (ja) * 2020-06-30 2023-08-08 マツクス－プランク－ゲゼルシヤフト ツール フエルデルング デル ヴイツセンシヤフテン エー フアウ ソース材料の蒸発レートを制御する方法、ソース表面上において反射される電磁放射を計測する検出器、及び、電磁放射による熱蒸発用のシステム
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