CN103476964B - 具有测量单元的蒸发系统 - Google Patents

具有测量单元的蒸发系统 Download PDF

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Publication number
CN103476964B
CN103476964B CN201280018968.6A CN201280018968A CN103476964B CN 103476964 B CN103476964 B CN 103476964B CN 201280018968 A CN201280018968 A CN 201280018968A CN 103476964 B CN103476964 B CN 103476964B
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CN
China
Prior art keywords
measurement system
measurement
evaporator
substrate
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280018968.6A
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English (en)
Chinese (zh)
Other versions
CN103476964A (zh
Inventor
U·霍夫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN103476964A publication Critical patent/CN103476964A/zh
Application granted granted Critical
Publication of CN103476964B publication Critical patent/CN103476964B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electroluminescent Light Sources (AREA)
CN201280018968.6A 2011-04-06 2012-04-03 具有测量单元的蒸发系统 Expired - Fee Related CN103476964B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11161343.6A EP2508645B1 (en) 2011-04-06 2011-04-06 Evaporation system with measurement unit
EP11161343.6 2011-04-06
PCT/EP2012/056107 WO2012136673A1 (en) 2011-04-06 2012-04-03 Evaporation system with measurement unit

Publications (2)

Publication Number Publication Date
CN103476964A CN103476964A (zh) 2013-12-25
CN103476964B true CN103476964B (zh) 2016-03-16

Family

ID=44533347

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280018968.6A Expired - Fee Related CN103476964B (zh) 2011-04-06 2012-04-03 具有测量单元的蒸发系统

Country Status (6)

Country Link
US (2) US20120258239A1 (enExample)
EP (1) EP2508645B1 (enExample)
JP (1) JP6140681B2 (enExample)
KR (1) KR101877458B1 (enExample)
CN (1) CN103476964B (enExample)
WO (1) WO2012136673A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100233353A1 (en) * 2009-03-16 2010-09-16 Applied Materials, Inc. Evaporator, coating installation, and method for use thereof
KR20120061394A (ko) * 2010-12-03 2012-06-13 삼성모바일디스플레이주식회사 증발원 및 유기물 증착 방법
CN103608484B (zh) * 2011-04-20 2016-06-22 Oled工厂有限责任公司 用于气相沉积应用的测量设备和方法
KR101938365B1 (ko) * 2012-07-31 2019-04-12 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 증착량 측정 방법
US9062368B2 (en) * 2012-10-16 2015-06-23 The Regents Of The University Of Michigan Method of monitoring photoactive organic molecules in-situ during gas-phase deposition of the photoactive organic molecules
WO2015073156A1 (en) * 2013-11-16 2015-05-21 NuvoSun, Inc. Method for monitoring se vapor in vacuum reactor apparatus
EP3119920A1 (en) * 2014-03-21 2017-01-25 Applied Materials, Inc. Evaporation source for organic material
BR112016020156A2 (pt) * 2014-05-08 2018-05-08 Halliburton Energy Services Inc sistema, e, métodos para fabricar e para formar um dispositivo de película ótica fina
DE102014014970B4 (de) 2014-10-14 2020-01-02 NICE Solar Energy GmbH Vorrichtung und Verfahren zur Schichtdickenmessung für Dampfabscheideverfahren
CN107078215B (zh) * 2014-11-07 2020-09-22 应用材料公司 用于真空沉积的材料源配置与材料分布配置
KR101950959B1 (ko) * 2015-06-17 2019-02-21 어플라이드 머티어리얼스, 인코포레이티드 증착률을 측정하기 위한 방법 및 증착률 제어 시스템
WO2016202388A1 (en) * 2015-06-17 2016-12-22 Applied Materials, Inc. Measurement assembly for measuring a deposition rate and method therefore
EP3403076A1 (en) * 2016-01-15 2018-11-21 Applied Materials, Inc. Optical inspection system, processing system for processing of a material on a flexible substrate, and methods of inspecting a flexible substrate
KR101930522B1 (ko) * 2016-05-10 2018-12-18 어플라이드 머티어리얼스, 인코포레이티드 증착 장치를 동작시키는 방법, 증발된 소스 재료를 기판 상에 증착하는 방법, 및 증착 장치
US10100410B2 (en) * 2016-08-05 2018-10-16 Industrial Technology Research Institute Film thickness monitoring system and method using the same
KR102188702B1 (ko) * 2016-12-14 2020-12-08 어플라이드 머티어리얼스, 인코포레이티드 증착 시스템
CN107779822B (zh) * 2017-10-30 2019-12-03 深圳市华星光电半导体显示技术有限公司 蒸镀装置与蒸镀方法
WO2020108743A1 (en) * 2018-11-28 2020-06-04 Applied Materials, Inc. Deposition source for depositing evaporated material, deposition apparatus, and methods therefor
WO2020122944A1 (en) * 2018-12-14 2020-06-18 Applied Materials, Inc. Measurement assembly for measuring a deposition rate and method therefore
KR102245087B1 (ko) * 2019-07-08 2021-04-28 엘지전자 주식회사 증착 장비용 박막 두께 측정장치
EP3869534A1 (en) * 2020-02-20 2021-08-25 Bühler Alzenau GmbH In-situ etch rate or deposition rate measurement system
WO2021230859A1 (en) * 2020-05-12 2021-11-18 Applied Materials, Inc. Evaporation source, evaporation system, and method of monitoring material deposition on a substrate
CN111549319B (zh) * 2020-05-20 2022-03-29 武汉天马微电子有限公司 一种真空蒸镀系统及真空蒸镀方法
JP2023534105A (ja) * 2020-06-30 2023-08-08 マツクス－プランク－ゲゼルシヤフト ツール フエルデルング デル ヴイツセンシヤフテン エー フアウ ソース材料の蒸発レートを制御する方法、ソース表面上において反射される電磁放射を計測する検出器、及び、電磁放射による熱蒸発用のシステム
WO2025133674A1 (en) * 2023-12-19 2025-06-26 Applied Materials, Inc. Measurement assembly for measuring a deposition rate of an evaporation source, evaporation source, deposition apparatus, and method of measuring a disposition rate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523840A (en) * 1993-06-21 1996-06-04 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for measuring the thicknesses of layers of a multiple layer semiconductor film utilizing the comparison between a spatialgram and an optical characteristic matrix
US20070248751A1 (en) * 2001-10-26 2007-10-25 Hermosa Thin Film Co., Ltd. Dynamic film thickness control system/method and its utilization
CN100482856C (zh) * 2005-05-24 2009-04-29 鸿富锦精密工业（深圳）有限公司 镀膜设备及其镀膜方法
US20100316788A1 (en) * 2009-06-12 2010-12-16 Applied Materials, Inc. Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH634424A5 (fr) * 1978-08-18 1983-01-31 Nat Res Dev Procede et appareil de detection et de commande de depot d'une pellicule fine.
JPS5751262A (en) * 1980-09-08 1982-03-26 Nec Corp Detection of thickness of vapor deposited film
DD202897A1 (de) * 1981-07-31 1983-10-05 Ulrike Ehrlich Einrichtung zum wechseln von testglaesern in vakuum-bedampfungsanlagen
JPS62142766A (ja) * 1985-12-16 1987-06-26 Matsushita Electric Ind Co Ltd 薄膜形成方法
DE3604624A1 (de) * 1986-02-14 1987-08-20 Leybold Heraeus Gmbh & Co Kg Testglaswechsler zur optischen messung von schichteigenschaften in vakuumbeschichtungsanlagen
JP3298682B2 (ja) * 1992-01-17 2002-07-02 松下電器産業株式会社 多層膜の成膜装置並びに光学特性の測定方法及び成膜方法
US5410411A (en) * 1992-01-17 1995-04-25 Matsushita Electric Industrial Co., Ltd. Method of and apparatus for forming multi-layer film
US6338775B1 (en) * 2000-08-07 2002-01-15 Advanced Ion Beam Technology, Inc. Apparatus and method for uniformly depositing thin films over substrates
GB0019848D0 (en) * 2000-08-11 2000-09-27 Rtc Systems Ltd Apparatus and method for coating substrates
US6558735B2 (en) * 2001-04-20 2003-05-06 Eastman Kodak Company Reusable mass-sensor in manufacture of organic light-emitting devices
US6798499B2 (en) * 2001-07-18 2004-09-28 Alps Electric Co., Ltd. Method of forming optical thin films on substrate at high accuracy and apparatus therefor
DE10204075B4 (de) * 2002-02-01 2006-09-07 Leybold Optics Gmbh Vorrichtung für Einrichtungen zur Bestimmung von Eigenschaften aufgebrachter Schichten
JP3802846B2 (ja) * 2002-06-20 2006-07-26 株式会社エイコー・エンジニアリング 薄膜堆積用分子線源セル
JP2005001699A (ja) * 2003-06-11 2005-01-06 S T Chem Co Ltd 容器体
JP2007051347A (ja) * 2005-08-18 2007-03-01 Pentax Corp 多層膜とその形成装置及び形成方法、及び多層膜を有する光学素子
JP4737760B2 (ja) * 2006-03-31 2011-08-03 株式会社昭和真空 真空蒸着装置
JP4813292B2 (ja) * 2006-08-25 2011-11-09 株式会社昭和真空 有機薄膜の膜厚測定装置及び有機薄膜形成装置
JP2008115410A (ja) * 2006-11-01 2008-05-22 Canon Inc 蒸着装置
JP5024075B2 (ja) * 2008-01-28 2012-09-12 パナソニック株式会社 真空蒸着装置
JP2009228090A (ja) * 2008-03-25 2009-10-08 Canon Inc 蒸着装置及び蒸着源
KR101018644B1 (ko) * 2008-09-05 2011-03-03 에스엔유 프리시젼 주식회사 증착장치 및 이를 이용한 증착방법
EP2469268A1 (en) * 2010-12-23 2012-06-27 Applied Materials, Inc. Evaporation system with measurement unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523840A (en) * 1993-06-21 1996-06-04 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for measuring the thicknesses of layers of a multiple layer semiconductor film utilizing the comparison between a spatialgram and an optical characteristic matrix
US20070248751A1 (en) * 2001-10-26 2007-10-25 Hermosa Thin Film Co., Ltd. Dynamic film thickness control system/method and its utilization
CN100482856C (zh) * 2005-05-24 2009-04-29 鸿富锦精密工业（深圳）有限公司 镀膜设备及其镀膜方法
US20100316788A1 (en) * 2009-06-12 2010-12-16 Applied Materials, Inc. Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device

Also Published As

Publication number Publication date
EP2508645A1 (en) 2012-10-10
US20170066010A1 (en) 2017-03-09
KR101877458B9 (ko) 2025-01-08
WO2012136673A1 (en) 2012-10-11
JP2014514450A (ja) 2014-06-19
EP2508645B1 (en) 2015-02-25
KR101877458B1 (ko) 2018-07-11
JP6140681B2 (ja) 2017-05-31
KR20140027213A (ko) 2014-03-06
US20120258239A1 (en) 2012-10-11
CN103476964A (zh) 2013-12-25

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