KR101877458B1 - 측정 유닛을 구비한 증발 시스템 - Google Patents

측정 유닛을 구비한 증발 시스템 Download PDF

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Publication number
KR101877458B1
KR101877458B1 KR1020137029191A KR20137029191A KR101877458B1 KR 101877458 B1 KR101877458 B1 KR 101877458B1 KR 1020137029191 A KR1020137029191 A KR 1020137029191A KR 20137029191 A KR20137029191 A KR 20137029191A KR 101877458 B1 KR101877458 B1 KR 101877458B1
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KR
South Korea
Prior art keywords
measurement
measurement system
outlet
detector
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020137029191A
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English (en)
Korean (ko)
Other versions
KR101877458B9 (ko
KR20140027213A (ko
Inventor
우베 호프만
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20140027213A publication Critical patent/KR20140027213A/ko
Application granted granted Critical
Publication of KR101877458B1 publication Critical patent/KR101877458B1/ko
Publication of KR101877458B9 publication Critical patent/KR101877458B9/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020137029191A 2011-04-06 2012-04-03 측정 유닛을 구비한 증발 시스템 Expired - Fee Related KR101877458B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11161343.6A EP2508645B1 (en) 2011-04-06 2011-04-06 Evaporation system with measurement unit
EP11161343.6 2011-04-06
PCT/EP2012/056107 WO2012136673A1 (en) 2011-04-06 2012-04-03 Evaporation system with measurement unit

Publications (3)

Publication Number Publication Date
KR20140027213A KR20140027213A (ko) 2014-03-06
KR101877458B1 true KR101877458B1 (ko) 2018-07-11
KR101877458B9 KR101877458B9 (ko) 2025-01-08

Family

ID=44533347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137029191A Expired - Fee Related KR101877458B1 (ko) 2011-04-06 2012-04-03 측정 유닛을 구비한 증발 시스템

Country Status (6)

Country Link
US (2) US20120258239A1 (enExample)
EP (1) EP2508645B1 (enExample)
JP (1) JP6140681B2 (enExample)
KR (1) KR101877458B1 (enExample)
CN (1) CN103476964B (enExample)
WO (1) WO2012136673A1 (enExample)

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KR20120061394A (ko) * 2010-12-03 2012-06-13 삼성모바일디스플레이주식회사 증발원 및 유기물 증착 방법
CN103608484B (zh) * 2011-04-20 2016-06-22 Oled工厂有限责任公司 用于气相沉积应用的测量设备和方法
KR101938365B1 (ko) * 2012-07-31 2019-04-12 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 증착량 측정 방법
US9062368B2 (en) * 2012-10-16 2015-06-23 The Regents Of The University Of Michigan Method of monitoring photoactive organic molecules in-situ during gas-phase deposition of the photoactive organic molecules
WO2015073156A1 (en) * 2013-11-16 2015-05-21 NuvoSun, Inc. Method for monitoring se vapor in vacuum reactor apparatus
EP3119920A1 (en) * 2014-03-21 2017-01-25 Applied Materials, Inc. Evaporation source for organic material
BR112016020156A2 (pt) * 2014-05-08 2018-05-08 Halliburton Energy Services Inc sistema, e, métodos para fabricar e para formar um dispositivo de película ótica fina
DE102014014970B4 (de) 2014-10-14 2020-01-02 NICE Solar Energy GmbH Vorrichtung und Verfahren zur Schichtdickenmessung für Dampfabscheideverfahren
CN107078215B (zh) * 2014-11-07 2020-09-22 应用材料公司 用于真空沉积的材料源配置与材料分布配置
KR101950959B1 (ko) * 2015-06-17 2019-02-21 어플라이드 머티어리얼스, 인코포레이티드 증착률을 측정하기 위한 방법 및 증착률 제어 시스템
WO2016202388A1 (en) * 2015-06-17 2016-12-22 Applied Materials, Inc. Measurement assembly for measuring a deposition rate and method therefore
EP3403076A1 (en) * 2016-01-15 2018-11-21 Applied Materials, Inc. Optical inspection system, processing system for processing of a material on a flexible substrate, and methods of inspecting a flexible substrate
KR101930522B1 (ko) * 2016-05-10 2018-12-18 어플라이드 머티어리얼스, 인코포레이티드 증착 장치를 동작시키는 방법, 증발된 소스 재료를 기판 상에 증착하는 방법, 및 증착 장치
US10100410B2 (en) * 2016-08-05 2018-10-16 Industrial Technology Research Institute Film thickness monitoring system and method using the same
KR102188702B1 (ko) * 2016-12-14 2020-12-08 어플라이드 머티어리얼스, 인코포레이티드 증착 시스템
CN107779822B (zh) * 2017-10-30 2019-12-03 深圳市华星光电半导体显示技术有限公司 蒸镀装置与蒸镀方法
WO2020108743A1 (en) * 2018-11-28 2020-06-04 Applied Materials, Inc. Deposition source for depositing evaporated material, deposition apparatus, and methods therefor
WO2020122944A1 (en) * 2018-12-14 2020-06-18 Applied Materials, Inc. Measurement assembly for measuring a deposition rate and method therefore
KR102245087B1 (ko) * 2019-07-08 2021-04-28 엘지전자 주식회사 증착 장비용 박막 두께 측정장치
EP3869534A1 (en) * 2020-02-20 2021-08-25 Bühler Alzenau GmbH In-situ etch rate or deposition rate measurement system
WO2021230859A1 (en) * 2020-05-12 2021-11-18 Applied Materials, Inc. Evaporation source, evaporation system, and method of monitoring material deposition on a substrate
CN111549319B (zh) * 2020-05-20 2022-03-29 武汉天马微电子有限公司 一种真空蒸镀系统及真空蒸镀方法
JP2023534105A (ja) * 2020-06-30 2023-08-08 マツクス－プランク－ゲゼルシヤフト ツール フエルデルング デル ヴイツセンシヤフテン エー フアウ ソース材料の蒸発レートを制御する方法、ソース表面上において反射される電磁放射を計測する検出器、及び、電磁放射による熱蒸発用のシステム
WO2025133674A1 (en) * 2023-12-19 2025-06-26 Applied Materials, Inc. Measurement assembly for measuring a deposition rate of an evaporation source, evaporation source, deposition apparatus, and method of measuring a disposition rate

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Also Published As

Publication number Publication date
EP2508645A1 (en) 2012-10-10
US20170066010A1 (en) 2017-03-09
CN103476964B (zh) 2016-03-16
KR101877458B9 (ko) 2025-01-08
WO2012136673A1 (en) 2012-10-11
JP2014514450A (ja) 2014-06-19
EP2508645B1 (en) 2015-02-25
JP6140681B2 (ja) 2017-05-31
KR20140027213A (ko) 2014-03-06
US20120258239A1 (en) 2012-10-11
CN103476964A (zh) 2013-12-25

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