JP2014503680A5 - - Google Patents
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- JP2014503680A5 JP2014503680A5 JP2013551984A JP2013551984A JP2014503680A5 JP 2014503680 A5 JP2014503680 A5 JP 2014503680A5 JP 2013551984 A JP2013551984 A JP 2013551984A JP 2013551984 A JP2013551984 A JP 2013551984A JP 2014503680 A5 JP2014503680 A5 JP 2014503680A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- composition
- metal
- thermally conductive
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims 10
- 239000011231 conductive filler Substances 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- -1 phthalocyanine compound Chemical class 0.000 claims 5
- 229920001296 polysiloxane Polymers 0.000 claims 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 3
- 239000000395 magnesium oxide Substances 0.000 claims 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 239000011787 zinc oxide Substances 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000007809 chemical reaction catalyst Substances 0.000 claims 1
- VVOLVFOSOPJKED-UHFFFAOYSA-N copper phthalocyanine Chemical compound [Cu].N=1C2=NC(C3=CC=CC=C33)=NC3=NC(C3=CC=CC=C33)=NC3=NC(C3=CC=CC=C33)=NC3=NC=1C1=CC=CC=C12 VVOLVFOSOPJKED-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 239000010419 fine particle Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000006459 hydrosilylation reaction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910001868 water Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161436214P | 2011-01-26 | 2011-01-26 | |
| US61/436,214 | 2011-01-26 | ||
| PCT/US2012/020699 WO2012102852A1 (en) | 2011-01-26 | 2012-01-10 | High temperature stable thermally conductive materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014503680A JP2014503680A (ja) | 2014-02-13 |
| JP2014503680A5 true JP2014503680A5 (https=) | 2015-01-29 |
| JP6048416B2 JP6048416B2 (ja) | 2016-12-21 |
Family
ID=45563525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013551984A Active JP6048416B2 (ja) | 2011-01-26 | 2012-01-10 | 高温安定熱伝導性材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9598575B2 (https=) |
| EP (1) | EP2668239B1 (https=) |
| JP (1) | JP6048416B2 (https=) |
| KR (1) | KR101866299B1 (https=) |
| CN (2) | CN103298887A (https=) |
| TW (1) | TWI620797B (https=) |
| WO (1) | WO2012102852A1 (https=) |
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| US9070660B2 (en) * | 2013-03-15 | 2015-06-30 | Intel Corporation | Polymer thermal interface material having enhanced thermal conductivity |
| KR102174540B1 (ko) | 2013-03-15 | 2020-11-05 | 다우 실리콘즈 코포레이션 | 알칼리 토금속을 포함하는 아릴 기-함유 실록산 조성물 |
| JP6205824B2 (ja) * | 2013-04-26 | 2017-10-04 | 富士電機株式会社 | パワーモジュール |
| WO2015042285A1 (en) * | 2013-09-18 | 2015-03-26 | Dow Corning Corporation | Compositions of resin-linear organosiloxane block copolymers |
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| JP4828146B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| US20070219312A1 (en) * | 2006-03-17 | 2007-09-20 | Jennifer Lynn David | Silicone adhesive composition and method for preparing the same |
| TWI380325B (en) * | 2006-09-26 | 2012-12-21 | Polytronics Technology Corp | Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same |
| DE102006048575A1 (de) * | 2006-10-13 | 2008-04-17 | Evonik Degussa Gmbh | Oberflächenmodifizierte Kieselsäuren |
| JP4970987B2 (ja) * | 2007-03-08 | 2012-07-11 | 株式会社メニコン | 眼用レンズ材料用シリコーンインク組成物 |
| CN101835830B (zh) * | 2007-08-31 | 2013-02-20 | 卡伯特公司 | 热界面材料 |
| JP4572243B2 (ja) | 2008-03-27 | 2010-11-04 | 信越化学工業株式会社 | 熱伝導性積層体およびその製造方法 |
| JP5329114B2 (ja) | 2008-03-31 | 2013-10-30 | 株式会社ジーシー | 歯科用シリコーン系適合試験材組成物 |
| CN102341459B (zh) * | 2009-03-12 | 2014-01-01 | 道康宁公司 | 热界面材料和它们的制备与使用方法 |
| JP5538872B2 (ja) * | 2009-12-24 | 2014-07-02 | 東レ・ダウコーニング株式会社 | シリコーンエラストマー組成物 |
| JP5783128B2 (ja) | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | 加熱硬化型熱伝導性シリコーングリース組成物 |
| JP5947267B2 (ja) | 2013-09-20 | 2016-07-06 | 信越化学工業株式会社 | シリコーン組成物及び熱伝導性シリコーン組成物の製造方法 |
| EP3150672B1 (en) | 2015-10-02 | 2018-05-09 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition and semiconductor device |
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2012
- 2012-01-10 KR KR1020137019092A patent/KR101866299B1/ko active Active
- 2012-01-10 CN CN2012800052058A patent/CN103298887A/zh active Pending
- 2012-01-10 JP JP2013551984A patent/JP6048416B2/ja active Active
- 2012-01-10 US US13/990,446 patent/US9598575B2/en active Active
- 2012-01-10 WO PCT/US2012/020699 patent/WO2012102852A1/en not_active Ceased
- 2012-01-10 EP EP12702642.5A patent/EP2668239B1/en active Active
- 2012-01-10 CN CN201811365168.7A patent/CN109401333A/zh active Pending
- 2012-01-18 TW TW101102003A patent/TWI620797B/zh active
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2017
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