JP2014165210A5 - - Google Patents
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- JP2014165210A5 JP2014165210A5 JP2013032450A JP2013032450A JP2014165210A5 JP 2014165210 A5 JP2014165210 A5 JP 2014165210A5 JP 2013032450 A JP2013032450 A JP 2013032450A JP 2013032450 A JP2013032450 A JP 2013032450A JP 2014165210 A5 JP2014165210 A5 JP 2014165210A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sub
- module
- board
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 230000000875 corresponding Effects 0.000 claims description 2
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013032450A JP2014165210A (ja) | 2013-02-21 | 2013-02-21 | モジュール基板 |
US14/184,958 US9468104B2 (en) | 2013-02-21 | 2014-02-20 | Module board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013032450A JP2014165210A (ja) | 2013-02-21 | 2013-02-21 | モジュール基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014165210A JP2014165210A (ja) | 2014-09-08 |
JP2014165210A5 true JP2014165210A5 (hu) | 2016-04-07 |
Family
ID=51350999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013032450A Pending JP2014165210A (ja) | 2013-02-21 | 2013-02-21 | モジュール基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9468104B2 (hu) |
JP (1) | JP2014165210A (hu) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9363892B2 (en) * | 2013-07-19 | 2016-06-07 | Google Technology Holdings LLC | Circuit assembly and corresponding methods |
DE102015220676A1 (de) * | 2015-10-22 | 2017-04-27 | Zf Friedrichshafen Ag | Leiterplatte und Anordnung mit einer Leiterplatte |
US20200275553A1 (en) * | 2017-03-09 | 2020-08-27 | Huawei Technologies Co., Ltd. | Mainboard for consumer electronic product, and terminal |
DE102017206099A1 (de) * | 2017-04-10 | 2018-10-11 | BSH Hausgeräte GmbH | Leiterplatten-Anordnung sowie Verfahren zur Herstellung einer Leiterplatten-Anordnung |
US11553616B2 (en) * | 2018-12-07 | 2023-01-10 | Delta Electronics, Inc. | Module with power device |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06111869A (ja) * | 1992-09-29 | 1994-04-22 | Fujitsu Ltd | 表面実装用端子 |
EP0732107A3 (en) * | 1995-03-16 | 1997-05-07 | Toshiba Kk | Screen device for circuit substrate |
US6525414B2 (en) * | 1997-09-16 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device including a wiring board and semiconductor elements mounted thereon |
US6137164A (en) * | 1998-03-16 | 2000-10-24 | Texas Instruments Incorporated | Thin stacked integrated circuit device |
SG77652A1 (en) * | 1998-03-18 | 2001-01-16 | Hitachi Cable | Semiconductor device lead-patterning substrate and electronics device and method for fabricating same |
JP2001167969A (ja) * | 1999-12-06 | 2001-06-22 | Tdk Corp | 三次元搭載用多端子積層セラミックコンデンサ |
US6528870B2 (en) * | 2000-01-28 | 2003-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having a plurality of stacked wiring boards |
EP1189282A4 (en) * | 2000-03-21 | 2006-02-15 | Mitsubishi Electric Corp | SEMICONDUCTOR ARRANGEMENT, METHOD FOR THE PRODUCTION OF ELECTRONIC SWITCHING, ELECTRONIC SWITCHING, AND PORTABLE INFORMATION TERMINAL |
US6528408B2 (en) * | 2001-05-21 | 2003-03-04 | Micron Technology, Inc. | Method for bumped die and wire bonded board-on-chip package |
US7087988B2 (en) * | 2002-07-30 | 2006-08-08 | Kabushiki Kaisha Toshiba | Semiconductor packaging apparatus |
JP2004303944A (ja) | 2003-03-31 | 2004-10-28 | Matsushita Electric Ind Co Ltd | モジュール基板及びその製造方法 |
PL200759B1 (pl) * | 2003-04-25 | 2009-02-27 | Adb Polska Sp | Zestaw płytek z obwodami drukowanymi |
JP2005277355A (ja) * | 2004-03-26 | 2005-10-06 | Sanyo Electric Co Ltd | 回路装置 |
JP2005286057A (ja) * | 2004-03-29 | 2005-10-13 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
JP4421436B2 (ja) * | 2004-09-30 | 2010-02-24 | 太陽誘電株式会社 | 面実装コイル部品 |
JP2007066936A (ja) * | 2005-08-29 | 2007-03-15 | Matsushita Electric Ind Co Ltd | 高周波モジュールとその製造方法 |
JP4864419B2 (ja) * | 2005-10-28 | 2012-02-01 | 株式会社東芝 | プリント回路板および電子機器 |
JP4740765B2 (ja) * | 2006-02-24 | 2011-08-03 | エルピーダメモリ株式会社 | 半導体装置及びその製造方法 |
JP2007281276A (ja) * | 2006-04-10 | 2007-10-25 | Nec Electronics Corp | 半導体装置 |
US20070241441A1 (en) * | 2006-04-17 | 2007-10-18 | Stats Chippac Ltd. | Multichip package system |
JP2007294560A (ja) * | 2006-04-24 | 2007-11-08 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP5154262B2 (ja) * | 2008-02-26 | 2013-02-27 | 太陽誘電株式会社 | 電子部品 |
TWI362732B (en) * | 2008-04-07 | 2012-04-21 | Nanya Technology Corp | Multi-chip stack package |
KR20100046760A (ko) * | 2008-10-28 | 2010-05-07 | 삼성전자주식회사 | 반도체 패키지 |
JP5240293B2 (ja) * | 2009-04-02 | 2013-07-17 | 株式会社村田製作所 | 回路基板 |
JP5234521B2 (ja) * | 2009-08-21 | 2013-07-10 | Tdk株式会社 | 電子部品及びその製造方法 |
JP2011171427A (ja) * | 2010-02-17 | 2011-09-01 | Canon Inc | 積層型半導体装置 |
US8847376B2 (en) * | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
JP2012079876A (ja) * | 2010-09-30 | 2012-04-19 | Fujitsu Ltd | 電子装置の製造方法及び電子装置 |
JP2012104790A (ja) * | 2010-10-12 | 2012-05-31 | Elpida Memory Inc | 半導体装置 |
JP5788166B2 (ja) * | 2010-11-02 | 2015-09-30 | 新光電気工業株式会社 | 接続端子構造及びその製造方法、並びにソケット |
JP5360158B2 (ja) * | 2011-08-05 | 2013-12-04 | 株式会社村田製作所 | チップ部品構造体 |
US8436457B2 (en) * | 2011-10-03 | 2013-05-07 | Invensas Corporation | Stub minimization for multi-die wirebond assemblies with parallel windows |
KR101894823B1 (ko) * | 2011-10-03 | 2018-09-04 | 인벤사스 코포레이션 | 평행한 윈도우를 갖는 다중-다이 와이어 본드 어셈블리를 위한 스터브 최소화 |
US9462732B2 (en) * | 2013-03-13 | 2016-10-04 | Laird Technologies, Inc. | Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features |
JP6336714B2 (ja) * | 2013-05-27 | 2018-06-06 | 富士通コンポーネント株式会社 | 電子装置 |
JP2015195263A (ja) * | 2014-03-31 | 2015-11-05 | マイクロン テクノロジー, インク. | 半導体装置及びその製造方法 |
-
2013
- 2013-02-21 JP JP2013032450A patent/JP2014165210A/ja active Pending
-
2014
- 2014-02-20 US US14/184,958 patent/US9468104B2/en not_active Expired - Fee Related
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