DE602007007470D1 - Mehrschichtmodul mit gehäuse - Google Patents

Mehrschichtmodul mit gehäuse

Info

Publication number
DE602007007470D1
DE602007007470D1 DE602007007470T DE602007007470T DE602007007470D1 DE 602007007470 D1 DE602007007470 D1 DE 602007007470D1 DE 602007007470 T DE602007007470 T DE 602007007470T DE 602007007470 T DE602007007470 T DE 602007007470T DE 602007007470 D1 DE602007007470 D1 DE 602007007470D1
Authority
DE
Germany
Prior art keywords
inner conductor
conductor layer
side electrodes
multilayer module
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007007470T
Other languages
English (en)
Inventor
Koji Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602007007470D1 publication Critical patent/DE602007007470D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE602007007470T 2006-05-17 2007-03-30 Mehrschichtmodul mit gehäuse Active DE602007007470D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006138235A JP3969453B1 (ja) 2006-05-17 2006-05-17 ケース付き多層モジュール
PCT/JP2007/057101 WO2007132599A1 (ja) 2006-05-17 2007-03-30 ケース付き多層モジュール

Publications (1)

Publication Number Publication Date
DE602007007470D1 true DE602007007470D1 (de) 2010-08-12

Family

ID=38556211

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007007470T Active DE602007007470D1 (de) 2006-05-17 2007-03-30 Mehrschichtmodul mit gehäuse

Country Status (9)

Country Link
US (1) US7660132B2 (de)
EP (1) EP2019577B1 (de)
JP (1) JP3969453B1 (de)
KR (1) KR100977391B1 (de)
CN (1) CN101449635B (de)
AT (1) ATE472931T1 (de)
DE (1) DE602007007470D1 (de)
TW (1) TWI336609B (de)
WO (1) WO2007132599A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5118713B2 (ja) * 2010-02-25 2013-01-16 シャープ株式会社 回路モジュールおよびそれを備えた電子機器ならびに回路モジュールの製造方法
KR101128931B1 (ko) * 2010-08-11 2012-03-27 삼성전기주식회사 카메라 모듈
TWI525782B (zh) * 2011-01-05 2016-03-11 矽品精密工業股份有限公司 半導體封裝件及其製法
US9105899B2 (en) * 2012-09-07 2015-08-11 Apple Inc. Electronic device subassemblies
US20140139985A1 (en) * 2012-11-12 2014-05-22 Industrial Technology Research Institute Environmental sensitive electronic device package
KR20170057954A (ko) * 2015-11-18 2017-05-26 삼성전자주식회사 쉴드캔 구조
CN109699115B (zh) * 2017-10-23 2020-06-23 苏州旭创科技有限公司 光模块
JP2020155517A (ja) * 2019-03-19 2020-09-24 キオクシア株式会社 半導体装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110906A (ja) * 1989-09-26 1991-05-10 Nec Corp 発振器
JP2616280B2 (ja) * 1991-04-27 1997-06-04 株式会社村田製作所 発振器及びその製造方法
JPH06252562A (ja) 1993-02-26 1994-09-09 Alps Electric Co Ltd 多層回路基板
US5376759A (en) * 1993-06-24 1994-12-27 Northern Telecom Limited Multiple layer printed circuit board
JPH07263892A (ja) * 1994-03-18 1995-10-13 Sony Corp ケース付き電子部品
JP2938820B2 (ja) * 1996-03-14 1999-08-25 ティーディーケイ株式会社 高周波モジュール
US5875099A (en) * 1996-05-09 1999-02-23 Murata Manufacturing Co., Ltd. Electronic component
JP2850860B2 (ja) * 1996-06-24 1999-01-27 住友金属工業株式会社 電子部品の製造方法
JPH10284935A (ja) * 1997-04-09 1998-10-23 Murata Mfg Co Ltd 電圧制御発振器およびその製造方法
JPH1131893A (ja) * 1997-05-12 1999-02-02 Murata Mfg Co Ltd 電子部品の製造方法およびそれを用いた電子部品
JP3679600B2 (ja) 1998-02-19 2005-08-03 日本特殊陶業株式会社 表面実装用基板
JP3520776B2 (ja) * 1998-05-28 2004-04-19 株式会社村田製作所 電子部品
JP3304898B2 (ja) * 1998-11-20 2002-07-22 株式会社村田製作所 複合高周波部品及びそれを用いた移動体通信装置
JP3891737B2 (ja) * 1999-04-19 2007-03-14 シャープ株式会社 発振器及びその発振特性調整方法
JP2001237585A (ja) * 2000-02-22 2001-08-31 Murata Mfg Co Ltd 電子部品及びその製造方法
GB2365007B (en) * 2000-07-21 2002-06-26 Murata Manufacturing Co Insulative ceramic compact
JP2002141248A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
GB2371775B (en) * 2000-12-19 2002-12-31 Murata Manufacturing Co Composite multilayer ceramic electronic parts and method of manfacturing the same
KR100519422B1 (ko) * 2001-03-28 2005-10-07 가부시키가이샤 무라타 세이사쿠쇼 절연체 세라믹 조성물 및 그것을 이용한 절연체 세라믹
JP3855679B2 (ja) * 2001-05-01 2006-12-13 株式会社村田製作所 表面実装型電子部品
JP3843912B2 (ja) * 2001-10-22 2006-11-08 株式会社村田製作所 多層回路基板用ガラスセラミック材料および多層回路基板
JP2004235184A (ja) * 2003-01-28 2004-08-19 Matsushita Electric Ind Co Ltd 高周波装置

Also Published As

Publication number Publication date
TWI336609B (en) 2011-01-21
KR20080109091A (ko) 2008-12-16
JP2007311505A (ja) 2007-11-29
EP2019577A1 (de) 2009-01-28
US7660132B2 (en) 2010-02-09
EP2019577A4 (de) 2009-08-26
CN101449635B (zh) 2012-06-13
JP3969453B1 (ja) 2007-09-05
CN101449635A (zh) 2009-06-03
ATE472931T1 (de) 2010-07-15
KR100977391B1 (ko) 2010-08-20
EP2019577B1 (de) 2010-06-30
WO2007132599A1 (ja) 2007-11-22
US20090052149A1 (en) 2009-02-26
TW200744426A (en) 2007-12-01

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