JP2014123572A - 導電粒子配置シート及び異方導電性フィルム - Google Patents
導電粒子配置シート及び異方導電性フィルム Download PDFInfo
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- JP2014123572A JP2014123572A JP2014021790A JP2014021790A JP2014123572A JP 2014123572 A JP2014123572 A JP 2014123572A JP 2014021790 A JP2014021790 A JP 2014021790A JP 2014021790 A JP2014021790 A JP 2014021790A JP 2014123572 A JP2014123572 A JP 2014123572A
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- insulating resin
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract
【解決手段】導電粒子と、基準面P1及び相対する基準面P2を有する絶縁樹脂シートとを含んでなる導電粒子配置シートであって、該絶縁樹脂シートの厚みは該導電粒子の平均粒径より小さく、該絶縁樹脂シートの少なくとも片側の所定の基準面から導電粒子が突出し、導電粒子の絶縁樹脂シートの前記基準面から突出した部分が、該絶縁樹脂シートを構成する該絶縁樹脂と同じ樹脂からなる被覆層で覆われ、前記基準面から突出した導電粒子の被覆層の頂部の被覆厚みが、0.1μm以上2μm以下であり、該絶縁樹脂シートの180℃溶融粘度が10Pa・s以上5万Pa・s以下であることを特徴とする上記導電粒子配置シート。
【選択図】図5
Description
(1)導電粒子と、基準面P1及びそれに相対する基準面P2を有する絶縁樹脂シートとを含んでなる導電粒子配置シートであって、該絶縁樹脂シートの厚みは該導電粒子の平均粒径より小さく、該絶縁樹脂シートの少なくとも片側の基準面P1から導電粒子が突出しており、導電粒子の絶縁樹脂シートの基準面P1から突出した部分が、該絶縁樹脂シートを構成する該絶縁樹脂と同じ樹脂からなる被覆層で覆われており、
ここで、基準面P1と、導電粒子の基準面P1に平行な接線であって該基準面P1から突出した突出部分に接する接線L1との間の距離の平均を平均突出高さh1(h1>0)とし、基準面P2と、導電粒子の基準面P2に平行な接線であって該導電粒子を挟んで接線L1とは反対側にある接線L2との間の距離の平均を平均突出高さh2とした場合(但し、該接線L2が該絶縁樹脂シート内にある時はh2<0、該接線L2が基準面P2上にある時はh2=0、該接線L2が該絶縁樹脂シート外にある時はh2>0とする)、h1>h2の関係を満たし、
該基準面P1から突出した導電粒子の被覆層の頂部の被覆厚みが、0.1μm以上2μm以下であり、該絶縁樹脂シートの180℃溶融粘度が10Pa・s以上5万Pa・s以下であることを特徴とする上記導電粒子配置シート。
(2)前記絶縁樹脂シートの両面から前記導電粒子が突出しており、前記平均突出高さh1に対する平均突出高さh2の比h2/h1が、0以上、1/1.1以下である(1)に記載の導電粒子配置シート。
(4)前記導電粒子の絶縁樹脂シートの面積に占める導電粒子の投影面積の合計として定義される面積率が、2%以上40%以下である(1)に記載の導電粒子配置シート。
(5)前記絶縁樹脂シートがフェノキシ樹脂を含有する(1)に記載の導電粒子配置シート。
(7)前記導電粒子の中心間距離の変動係数が、0.03以上0.6以下である(1)に記載の導電粒子配置シート。
(8)延伸可能なシート上に導電粒子を単層で充填して導電粒子層を形成し、該導電粒子層上に絶縁樹脂層を形成して導電粒子充填シートを形成し、該導電粒子充填シートを延伸することを含む(1)に記載の導電粒子配置シートの製造方法。
(9)前記延伸可能なシート上に導電粒子を単層で充填して導電粒子層を形成するに際し、該延伸可能なシート上に、粘着剤を塗布し、該粘着剤上に導電粒子を単層で充填した導電粒子層を形成する(8)に記載の方法。
(11)前記延伸可能なシート上に、粘着剤を塗布し、該粘着剤上に導電粒子を単層で充填して導電粒子層を形成するに際し、導電粒子を粘着剤に埋め込む(9)に記載の方法。
(12)前記導電粒子を単層で充填して導電粒子層を形成するに際し、全面積に対する導電粒子の投影面積の割合として定義される充填率が、50%以上90%以下となるように導電粒子を充填した(8)に記載の方法。
(14)前記導電粒子層上に絶縁樹脂層を形成するに際し、絶縁樹脂層として、溶剤に溶解した絶縁樹脂を塗工し、溶剤を乾燥して得られた絶縁樹脂を導電粒子層上に形成する(8)に記載の方法。
(15)縦方向の延伸倍率と横方向の延伸倍率の積として定義される面倍率が、2.2倍以上25倍以下である(8)に記載の方法。
本発明の導電粒子配置シートは導電粒子と絶縁樹脂シートとを含んでなる。
導電粒子としては、例えば、金属粒子又は高分子核材に金属薄膜を被覆した粒子を用いることができる。
なお、ここで、絶縁樹脂シートが熱硬化性樹脂を含む場合、その溶融粘度とは、絶縁樹脂シートから硬化剤を除去した、あるいは、硬化剤が未配合の状態での溶融粘度を指す。
絶縁樹脂シートSは表裏の二つの相対する表面を有し、それらを基準面P1及び基準面P2と称する。但し、本発明の導電粒子配置シートにおいて、絶縁樹脂シートSの基準面P1からは導電粒子Eが突出しているものとし、また、基準面P1と、導電粒子Eの基準面P1に平行な接線であって該基準面P1から突出した突出部分に接する接線L1との間の距離の平均を平均突出高さh1(h1>0)とし、基準面P2と、導電粒子Eの基準面P2に平行な接線であって該導電粒子を挟んで接線L1とは反対側にある接線L2との間の距離の平均を平均突出高さh2とした場合、h1>h2の関係を満たすものとする。ここで、該接線L2が該絶縁樹脂シート内にある時はh2<0(図1右)、該接線L2が基準面P2上にある時はh2=0、該接線L2が該絶縁樹脂シート外にある時はh2>0(図1左)とする。
0≦ |h2|/|h1| ≦1/1.1
であることが好ましく、より好ましくは
0≦ |h2|/|h1| ≦1/3
である。これは、例えば導電粒子が絶縁樹脂シートの両面から突出している場合(h1>0且つh2>0)、突出高さh1が突出高さh2の好ましくは1.1倍以上、より好ましくは3倍以上であることを表す。
一般に異方導電性フィルムは、所望の幅にスリットされ、リール状に巻き取られる。
a.溶融粘度測定
HAAKE社製、RHeoStress600 Thermoを用い、20mm径のコーン(PP20H)を用いて測定した。
フェノキシ樹脂(InChem社製、商品名:PKHC)80質量部、ビスフェノールA型液状エポキシ樹脂(旭化成ケミカルズ株式会社製、商品名:AER2603)20質量部、シランカップリング剤(日本ユニカー社製、商品名:A−187)0.25質量部、酢酸エチル300質量部を混合し、絶縁樹脂シート用ワニスを得た。絶縁樹脂シート用ワニスから溶剤を除去して得た絶縁樹脂シートの180℃溶融粘度は、1500Pa・sであった。
絶縁樹脂シートとして、フェノキシ樹脂(InChem社製、商品名:PKHB、180℃の溶融粘度は980Pa・s)を単独で用い、導電粒子の平均粒径を3μmに、充填率を82%に変更した以外は実施例1と同様にして導電粒子充填シートを得、延伸倍率を2.7倍にした以外は実施例1と同様にして導電粒子配置シート(導電粒子配置シートBと称す)を得た。
絶縁樹脂シート用ワニスの塗工量を下げて、絶縁樹脂シート層の厚さを3.5μmとした以外は、実施例1と同様にして、導電粒子配置シート(導電粒子配置シートCと称す)を得た。
絶縁樹脂シート用ワニスの塗工量を上げて、絶縁樹脂シート層の厚さを20μmとした以外は、実施例1と同様にして、導電粒子配置シート(導電粒子配置シートDと称す)を得た。
Claims (15)
- 導電粒子と、基準面P1及びそれに相対する基準面P2を有する絶縁樹脂シートとを含んでなる導電粒子配置シートであって、該絶縁樹脂シートの厚みは該導電粒子の平均粒径より小さく、該絶縁樹脂シートの少なくとも片側の基準面P1から導電粒子が突出しており、導電粒子の絶縁樹脂シートの基準面P1から突出した部分が、該絶縁樹脂シートを構成する該絶縁樹脂と同じ樹脂からなる被覆層で覆われており、
ここで、基準面P1と、導電粒子の基準面P1に平行な接線であって該基準面P1から突出した突出部分に接する接線L1との間の距離の平均を平均突出高さh1(h1>0)とし、基準面P2と、導電粒子の基準面P2に平行な接線であって該導電粒子を挟んで接線L1とは反対側にある接線L2との間の距離の平均を平均突出高さh2とした場合(但し、該接線L2が該絶縁樹脂シート内にある時はh2<0、該接線L2が基準面P2上にある時はh2=0、該接線L2が該絶縁樹脂シート外にある時はh2>0とする)、h1>h2の関係を満たし、
該基準面P1から突出した導電粒子の被覆層の頂部の被覆厚みが、0.1μm以上2μm以下であり、該絶縁樹脂シートの180℃溶融粘度が10Pa・s以上5万Pa・s以下であることを特徴とする上記導電粒子配置シート。 - 前記絶縁樹脂シートの両面から前記導電粒子が突出しており、前記平均突出高さh1に対する平均突出高さh2の比h2/h1が、0以上、1/1.1以下である請求項1に記載の導電粒子配置シート。
- 前記基準面P2から突出した導電粒子は、絶縁樹脂シートから露出している請求項2に記載の導電粒子配置シート。
- 前記導電粒子の絶縁樹脂シートの面積に占める導電粒子の投影面積の合計として定義される面積率が、2%以上40%以下である請求項1に記載の導電粒子配置シート。
- 前記絶縁樹脂シートがフェノキシ樹脂を含有する請求項1に記載の導電粒子配置シート
- 前記導電粒子の平均粒径が0.5μm以上10μm以下である請求項1に記載の導電粒子配置シート。
- 前記導電粒子の中心間距離の変動係数が、0.03以上0.6以下である請求項1に記載の導電粒子配置シート。
- 延伸可能なシート上に導電粒子を単層で充填して導電粒子層を形成し、該導電粒子層上に絶縁樹脂層を形成して導電粒子充填シートを形成し、該導電粒子充填シートを延伸することを含む請求項1に記載の導電粒子配置シートの製造方法。
- 前記延伸可能なシート上に導電粒子を単層で充填して導電粒子層を形成するに際し、該延伸可能なシート上に、粘着剤を塗布し、該粘着剤上に導電粒子を単層で充填した導電粒子層を形成する請求項8に記載の方法。
- 前記導電粒子充填シートの絶縁樹脂層の厚みが、導電粒子の平均粒径に対して1.0倍以上10倍以下である請求項8に記載の方法。
- 前記延伸可能なシート上に、粘着剤を塗布し、該粘着剤上に導電粒子を単層で充填して導電粒子層を形成するに際し、導電粒子を粘着剤に埋め込む請求項9に記載の方法。
- 前記導電粒子を単層で充填して導電粒子層を形成するに際し、全面積に対する導電粒子の投影面積の割合として定義される充填率が、50%以上90%以下となるように導電粒子を充填した請求項8に記載の方法。
- 前記導電粒子層上に絶縁樹脂層を形成するに際し、絶縁樹脂層として、シート状の絶縁樹脂を導電粒子層上に形成する請求項8に記載の方法。
- 前記導電粒子層上に絶縁樹脂層を形成するに際し、絶縁樹脂層として、溶剤に溶解した絶縁樹脂を塗工し、溶剤を乾燥して得られた絶縁樹脂を導電粒子層上に形成する請求項8に記載の方法。
- 縦方向の延伸倍率と横方向の延伸倍率の積として定義される面倍率が、2.2倍以上25倍以下である請求項8に記載の方法。
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US20090090545A1 (en) | 2009-04-09 |
KR101115271B1 (ko) | 2012-07-12 |
KR20080111500A (ko) | 2008-12-23 |
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TW200810243A (en) | 2008-02-16 |
TWI373884B (en) | 2012-10-01 |
KR20110122225A (ko) | 2011-11-09 |
JP5388572B2 (ja) | 2014-01-15 |
JP2013101938A (ja) | 2013-05-23 |
JP5472434B2 (ja) | 2014-04-16 |
WO2007125993A1 (ja) | 2007-11-08 |
TWI387157B (zh) | 2013-02-21 |
CN101432931A (zh) | 2009-05-13 |
CN101432931B (zh) | 2013-04-24 |
KR101240155B1 (ko) | 2013-03-11 |
US8247701B2 (en) | 2012-08-21 |
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