JPS6410508A - Aeolotropic conductive film - Google Patents

Aeolotropic conductive film

Info

Publication number
JPS6410508A
JPS6410508A JP16565887A JP16565887A JPS6410508A JP S6410508 A JPS6410508 A JP S6410508A JP 16565887 A JP16565887 A JP 16565887A JP 16565887 A JP16565887 A JP 16565887A JP S6410508 A JPS6410508 A JP S6410508A
Authority
JP
Japan
Prior art keywords
film
grains
solder
conductive film
broken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16565887A
Other languages
Japanese (ja)
Inventor
Minoru Tashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16565887A priority Critical patent/JPS6410508A/en
Publication of JPS6410508A publication Critical patent/JPS6410508A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE:To obtain an aeolotropic conductive film by dispersing conductor grains provided with an electric insulating film on the surface of the metal grains in thermoplastic resin. CONSTITUTION:Epoxy/polyamide resin is coated on solder grains 12a of 60Sn-40Pb and dried to coat them with a thin film 12b. The film has the heat resistance not to be broken at the melting temperature of the solder grain inside. The conductor grains are dispersed in thermoplastic resin made of acryl polymer, solvent, and plasticizer and coated on the paraffin-coated kraft paper and dried into a film to obtain an aeolotropic conductive film 1. When the composite material grains in this constitution are heated and pressurized, the inside solder is melted, the insulating film 12b is broken, the solder 12a flows out, and the electric connection is attained like the aeolotropic conductive film. The film 12b is not broken at the unpressurized portion, no electric connection is made, no detective connection is generated, and the yield of micro-connection is remarkably improved.
JP16565887A 1987-07-01 1987-07-01 Aeolotropic conductive film Pending JPS6410508A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16565887A JPS6410508A (en) 1987-07-01 1987-07-01 Aeolotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16565887A JPS6410508A (en) 1987-07-01 1987-07-01 Aeolotropic conductive film

Publications (1)

Publication Number Publication Date
JPS6410508A true JPS6410508A (en) 1989-01-13

Family

ID=15816548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16565887A Pending JPS6410508A (en) 1987-07-01 1987-07-01 Aeolotropic conductive film

Country Status (1)

Country Link
JP (1) JPS6410508A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346774A (en) * 1989-07-12 1991-02-28 Catalysts & Chem Ind Co Ltd Anisotropic conductive adhesive, method of electrical connection between electrodes using such adhesive, and electric circuit base formed in such method
JPH0372648A (en) * 1989-08-11 1991-03-27 Hitachi Chem Co Ltd Method for inspecting energized state of fine circuit
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
US8247701B2 (en) * 2006-04-27 2012-08-21 Asahi Kasei Emd Corporation Electroconductive particle placement sheet and anisotropic electroconductive film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346774A (en) * 1989-07-12 1991-02-28 Catalysts & Chem Ind Co Ltd Anisotropic conductive adhesive, method of electrical connection between electrodes using such adhesive, and electric circuit base formed in such method
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
JPH0372648A (en) * 1989-08-11 1991-03-27 Hitachi Chem Co Ltd Method for inspecting energized state of fine circuit
US8247701B2 (en) * 2006-04-27 2012-08-21 Asahi Kasei Emd Corporation Electroconductive particle placement sheet and anisotropic electroconductive film

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