JP2014011383A5 - - Google Patents

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Publication number
JP2014011383A5
JP2014011383A5 JP2012148512A JP2012148512A JP2014011383A5 JP 2014011383 A5 JP2014011383 A5 JP 2014011383A5 JP 2012148512 A JP2012148512 A JP 2012148512A JP 2012148512 A JP2012148512 A JP 2012148512A JP 2014011383 A5 JP2014011383 A5 JP 2014011383A5
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JP
Japan
Prior art keywords
metal layer
film
forming
base substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012148512A
Other languages
English (en)
Japanese (ja)
Other versions
JP6024242B2 (ja
JP2014011383A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012148512A priority Critical patent/JP6024242B2/ja
Priority claimed from JP2012148512A external-priority patent/JP6024242B2/ja
Priority to US13/922,622 priority patent/US9549481B2/en
Priority to CN201310246968.8A priority patent/CN103524149B/zh
Priority to TW102123368A priority patent/TWI492676B/zh
Publication of JP2014011383A publication Critical patent/JP2014011383A/ja
Publication of JP2014011383A5 publication Critical patent/JP2014011383A5/ja
Application granted granted Critical
Publication of JP6024242B2 publication Critical patent/JP6024242B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012148512A 2012-07-02 2012-07-02 電子デバイスの製造方法 Expired - Fee Related JP6024242B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012148512A JP6024242B2 (ja) 2012-07-02 2012-07-02 電子デバイスの製造方法
US13/922,622 US9549481B2 (en) 2012-07-02 2013-06-20 Method for producing base substrate, method for producing electronic device, base substrate, and electronic apparatus
CN201310246968.8A CN103524149B (zh) 2012-07-02 2013-06-20 基底基板、电子器件及其制造方法以及电子设备
TW102123368A TWI492676B (zh) 2012-07-02 2013-06-28 基座基板之製造方法、電子裝置之製造方法、基座基板及電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012148512A JP6024242B2 (ja) 2012-07-02 2012-07-02 電子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2014011383A JP2014011383A (ja) 2014-01-20
JP2014011383A5 true JP2014011383A5 (enExample) 2015-06-18
JP6024242B2 JP6024242B2 (ja) 2016-11-09

Family

ID=49777928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012148512A Expired - Fee Related JP6024242B2 (ja) 2012-07-02 2012-07-02 電子デバイスの製造方法

Country Status (4)

Country Link
US (1) US9549481B2 (enExample)
JP (1) JP6024242B2 (enExample)
CN (1) CN103524149B (enExample)
TW (1) TWI492676B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014013795A (ja) * 2012-07-03 2014-01-23 Seiko Epson Corp ベース基板、電子デバイスおよび電子機器
US10109669B2 (en) * 2014-12-18 2018-10-23 Sony Corporation Solid-state imaging device and electronic apparatus
WO2017022504A1 (ja) * 2015-07-31 2017-02-09 株式会社村田製作所 電子部品及びその製造方法
CH712475A2 (fr) * 2016-05-19 2017-11-30 Swatch Group Res & Dev Ltd Procédé de fabrication d'une pièce pour l'horlogerie dotée d'un élément d'habillage creux ou en relief.
JP6772574B2 (ja) * 2016-06-16 2020-10-21 株式会社村田製作所 圧電振動子及びその製造方法
JP2019047309A (ja) 2017-09-01 2019-03-22 株式会社村田製作所 圧電振動子
CN111362715A (zh) * 2020-03-16 2020-07-03 研创科技（惠州）有限公司 一种基于纳米金属的封装方法
JP2020150554A (ja) * 2020-05-29 2020-09-17 株式会社村田製作所 圧電振動子及びその製造方法
WO2022102444A1 (ja) * 2020-11-10 2022-05-19 株式会社村田製作所 電子部品モジュール、および、電子部品モジュールの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645283A (ja) 1992-07-27 1994-02-18 Nec Corp 半導体装置の製造方法
JP3323871B2 (ja) 1993-03-15 2002-09-09 株式会社東芝 半導体素子の製造方法
JPH10270831A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd セラミック配線板のめっき方法
JP3466452B2 (ja) * 1997-12-24 2003-11-10 京セラ株式会社 配線基板の製造方法
DE10120517B4 (de) 2001-04-26 2013-06-06 Epcos Ag Elektrischer Vielschicht-Kaltleiter und Verfahren zu dessen Herstellung
JP2003152145A (ja) 2001-08-31 2003-05-23 Sumitomo Electric Ind Ltd 半導体放熱用基板とその製造方法及びパッケージ
JP2003155575A (ja) 2001-11-16 2003-05-30 Ngk Insulators Ltd 複合材料及びその製造方法
JP2003297158A (ja) 2002-04-01 2003-10-17 Canon Inc グリッド電極を有する透明導電膜及びその製造方法
JP2004127953A (ja) * 2002-07-29 2004-04-22 Kyocera Corp 配線基板
JP2004200644A (ja) * 2002-10-22 2004-07-15 Kyocera Corp 配線基板
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
JP2005252121A (ja) 2004-03-08 2005-09-15 Sumitomo Metal Electronics Devices Inc 半導体素子収納用パッケージ及びその製造方法
US7293359B2 (en) * 2004-04-29 2007-11-13 Hewlett-Packard Development Company, L.P. Method for manufacturing a fluid ejection device
JP2006086480A (ja) 2004-09-17 2006-03-30 Ngk Spark Plug Co Ltd セラミック配線基板及びその製造方法
JP4817043B2 (ja) 2005-08-30 2011-11-16 日立金属株式会社 セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法
JP4471004B2 (ja) 2008-01-23 2010-06-02 セイコーエプソン株式会社 接合体の形成方法
JP2011199672A (ja) 2010-03-19 2011-10-06 Seiko Instruments Inc ガラス基板の接合方法、ガラス接合体、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
US9634412B2 (en) * 2011-07-15 2017-04-25 Tessera, Inc. Connector structures and methods

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