JP2013508538A5 - - Google Patents
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- JP2013508538A5 JP2013508538A5 JP2012518625A JP2012518625A JP2013508538A5 JP 2013508538 A5 JP2013508538 A5 JP 2013508538A5 JP 2012518625 A JP2012518625 A JP 2012518625A JP 2012518625 A JP2012518625 A JP 2012518625A JP 2013508538 A5 JP2013508538 A5 JP 2013508538A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- acid
- electrolyte
- group
- amino acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000001576 beta-amino acids Chemical class 0.000 claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 40
- 239000003792 electrolyte Substances 0.000 claims description 39
- 238000009472 formulation Methods 0.000 claims description 36
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 20
- 150000001768 cations Chemical class 0.000 claims description 19
- 239000003638 chemical reducing agent Substances 0.000 claims description 18
- 239000008139 complexing agent Substances 0.000 claims description 14
- 239000003381 stabilizer Substances 0.000 claims description 14
- -1 loader two emissions Chemical compound 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 11
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 229910021645 metal ion Inorganic materials 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 5
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- 150000003862 amino acid derivatives Chemical class 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 6
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 claims 5
- OQEBBZSWEGYTPG-UHFFFAOYSA-N 3-aminobutanoic acid Chemical compound CC(N)CC(O)=O OQEBBZSWEGYTPG-UHFFFAOYSA-N 0.000 claims 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 4
- 229910045601 alloy Inorganic materials 0.000 claims 4
- 229910052796 boron Inorganic materials 0.000 claims 4
- 229910017052 cobalt Inorganic materials 0.000 claims 4
- 239000010941 cobalt Substances 0.000 claims 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 4
- 239000010931 gold Substances 0.000 claims 4
- 150000002739 metals Chemical class 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 claims 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 3
- TVJORGWKNPGCDW-UHFFFAOYSA-N aminoboron Chemical compound N[B] TVJORGWKNPGCDW-UHFFFAOYSA-N 0.000 claims 3
- 229910052787 antimony Inorganic materials 0.000 claims 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 3
- 229910052797 bismuth Inorganic materials 0.000 claims 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 3
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims 3
- 229910000085 borane Inorganic materials 0.000 claims 3
- 239000004202 carbamide Substances 0.000 claims 3
- 235000013877 carbamide Nutrition 0.000 claims 3
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 claims 3
- 229960002449 glycine Drugs 0.000 claims 3
- 235000013905 glycine and its sodium salt Nutrition 0.000 claims 3
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims 3
- 229940091173 hydantoin Drugs 0.000 claims 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims 3
- HJSRRUNWOFLQRG-UHFFFAOYSA-N propanedioic acid Chemical compound OC(=O)CC(O)=O.OC(=O)CC(O)=O HJSRRUNWOFLQRG-UHFFFAOYSA-N 0.000 claims 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims 3
- 229940081974 saccharin Drugs 0.000 claims 3
- 235000019204 saccharin Nutrition 0.000 claims 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims 3
- 150000003672 ureas Chemical class 0.000 claims 3
- 229910052725 zinc Inorganic materials 0.000 claims 3
- 239000011701 zinc Substances 0.000 claims 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 2
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims 2
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 claims 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 2
- 229940072107 ascorbate Drugs 0.000 claims 2
- 235000010323 ascorbic acid Nutrition 0.000 claims 2
- 239000011668 ascorbic acid Substances 0.000 claims 2
- GLUJNGJDHCTUJY-UHFFFAOYSA-N beta-leucine Chemical compound CC(C)C(N)CC(O)=O GLUJNGJDHCTUJY-UHFFFAOYSA-N 0.000 claims 2
- 229910001510 metal chloride Inorganic materials 0.000 claims 2
- 150000002736 metal compounds Chemical class 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 claims 2
- 229940065287 selenium compound Drugs 0.000 claims 2
- 150000003343 selenium compounds Chemical class 0.000 claims 2
- 229910052717 sulfur Inorganic materials 0.000 claims 2
- 239000011593 sulfur Substances 0.000 claims 2
- 150000003464 sulfur compounds Chemical class 0.000 claims 2
- 229960003080 taurine Drugs 0.000 claims 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 229940116298 l- malic acid Drugs 0.000 claims 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims 1
- 235000011121 sodium hydroxide Nutrition 0.000 claims 1
- 239000000243 solution Substances 0.000 description 20
- 238000007772 electroless plating Methods 0.000 description 16
- 150000001735 carboxylic acids Chemical class 0.000 description 15
- 150000003839 salts Chemical class 0.000 description 11
- 150000001408 amides Chemical class 0.000 description 10
- 150000001413 amino acids Chemical class 0.000 description 7
- 239000012736 aqueous medium Substances 0.000 description 6
- 238000000502 dialysis Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 3
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 2
- HWXBTNAVRSUOJR-UHFFFAOYSA-N 2-hydroxyglutaric acid Chemical compound OC(=O)C(O)CCC(O)=O HWXBTNAVRSUOJR-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 101000724404 Homo sapiens Saccharopine dehydrogenase Proteins 0.000 description 2
- 102100028294 Saccharopine dehydrogenase Human genes 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- ROBFUDYVXSDBQM-UHFFFAOYSA-N hydroxymalonic acid Chemical compound OC(=O)C(O)C(O)=O ROBFUDYVXSDBQM-UHFFFAOYSA-N 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- OTTXIFWBPRRYOG-UHFFFAOYSA-N 2-hydroxyadipic acid Chemical compound OC(=O)C(O)CCCC(O)=O OTTXIFWBPRRYOG-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- IAJILQKETJEXLJ-UHFFFAOYSA-N Galacturonsaeure Natural products O=CC(O)C(O)C(O)C(O)C(O)=O IAJILQKETJEXLJ-UHFFFAOYSA-N 0.000 description 1
- 150000008575 L-amino acids Chemical class 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- IAJILQKETJEXLJ-QTBDOELSSA-N aldehydo-D-glucuronic acid Chemical compound O=C[C@H](O)[C@@H](O)[C@H](O)[C@H](O)C(O)=O IAJILQKETJEXLJ-QTBDOELSSA-N 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229940061720 alpha hydroxy acid Drugs 0.000 description 1
- 150000001280 alpha hydroxy acids Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 238000010640 amide synthesis reaction Methods 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 229940097043 glucuronic acid Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09008744.6 | 2009-07-03 | ||
| EP09008744A EP2270255A1 (en) | 2009-07-03 | 2009-07-03 | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer |
| EP10004296.9 | 2010-04-22 | ||
| EP10004296 | 2010-04-22 | ||
| PCT/US2010/041077 WO2011003116A2 (en) | 2009-07-03 | 2010-07-06 | Beta-amino acid comprising electrolyte and method for the deposition of a metal layer |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017099768A Division JP6501821B2 (ja) | 2009-07-03 | 2017-05-19 | 基板上に金属層を堆積させるための鍍金処方物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013508538A JP2013508538A (ja) | 2013-03-07 |
| JP2013508538A5 true JP2013508538A5 (enExample) | 2017-07-20 |
| JP6192934B2 JP6192934B2 (ja) | 2017-09-20 |
Family
ID=43411795
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012518625A Active JP6192934B2 (ja) | 2009-07-03 | 2010-07-06 | β−アミノ酸含有電解質および金属層の堆積方法 |
| JP2017099768A Active JP6501821B2 (ja) | 2009-07-03 | 2017-05-19 | 基板上に金属層を堆積させるための鍍金処方物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017099768A Active JP6501821B2 (ja) | 2009-07-03 | 2017-05-19 | 基板上に金属層を堆積させるための鍍金処方物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8962070B2 (enExample) |
| EP (1) | EP2449148B1 (enExample) |
| JP (2) | JP6192934B2 (enExample) |
| KR (1) | KR101635661B1 (enExample) |
| CN (1) | CN102892924B (enExample) |
| ES (1) | ES2714824T3 (enExample) |
| PL (1) | PL2449148T3 (enExample) |
| WO (1) | WO2011003116A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892924B (zh) * | 2009-07-03 | 2015-02-18 | 恩索恩公司 | 包括β-氨基酸的电解质以及用于沉积金属层的方法 |
| US20130065069A1 (en) * | 2011-09-09 | 2013-03-14 | Yun Li Liu | Electrodeposition of Hard Magnetic Coatings |
| US9376755B2 (en) * | 2013-06-04 | 2016-06-28 | Sanchem, Inc. | Method and composition for electroless nickel and cobalt deposition |
| US10246778B2 (en) * | 2013-08-07 | 2019-04-02 | Macdermid Acumen, Inc. | Electroless nickel plating solution and method |
| CN103602965B (zh) * | 2013-11-18 | 2016-06-22 | 广东哈福科技有限公司 | 一种解决渗镀漏镀的化学镍工艺 |
| US11685999B2 (en) * | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
| US9708693B2 (en) * | 2014-06-03 | 2017-07-18 | Macdermid Acumen, Inc. | High phosphorus electroless nickel |
| KR101444687B1 (ko) * | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
| ES2639300T3 (es) * | 2014-12-16 | 2017-10-26 | Atotech Deutschland Gmbh | Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas |
| EP3156517B1 (en) * | 2015-10-13 | 2018-12-05 | MacDermid Enthone Inc. | Use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition |
| CN108048164B (zh) * | 2017-12-08 | 2020-10-20 | 合肥工业大学 | 表面涂层与纳米润滑剂协同改善内燃机摩擦学性能的方法 |
| CN108411323B (zh) * | 2018-03-16 | 2019-04-23 | 浙江工业大学 | 一种镍-镍硒核-壳阵列材料的制备方法及其应用 |
| CN108456901B (zh) * | 2018-03-16 | 2019-06-25 | 浙江工业大学 | 一种镍硒阵列材料的制备方法及其应用 |
| DE102018008312A1 (de) * | 2018-10-22 | 2020-04-23 | RIAG Oberflächentechnik AG | Verfahren zur Beschichtung von Substratoberflächen, Vorrichtung mit Beschichtungsbad, Dichtemesseinrichtung, Entnahmeeinrichtung, Zugabeeinrichtungen und Steuerung |
| RU2762733C1 (ru) * | 2021-02-18 | 2021-12-22 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Раствор для химического никелирования металлических изделий |
| US20250137156A1 (en) * | 2023-10-26 | 2025-05-01 | Macdermid Enthone Inc. | Boric acid-free satin nickel |
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| GB785695A (en) * | 1953-08-27 | 1957-11-06 | Gen Am Transport | Improvements in or relating to processes and baths for chemical plating with nickel |
| US2935425A (en) * | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
| US3515564A (en) * | 1968-05-27 | 1970-06-02 | Allied Res Prod Inc | Stabilization of electroless plating solutions |
| US3846138A (en) * | 1973-08-02 | 1974-11-05 | Webline Corp | Electroless copper plating |
| US4171225A (en) * | 1976-01-23 | 1979-10-16 | U.S. Philips Corporation | Electroless copper plating solutions |
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| AU636871B2 (en) * | 1989-09-26 | 1993-05-13 | Courtaulds Coatings (Holdings) Limited | Improvements related to coatings |
| US5258061A (en) * | 1992-11-20 | 1993-11-02 | Monsanto Company | Electroless nickel plating baths |
| JPH06322548A (ja) * | 1993-03-18 | 1994-11-22 | Hitachi Ltd | 化学銅めっき液、化学銅めっき方法および配線基板の製造方法 |
| CA2178146C (en) | 1995-06-06 | 2002-01-15 | Mark W. Zitko | Electroless nickel cobalt phosphorous composition and plating process |
| JP2901523B2 (ja) * | 1995-08-09 | 1999-06-07 | 日本カニゼン株式会社 | 無電解黒色めっき浴組成と皮膜の形成方法 |
| JP3014958B2 (ja) * | 1996-02-23 | 2000-02-28 | 学校法人早稲田大学 | ニッケル・リン薄膜および無電解ニッケル・リンめっき液 |
| DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
| JP2003113478A (ja) * | 2001-10-10 | 2003-04-18 | C Uyemura & Co Ltd | 無電解酸化亜鉛めっき浴 |
| US6926922B2 (en) * | 2002-04-09 | 2005-08-09 | Shipley Company, L.L.C. | PWB manufacture |
| US6800121B2 (en) * | 2002-06-18 | 2004-10-05 | Atotech Deutschland Gmbh | Electroless nickel plating solutions |
| DE10246453A1 (de) * | 2002-10-04 | 2004-04-15 | Enthone Inc., West Haven | Verfahren zur stromlosen Abscheidung von Nickel |
| JP2005126734A (ja) * | 2003-10-21 | 2005-05-19 | C Uyemura & Co Ltd | 無電解ニッケルめっき浴及びそれを用いためっき方法 |
| US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| JP4185523B2 (ja) * | 2005-12-14 | 2008-11-26 | 日本カニゼン株式会社 | 無電解ニッケルめっき皮膜およびこの皮膜を有する機械部品 |
| EP1816237A1 (de) * | 2006-02-02 | 2007-08-08 | Enthone, Inc. | Verfahren und Vorrichtung zur Beschichtung von Substratoberflächen |
| TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
| JP2008081765A (ja) * | 2006-09-26 | 2008-04-10 | Tanaka Kikinzoku Kogyo Kk | パラジウム合金めっき液及びそのめっき液を用いためっき方法。 |
| CN102892924B (zh) * | 2009-07-03 | 2015-02-18 | 恩索恩公司 | 包括β-氨基酸的电解质以及用于沉积金属层的方法 |
-
2010
- 2010-07-06 CN CN201080037528.6A patent/CN102892924B/zh active Active
- 2010-07-06 KR KR1020127003101A patent/KR101635661B1/ko active Active
- 2010-07-06 US US13/382,131 patent/US8962070B2/en active Active
- 2010-07-06 ES ES10730685T patent/ES2714824T3/es active Active
- 2010-07-06 EP EP10730685.4A patent/EP2449148B1/en active Active
- 2010-07-06 JP JP2012518625A patent/JP6192934B2/ja active Active
- 2010-07-06 PL PL10730685T patent/PL2449148T3/pl unknown
- 2010-07-06 WO PCT/US2010/041077 patent/WO2011003116A2/en not_active Ceased
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2015
- 2015-02-24 US US14/630,268 patent/US9249513B2/en active Active
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2017
- 2017-05-19 JP JP2017099768A patent/JP6501821B2/ja active Active
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