JP2013207686A - 水晶発振器 - Google Patents

水晶発振器 Download PDF

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Publication number
JP2013207686A
JP2013207686A JP2012076925A JP2012076925A JP2013207686A JP 2013207686 A JP2013207686 A JP 2013207686A JP 2012076925 A JP2012076925 A JP 2012076925A JP 2012076925 A JP2012076925 A JP 2012076925A JP 2013207686 A JP2013207686 A JP 2013207686A
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JP
Japan
Prior art keywords
crystal
wall layer
chip
package
bottom wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012076925A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013207686A5 (enExample
Inventor
Fumio Asamura
文雄 浅村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2012076925A priority Critical patent/JP2013207686A/ja
Priority to US13/831,996 priority patent/US9041476B2/en
Priority to CN2013101062848A priority patent/CN103457569A/zh
Priority to TW102111286A priority patent/TW201340587A/zh
Publication of JP2013207686A publication Critical patent/JP2013207686A/ja
Publication of JP2013207686A5 publication Critical patent/JP2013207686A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012076925A 2012-03-29 2012-03-29 水晶発振器 Pending JP2013207686A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012076925A JP2013207686A (ja) 2012-03-29 2012-03-29 水晶発振器
US13/831,996 US9041476B2 (en) 2012-03-29 2013-03-15 Crystal controlled oscillator
CN2013101062848A CN103457569A (zh) 2012-03-29 2013-03-29 晶体振荡器
TW102111286A TW201340587A (zh) 2012-03-29 2013-03-29 晶體振盪器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076925A JP2013207686A (ja) 2012-03-29 2012-03-29 水晶発振器

Publications (2)

Publication Number Publication Date
JP2013207686A true JP2013207686A (ja) 2013-10-07
JP2013207686A5 JP2013207686A5 (enExample) 2015-04-30

Family

ID=49234122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012076925A Pending JP2013207686A (ja) 2012-03-29 2012-03-29 水晶発振器

Country Status (4)

Country Link
US (1) US9041476B2 (enExample)
JP (1) JP2013207686A (enExample)
CN (1) CN103457569A (enExample)
TW (1) TW201340587A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091079A (ja) * 2013-11-07 2015-05-11 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
JP2015099993A (ja) * 2013-11-18 2015-05-28 ミツミ電機株式会社 電子部品モジュール及びその製造方法
JP2016005118A (ja) * 2014-06-17 2016-01-12 セイコーエプソン株式会社 発振回路、発振器、電子機器、および移動体
JP2016092437A (ja) * 2014-10-29 2016-05-23 日本電波工業株式会社 水晶振動子及びその製造方法
JP2019068462A (ja) * 2015-03-27 2019-04-25 株式会社大真空 圧電振動デバイス
JP2021016184A (ja) * 2016-11-16 2021-02-12 株式会社大真空 水晶振動デバイス
JP2023004743A (ja) * 2021-06-28 2023-01-17 太陽誘電株式会社 電子部品
WO2023008138A1 (ja) * 2021-07-30 2023-02-02 京セラ株式会社 水晶発振器及びその製造方法

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JP6077813B2 (ja) * 2012-01-23 2017-02-08 日本電波工業株式会社 圧電モジュール
JP6183156B2 (ja) * 2013-10-30 2017-08-23 セイコーエプソン株式会社 パッケージ、振動デバイス、発振器、電子機器及び移動体
US10103709B2 (en) 2013-11-05 2018-10-16 Kyocera Corporation Crystal unit
US9287882B2 (en) * 2013-11-07 2016-03-15 Kyocera Crystal Device Corporation Temperature compensated crystal oscillator
JP2015171109A (ja) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP6041070B2 (ja) * 2014-05-07 2016-12-07 株式会社村田製作所 水晶振動装置
US9660610B2 (en) * 2014-05-30 2017-05-23 Kyocera Crystal Device Corporation Crystal device and mounting arrangement
KR101695709B1 (ko) * 2014-08-12 2017-01-12 삼성전자주식회사 하우징, 하우징 제조 방법 및 그것을 포함하는 전자 장치
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
KR102029501B1 (ko) * 2014-11-24 2019-10-07 삼성전기주식회사 수정진동자 패키지
WO2017126185A1 (ja) * 2016-01-21 2017-07-27 株式会社村田製作所 水晶振動子及びその製造方法
JP6769220B2 (ja) * 2016-10-03 2020-10-14 セイコーエプソン株式会社 電子部品用パッケージ、発振器、電子機器、および移動体
JP6858590B2 (ja) * 2017-02-27 2021-04-14 日本電波工業株式会社 水晶発振器及び水晶発振器の製造方法
JP6987589B2 (ja) * 2017-10-02 2022-01-05 京セラ株式会社 水晶振動子
US10660201B2 (en) * 2018-02-22 2020-05-19 Dexcom, Inc. Sensor interposer employing castellated through-vias
JP7211081B2 (ja) * 2018-12-28 2023-01-24 セイコーエプソン株式会社 振動デバイス
KR102601787B1 (ko) * 2019-03-08 2023-11-13 데쿠세리아루즈 가부시키가이샤 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
WO2020184267A1 (ja) 2019-03-08 2020-09-17 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
CN111786652B (zh) * 2019-04-04 2022-05-10 中芯集成电路（宁波）有限公司上海分公司 体声波谐振器及其制造方法和滤波器、射频通信系统
JP2021057651A (ja) * 2019-09-27 2021-04-08 日本電波工業株式会社 ブランクを搭載する台座、振動子及び発振器
CN112133680B (zh) * 2020-08-18 2022-06-28 山东汉旗科技有限公司 一种低压大电流Mosfet功率芯片
JP7594478B2 (ja) * 2021-03-26 2024-12-04 日本電波工業株式会社 水晶発振器
CN113659956B (zh) * 2021-08-12 2024-01-30 深圳市聚强晶体有限公司 一种石英晶体谐振器
TWI896059B (zh) * 2023-03-28 2025-09-01 模赫半導體股份有限公司 晶體振盪器及其製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032430A (ja) * 1996-07-17 1998-02-03 Nippon Dempa Kogyo Co Ltd 表面実装用圧電発振器
JP3628931B2 (ja) * 2000-03-01 2005-03-16 日本電波工業株式会社 水晶発振器
JP2007060319A (ja) * 2005-08-24 2007-03-08 Epson Toyocom Corp 表面実装型圧電発振器、及びその製造方法
JP2007142947A (ja) * 2005-11-21 2007-06-07 Daishinku Corp 表面実装型圧電発振器
JP2008109429A (ja) * 2006-10-26 2008-05-08 Epson Toyocom Corp 圧電デバイス
JP2008271491A (ja) * 2007-03-22 2008-11-06 Epson Toyocom Corp 水晶デバイス及びその封止方法
JP2009100398A (ja) * 2007-10-19 2009-05-07 Epson Toyocom Corp 圧電デバイス
JP2010088065A (ja) * 2008-10-02 2010-04-15 Kyocera Kinseki Corp 圧電振動子及び圧電発振器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382929A (en) * 1992-07-31 1995-01-17 Ndk, Nihon Dempa Kogyo Company, Ltd. Monolithic crystal filter
WO2001058007A1 (en) * 2000-01-31 2001-08-09 Kinseki Limited Vessel for oscillation circuits using piezoelectric vibrator, method of producing the same, and oscillator
WO2002019514A1 (fr) * 2000-08-31 2002-03-07 Citizen Watch Co., Ltd. Oscillateur a compensation de temperature
US20050040905A1 (en) * 2003-05-29 2005-02-24 Kyocera Corporation Temperature-compensated crystal oscillator
JP4591330B2 (ja) 2005-11-25 2010-12-01 パナソニック株式会社 電子部品接続構造および電子部品接続方法
JP4629723B2 (ja) 2007-12-19 2011-02-09 日本電波工業株式会社 表面実装用の水晶発振器
JP4750177B2 (ja) * 2008-12-23 2011-08-17 日本電波工業株式会社 表面実装用の水晶発振器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032430A (ja) * 1996-07-17 1998-02-03 Nippon Dempa Kogyo Co Ltd 表面実装用圧電発振器
JP3628931B2 (ja) * 2000-03-01 2005-03-16 日本電波工業株式会社 水晶発振器
JP2007060319A (ja) * 2005-08-24 2007-03-08 Epson Toyocom Corp 表面実装型圧電発振器、及びその製造方法
JP2007142947A (ja) * 2005-11-21 2007-06-07 Daishinku Corp 表面実装型圧電発振器
JP2008109429A (ja) * 2006-10-26 2008-05-08 Epson Toyocom Corp 圧電デバイス
JP2008271491A (ja) * 2007-03-22 2008-11-06 Epson Toyocom Corp 水晶デバイス及びその封止方法
JP2009100398A (ja) * 2007-10-19 2009-05-07 Epson Toyocom Corp 圧電デバイス
JP2010088065A (ja) * 2008-10-02 2010-04-15 Kyocera Kinseki Corp 圧電振動子及び圧電発振器

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091079A (ja) * 2013-11-07 2015-05-11 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
JP2015099993A (ja) * 2013-11-18 2015-05-28 ミツミ電機株式会社 電子部品モジュール及びその製造方法
JP2016005118A (ja) * 2014-06-17 2016-01-12 セイコーエプソン株式会社 発振回路、発振器、電子機器、および移動体
JP2016092437A (ja) * 2014-10-29 2016-05-23 日本電波工業株式会社 水晶振動子及びその製造方法
JP2019068462A (ja) * 2015-03-27 2019-04-25 株式会社大真空 圧電振動デバイス
US10771037B2 (en) 2015-03-27 2020-09-08 Daishinku Corporation Piezoelectric resonator device
JP2021016184A (ja) * 2016-11-16 2021-02-12 株式会社大真空 水晶振動デバイス
JP2021057914A (ja) * 2016-11-16 2021-04-08 株式会社大真空 水晶振動デバイス
JP7060053B2 (ja) 2016-11-16 2022-04-26 株式会社大真空 水晶振動デバイス
US11342899B2 (en) 2016-11-16 2022-05-24 Daishinku Corporation Crystal resonator device
JP2023004743A (ja) * 2021-06-28 2023-01-17 太陽誘電株式会社 電子部品
JP7706276B2 (ja) 2021-06-28 2025-07-11 太陽誘電株式会社 電子部品
WO2023008138A1 (ja) * 2021-07-30 2023-02-02 京セラ株式会社 水晶発振器及びその製造方法

Also Published As

Publication number Publication date
CN103457569A (zh) 2013-12-18
TW201340587A (zh) 2013-10-01
US20130257549A1 (en) 2013-10-03
US9041476B2 (en) 2015-05-26

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