CN103457569A - 晶体振荡器 - Google Patents

晶体振荡器 Download PDF

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Publication number
CN103457569A
CN103457569A CN2013101062848A CN201310106284A CN103457569A CN 103457569 A CN103457569 A CN 103457569A CN 2013101062848 A CN2013101062848 A CN 2013101062848A CN 201310106284 A CN201310106284 A CN 201310106284A CN 103457569 A CN103457569 A CN 103457569A
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CN
China
Prior art keywords
crystal
wall layer
package
bottom wall
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013101062848A
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English (en)
Chinese (zh)
Inventor
浅村文雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN103457569A publication Critical patent/CN103457569A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN2013101062848A 2012-03-29 2013-03-29 晶体振荡器 Pending CN103457569A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-076925 2012-03-29
JP2012076925A JP2013207686A (ja) 2012-03-29 2012-03-29 水晶発振器

Publications (1)

Publication Number Publication Date
CN103457569A true CN103457569A (zh) 2013-12-18

Family

ID=49234122

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013101062848A Pending CN103457569A (zh) 2012-03-29 2013-03-29 晶体振荡器

Country Status (4)

Country Link
US (1) US9041476B2 (enExample)
JP (1) JP2013207686A (enExample)
CN (1) CN103457569A (enExample)
TW (1) TW201340587A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105281696A (zh) * 2014-05-30 2016-01-27 京瓷晶体元件有限公司 水晶器件以及水晶器件的制造方法
CN105322889A (zh) * 2014-06-17 2016-02-10 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN105634434A (zh) * 2014-11-24 2016-06-01 三星电机株式会社 晶体振荡器封装件及其振动部
CN108496307A (zh) * 2016-01-21 2018-09-04 株式会社村田制作所 水晶振子及其制造方法
CN108512524A (zh) * 2017-02-27 2018-09-07 日本电波工业株式会社 晶体振荡器及晶体振荡器的制造方法
CN109600136A (zh) * 2017-10-02 2019-04-09 京瓷株式会社 晶体振荡器
CN112133680A (zh) * 2020-08-18 2020-12-25 山东汉旗科技有限公司 一种低压大电流Mosfet功率芯片
CN113474872A (zh) * 2019-03-08 2021-10-01 迪睿合株式会社 连接构造体的制造方法及连接构造体以及膜构造体及膜构造体的制造方法
CN113659956A (zh) * 2021-08-12 2021-11-16 深圳市聚强晶体有限公司 一种石英晶体谐振器
US12142621B2 (en) 2019-03-08 2024-11-12 Dexerials Corporation Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
TWI896059B (zh) * 2023-03-28 2025-09-01 模赫半導體股份有限公司 晶體振盪器及其製造方法

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JP6077813B2 (ja) * 2012-01-23 2017-02-08 日本電波工業株式会社 圧電モジュール
JP6183156B2 (ja) * 2013-10-30 2017-08-23 セイコーエプソン株式会社 パッケージ、振動デバイス、発振器、電子機器及び移動体
US10103709B2 (en) 2013-11-05 2018-10-16 Kyocera Corporation Crystal unit
JP6311277B2 (ja) * 2013-11-07 2018-04-18 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
US9287882B2 (en) * 2013-11-07 2016-03-15 Kyocera Crystal Device Corporation Temperature compensated crystal oscillator
JP6303427B2 (ja) * 2013-11-18 2018-04-04 ミツミ電機株式会社 電子部品モジュール及びその製造方法
JP2015171109A (ja) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP6041070B2 (ja) * 2014-05-07 2016-12-07 株式会社村田製作所 水晶振動装置
KR101695709B1 (ko) * 2014-08-12 2017-01-12 삼성전자주식회사 하우징, 하우징 제조 방법 및 그것을 포함하는 전자 장치
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
JP6449620B2 (ja) * 2014-10-29 2019-01-09 日本電波工業株式会社 水晶振動子及びその製造方法
WO2016158010A1 (ja) * 2015-03-27 2016-10-06 株式会社大真空 圧電振動デバイス
JP6769220B2 (ja) * 2016-10-03 2020-10-14 セイコーエプソン株式会社 電子部品用パッケージ、発振器、電子機器、および移動体
JPWO2018092572A1 (ja) * 2016-11-16 2019-10-17 株式会社大真空 水晶振動デバイス
US10660201B2 (en) * 2018-02-22 2020-05-19 Dexcom, Inc. Sensor interposer employing castellated through-vias
JP7211081B2 (ja) * 2018-12-28 2023-01-24 セイコーエプソン株式会社 振動デバイス
CN111786652B (zh) * 2019-04-04 2022-05-10 中芯集成电路（宁波）有限公司上海分公司 体声波谐振器及其制造方法和滤波器、射频通信系统
JP2021057651A (ja) * 2019-09-27 2021-04-08 日本電波工業株式会社 ブランクを搭載する台座、振動子及び発振器
JP7594478B2 (ja) * 2021-03-26 2024-12-04 日本電波工業株式会社 水晶発振器
JP7706276B2 (ja) * 2021-06-28 2025-07-11 太陽誘電株式会社 電子部品
WO2023008138A1 (ja) * 2021-07-30 2023-02-02 京セラ株式会社 水晶発振器及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032430A (ja) * 1996-07-17 1998-02-03 Nippon Dempa Kogyo Co Ltd 表面実装用圧電発振器
JP2001244744A (ja) * 2000-03-01 2001-09-07 Nippon Dempa Kogyo Co Ltd 水晶発振器
CN1389015A (zh) * 2000-08-31 2003-01-01 西铁城时计株式会社 温度补偿型振荡器
CN101764591A (zh) * 2008-12-23 2010-06-30 日本电波工业株式会社 表面安装用晶体振荡器

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US5382929A (en) * 1992-07-31 1995-01-17 Ndk, Nihon Dempa Kogyo Company, Ltd. Monolithic crystal filter
WO2001058007A1 (en) * 2000-01-31 2001-08-09 Kinseki Limited Vessel for oscillation circuits using piezoelectric vibrator, method of producing the same, and oscillator
US20050040905A1 (en) * 2003-05-29 2005-02-24 Kyocera Corporation Temperature-compensated crystal oscillator
JP2007060319A (ja) * 2005-08-24 2007-03-08 Epson Toyocom Corp 表面実装型圧電発振器、及びその製造方法
JP2007142947A (ja) * 2005-11-21 2007-06-07 Daishinku Corp 表面実装型圧電発振器
JP4591330B2 (ja) 2005-11-25 2010-12-01 パナソニック株式会社 電子部品接続構造および電子部品接続方法
JP2008109429A (ja) * 2006-10-26 2008-05-08 Epson Toyocom Corp 圧電デバイス
JP5119866B2 (ja) * 2007-03-22 2013-01-16 セイコーエプソン株式会社 水晶デバイス及びその封止方法
JP5071035B2 (ja) * 2007-10-19 2012-11-14 セイコーエプソン株式会社 圧電デバイス
JP4629723B2 (ja) 2007-12-19 2011-02-09 日本電波工業株式会社 表面実装用の水晶発振器
JP5220539B2 (ja) * 2008-10-02 2013-06-26 京セラクリスタルデバイス株式会社 圧電振動子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1032430A (ja) * 1996-07-17 1998-02-03 Nippon Dempa Kogyo Co Ltd 表面実装用圧電発振器
JP2001244744A (ja) * 2000-03-01 2001-09-07 Nippon Dempa Kogyo Co Ltd 水晶発振器
CN1389015A (zh) * 2000-08-31 2003-01-01 西铁城时计株式会社 温度补偿型振荡器
CN101764591A (zh) * 2008-12-23 2010-06-30 日本电波工业株式会社 表面安装用晶体振荡器

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105281696B (zh) * 2014-05-30 2018-02-09 京瓷株式会社 水晶器件以及水晶器件的制造方法
CN105281696A (zh) * 2014-05-30 2016-01-27 京瓷晶体元件有限公司 水晶器件以及水晶器件的制造方法
CN105322889A (zh) * 2014-06-17 2016-02-10 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN105634434B (zh) * 2014-11-24 2020-04-28 三星电机株式会社 晶体振荡器封装件及其振动部
CN105634434A (zh) * 2014-11-24 2016-06-01 三星电机株式会社 晶体振荡器封装件及其振动部
CN108496307B (zh) * 2016-01-21 2021-07-23 株式会社村田制作所 水晶振子及其制造方法
CN108496307A (zh) * 2016-01-21 2018-09-04 株式会社村田制作所 水晶振子及其制造方法
CN108512524A (zh) * 2017-02-27 2018-09-07 日本电波工业株式会社 晶体振荡器及晶体振荡器的制造方法
CN108512524B (zh) * 2017-02-27 2023-05-26 日本电波工业株式会社 晶体振荡器及晶体振荡器的制造方法
CN109600136A (zh) * 2017-10-02 2019-04-09 京瓷株式会社 晶体振荡器
CN109600136B (zh) * 2017-10-02 2023-12-19 京瓷株式会社 晶体振荡器
CN113474872A (zh) * 2019-03-08 2021-10-01 迪睿合株式会社 连接构造体的制造方法及连接构造体以及膜构造体及膜构造体的制造方法
US12142621B2 (en) 2019-03-08 2024-11-12 Dexerials Corporation Method of manufacturing connection structure, connection structure, film structure, and method of manufacturing film structure
CN112133680A (zh) * 2020-08-18 2020-12-25 山东汉旗科技有限公司 一种低压大电流Mosfet功率芯片
CN112133680B (zh) * 2020-08-18 2022-06-28 山东汉旗科技有限公司 一种低压大电流Mosfet功率芯片
CN113659956B (zh) * 2021-08-12 2024-01-30 深圳市聚强晶体有限公司 一种石英晶体谐振器
CN113659956A (zh) * 2021-08-12 2021-11-16 深圳市聚强晶体有限公司 一种石英晶体谐振器
TWI896059B (zh) * 2023-03-28 2025-09-01 模赫半導體股份有限公司 晶體振盪器及其製造方法

Also Published As

Publication number Publication date
JP2013207686A (ja) 2013-10-07
TW201340587A (zh) 2013-10-01
US20130257549A1 (en) 2013-10-03
US9041476B2 (en) 2015-05-26

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Application publication date: 20131218