JP4629723B2 - 表面実装用の水晶発振器 - Google Patents
表面実装用の水晶発振器 Download PDFInfo
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- JP4629723B2 JP4629723B2 JP2007326813A JP2007326813A JP4629723B2 JP 4629723 B2 JP4629723 B2 JP 4629723B2 JP 2007326813 A JP2007326813 A JP 2007326813A JP 2007326813 A JP2007326813 A JP 2007326813A JP 4629723 B2 JP4629723 B2 JP 4629723B2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2924/161—Cap
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- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Wire Bonding (AREA)
Description
表面実装発振器は小型・軽量であることから特に携帯型の電子機器に周波数や時間の基準源として内蔵される。このようなものの一つに、イオンビームの照射によって発振周波数を調整した表面実装発振器がある。
第3図及び第4図は一従来例を説明する図で、第3図(a)は表面実装発振器の断面図、同図(b)はカバーを除く平面図、同図(c)は水晶片の平面図、第4図は簡略的な発振回路図である。
しかしながら、上記構成の表面実装発振器では、各メーカの設計に基づいたICチップ1によって、IC端子6の配置が異なる。この場合、発振用増幅素子5の入出力端に接続する一端部両側の水晶端子6(xy)は、必ずしも一様ではなく、例えば一端部両側の右側(図の下側)となる水晶端子6xが出力側になることも入力側になることもある。
本発明は、ICチップのIC端子(水晶端子)の位置に拘わらず、水晶片の上面側となる一方の励振電極が発振用増幅素子の出力側になる生産性に富んだ表面実装発振器を提供することを目的とする。
そして、入力水晶端子及び出力水晶端子と第1ないし第4回路端子とは、前記のいずれか一方の配線方式を採用する。
これにより、IC端子中における一端部両側の水晶端子が発振用増幅素子の入力端及び出力端のいずれに接続していたとしても、容器本体の開口端面側となる一方の励振電極(上面電極)を発振用増幅素子の出力端に接続できる。
本発明の請求項2では、請求項1において、前記容器本体は一端部に内壁段部を有し、前記ICチップは容器本体の内底面に固着し、前記励振電極から引出電極の延出した水晶片の一端部両側は前記内壁段部に固着する。これにより、請求項1での容器本体に対するICチップと水晶片との位置関係を明確にする。
Claims (2)
- 少なくとも発振用増幅素子を集積化してなるICチップと、一対の励振電極を両主面に有して引出電極が一端部両側に延出した水晶片とを凹部を有する容器本体に収容するとともに、前記引出電極の延出した水晶片の一端部両側は導電性接着剤によって前記容器本体に形成された一対の水晶保持端子と接続し、
前記発振用増幅素子の入力端及び出力端であって、水晶端子である入力水晶端子及び出力水晶端子がIC端子中の一端部両側に設けられ、前記入力水晶端子及び前記出力水晶端子と前記励振電極とはワイヤーボンディングを経て電気的に接続し、
前記出力水晶端子に電気的に接続した前記励振電極中の一方の励振電極は前記容器本体の開口端面側に位置し、前記一方の励振電極にイオンビームを照射して発振周波数を調整してなる表面実装用の水晶発振器において、
前記容器本体における前記凹部には、前記入力水晶端子に隣接して第1及び第2の回路端子が形成され、前記出力水晶端子に隣接して第3及び第4の回路端子が形成されて、
前記一対の水晶保持端子の一方は前記第1の回路端子及び第3の回路端子と電気的に接続し、前記一対の水晶保持端子の他方は前記第2の回路端子及び第4の回路端子と電気的に接続し、
前記入力水晶端子は前記第1の回路端子に前記ワイヤーボンディングによって接続し、前記出力水晶端子は前記第4の回路端子に前記ワイヤーボンディングによって接続する配線方式、又は、前記入力水晶端子は前記第2の回路端子に前記ワイヤーボンディングによって接続し、前記出力水晶端子は前記第3の回路端子に前記ワイヤーボンディングによって接続する配線方式のいずれか一方の配線方式が採用されたことを特徴とする表面実装用の水晶発振器。 - 請求項1において、前記容器本体は一端部に分割された内壁段部を有し、前記ICチップは容器本体の内底面に固着し、前記引出電極の延出した水晶片の一端部両側は前記内壁段部に固着した表面実装用の水晶発振器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326813A JP4629723B2 (ja) | 2007-12-19 | 2007-12-19 | 表面実装用の水晶発振器 |
US12/336,926 US7795982B2 (en) | 2007-12-19 | 2008-12-17 | Surface-mount type crystal oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326813A JP4629723B2 (ja) | 2007-12-19 | 2007-12-19 | 表面実装用の水晶発振器 |
Publications (2)
Publication Number | Publication Date |
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JP2009152715A JP2009152715A (ja) | 2009-07-09 |
JP4629723B2 true JP4629723B2 (ja) | 2011-02-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007326813A Expired - Fee Related JP4629723B2 (ja) | 2007-12-19 | 2007-12-19 | 表面実装用の水晶発振器 |
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US (1) | US7795982B2 (ja) |
JP (1) | JP4629723B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013207686A (ja) | 2012-03-29 | 2013-10-07 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
JP2015088930A (ja) * | 2013-10-30 | 2015-05-07 | セイコーエプソン株式会社 | 発振回路、発振器、発振器の製造方法、電子機器及び移動体 |
JP6206664B2 (ja) | 2013-10-30 | 2017-10-04 | セイコーエプソン株式会社 | 発振回路、発振器、発振器の製造方法、電子機器及び移動体 |
JP2015088876A (ja) | 2013-10-30 | 2015-05-07 | セイコーエプソン株式会社 | 振動素子、振動子、電子デバイス、電子機器及び移動体 |
JP2015088931A (ja) | 2013-10-30 | 2015-05-07 | セイコーエプソン株式会社 | 発振回路、発振器、発振器の製造方法、電子機器及び移動体 |
JP6226127B2 (ja) | 2013-10-30 | 2017-11-08 | セイコーエプソン株式会社 | 発振回路、発振器、発振器の製造方法、電子機器及び移動体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244744A (ja) * | 2000-03-01 | 2001-09-07 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
JP2005236892A (ja) * | 2004-02-23 | 2005-09-02 | Kyocera Corp | 圧電振動子収納用パッケージおよび圧電装置 |
JP2005244939A (ja) * | 2004-01-29 | 2005-09-08 | Seiko Epson Corp | 電子部品用パッケージおよび電子部品並びに圧電デバイスの製造方法 |
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JP2004015441A (ja) * | 2002-06-06 | 2004-01-15 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
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2007
- 2007-12-19 JP JP2007326813A patent/JP4629723B2/ja not_active Expired - Fee Related
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2008
- 2008-12-17 US US12/336,926 patent/US7795982B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244744A (ja) * | 2000-03-01 | 2001-09-07 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
JP2005244939A (ja) * | 2004-01-29 | 2005-09-08 | Seiko Epson Corp | 電子部品用パッケージおよび電子部品並びに圧電デバイスの製造方法 |
JP2005236892A (ja) * | 2004-02-23 | 2005-09-02 | Kyocera Corp | 圧電振動子収納用パッケージおよび圧電装置 |
Also Published As
Publication number | Publication date |
---|---|
US7795982B2 (en) | 2010-09-14 |
JP2009152715A (ja) | 2009-07-09 |
US20090160563A1 (en) | 2009-06-25 |
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