JP5371469B2 - 表面実装用の水晶発振器 - Google Patents
表面実装用の水晶発振器 Download PDFInfo
- Publication number
- JP5371469B2 JP5371469B2 JP2009030926A JP2009030926A JP5371469B2 JP 5371469 B2 JP5371469 B2 JP 5371469B2 JP 2009030926 A JP2009030926 A JP 2009030926A JP 2009030926 A JP2009030926 A JP 2009030926A JP 5371469 B2 JP5371469 B2 JP 5371469B2
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- JP
- Japan
- Prior art keywords
- crystal
- pair
- terminal
- container body
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
表面実装発振器は小型・軽量であることから、特に携帯電話に代表される携帯型の電子機器に内蔵される。このようなものの一つに、容器本体を両主面に凹部を有する断面H状として、一方の凹部に水晶片を、他方の凹部にICチップを収容したものがある。
しかしながら、上記構成の表面実装発振器では、電源投入時のICチップ3の特に能動素子の発熱によって温度が急激に上昇する。そして、特に、IC端子中の水晶端子、回路端子7(xy)、配線路6及び水晶保持端子5(ab)を経て水晶片2に伝熱する。さらに、導電性接着剤11によって水晶保持端子5(ab)と直接に接続する引出電極10(ab)から励振電極9(ab)に伝熱され、言わば、ICチップ3の発熱温度が水晶片2の振動領域「励振電極9(ab)部」に直接的に伝熱する。また、底壁1aからの熱も空間を経て振動領域に伝熱する。
本発明は電源投入時の周波数変動を防止する表面実装発振器を提供することを目的とする。
6 配線路、7 回路端子、7(xy)水晶端子、8 実装端子、9 励振電極、
10 引出電極、11 導電性接着剤、12 バンプ、13 金属リング、14 放熱用電極。
Claims (1)
- 底壁の両主面に枠壁を積層して両主面に凹部を有する容器本体と、前記容器本体の一方の凹部内底面に設けられた一対の水晶保持端子に引出電極の延出した一端部両側が固着された水晶片と、前記一方の凹部の開口端面に接合して前記水晶片を密閉封入する金属カバーと、前記容器本体の他方の凹部内底面に設けられた回路端子にIC端子が電気的・機械的に接続したICチップとを備えた表面実装用の水晶発振器において、
前記回路端子は一対の水晶端子を含み、前記容器本体の前記底壁に設けた配線路によって前記一対の水晶保持端子に接続しており、
前記一対の水晶保持端子から前記容器本体の内底面に延出した一対の放熱用電極を有し、
前記一対の放熱用電極のそれぞれは、前記水晶片の内底面で各長辺の外側領域に延出し、当該一対の放電用電極の先端間が前記水晶保持端子の間に対して同等以上の間をもって設けられたことを特徴とする表面実装用の水晶発振器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009030926A JP5371469B2 (ja) | 2009-02-13 | 2009-02-13 | 表面実装用の水晶発振器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009030926A JP5371469B2 (ja) | 2009-02-13 | 2009-02-13 | 表面実装用の水晶発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010187263A JP2010187263A (ja) | 2010-08-26 |
JP5371469B2 true JP5371469B2 (ja) | 2013-12-18 |
Family
ID=42767630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009030926A Expired - Fee Related JP5371469B2 (ja) | 2009-02-13 | 2009-02-13 | 表面実装用の水晶発振器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5371469B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5731870B2 (ja) * | 2011-03-29 | 2015-06-10 | セイコーインスツル株式会社 | 電子部品パッケージ |
JP6127889B2 (ja) * | 2013-10-04 | 2017-05-17 | 株式会社大真空 | 圧電デバイス |
JP6376330B2 (ja) | 2014-03-25 | 2018-08-22 | セイコーエプソン株式会社 | 電子部品、電子機器および移動体 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008294585A (ja) * | 2007-05-22 | 2008-12-04 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
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2009
- 2009-02-13 JP JP2009030926A patent/JP5371469B2/ja not_active Expired - Fee Related
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JP2010187263A (ja) | 2010-08-26 |
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