JP4359934B2 - 温度補償型水晶発振器 - Google Patents
温度補償型水晶発振器 Download PDFInfo
- Publication number
- JP4359934B2 JP4359934B2 JP2006123137A JP2006123137A JP4359934B2 JP 4359934 B2 JP4359934 B2 JP 4359934B2 JP 2006123137 A JP2006123137 A JP 2006123137A JP 2006123137 A JP2006123137 A JP 2006123137A JP 4359934 B2 JP4359934 B2 JP 4359934B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- crystal oscillator
- cavity portion
- electronic component
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Description
2・・水晶振動子
3・・ICチップ
4、5・・電子部品素子
6・・・金属製蓋体
40、50・・・部品搭載用電極パッド
40a、40b、50a、50b・・・・電極部
41a 、41b 、44a 、44b 、45a 、45b 、46a 、46b ・・切り欠き部
Claims (4)
- 容器体の主面にキャビティー部を配置するとともに、該主面の四隅部に端子電極を配置し、
前記キャビティー部は、隣り合う前記端子電極間の4つの領域よりも内側に位置している中央部と、前記中央部と一体的に設けられ、隣り合う前記端子電極間の4つの領域に位置している周辺部とを有しており、
水晶振動子に電気的に接続されるICチップが、前記中央部を挟んで対向する前記周辺部間を跨ぐようにして配置され、
前記ICチップの動作制御を行うための動作制御電極を前記隣り合う端子電極間の領域を介して前記キャビティー部の内部から外部にかけて導出させたことを特徴とする温度補償型水晶発振器。 - 前記ICチップは、前記キャビティー部の底面に配置されるIC接続用電極パッドに対してバンプ部材を介して接続されていることを特徴とする請求項1に記載の温度補償型水晶発振器。
- 前記キャビティー部内にICチップ封止用樹脂が充填されていることを特徴とする請求項1または請求項2に記載の温度補償型水晶発振器。
- 前記ICチップ封止用樹脂の一部が、前記キャビティー部の前記周辺部に設けられており、前記キャビティー部の側壁に接していることを特徴とする請求項3記載の水晶発振器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006123137A JP4359934B2 (ja) | 2006-04-27 | 2006-04-27 | 温度補償型水晶発振器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006123137A JP4359934B2 (ja) | 2006-04-27 | 2006-04-27 | 温度補償型水晶発振器 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003033158A Division JP3840187B2 (ja) | 2003-02-12 | 2003-02-12 | 温度補償型水晶発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006217665A JP2006217665A (ja) | 2006-08-17 |
JP4359934B2 true JP4359934B2 (ja) | 2009-11-11 |
Family
ID=36980396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006123137A Expired - Lifetime JP4359934B2 (ja) | 2006-04-27 | 2006-04-27 | 温度補償型水晶発振器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4359934B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008141412A (ja) * | 2006-11-30 | 2008-06-19 | Kyocera Kinseki Corp | 圧電デバイス |
JP5101201B2 (ja) * | 2007-07-31 | 2012-12-19 | 京セラクリスタルデバイス株式会社 | 圧電発振器 |
-
2006
- 2006-04-27 JP JP2006123137A patent/JP4359934B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2006217665A (ja) | 2006-08-17 |
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