TW201340587A - 晶體振盪器 - Google Patents

晶體振盪器 Download PDF

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Publication number
TW201340587A
TW201340587A TW102111286A TW102111286A TW201340587A TW 201340587 A TW201340587 A TW 201340587A TW 102111286 A TW102111286 A TW 102111286A TW 102111286 A TW102111286 A TW 102111286A TW 201340587 A TW201340587 A TW 201340587A
Authority
TW
Taiwan
Prior art keywords
crystal
wall layer
package
crystal oscillator
bottom wall
Prior art date
Application number
TW102111286A
Other languages
English (en)
Chinese (zh)
Inventor
浅村文雄
Original Assignee
日本電波工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電波工業股份有限公司 filed Critical 日本電波工業股份有限公司
Publication of TW201340587A publication Critical patent/TW201340587A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW102111286A 2012-03-29 2013-03-29 晶體振盪器 TW201340587A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076925A JP2013207686A (ja) 2012-03-29 2012-03-29 水晶発振器

Publications (1)

Publication Number Publication Date
TW201340587A true TW201340587A (zh) 2013-10-01

Family

ID=49234122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102111286A TW201340587A (zh) 2012-03-29 2013-03-29 晶體振盪器

Country Status (4)

Country Link
US (1) US9041476B2 (enExample)
JP (1) JP2013207686A (enExample)
CN (1) CN103457569A (enExample)
TW (1) TW201340587A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI849375B (zh) * 2021-03-26 2024-07-21 日商日本電波工業股份有限公司 晶體振盪器

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JP6077813B2 (ja) * 2012-01-23 2017-02-08 日本電波工業株式会社 圧電モジュール
JP6183156B2 (ja) * 2013-10-30 2017-08-23 セイコーエプソン株式会社 パッケージ、振動デバイス、発振器、電子機器及び移動体
US10103709B2 (en) 2013-11-05 2018-10-16 Kyocera Corporation Crystal unit
JP6311277B2 (ja) * 2013-11-07 2018-04-18 セイコーエプソン株式会社 電子デバイス、電子デバイス用回路基板、電子機器、移動体
US9287882B2 (en) * 2013-11-07 2016-03-15 Kyocera Crystal Device Corporation Temperature compensated crystal oscillator
JP6303427B2 (ja) * 2013-11-18 2018-04-04 ミツミ電機株式会社 電子部品モジュール及びその製造方法
JP2015171109A (ja) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP6041070B2 (ja) * 2014-05-07 2016-12-07 株式会社村田製作所 水晶振動装置
US9660610B2 (en) * 2014-05-30 2017-05-23 Kyocera Crystal Device Corporation Crystal device and mounting arrangement
JP2016005118A (ja) * 2014-06-17 2016-01-12 セイコーエプソン株式会社 発振回路、発振器、電子機器、および移動体
KR101695709B1 (ko) * 2014-08-12 2017-01-12 삼성전자주식회사 하우징, 하우징 제조 방법 및 그것을 포함하는 전자 장치
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
JP6449620B2 (ja) * 2014-10-29 2019-01-09 日本電波工業株式会社 水晶振動子及びその製造方法
KR102029501B1 (ko) * 2014-11-24 2019-10-07 삼성전기주식회사 수정진동자 패키지
WO2016158010A1 (ja) * 2015-03-27 2016-10-06 株式会社大真空 圧電振動デバイス
WO2017126185A1 (ja) * 2016-01-21 2017-07-27 株式会社村田製作所 水晶振動子及びその製造方法
JP6769220B2 (ja) * 2016-10-03 2020-10-14 セイコーエプソン株式会社 電子部品用パッケージ、発振器、電子機器、および移動体
JPWO2018092572A1 (ja) * 2016-11-16 2019-10-17 株式会社大真空 水晶振動デバイス
JP6858590B2 (ja) * 2017-02-27 2021-04-14 日本電波工業株式会社 水晶発振器及び水晶発振器の製造方法
JP6987589B2 (ja) * 2017-10-02 2022-01-05 京セラ株式会社 水晶振動子
US10660201B2 (en) * 2018-02-22 2020-05-19 Dexcom, Inc. Sensor interposer employing castellated through-vias
JP7211081B2 (ja) * 2018-12-28 2023-01-24 セイコーエプソン株式会社 振動デバイス
KR102601787B1 (ko) * 2019-03-08 2023-11-13 데쿠세리아루즈 가부시키가이샤 접속 구조체의 제조 방법, 및 접속 구조체, 그리고 필름 구조체, 및 필름 구조체의 제조 방법
WO2020184267A1 (ja) 2019-03-08 2020-09-17 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
CN111786652B (zh) * 2019-04-04 2022-05-10 中芯集成电路（宁波）有限公司上海分公司 体声波谐振器及其制造方法和滤波器、射频通信系统
JP2021057651A (ja) * 2019-09-27 2021-04-08 日本電波工業株式会社 ブランクを搭載する台座、振動子及び発振器
CN112133680B (zh) * 2020-08-18 2022-06-28 山东汉旗科技有限公司 一种低压大电流Mosfet功率芯片
JP7706276B2 (ja) * 2021-06-28 2025-07-11 太陽誘電株式会社 電子部品
WO2023008138A1 (ja) * 2021-07-30 2023-02-02 京セラ株式会社 水晶発振器及びその製造方法
CN113659956B (zh) * 2021-08-12 2024-01-30 深圳市聚强晶体有限公司 一种石英晶体谐振器
TWI896059B (zh) * 2023-03-28 2025-09-01 模赫半導體股份有限公司 晶體振盪器及其製造方法

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JP3628931B2 (ja) * 2000-03-01 2005-03-16 日本電波工業株式会社 水晶発振器
WO2002019514A1 (fr) * 2000-08-31 2002-03-07 Citizen Watch Co., Ltd. Oscillateur a compensation de temperature
US20050040905A1 (en) * 2003-05-29 2005-02-24 Kyocera Corporation Temperature-compensated crystal oscillator
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JP2007142947A (ja) * 2005-11-21 2007-06-07 Daishinku Corp 表面実装型圧電発振器
JP4591330B2 (ja) 2005-11-25 2010-12-01 パナソニック株式会社 電子部品接続構造および電子部品接続方法
JP2008109429A (ja) * 2006-10-26 2008-05-08 Epson Toyocom Corp 圧電デバイス
JP5119866B2 (ja) * 2007-03-22 2013-01-16 セイコーエプソン株式会社 水晶デバイス及びその封止方法
JP5071035B2 (ja) * 2007-10-19 2012-11-14 セイコーエプソン株式会社 圧電デバイス
JP4629723B2 (ja) 2007-12-19 2011-02-09 日本電波工業株式会社 表面実装用の水晶発振器
JP5220539B2 (ja) * 2008-10-02 2013-06-26 京セラクリスタルデバイス株式会社 圧電振動子の製造方法
JP4750177B2 (ja) * 2008-12-23 2011-08-17 日本電波工業株式会社 表面実装用の水晶発振器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849375B (zh) * 2021-03-26 2024-07-21 日商日本電波工業股份有限公司 晶體振盪器

Also Published As

Publication number Publication date
JP2013207686A (ja) 2013-10-07
CN103457569A (zh) 2013-12-18
US20130257549A1 (en) 2013-10-03
US9041476B2 (en) 2015-05-26

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