JP2013161946A - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP2013161946A
JP2013161946A JP2012022756A JP2012022756A JP2013161946A JP 2013161946 A JP2013161946 A JP 2013161946A JP 2012022756 A JP2012022756 A JP 2012022756A JP 2012022756 A JP2012022756 A JP 2012022756A JP 2013161946 A JP2013161946 A JP 2013161946A
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JP
Japan
Prior art keywords
substrate
stage
support
processed
support pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012022756A
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English (en)
Japanese (ja)
Inventor
Toshihiko Ueda
稔彦 植田
Takahiro Furuya
高広 古家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012022756A priority Critical patent/JP2013161946A/ja
Priority to TW102100230A priority patent/TW201347078A/zh
Priority to KR1020130012755A priority patent/KR20130090829A/ko
Priority to CN2013100481651A priority patent/CN103247564A/zh
Publication of JP2013161946A publication Critical patent/JP2013161946A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
JP2012022756A 2012-02-06 2012-02-06 基板処理装置及び基板処理方法 Pending JP2013161946A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012022756A JP2013161946A (ja) 2012-02-06 2012-02-06 基板処理装置及び基板処理方法
TW102100230A TW201347078A (zh) 2012-02-06 2013-01-04 基板處理裝置及基板處理方法
KR1020130012755A KR20130090829A (ko) 2012-02-06 2013-02-05 기판 처리 장치 및 기판 처리 방법
CN2013100481651A CN103247564A (zh) 2012-02-06 2013-02-06 基板处理装置和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012022756A JP2013161946A (ja) 2012-02-06 2012-02-06 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
JP2013161946A true JP2013161946A (ja) 2013-08-19

Family

ID=48926979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012022756A Pending JP2013161946A (ja) 2012-02-06 2012-02-06 基板処理装置及び基板処理方法

Country Status (4)

Country Link
JP (1) JP2013161946A (zh)
KR (1) KR20130090829A (zh)
CN (1) CN103247564A (zh)
TW (1) TW201347078A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015167159A (ja) * 2014-03-03 2015-09-24 東京エレクトロン株式会社 基板載置装置及び基板処理装置
JP2015228488A (ja) * 2014-05-03 2015-12-17 株式会社半導体エネルギー研究所 フィルム状部材の支持装置
US11243476B2 (en) 2018-04-26 2022-02-08 Asml Netherlands B.V. Stage apparatus, lithographic apparatus, control unit and method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101719176B1 (ko) * 2015-09-11 2017-03-23 주식회사 선익시스템 글라스기판 서포트방법
JP6639175B2 (ja) * 2015-09-29 2020-02-05 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
TWI725115B (zh) * 2016-01-29 2021-04-21 日商達誼恆股份有限公司 基板移載用機器手
JP6461235B2 (ja) * 2017-05-22 2019-01-30 キヤノントッキ株式会社 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
CN109343248A (zh) * 2018-12-06 2019-02-15 深圳市华星光电半导体显示技术有限公司 真空贴合装置及其脱离显示面板的方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181054A (ja) * 1994-12-26 1996-07-12 Nikon Corp ステージ装置及びその制御方法
JPH1124236A (ja) * 1997-07-08 1999-01-29 Nikon Corp フォトマスク、フォトマスク支持装置及びフォトマスク支持方法
JP2004146625A (ja) * 2002-10-25 2004-05-20 Tokyo Electron Ltd ベーキング方法及びベーキング装置
JP2008112902A (ja) * 2006-10-31 2008-05-15 Mitsubishi Heavy Ind Ltd 基板の支持方法及び支持構造
JP2008235472A (ja) * 2007-03-19 2008-10-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2011100917A (ja) * 2009-11-09 2011-05-19 Nikon Corp 基板受け渡し装置、露光装置、デバイス製造方法、及び基板受け渡し方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3295620B2 (ja) * 1996-08-08 2002-06-24 東京エレクトロン株式会社 処理装置
JP3989384B2 (ja) * 2003-02-07 2007-10-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4799325B2 (ja) * 2006-09-05 2011-10-26 東京エレクトロン株式会社 基板受け渡し装置，基板処理装置，基板受け渡し方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181054A (ja) * 1994-12-26 1996-07-12 Nikon Corp ステージ装置及びその制御方法
JPH1124236A (ja) * 1997-07-08 1999-01-29 Nikon Corp フォトマスク、フォトマスク支持装置及びフォトマスク支持方法
JP2004146625A (ja) * 2002-10-25 2004-05-20 Tokyo Electron Ltd ベーキング方法及びベーキング装置
JP2008112902A (ja) * 2006-10-31 2008-05-15 Mitsubishi Heavy Ind Ltd 基板の支持方法及び支持構造
JP2008235472A (ja) * 2007-03-19 2008-10-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2011100917A (ja) * 2009-11-09 2011-05-19 Nikon Corp 基板受け渡し装置、露光装置、デバイス製造方法、及び基板受け渡し方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015167159A (ja) * 2014-03-03 2015-09-24 東京エレクトロン株式会社 基板載置装置及び基板処理装置
JP2015228488A (ja) * 2014-05-03 2015-12-17 株式会社半導体エネルギー研究所 フィルム状部材の支持装置
US11243476B2 (en) 2018-04-26 2022-02-08 Asml Netherlands B.V. Stage apparatus, lithographic apparatus, control unit and method

Also Published As

Publication number Publication date
TW201347078A (zh) 2013-11-16
CN103247564A (zh) 2013-08-14
KR20130090829A (ko) 2013-08-14

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