JP2012513499A - ひけが少なく優れた表面外観を有する強化ポリアミド組成物およびその物品 - Google Patents
ひけが少なく優れた表面外観を有する強化ポリアミド組成物およびその物品 Download PDFInfo
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- JP2012513499A JP2012513499A JP2011542561A JP2011542561A JP2012513499A JP 2012513499 A JP2012513499 A JP 2012513499A JP 2011542561 A JP2011542561 A JP 2011542561A JP 2011542561 A JP2011542561 A JP 2011542561A JP 2012513499 A JP2012513499 A JP 2012513499A
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- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical class [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- WFMPGHGAHVPFKP-UHFFFAOYSA-N dodecane;methanediamine Chemical compound NCN.CCCCCCCCCCCC WFMPGHGAHVPFKP-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 229920006024 semi-aromatic copolyamide Polymers 0.000 description 1
- 229920006134 semi-aromatic non-crystalline polyamide resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31859—Next to an aldehyde or ketone condensation product
- Y10T428/3187—Amide-aldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
Abstract
Description
HMD ヘキサメチレンジアミン(または二酸と組合せて使用される場合は6)
AA アジピン酸
I イソフタル酸
T テレフタル酸
DMD デカメチレンジアミン
DDMD ドデカメチレンジアミン
DDA デカン二酸
DDDA ドデカン二酸
TDDA テトラデカン二酸
MXD メタ−キシリレンジアミン
MPMD 2−メチルペンタメチレンジアミン
TMD 2,2,4−トリメチルヘキサメチレンジアミン
IND 2,4,4−トリメチルヘキサメチレンジアミン
MACM 3,3’−ジメチル−4,4’−ジアミノ−ジシクロヘキシルメタン
IPD 3−アミノメチル−3,5,5−トリメチルシクロヘキシルアミン
PACM ビス(4−アミノシクロヘキシル)メタン
PACP 2,2−ビス(p−アミノシクロヘキシル)プロパン
ND 1,6−ジアミノ−2,2,4−トリメチルヘキサン
6 ε−カプロラクタムから形成されたポリマー反復単位
66 HMDとAAから形成されたポリマー反復単位
610 HMDとDDAから形成されたポリマー反復単位
612 HMDとDDDAから形成されたポリマー反復単位
1010 DMDとDDAから形成されたポリマー反復単位
1012 DMDとDDDAから形成されたポリマー反復単位
6I HMDとIから形成されたポリマー反復単位
6T HMDとTから形成されたポリマー反復単位
IPDI IPDとIから形成されたポリマー反復単位
IPDT IPDとTから形成されたポリマー反復単位
PACMI PACMとIから形成されたポリマー反復単位
PACMT HMDとTから形成されたポリマー反復単位
TMDT TMDとTから形成されたポリマー反復単位
12 12−アミノドデカン酸から形成されたポリマー反復単位
約300rpmのスクリュー速度、110kg/時の処理能力および手で測定した約290℃の溶融温度を用いて約280℃で作動する40mmの二軸スクリュー押出機(Berstorff ZE40)内で、表1に示す成分をメルトブレンドすることにより、実施例の組成物を調製した。スクリュー側フィーダを通してメルトにガラス繊維を添加した。表1に示された成分数量は、樹脂組成物の合計重量に基づく重量%単位で記されている。
ISO527−2/1B/1にしたがって引張係数を測定した。ISO527に準じて4mmの幅および20mmの供試体厚みで、射出成形したISO棒試料(溶融温度:約290℃;金型温度;約90℃および保持圧力;90MPa)について測定を行なった。供試体を23℃で、成形時乾燥状態(DAM(Dried as molded))で測定した。
表面外観およびひけの測定を、射出成形した供試体(溶融温度:約290℃;金型温度:約90℃および保持圧力:90MPa)について行なった。170×26×2mmの矩形形状を有する供試体を、光沢面を有する(すなわちテクスチュア無し)金型内で成形した。供試体には2×26×2mmのリブを備えた。供試体を23℃で、成形時乾燥状態(DAM)で測定した。
Claims (12)
- a)少なくとも1種の非晶質半芳香族ポリアミドと;
b)少なくとも2種の半結晶性ポリアミドb1)およびb2)と;
c)少なくとも1種のガラス強化剤と、
を含む樹脂組成物。 - a)前記少なくとも1種の非晶質半芳香族ポリアミドが20重量%または約20重量%〜50重量%または約50重量%の量で存在し;
b)前記少なくとも2種の半結晶性ポリアミドb1)およびb2)が、10重量%または約10重量%〜40重量%または約40重量%の量で存在し;
c)前記少なくとも1種のガラス強化剤が10重量%または約10重量%〜70重量%または約70重量%の量で存在し、重量百分率が前記樹脂組成物の合計重量に基づいている、請求項1に記載の樹脂組成物。 - a)前記少なくとも1種の非晶質半芳香族ポリアミドがPA6I/6T;PA6I/6T/PACMI/PACMT;PA6I/MACMI/MACMT、PA6I/6T/MACMI、PA12/MACMT、PA TMDT、PA6I/6T/IPDI/IPDT、PA6/TMDT/6Tおよびその混合物から選択され;
b)前記少なくとも2種の半結晶性ポリアミドの1種b1)がPA66であり、前記少なくとも2種の半結晶性脂肪族ポリアミドの1種b2)がPA1010、PA612、PA610およびその混合物から選択される、請求項1または2に記載の樹脂組成物。 - a)前記少なくとも1種の非晶質半芳香族ポリアミドがPA6I/6Tであり;
b)前記少なくとも2種の半結晶性ポリアミドの1種b1)がPA66であり、前記少なくとも2種の半結晶性脂肪族ポリアミドの1種b2)がPA1010、PA612、PA610およびその混合物から選択される、
請求項1または2に記載の樹脂組成物。 - b1)が5重量%または約5重量%〜20重量%または約20重量%の量で存在し、b2)が5重量%または約5重量%〜20重量%の量で存在するが、ここでb1)とb2)の和が10重量%または約10重量%〜40重量%または約40重量%であることが条件であり、前記重量百分率は前記樹脂組成物の前記合計重量に基づいている、請求項1〜4のいずれか一項に記載の樹脂組成物。
- 前記ガラス強化剤が、繊維質非円形断面ガラスである、請求項1〜5のいずれか一項に記載の樹脂組成物。
- 円形断面を有する繊維質強化剤およびガラスフレークからなる群から選択される1種以上の追加の強化剤をさらに含む、請求項1〜6のいずれか一項に記載の樹脂組成物。
- さらに1種以上の酸化防止剤を含む、請求項1〜7のいずれか一項に記載の樹脂組成物。
- 請求項1〜8のいずれか一項に記載の前記樹脂組成物を造形するステップを含む、物品の製造方法。
- 請求項1〜8のいずれか一項に記載の前記樹脂組成物から形成された、造形品。
- 請求項1〜10のいずれか一項に記載の前記樹脂組成物で製造された携帯式電子デバイスのハウジングである、請求項10に記載の造形品。
- デバイスが携帯電話である、請求項11に記載の携帯式電子デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US20357208P | 2008-12-23 | 2008-12-23 | |
US61/203,572 | 2008-12-23 | ||
PCT/US2009/069142 WO2010075351A2 (en) | 2008-12-23 | 2009-12-22 | Low sink marks and excellent surface appearance reinforced polyamide compositions |
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JP2012513499A true JP2012513499A (ja) | 2012-06-14 |
JP2012513499A5 JP2012513499A5 (ja) | 2013-02-14 |
JP5628829B2 JP5628829B2 (ja) | 2014-11-19 |
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Country Status (5)
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US (1) | US8476354B2 (ja) |
EP (1) | EP2367884B1 (ja) |
JP (1) | JP5628829B2 (ja) |
CN (1) | CN102264839B (ja) |
WO (1) | WO2010075351A2 (ja) |
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JP2017193703A (ja) * | 2016-03-23 | 2017-10-26 | エーエムエス−パテント アクチェンゲゼルシャフト | 耐高温性ポリアミド成形材料および特に自動車産業分野におけるその使用 |
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JP7002851B2 (ja) | 2016-03-23 | 2022-01-20 | エーエムエス-パテント アクチェンゲゼルシャフト | 耐高温性ポリアミド成形材料および特に自動車産業分野におけるその使用 |
KR20190019878A (ko) * | 2017-08-18 | 2019-02-27 | 이엠에스-패턴트 에이지 | 낮은 헤이즈를 가지는 보강 폴리아미드 성형 화합물 및 그로부터 제조된 성형체 |
JP2019065260A (ja) * | 2017-08-18 | 2019-04-25 | エムス−パテント アクツィエンゲゼルシャフト | 低ヘイズの強化ポリアミド成形材料及びその成形体 |
JP7327913B2 (ja) | 2017-08-18 | 2023-08-16 | エムス-パテント アクツィエンゲゼルシャフト | 低ヘイズの強化ポリアミド成形材料及びその成形体 |
KR102573575B1 (ko) | 2017-08-18 | 2023-09-01 | 이엠에스-패턴트 에이지 | 낮은 헤이즈를 가지는 보강 폴리아미드 성형 화합물 및 그로부터 제조된 성형체 |
JP2023517354A (ja) * | 2020-03-13 | 2023-04-25 | インヴィスタ テキスタイルズ(ユー.ケー.)リミテッド | ネットワーク用途のための熱可塑性樹脂 |
Also Published As
Publication number | Publication date |
---|---|
WO2010075351A3 (en) | 2010-08-19 |
CN102264839A (zh) | 2011-11-30 |
CN102264839B (zh) | 2014-05-07 |
EP2367884A2 (en) | 2011-09-28 |
US8476354B2 (en) | 2013-07-02 |
EP2367884B1 (en) | 2018-09-26 |
WO2010075351A2 (en) | 2010-07-01 |
JP5628829B2 (ja) | 2014-11-19 |
US20100160008A1 (en) | 2010-06-24 |
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