JP2012504868A5 - - Google Patents

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Publication number
JP2012504868A5
JP2012504868A5 JP2011530090A JP2011530090A JP2012504868A5 JP 2012504868 A5 JP2012504868 A5 JP 2012504868A5 JP 2011530090 A JP2011530090 A JP 2011530090A JP 2011530090 A JP2011530090 A JP 2011530090A JP 2012504868 A5 JP2012504868 A5 JP 2012504868A5
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JP
Japan
Prior art keywords
substrate
cleaning apparatus
chamber body
rollers
processing volume
Prior art date
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Application number
JP2011530090A
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English (en)
Japanese (ja)
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JP2012504868A (ja
JP5504271B2 (ja
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Publication date
Priority claimed from US12/243,685 external-priority patent/US8844546B2/en
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Publication of JP2012504868A publication Critical patent/JP2012504868A/ja
Publication of JP2012504868A5 publication Critical patent/JP2012504868A5/ja
Application granted granted Critical
Publication of JP5504271B2 publication Critical patent/JP5504271B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011530090A 2008-10-01 2009-09-11 加圧流体を使用して半導体基板を洗浄する装置及び方法 Expired - Fee Related JP5504271B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/243,685 US8844546B2 (en) 2008-10-01 2008-10-01 Apparatus and method for cleaning semiconductor substrate using pressurized fluid
US12/243,685 2008-10-01
PCT/US2009/056679 WO2010039409A2 (en) 2008-10-01 2009-09-11 Apparatus and method for cleaning semiconductor substrate using pressurized fluid

Publications (3)

Publication Number Publication Date
JP2012504868A JP2012504868A (ja) 2012-02-23
JP2012504868A5 true JP2012504868A5 (enExample) 2012-11-01
JP5504271B2 JP5504271B2 (ja) 2014-05-28

Family

ID=42056078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011530090A Expired - Fee Related JP5504271B2 (ja) 2008-10-01 2009-09-11 加圧流体を使用して半導体基板を洗浄する装置及び方法

Country Status (4)

Country Link
US (1) US8844546B2 (enExample)
JP (1) JP5504271B2 (enExample)
KR (1) KR20110063852A (enExample)
WO (1) WO2010039409A2 (enExample)

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US9646859B2 (en) 2010-04-30 2017-05-09 Applied Materials, Inc. Disk-brush cleaner module with fluid jet
JP2015060852A (ja) * 2013-09-17 2015-03-30 株式会社東芝 半導体装置の製造方法及び製造装置
US9610615B2 (en) * 2015-03-31 2017-04-04 Taiwan Semiconductor Manufacturing Co., Ltd Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication
CN109923659B (zh) 2016-11-09 2024-03-12 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
WO2018140789A1 (en) 2017-01-27 2018-08-02 Tel Fsi, Inc. Systems and methods for rotating and translating a substrate in a process chamber
CN111937128A (zh) 2018-02-19 2020-11-13 东京毅力科创美国制造与工程公司 具有可控射束大小的处理喷雾的微电子处理系统
WO2020010357A1 (en) * 2018-07-06 2020-01-09 Oem Group, Llc Systems and methods for a spray measurement apparatus
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
US11791173B2 (en) 2019-03-21 2023-10-17 Samsung Electronics Co., Ltd. Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
CN112820664A (zh) * 2019-11-18 2021-05-18 辛耘企业股份有限公司 基板冲洗装置
TWI710049B (zh) * 2019-11-18 2020-11-11 辛耘企業股份有限公司 基板沖洗裝置
KR102260571B1 (ko) * 2020-08-21 2021-06-07 (주)제이에스엠티 회전형 수직 습식에칭장치
EP4250341A1 (de) * 2022-03-24 2023-09-27 Siltronic AG Verfahren zum reinigen von halbleiterscheiben in einer reinigungsstrasse
CN116845018A (zh) * 2022-06-30 2023-10-03 杭州众硅电子科技有限公司 一种晶圆传输检测方法

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US2186600A (en) * 1938-10-29 1940-01-09 Walter S Behrens Sterilizer for dental hand pieces
JPS62173718A (ja) 1986-01-28 1987-07-30 Toshiba Corp 半導体ウエハの洗浄方法
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JPH10189528A (ja) 1996-12-27 1998-07-21 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JPH10289889A (ja) 1997-04-16 1998-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
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