Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Definitions

• Embodiments of the present invention generally relate to an apparatus and a method for processing semiconductor substrates. More particularly, embodiments of the present invention provide apparatus and method for cleaning semiconductor substrates.
• planarization is typically performed mechanically, chemically, and/or electrically by pressing a device side of a semiconductor substrate against a polishing pad which is saturated with a polishing solution, such as an abrasive compound, and by rotating the polishing pad relative to the semiconductor substrate.
• polishing solution such as an abrasive compound
• the planarization process is generally followed by a cleaning process which removes residual of the polishing solutions and/or particles from polishing.
• Conventional cleaning processes generally include scrubbing the substrate surfaces with mechanical scrubbing devices using brushes made from porous or sponge like materials, such as polyvinyl acetate (PVA), or brushes made with nylon bristles. Additionally, one or more nozzles that output sonically energized fluid may be used in combination with the brushes. Scrubbing and spraying may remove majority of residual polishing solution and other particles on the substrate surfaces.
• PVA polyvinyl acetate
• nozzles that output sonically energized fluid may be used in combination with the brushes. Scrubbing and spraying may remove majority of residual polishing solution and other particles on the substrate surfaces.
• conventional cleaning processes usually fail to remove particles in deep trench of a patterned substrate and the substrates are also susceptible to damages caused by conventional cleaning. [0004] Therefore, there is a need for an apparatus and method to remove particles in deep trenches of a substrate surface and to reduce damages during cleaning.
• the present invention generally relates to a method and apparatus for cleaning a substrate after a polishing process. Particularly, embodiments of the present invention relate to an apparatus and method for cleaning a substrate using pressurized fluid.
• One embodiment provides a substrate cleaner comprising a chamber body defining a processing volume, two rollers disposed in the processing volume, wherein each of the rollers has a grove configured to receive an edge of a substrate, and the two rollers are configured to support a substrate in a substantially vertical orientation and to rotate the substrate, and a nozzle movably disposed in the processing volume, wherein the nozzle is configured to move parallel to the substrate and to direct a pressurized fluid towards one or more regions of the substrate.
• a substrate cleaner comprising a chamber body defining a processing volume configured to house a substrate in a substantially vertical orientation, wherein the chamber body has a top opening configured to allow passage of the substrate, first and second rollers disposed in a lower portion of the processing volume, wherein each of the first and second rollers has a grove configured to receive an edge of the substrate, and the first and second rollers are configured to rotate the substrate in the substantially vertical orientation, a pressure wheel disposed in an upper portion of the processing volume, wherein the pressure wheel is movable between a retracted position configured to clear a passage for the substrate and an extended position configured to retain the substrate, the pressure wheel is configured to apply a force on the edge of the substrate to push the substrate against the first and second rollers to engage substrate with the first and second rollers, and a swing nozzle coupled to a pivoting arm disposed in the processing volume, wherein the swing nozzle is configured to swing parallel to the substrate and to direct a pressurized fluid towards one or more regions of the substrate.
• Yet another embodiment provides a method for cleaning a semiconductor substrate comprising positioning a substrate on first and second rollers, wherein the first and second rollers are configured to support the substrate and rotate the substrate in a substantially vertical orientation, engaging the substrate with the first and second rollers by applying a force to an edge of the substrate by a pressure wheel, rotating the first and second rollers to rotate the substrate, and cleaning the substrate by directing a pressurized fluid toward the substrate from a spraying nozzle while swing the spraying nozzle across a radius of the substrate.
• Figure 1 is a schematic plan view of a polishing system in accordance with one embodiment of the present invention.
• Figure 2 is a schematic perspective view of a jet cleaner assembly in accordance with one embodiment of the present invention.
• Figure 3A is a schematic sectional side view of a jet cleaner in accordance with one embodiment of the present invention.
• Figure 3B is a schematic sectional side view of the jet cleaner of Figure 3A with a pressure wheel in a released position.
• Figure 4A is a schematic top view of the jet cleaner of Figure 3A.
• Figure 4B is a schematic top view of the jet cleaner of Figure 3A with the pressure wheel in a retracted position.
• Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relate to an apparatus and method for cleaning a substrate using pressurized fluid.
• One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
• Embodiments of the present invention enable substrate cleaning using a pressurized fluid to remove residue of polishing solution and particles in trenches formed on the substrate. Configuration of the pressure wheel and two rollers enables effective rotation of substrate in a vertical position, which allows simplified substrate transfer.
• a pressure sensor is used to monitor the force applied to the substrate by the pressure wheel to prevent damages to the substrate.
• the two rollers are driven by one motor via a belt assembly.
• FIG. 1 is a schematic plan view of a polishing system 100 in accordance with one embodiment of the present invention.
• the polishing system 100 generally includes a factory interface 102, a cleaner module 104 and a polishing module 106.
• a wet robot 108 is provided to transfer substrates 170 between the factory interface 102 and the polishing module 106.
• the wet robot 108 may also be configured to transfer substrates between the polishing module 106 and the cleaner module 104.
• the flow of substrates, such as semiconductor wafers or other work piece, through the polishing system 100 is indicated by arrows 160.
• the factory interface 102 generally includes a dry robot 110 which is configured to transfer substrates 170 among one or more cassettes 114 and one or more transfer platforms 116.
• the dry robot 110 may be movable along a track 112.
• the wet robot 108 generally is configured to retrieve the substrates 170 from the factory interface 102 in a face-up horizontal orientation, to flip the substrates 170 to a face-down horizontal orientation to the polishing module 106, and to rotate the substrates 170 to a vertical orientation to the cleaner module 104.
• the wet robot 108 is mounted on a track 120 that facilitates linear translation of the wet robot 108.
• the polishing module 106 generally comprises a plurality of polishing heads 126 configured to retain substrates 170, load cups 122 configured to receive the substrates 170 from the wet robot 108 and transfer the substrates 170 to the polishing heads 126, and two or more polishing stations 124 configured to polish the substrates 170 on the polishing heads 126.
• the polishing heads 126 are coupled to an overhead track 128.
• the overhead track 128 is configured to transfer the polishing heads 126 and to position the polishing heads 126 selectively over the polishing stations 124 and load cups 122.
• the overhead track 128 has a circular configuration which allows the polishing heads 126 to be selectively rotated over and/or clear of the load cups 122 and the polishing stations 124. It is contemplated that the overhead track 128 may have other configurations including elliptical, oval, linear or other suitable orientation.
• the substrates 170 are transferred from the cassette 114 to the transfer platform 116 by the dry robot 110.
• the substrates 170 are then picked up by the wet robot 108 and transferred to the load cups 122.
• processed substrates are returned to the load cups 122 of the polishing module 106 for transfer by the wet robot 108 to the cleaner 104.
• the cleaner 104 generally includes a shuttle 140 and one or more cleaning modules 144.
• the shuttle 140 includes a transfer mechanism 142 which facilitates hand-off of the processed substrates from the wet robot 108 to the one or more cleaning modules 144.
• the processed substrates are transferred from the shuttle 140 through of the one or more cleaning modules 144 by an overhead transfer mechanism (not shown).
• two cleaning modules 144 are shown in an aligned, parallel arrangement.
• Each of the cleaning modules 144 generally include one or more megasonic cleaners, one or more brush boxes, one or more spray jet boxes and one or more dryers.
• each of the cleaning modules 144 includes a megasonic cleaner 146, two brush box modules 148, a jet cleaner module 150 and a dryer 152.
• Dried substrates leaving the dryer 152 are rotated to a horizontal orientation for retrieval by the dry robot 110 which returns the dried substrates 170 to an empty slot in one of the wafer storage cassettes 144.
• a cleaning module that may be adapted to benefit from the invention is a DESCIA ® cleaner, available from Applied Materials, Inc., located in Santa Clara, California.
• a transfer device (not shown) is used to retrieve and advance substrates 170 through the cleaning module 144 sequentially, from the megasonic cleaner 146 to the brush box module 148 then to the jet cleaner module 150 and the dryer 152.
• Each module 146, 148, 150 focuses on different cleaning function to achieve a specific cleaning effect.
• the megasonic cleaner 146 is configured to perform an efficient cleaning step using megasonic energy. Embodiments of a megasonic cleaner may be found in United States Patent No. 6,119,708, entitled “Method and Apparatus for Cleaning the Edge of a Think Disc”.
• the brush box module 148 is configured to perform a cleaning step using mechanical contact, such as scrubbing motion.
• the dryer 152 is configured to quickly dry a substrate after cleaning to remove bath residue and prevent streaking, spotting caused by evaporation. Description of a dryer may be found in United States Patent No. 6,516,816, entitled “Spin-Rinse-Dryer".
• the jet cleaner module 150 is configured to perform a cleaning step using pressurized liquid. Exemplary embodiments of a jet cleaner module described in detail with Figures 2-4 of the present application.
• the jet cleaner module 150 is configured to clean a substrate positioned in a vertical orientation using a pressurized liquid stream.
• the pressurized liquid stream is configured for further cleaning after scrubbing, particularly removing particles or residues from structures, such as deep trenches, on a surface of the substrate being processed.
• the vertical orientation of the substrate in the jet cleaner module 150 reduces complexity of substrate transferring.
• FIG. 2 is a schematic perspective view of a jet cleaner assembly 200 in accordance with one embodiment of the present invention.
• the jet cleaner assembly 200 comprises two jet cleaner modules 202 secured on a supporting frame 201. Each jet cleaner module 202 is configured to receive and clean a substrate in a vertical orientation.
• the jet cleaner assembly 200 may be used in a system configured to clean two substrates in a parallel manner, such as the cleaner module 104 of Figure 1.
• Each jet cleaner module 202 has an opening 205 formed on a top 207 of a body 204.
• the opening 205 is configured to allow passage of a substrate.
• a substrate handler 208 may transfer substrates 209 to the jet cleaner assembly 200, lower the substrates 209 into the jet cleaner modules 202 for cleaning, and pick up the cleaned substrates 209 from the jet cleaner modules 202.
• the openings 205 may be closed by a sliding lid 203 to prevent cleaning solution from splashing out and prevent outside particles from entering the jet cleaner modules 202.
• the sliding lid 203 is configured to cover the opening 205 of both jet cleaner modules 202.
• an actuator 206 is coupled to the sliding lid 203 and configured to facilitate opening and closing of the openings 205.
• Figure 3A is a schematic sectional side view of the jet cleaner module 202 in accordance with one embodiment of the present invention.
• Figure 4A is a schematic top view of the jet cleaner module 202 of Figure 3A.
• the body 204 of the jet cleaner module 202 defines a processing volume
• the jet cleaner module 202 comprises two substrate rollers 210, 211 disposed in a lower portion of the processing volume 222. Each substrate roller 210, 211 has a recess 210a, 211 a configured to receive the substrate 209 near an edge. In one embodiment, the substrate rollers 210, 211 are coupled to driving axis 210b, 211 b respectively.
• the driving axis 210b, 211 b are coupled to driving mechanism to rotate the substrate rollers 210, 211.
• the driving axis 210b, 211 b may be rotated by different motors or share the same motor.
• the driving axis 210b is directly coupled to a motor 223 and the driving axis 211 b is coupled with the motor
• the substrate rollers 210, 211 rotate at substantially same rate and drive the substrate 209 to rotate through friction.
• the jet cleaner module 202 further comprises a pressure wheel 213 configured to pressure the substrate 209 against the substrate rollers 210, 211 during processing.
• the pressure wheel 213 is disposed on an upper portion of the processing volume 222.
• the pressure wheel 213 has a recess 213a formed therein, as shown in Figure 4A.
• the recess 213a is configured to receive the edge portion of the substrate 209.
• the pressure wheel 213 moves radially inward, as shown by an arrow 213b, while the recess 213a of the pressure wheel 213 is aligned with the edge of the substrate 209.
• the pressure wheel 213 eventually contacts the edge portion of the substrate 209 and applies a pressure to the edge of the substrate 209.
• the pressure from the pressure wheel 213 increases friction between the substrate 209 and the substrate rollers 210, 211 so that the substrate 209 can be efficiently rotated during processing.
• the pressure wheel 213 is connected to a motion mechanism 230, which may be disposed inside or outside the processing volume 222.
• the motion mechanism 230 comprises an axial actuator 228 configured to extend or retract the pressure wheel 213.
• Figure 4A is a schematic top view of the jet cleaner module 202 with the pressure wheel 213 in an extended position wherein the pressure wheel 213 is aligned with the substrate 209 and in position to apply a pressure to the substrate 209.
• Figure 4B is a schematic top view of the jet cleaner module 202 with the pressure wheel 213 in a retracted position wherein the pressure wheel 213 is cleared from a vertical plane of the substrate 209 to allow the substrate 209 to enter or to exit the processing volume 222.
• the motion mechanism 230 further comprises a vertical actuator 229 configured to move the pressure wheel 213 and the axial actuator 228 vertically to apply a pressure to the substrate 209 or to release the substrate 209.
• Figure 3A illustrates the pressure wheel 213 in a pressurizing position wherein the pressure wheel 213 contacts the substrate 209 and applies a vertical pressure the substrate 209.
• Figure 3B is a schematic sectional side view of the jet cleaner module 202 of Figure 3A with the pressure wheel 213 in a released position wherein the pressure wheel 213 is cleared from the substrate 209 and in position to retract by the axial actuator 228.
• the pressure is applied by lowering the pressure wheel 213 against the substrate 209 by the vertical actuator 229.
• a magnitude of the pressure applied to the substrate 209 by the pressure wheel 213 is monitored.
• the magnitude of the pressure can be monitored by monitoring the vertical actuator 229.
• one or more operating parameters of the vertical actuator 229 can be correlated to the magnitude of the pressure between the pressure wheel 213.
• a sensor 231 is coupled to the vertical actuator 229 and a system controller 232. The system controller 232 subsequently sends control signals to the vertical actuator 229 according signals from the sensor 231.
• the vertical actuator 229 comprises a hydraulic cylinder
• the sensor 231 is a pressure sensor
• the magnitude of the pressure applied to the substrate 209 can be monitored by measuring a hydraulic pressure of the hydraulic cylinder.
• the pressure wheel 213 is rotatable about an axis 213b. During processing, the pressure wheel 213 passively rotates about the axis 213b while applying a pressure to the rotating substrate 209.
• a rotation sensor such as an encoder, can be coupled to the pressure wheel 213, and the rotation rate of the substrate 209 can be measured by monitoring the rotation sensor coupled to the pressure wheel 213.
• the jet cleaner module 202 comprises a sensor wheel 216 disposed in a position to make contact with the substrate 209 during processing.
• the sensor wheel 216 is configured to rotate with the substrate 209 and to transfer the rotation rate of the substrate 209 to a rotation sensor 226.
• the sensor wheel 216 is disposed in a lower portion of the processing volume 222 so that the substrate 209 rests on the sensor wheel 216.
• the rotation sensor 226 is further coupled with the system controller 232.
• the jet cleaner module 202 further comprises a pivoting arm 214 disposed in the processing volume 222.
• One end of the pivoting arm 214 is coupled to a motor assembly 215 configured to pivot the pivoting arm 214 about a pivoting axis 227 so that the pivoting arm 214 moves in a plane substantially parallel to the substrate 209.
• a nozzle 218 is disposed on a distal end of the pivoting arm 214.
• the nozzle 218 is configured to direct a pressurized fluid towards the substrate 209 to dislodge particles or residues from the substrate 209, particularly from trench structures formed on a device side of the substrate 209. Pressure of the pressurized liquid dispensed from the nozzle may be adjusted to suit process requirement.
• the nozzle 218 may be configured to dispense Dl water, or other cleaning solutions.
• FIGS 3A and 3B schematically illustrate two different positions of the pivoting arm 214.
• rotation of the substrate 209 and pivoting motion of the pivoting arm 214 assures that the nozzle 218 directs a pressurized fluid towards entire surface of the substrate 209.
• the pivoting arm 214 is disposed near an upper portion of the processing volume 222.
• the jet cleaner module 202 further comprises cleaning solution spraying bars 220, 221 disposed in the processing volume 222.
• the cleaning solution spraying bars 220, 221 are disposed on opposite sides of the processing volume 222 and configured to direct cleaning solutions to both sides of the substrate 209.
• the cleaning solution spraying bar 220, 221 has a plurality of nozzles 220a, 221a disposed lengthwise. The plurality of nozzles 220a, 221a are configured to direct cleaning solution towards the substrate 209. In one embodiment, the plurality of nozzles 220a, 221a are evenly distributed along the cleaning solution spray bar 220, 221 respectively.
• the cleaning solution spraying bars 220, 221 are disposed in an upper portion of the processing volume 222.
• the jet cleaner module 202 further comprises a water spraying bar 219 disposed above the cleaning solution spraying bars 220, 221.
• the water spraying bar 219 has a plurality of spraying nozzles (not shown) disposed along the length.
• the water spraying bar 219 is configured to spray Dl water towards the substrate 209 when the substrate 209 is being transferred into or out of the processing volume 222.
• the water spraying bar 219 can be used to wet the substrate 209 prior to cleaning.
• the water spraying bar 219 and the pivoting arm 214 are disposed on the same side of the substrate 209.
• An exemplary cleaning process using the jet cleaner assembly 200 may be at follows.
• the sliding lid 203 slides back exposing the openings 205 of the jet cleaner module 202 and the pressure wheel 213 in each jet cleaner module 202 is in a retracted position.
• the substrate handler 208 transfers two substrates 209 over the openings 205, then lowers the substrate 209 into the processing volumes 222 with device sides of the substrates 209 facing the pivoting arm 214.
• the substrate handler 208 then exits the processing volume 222 and the sliding lid 203 moves to close the openings 205.
• the water spraying bar 219 sprays water towards the substrate 209 to wet the substrate 209 in each jet cleaner module 202.
• the substrate rollers 210, 211 receive the substrate 209 and the substrate handler 208 exits the processing volumes 222.
• the pressure wheel 213 extends to align with the substrate 209. The pressure wheel 213 is then lowered to contact the substrate 209 and apply a pressure to the substrate 209. The pressure wheel 213 stops when a parameter of the vertical actuator 229 reaches a critical value.
• the substrate 209 is then cleaned as the solution spraying bars 219, 220 spray cleaning solution to both sides of the substrate 209 and the nozzle 218 directs pressurized cleaning fluid toward the substrates 209 while the pivoting arm 214 pivots about the axis 227 and the substrate 209 is rotated by the substrate rollers 210, 211.
• the pressure wheel 213 raises to release the substrate 209 and then retracts to clear passage for the substrate 209.
• the sliding lid 203 moves to expose the openings 205 and the substrate handler 208 lowers into the processing volumes 222 to pick up the substrates 209.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Cleaning Or Drying Semiconductors (AREA)
• Mechanical Treatment Of Semiconductor (AREA)

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Publications (2)

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• 2008
  • 2008-10-01 US US12/243,685 patent/US8844546B2/en not_active Expired - Fee Related
• 2009
  • 2009-09-11 KR KR1020117009943A patent/KR20110063852A/ko not_active Withdrawn
  • 2009-09-11 WO PCT/US2009/056679 patent/WO2010039409A2/en not_active Ceased
  • 2009-09-11 JP JP2011530090A patent/JP5504271B2/ja not_active Expired - Fee Related

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