200414277 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一包含噴嘴清掃裝置及具備該噴嘴清掃裝置 之基板處理裝置，其係用於清掃將處理液供應至基板表面之 處理液供應噴嘴。 【先前技術】 將處理液供應至半導體晶圓、液晶顯示面板用玻璃基板或 半導體製造裝置用光罩基板等基板而處理之基板處理裝置， 係使用藉由-面從開缝狀之吐出口吐出處理液，—面對基板 相對地移動之方式，將處理液供應至基板表面之處理液：應 噴嘴時’ P«基板處理，在處理液供應噴嘴中的開缝狀吐出“ 精近會殘留有處理液，其形心染物f而產生處理液供應 赁嘴之污染。使用光阻’尤其含有稱為彩色光阻等之顏料的 光阻，當作處理液時，尤其容易產生如此之污染。因此，必 須藉由喷嘴清掃裝置定減清掃處理液供應嗜嘴。 如此之噴嘴清掃裝置，先前係將清潔用之拂拭構件抵接在 處理液供應噴嘴，形成藉由該拂拭構件清掃處理液供應嗜嘴 ί構成。純，料此之噴嘴清掃裝置，使用捲繞在傳送滾 同和捲繞㈣之間的長拂拭構件（例如，參照特許文 [特許文獻1] 日本特開2001-1 13213號公報 小纟1^於基板尺寸嬈大’處理液供應噴嘴中的開縫狀 裝f 1 & 了有夂長&傾向。13此’於先前之喷嘴清掃 裝置，產生拂拭構件之消耗量變多，成本增加之問題。 87695 200414277 二=具備蝴清掃裝置之基板處理裝置， 應噴嘴。轉拭構件之消耗量，—面確實地清掃處理液供 【發明内容】 乂請I利範圍第1項之發明係—噴嘴清掃裝置，其特徵為 =:面：開縫狀之吐出口吐出處理液，-面對基板相對地 用於清掃將處理液供應至前述基板表面之處理 ΐ:怎二Γ其包含：傳送滾筒，捲繞有長拂拭構件；捲繞 :同，捲繞從前述傳送滾筒送出至前述處理液供應嗜嘴中的 :出長度方向之拂拭構件；旋轉機構，旋轉前述捲繞滾 门’弟機構’藉由將從前述傳送滾筒送出之拂拭構件 :接在=述處理液供應㈣之方式，清掃前述處理液供應喷 ,、.，和弟2清掃機構，㈣由前述第1清掃機構清掃前述處理 1應噴嘴之前，使藉由從前述傳送滾筒送出之拂拭構件中 的可述第一1清掃機構之作用而抵接在前述處理液供應喷嘴後 :區域，藉由抵接在冑述處理液供應噴嘴之方4，預先清掃 别述處理液供應噴嘴。 一申請專利範圍第2項之發明係—噴嘴清掃裝置，其特徵為 藉由-面從開缝狀之吐出口吐出處理液，一面對基板相對地 移動 < 方式，用於清掃將處理液供應至前述基板表面之處理 义供應貪嘴，其包含·拂拭部，其包含：傳送滾筒，捲繞長 拂栻構件，捲繞滾筒，I繞從前述傳送滾筒$出至前述處理 夜供應噴嘴中的吐出口之長度方向之拂拭構件；旋轉機構， 87695 200414277 旋轉前述捲繞滾筒；第丨清掃機構，配# :件:接於前述處理，齡"之前述:拭構 =述傳〜㈣和前述捲繞滾筒之間的位置；和第^ =::=將前述拂拭構件抵接於前述處理⑽ =拂拭構件之移動路徑中的前述第❻掃機構$ 《間的位置；和移動機構，使前述拂拭構件在前述 處理液供應喷嘴中的吐出口之長度方向來回移動。 私日Γί利ί圍第3項之發明，係根據申請專利範圍第2項之 * ’則述弟2清掃機構係於前述拂拭部移動至 祕 农筒之拂拭構件的捲繞方向同一 ，、以捲％ 接為—f ♦ @、 向時，將前述拂拭構件抵 接“述處理液供應嘴嘴’於前述拂拭部移動 … 浪筒之拂拭構件的捲繞方向反方 ，、以捲％ 、、 Ο争’將匈述拂技;f盖姑 P二 述處理液供應噴嘴隔開。 心則 發明，係根據”專利範_項之 =“壤構係於前述拂拭部移動至與前述捲… 的捲繞方向同—方向時，旋轉前述捲繞滾二》 利範圍第5項之發明’係根據令請專利範圍第3項之 發明，其具備旋轉限制機構，於 ^ 繞滾筒之拂拭構㈣料4反、^拭㈣動至與前述捲 之旋轉。 …反万向時’限制前述捲出滾筒 申請專利範圍第6項之菸日Η ^ 第5項之任-項發明，第i，掃=請專利範園第1項至 抵接在前述處㈣供應㈣之^制包含將料拂拭構件 胃述拂试構件抵接在前迷處理液供應喷嘴之侧面的;： 87695 200414277 構件。 令請專利範圍第7项之發明，係裉 發明，前述第1清搞趟拔m 明專利乾圍弟6項之 推壓構件。卿具”錢”第丨㈣構件或第2 各月則A弟2推壓構件形成有對肩前 面之形狀的凹部，同時進 …處理液供應她 推壓構件之支持機構。具備以可移動方式支持該第2 :請㈣園第9項之發明，係根據令請專利範圍第㈣之 ^曰支持機構係由料拭部之移動方 二可移動到Y方向和Z方向之方式 的複數彈簧所構成。 推i稱忏 之=專利範圍第1〇項之發明’係根據”專利範圍第8項 :=前述第2推壓構件具有引導從前述捲出滾筒捲出之 那拭構件之兩端的引導部。 、:請專利範圍第11項之發明，係根據t請專利範圍第6項 =明’其具備將洗净液供應到前述拂拭構件之洗净液供應 磯構。 一申請專利範圍第㈣之發明係—噴嘴清掃裝置，其特徵為 ，由一面從開縫狀之吐出口吐出處理液，—面對基板相對地 和動（方式，祕清掃將處理液供應至前述基板表面之處理 :供應噴嘴’其包含：供應手段’供應長拂拭構件；回收收 &，回收從供應手段送出至前述處理液供應嘴嘴中的吐出口 〈長度万向之拂拭構件；第!清掃機構，藉由將從前述供應 87695 200414277 手丰又供應之拂拭構件抵接在前述處理液供應噴嘴之方式，清 掃前述處理液供應噴嘴；和第2清掃機構，於藉由前述第丨清 ㈣構清掃前述處理液供應喷嘴之前，使藉由從前述供應手 段供應之拂拭構件中的前述第丨清掃機構作用而抵接在前述 :理;夜供應喷嘴之後的區域，藉由抵接在前述處理液供應噴 角之方式’預先清掃前述處理液供應喷嘴。 一申請專利範圍第13項之發明係—嘴嘴清掃裝置，其特徵為 藉由-面從開縫狀之吐出口吐出處理液，—面對基板相對地 移動之方式，用於清掃將處理液供應至前述基板表面之處理 液供應噴嘴，其包含：拂拭部，其包含：供應手段，供應長 拂拭構件：时收段，时從前述供應手段以至前述處理 液供應喷嘴中的吐出Π之長度方向之拂拭構件；&清掃機 構丄配設在用於將前述拂拭構件抵料前述處理液供應喷嘴 (前述拂拭構件之移動路財的前述供應手段和前述回收手 段之間的位置；和第2清掃機構，配設在料將前述拂拭構 件^接^前述處理液供射嘴之前料拭構件之移動路徑中 的前述清掃機構和前述回收手段之間的位置；和移動機 構’使前述拂拭部在前述處理液供應嘴嘴中的吐出口之長产 方向來回移動。 又 申請專利範圍第㈣之發明，其特徵為包含：保持基板之 基板保持機構’·處理液供應噴嘴’藉由一面從開縫狀之吐出 2出處7 ’―面對藉由前述保持機構保持之基板相對地 力之万式’將處理液供應至前述基板表面 範圍第1項、第2項、第12福、〜π、 ^叫專利 弟弟12員、弟13項《任一項噴嘴清掃裝置。 87695 -10- 200414277 【實施方式】 以下’根據圖式說明本發明之實施型雖。 首先，說明關於適用本發明相關之嘴嘴清掃裝置财 處理裝置之構成。圖"系適用本發明相關之噴嘴清掃裝二之 基板處理裝置概要圖。 本基板處理裝置係用於在形成矩形之液晶面板用之彩色其 板（以下稱作「基板」师佈稱為彩色光阻之顏料的光阻/ 其包含：在吸附保持基板W之狀態藉由驅動馬達u而以轴 為中心旋轉之旋轉夾頭13、用於將級塗佈於保持在旋轉夹 頭U之基板W的處理液供應噴嘴14、移動該處理液供應嗜嘴 之喷嘴移動機構15、對處理液供應噴嘴14供應光阻之光阻 供應機構16、於旋轉藉由旋轉夾頭13塗佈光阻後之基板料 用於捕獲從基板w端緣飛散之光阻的総捕獲用杯件、本 發明相關之噴嘴清掃裝置丨8。 上述旋轉夾4 13及轴12係藉由不圖示之夾頭升降機構，而 形成可在圖1以實線表示之旋轉位置和以二點鎖線表示之塗· 佈位置之間升降。此處，旋轉位置係、將塗佈光阻後之基板％ 收谷在杯件17而旋轉之位置’而塗佈位置係藉由處理液供應 嘴嘴14將光阻塗佈在基板W之位置。 上述喷嘴移動機構15具備沿著水平地延伸之移動導件21而 來回移動 < 移動框22。處理液供應喷嘴丨4係介置以噴嘴支持 框23而於水平方向以可自由移動方式支持在該移動框22。然 後，上述噴嘴移動機構15不具備於上下方向移動之機構。因 此，可防止處理液供應噴嘴14沿著移動導件21移動時，處理 87695 200414277 液供應噴嘴14和基板w之距離變動。因而，使處理液供應哈 嘴14水平移動而將光阻塗佈在基板界時，可形成均等厚度之 塗佈膜。 & 上述光阻供應機構16包含具有密閉之構成的加壓槽^，和 收容在該加壓槽24内之光阻槽25。加壓槽24係藉由加壓配管 27而與不圖示之氮氣或氣體供應源連#。然|，該加壓配管 27内配設有氮氣給排切換用之三通閥28，和調節器。且， 光阻槽25内插入有與該光阻槽25和處理液供應噴嘴14連接之 光阻供應配管31之-端。該光阻供應配管31中配設有開閉間 33 ^ 於具有如此構成之光阻供應機構16，開閉閥33處於開放狀 悲時，光阻槽25内之光阻係介置以光阻供應配管3丨而藉由加 壓槽24内之氮氣壓力壓送至處理液供應噴嘴14，且藉由關閉 開閉閥33之方式而停止壓送光阻。 圖2係以模型方式表示處理液供應噴嘴14之光阻供應動作 說明圖。該處理液供應噴嘴14具有延伸至該長度方向（於圖2 之垂直於紙面之方向）之開缝狀吐出口34。該吐出口 34之長 度方向之長度，係基板W中的矩形元件形成部分之短邊長度 以上之長度’但此處設定成和前述矩形元件形成部分之短邊 長度大致相等。如圖2所示，藉由光阻供應配管3丨供應之光 阻35係介置以該開缝狀吐出口 34而供應至基板w表面。 圖3係處理液供應喷嘴14之下端部放大圖。如該圖所示， 該處理液供應喷嘴14具備傾斜之側面39，用於將附著於該處 之光阻35之量設定成最小。於該圖，符號38係形成吐出口 34 87695 -12- 200414277 之唇緣面。該唇緣面38構成側面39之下端部。 接著，說明關於藉由上述基板處理裝^將光阻塗佈在基 板以之塗佈動作。圖4係表示藉由基板處理裝置在基板W塗 体光阻之塗佈動作說明圖H根據以τ說明，處理液供 應噴嘴1 4之移動係藉由上述喷嘴移動機構丨5實行。 於實行光阻塗佈動作之前的狀態，處理液供應喷嘴Μ係配 設在與本發明相關之喷嘴清掃裝置18相對之位置。關於此時 之處理液供應噴嘴14等之狀態，隨後詳細地說明。 於該狀態’開始光阻之塗体動作時，在噴嘴清掃裝置耻 方使處理液供應喷嘴14從待機狀態，如箭頭①所示，使處理 液=噴嘴丨續噴嘴清掃裝置18水平移動至遠方側之基板w 疋一端上方。接著，藉由夾頭升降機構將基板w配設在塗佈 4置此時，基板w表面和處理液供應噴嘴丨4之吐出口 34之 間隔’係形成適於塗佈光阻之特定值。 於該狀態，從處理液供應喷嘴14中的開縫狀吐出口 34吐出 光阻，同時如箭頭②所示’使處理液供應噴嘴14沿著基板w =面水平移動。於該狀態，如圖2所示，將從處理液供應喷 背14中的開縫狀吐出口34吐出之光阻35，在基板w表面塗佈 成薄膜狀。 處理液供應噴嘴14中的開缝狀吐出口 34移動至與基板W另 崎部相尉 < 位置時，停止從處理液供應喷嘴14中的開缝狀 土出口34吐出光阻，而移動至喷嘴清掃裝置18上方。 接著，說明關於本發明相關之喷嘴清掃裝置丨8之構成。圖 5係同時表示本發明相關之喷嘴清掃裝置18和待機筒件36之 87695 -13 - 200414277 侧視圖。 該噴嘴清掃裝置18包含··技架42，可沿著與上述處理液供 應噴嘴14平行地配設之軌條41移動；馬達44，藉由使和該耗 架42連結之同步皮帶43來回旋轉之方式，而使絲42和處理 硬供應噴嘴14平行地㈣移動；和拂拭化，配設在技架^ 上方。如後述，該拂拭部45係用於拂拭處理液供應噴嘴“中 的開縫狀吐出口 34者。該拂拭部45係藉由驅動馬達料，而於 圖5以實線所示之位置和以二點鎖線所示之位置之間來回移 動0 另一方面，#機筒件36係於不塗佈光阻之狀g，用於防止 里液供應噴嘴14中_縫狀吐出口34附近之光阻乾燥而變 質者。該待機筒件36之内部例如儲存有溶解光阻之溶劑等。 該待機筒件36係藉由驅動汽筒37，而形成可於圖5以二點鎖 線所示之該上端開口部與處理液供應噴嘴14中的開缝狀吐出 口 34相對之上升位置’和以實線所示之下降位置之間升降之 構成。因此，於使處理液供射嘴14在噴嘴清掃裝Μ上方 待機之狀態，待機筒件36處於上升位置時，處理液供應喑嘴 Μ之吐出口 34形成露出在藉由待機筒件刊關閉之空間。此 時’由於該空間充滿含有溶劑蒸汽之氣體，因此可防止吐出 口 34附近之光阻乾燥。 ，接著’說明關於上述拂拭部45之構成。圖6係拂拭部45之 W視圖，圖7係拂拭部45之側面剖視圖。圖8係拂拭部45之俯 視圖。然後’於圖7及圖8，為了便於說明而省略部分拂拭構 件52之圖示。 87695 -14- 200414277 =拂拭構件45包含：外殼51、捲繞有長職構件52之傳送 浪同53、捲繞從傳送滾筒53送出之拂拭構件52的捲繞滾筒 54、將洗净液供應至拂拭構件52之洗淨液供應喷嘴55、％、 第1、第2清掃機構57、58。然後，在拂拭構件52使用薄板狀 《多孔性物質。如此之多孔性物f可使用滤紙等紙或不織布 等布或樹脂。 在傳送滾筒53之軸61附設有齒輪62。該齒輪62係介置以齒 輪63而與旋轉阻尼器等張力產生構件64連結。因此，傳送滾 筒53係於具有特定阻力之狀態旋轉。 且，如圖9所示，於附設在傳送滾筒53之軸61的齒輪“下 方，配設有用於限制旋轉傳送滾筒53之旋轉限制機構67。該 旋轉限制機構67具備連結在汽筒66之筒桿的齒條構件65。該 齒條構件65係藉由驅動汽筒66，於圖9以實線所示之待機位 置’和圖9以假設線所示之限制位置之間升降。於齒條構件65 配設在限制位置之狀態，齒條構件65和齒輪62咬合而限制旋 轉傳送滾筒53。 再度參照圖6至圖8，捲繞滾筒54之軸71係介置以搞合器72 而與馬達73之軸74連結。因此，捲繞滾筒54係藉由驅動馬達 73而旋轉。 於從傳送滾筒53到捲繞滾筒54之拂拭構件52下方之位置， 即拂拭構件52之移動路徑中的傳送滾筒53和捲繞滾筒54之間 之位置，配設有第1清掃機構57，用於藉由朝向處理液供應 噴嘴14推壓拂拭構件52之方式，使拂拭構件52抵接在處理液 供應噴嘴14。 87695 -15- 200414277 以下，說明關於第1清掃機構5 7之構成。圖1 〇係表示第1清 掃機構5 7之構成之說明圖，圖11係表示該主要部之立體圖。 然後’圖10(a)係取下第1清掃機構57之外殼75所見之俯視 圖，圖10(b)係第1清掃機構57之縱向剖視圖，圖l〇(c)係第i 清掃機構57之側視圖。且，於圖11，以假設線表現第1清掃 機構5 7之外殼7 5。 該第1清掃機構57係用於將從傳送滾筒53送出之拂拭構件 52抵接在處理液供應噴嘴14而清掃處理液供應噴嘴14者，其 包含：外殼75、該下端部收容在該外殼75内之一對第1推壓 構件76、該下端部收容在外殼75内之第2推壓構件77、支持 板80。用於將洗淨液供應至上述拂拭構件52之洗淨液供應噴 嘴55(參照圖8)係配設在該第1清掃機構57上方。 别述第1推壓構件7 6係使用於將拂拭構件5 2抵接在處理液 供應噴嘴14之唇緣面38者。該第1推壓構件76之該頭部形成 倒角成圓旅形之彎曲形，於後述處理液供應喷嘴丨4之清掃步 驟，用於緩和與處理液供應噴嘴14接觸時之衝擊。然後，亦 可設定成推拔狀代替彎曲形。 该第1推恩構件76下面和支持板80之間，配設有使第1推壓 構件76彈壓至拂拭構件52方向之一對彈簧82。且，第1推壓 構件76下端部形成有用於防止第1推壓構件76從外殼乃脫出 之凸部81。 前述第2推壓構件77係使用於將拂拭構件52抵接在處理液 供應噴嘴14之側面39者。該第2推壓構件77形成有對應於處 理液供應噴嘴14之側面39之形狀的凹部78。且，該第2推壓 87695 -16- 200414277 構件77之U 亦形成倒角成圓孤形之彎曲形，於後述處理 液供應噴嘴u之清掃步驟，用於緩和與處理液供應噴嘴⑷矣 觸時之衝擊。 該第2推壓構件77下面和支持板80之間，配設有使第2推壓 構件77彈壓轉拭構件52方向之—對彈簧8卜且，第2推塵 構件77下端部形成有用於防止第2推壓構件77從外殼75脫出 之凸邛84。再者，外殼75内部配設有可對外殼75滑動之一對 移動構件85，該移動構件85和第2推壓構件”之間配設有一 對彈簧86。 藉由汶等彈κ 83、8 6及移動構件85之作用，以可移動方式 支持第2推壓構件77。即，藉由彈簧83、％及移動構件以 作用，於將後述清掃步驟中的拂拭部45之移動方向當作圖1〇 及圖11所示之X方肖日寺，以可移動至γ方向及z方向之方式支 持該第2推壓構件77。藉此，即使第1清掃機構57和處理液供 應噴嘴14ι位置精確度有誤差時，仍可與形成在第2推壓構 件77之凹部78和處理液供應噴嘴14之側面39確實地抵接。 第2推壓構件77上端部形成有一對引導部79。該一對引導 邵79係用於引導藉由捲出滾筒53捲出之拂拭構件52之兩端 者。即，如圖12(a)所示，該等一對引導部77係配設成互相 地隔開與拂拭構件52之寬度大致同一距離，具有和拂拭構件 52兩端抵接之構成。因此，藉由該等引導部之作用，可有效 地防止拂拭構件52從第2推壓構件77上部之位置脫離。 然後，於後述清掃步驟，處理液供應噴嘴14和第2推壓構 件77介置以拂拭構件52而處於抵接狀態時，如圖i2(b)所示， 87695 -17- 200414277 精由處理液供應噴嘴14之側面39推壓拂拭構件U，而進入第 2推壓構件7 7中的凹部7 8内。 再度參照圖6至圖8，於拂拭構件52之移動路徑中的第^青 掃機構57和捲繞滾筒54之間之位置，配設有第2清掃機構58， 用於藉由再度朝向處理液供應噴嘴14推壓暫時和處理液供應 噴嘴14抵接後之拂拭構件52的方式，使該拂拭構件52抵接在 處理液供應嘴嘴14。 该第2清掃機構58具備用於引導拂拭構件52之固定引導滾 筒87及升降引導滾筒88。以可旋轉方式將固定引導滾筒^支 持在外敗51。另一方面，藉由驅動汽筒9〇而以可旋轉方式將 升降引導滾琦88支持在升降之大致L字形扰架89前端。因 此，升降引導滾筒88係藉由驅動汽筒9〇，於圖6以實線表示 之清掃位置’和以假設線表示之退避位置之間升降。此處， 该清掃位置係升降引導滾筒88將拂拭構件52抵接在處理液供 應嘴嘴14之唇緣面38，藉由拂拭構件52清掃該處之位置。然 後，用於將洗淨液供應至上述拂拭構件5 2之洗淨液供應噴嘴 56，係配設在該升降引導滾筒88之側方。 然後，於上述拂拭部45，將第1、第2清掃機構57、58等與 傳送滾同5 3或捲繞滾筒5 4等同時地採用可裝卸之卡匣機構。 接著，說明關於本發明相關之喷嘴清掃裝置丨8之處理液供 應噴嘴14之清掃動作。 使用該喷嘴清掃裝置實行處理液供應噴嘴14之清掃動作 時，於處理液供應噴嘴14位於清掃機構18上方之狀態，待機 筒件36於圖5從以二點鎖線所示之上升位置下降至以實線表 87695 -18- 200414277 示之下降位置。且，拂拭部45停止在圖5以假設線表示之移 動行程右端（位置。該位置係拂拭構件45配設在傳送滾筒Μ 側端邵之位置。 然後，藉由驅動馬達44，拂拭部45和牦架42同時地開始移 動至圖5所π I左方。該方向係與處理液供應噴嘴14中的開 縫狀吐出口 34平行之方向，係與捲繞滾筒54之拂拭構件⑵勺 捲繞方向同一方向。且，於拂拭構件52朝向左方移動時，使 第2清掃機構58之升降引導滾筒88配設在圖6以實線表示之清 掃位置。 於該狀態繼續移動拂拭部45時，最初，處理液供應噴嘴Μ 之唇緣面38和拂拭構件52藉由第2清掃機構58中的升降引導 滾筒884作用抵接，而藉由拂拭構件52預先清掃處理液供應 喷嘴14之唇緣面38。於該預先清掃步驟，對應必要而從洗淨 液供應噴嘴5 6將洗淨液供應至拂拭構件5 2。 此時，使用於該預先清掃之拂拭構件52如後述，係於其以 前之清掃步驟，已使用於藉由第丨清掃機構57清掃處理液供 應噴嘴14<唇緣面38及側面39之部分。因而，使用於該預先 清掃之拂拭構件52由於光阻而受到某種程度之污染，但由於 其後貫行第1清掃機構57之清掃，因此於預先清掃步驟，該 程度之污染不會造成問題。 然後，進一步繼續移動拂拭部45時，處理液供應噴嘴Μ和 拂拭構件52藉由第丨清掃機構57之作用抵接，而藉由拂拭構 件52正式清掃處理液供應噴嘴14。 參照圖13詳細地說明關於該第！清掃機構57之清掃動作。 87695 -19- 200414277 圖13係表示第1清掃機構57之處 模型圖。 理液供應噴嘴1 4之清掃動作 煮拂拭邵45之移動，處理液供應噴嘴Μ和帛❻掃機構y ’從圖13(a)所示之狀態變成圖u(b)之狀態時^ ^刀處理液供應噴嘴14之唇緣面38和拂拭構件52藉由捲繞滾 同54側《第丨推壓構㈣之作用抵接，而藉㈣拭構件切青 掃處輯供應噴嘴14之唇緣㈣。於該狀態，將捲繞滾㈣200414277 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a substrate cleaning device including a nozzle cleaning device and a nozzle cleaning device, which is used for cleaning a processing liquid supply nozzle for supplying a processing liquid to a substrate surface . [Prior art] A substrate processing apparatus that processes and supplies a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a photomask substrate for a semiconductor manufacturing apparatus is used to discharge from a slit-shaped ejection outlet through a side. Processing liquid, a method of supplying the processing liquid to the surface of the substrate relative to the substrate. The processing liquid is supplied to the substrate surface: when the nozzle is applied, "P« substrate processing, the slit-shaped discharge in the processing liquid supply nozzle will remain fine. The treatment liquid is contaminated by the centroid dye f. The photoresist, especially a photoresist containing a pigment called a color photoresist, is particularly liable to cause such pollution when used as a treatment liquid. The nozzle cleaning device must be used to reduce the cleaning solution supply nozzle. Such a nozzle cleaning device previously abutted the cleaning wiper member against the processing liquid supply nozzle, and formed the cleaning solution supply nozzle by the cleaning member. ί Structure. Pure, the nozzle cleaning device uses a long wiping member wound between the transfer roller and the winding roller (for example, refer to the patent [ Xu Jian 1] Japanese Patent Application Laid-Open No. 2001-1 13213, “Small size of substrate 1”, the slit-shaped package f 1 in the processing liquid supply nozzle & has a tendency of long length & The nozzle cleaning device has the problem of increasing the consumption of the wiping member and increasing the cost. 87695 200414277 Two = substrate processing device with butterfly cleaning device, the nozzle should be used. The consumption of the swivel member is to clean the processing liquid for [ Summary of the Invention: The invention of item 1 of the claim 1 is a nozzle cleaning device, which is characterized by: surface: a slit-shaped spout discharges processing liquid,-is opposite to the substrate for cleaning and supplies the processing liquid to Surface treatment of the aforementioned substrate ΐ: What is it? It includes: a transfer roller wound with a long wiping member; winding: the same, the winding is sent from the aforementioned transfer roller to the processing solution supply mouth: a wipe in the length direction Rotating mechanism that rotates the winding roll door 'brother mechanism' by the wiping member sent from the transfer roller: connected to the processing fluid supply nozzle, cleaning the processing fluid supply nozzle, .... 2 The cleaning mechanism, before the first cleaning mechanism cleans the processing nozzles, makes the first cleaning mechanism contact the processing liquid supply nozzles by the action of the first cleaning mechanism among the wiping members sent from the conveying rollers. : The area is cleaned in advance by abutting on the side 4 of the processing liquid supply nozzle described above. The invention of No. 2 of the scope of application for a patent-the nozzle cleaning device is characterized by The slit-shaped ejection outlet ejects the processing liquid and moves relatively to the substrate in a way of cleaning the processing supply nozzle that supplies the processing liquid to the surface of the substrate. The cleaning nozzle includes a wiper and includes a transfer roller. Winding the long broom member, the winding drum, I wind the wiping member in the length direction from the conveying roller to the discharge port in the processing night supply nozzle; the rotating mechanism, 87695 200414277 rotates the winding roller; the first cleaning机构 ， 配 #: Pieces: Following the aforementioned processing, the aforementioned: the wiping structure = the position between Shu Chuan ~ ㈣ and the winding drum; and the ^ = :: = At the position between the processing ⑽ = wiping member of the movement path of the first sweep means ❻ $ "; and the moving mechanism, so that the longitudinal direction of the discharge port in the wiping member in the processing solution supply nozzle moves back and forth. On the private day, the invention of the third item is based on the second item of the scope of the patent application. * The second brother's cleaning mechanism is the same as the winding direction of the wiping member that moves from the aforementioned wiping section to the secret tube. The volume% is next to -f ♦ @ 、 When the direction, the aforesaid wiping member abuts "the processing liquid supply nozzle mouth" and moves in the aforementioned wiping part ... The winding direction of the wiping member of the wave tube is reversed, and the volume%,, Ο Contends to separate the Hungarian brush technique; f Gaigu P, second processing fluid supply nozzles. The heart of the invention is based on the "patent model _ item =" soil structure is moved to the volume with the aforementioned volume ... When the winding direction is the same direction, the aforementioned winding roll 2 is rotated. The invention of the fifth scope of the invention is an invention according to the third scope of the patent, which is provided with a rotation restricting mechanism. Reverse, ^ swipe to rotate with the aforementioned roll.… When reversed, 'restrict the smoke roll of item 6 of the patent scope of the aforementioned roll-out roller application ^ Any of the 5th item-invention, item i, sweep = please Patent Fanyuan No. 1 to the aforesaid system (supply) system including the material Stomach test component abutting on the side of the front fluid treatment nozzle: 87695 200414277. Order the invention in item 7 of the patent, which is a 裉 invention. The pressing member of item 6. There is a "money" first or second month member. Then, the second pressing member of A is formed with a concave shape in front of the shoulder. At the same time, the processing liquid is supplied to support the pressing member. The mechanism has the support to move the second invention in a movable manner. The invention of item 9 of the garden is requested according to the order. The support mechanism is the movement of the material swab. The two can move to the Y direction and Z. It is composed of a plurality of springs in a direction-oriented manner. According to the invention, the invention of the tenth item of the patent scope is based on the eighth aspect of the patent scope: the aforementioned second pressing member has a guide for unwinding from the unwinding roller. Then wipe the guides on both ends of the member. : The invention according to item 11 of the patent scope is based on the item 6 of the patent scope == ', which is provided with a washing liquid supply mechanism for supplying a washing liquid to the aforementioned wiping member. The invention of claim No. 1 in the scope of the patent application is the nozzle cleaning device, which is characterized in that the processing liquid is discharged from the slit-shaped discharge port on one side, and the substrate is relatively and smoothly moved toward the substrate (in a manner, the cleaning liquid supplies the processing liquid to the foregoing). Substrate surface treatment: the supply nozzle 'which includes: the supply means' supplies the long wiping member; recovery & collection of the discharge port sent from the supply means to the aforementioned processing liquid supply nozzle mouth <the universal brushing member of the length; the first! The cleaning mechanism cleans the processing liquid supply nozzle by abutting the wiping member supplied from the aforementioned supply 87695 200414277 to the processing liquid supply nozzle; and a second cleaning mechanism for cleaning Before cleaning the processing liquid supply nozzle, the aforesaid cleaning mechanism in the wiping member supplied from the supply means is brought into abutment with the above-mentioned processing: the area behind the night supply nozzle is abutted with the processing The method of the liquid supply spraying angle 'cleans the aforementioned processing liquid supply nozzle in advance. The invention of item 13 of the scope of patent application-the mouth and mouth cleaning device, It is characterized in that the processing liquid is discharged from the slit-shaped discharge port by a side, and the processing liquid supply nozzle for cleaning and supplying the processing liquid to the surface of the substrate is moved relative to the substrate, and includes a wiper It includes: a supply means, a long brushing means for supplying: a time-receiving section, a brushing means in the length direction from the aforementioned supplying means to the discharge Π in the processing liquid supply nozzle; & a cleaning mechanism The wiping member abuts the aforementioned processing liquid supply nozzle (a position between the aforementioned supplying means and the aforementioned recycling means of the moving means of the aforementioned wiping member; and a second cleaning mechanism, which is arranged to feed the aforementioned wiping member ^ to the aforementioned processing liquid The position between the cleaning mechanism and the recovery means in the moving path of the wiping member before the nozzle is supplied; and the moving mechanism 'moves the wiping part back and forth in the long production direction of the spout in the nozzle of the processing liquid supply nozzle. The invention applying for the scope of patent No. 1 is also characterized in that it includes a substrate holding mechanism 'processing liquid supply nozzle' for holding a substrate. Slit-like spout 2 outlets 7 '-Face-to-face relative force of the substrate held by the aforementioned holding mechanism' Supply processing liquid to the aforementioned substrate surface range item 1, item 2, item 12 blessing, ~ π, ^ Called patent brother 12 members, brother 13 items "any nozzle cleaning device. 87695 -10- 200414277 [Embodiment] The following describes the embodiment of the present invention based on the drawings. First, the mouth related to the application of the present invention will be described. The structure of the nozzle cleaning device and the financial processing device. Figure " is a schematic diagram of a substrate processing device to which the nozzle cleaning device 2 related to the present invention is applied. The substrate processing device is a color plate (hereinafter referred to as a plate) for forming a rectangular liquid crystal panel. The photoresist for the “substrate” pigment is called a color photoresist. It contains: a rotating chuck 13 that rotates around the axis by driving the motor u while holding and holding the substrate W, and is used for coating The processing liquid supply nozzle 14 holding the substrate W of the rotary chuck U, a nozzle moving mechanism 15 that moves the processing liquid supply nozzle, a photoresist supply mechanism 16 that supplies a photoresist to the processing liquid supply nozzle 14, By rotation of the spin chuck 13 after the substrate is coated with resist material to capture the cup for capturing the substrate w from Cong scattering of the photoresist edge, the associated nozzle cleaning device of the present invention Shu 8. The rotation clamp 4 13 and the shaft 12 are raised and lowered between a rotation position indicated by a solid line and a coated and cloth position indicated by a two-point lock line by a chuck lifting mechanism (not shown). Here, the rotation position is a position where the substrate% after the photoresist is applied is rotated at the position where the cup member 17 is rotated, and the application position is the position where the photoresist is applied to the substrate W by the processing liquid supply nozzle 14. . The nozzle moving mechanism 15 is provided with a moving guide 21 that extends horizontally, and < moving frame 22. The processing liquid supply nozzle 4 is provided with a nozzle support frame 23 interposed therebetween, and is supported in the movable frame 22 in a horizontally movable manner. The nozzle moving mechanism 15 is not provided with a mechanism for moving in the vertical direction. Therefore, it is possible to prevent the distance between the processing liquid supply nozzle 14 and the substrate w from being changed when the processing liquid supply nozzle 14 moves along the moving guide 21. Therefore, when the processing liquid supply nozzle 14 is moved horizontally and a photoresist is applied on the substrate boundary, a coating film with an even thickness can be formed. & The photoresist supply mechanism 16 includes a pressure tank ^ having a closed structure, and a photoresist tank 25 housed in the pressure tank 24. The pressure tank 24 is connected to a nitrogen or gas supply source (not shown) via a pressure pipe 27. Of course, the pressure pipe 27 is provided with a three-way valve 28 for nitrogen supply and discharge switching and a regulator. In addition, the photoresist tank 25 is inserted with a negative end of a photoresist supply pipe 31 connected to the photoresist tank 25 and the processing liquid supply nozzle 14. The photoresist supply pipe 31 is provided with an opening and closing chamber 33. When the photoresist supply mechanism 16 is configured in this way, and the opening and closing valve 33 is in an open state, the photoresist in the photoresist groove 25 is interposed with the photoresist supply pipe. 3 丨 And the pressure is sent to the processing liquid supply nozzle 14 by the nitrogen pressure in the pressure tank 24, and the pressure-feeding photoresist is stopped by closing the on-off valve 33. Fig. 2 is an explanatory view showing a photoresist supply operation of the processing liquid supply nozzle 14 in a model manner. The treatment liquid supply nozzle 14 has a slit-shaped discharge port 34 extending to the longitudinal direction (a direction perpendicular to the paper surface in FIG. 2). The length in the length direction of the discharge opening 34 is a length equal to or greater than the length of the short side of the rectangular element forming portion in the substrate W. However, it is set here to be approximately equal to the length of the short side of the aforementioned rectangular element forming portion. As shown in FIG. 2, the photoresist 35 supplied through the photoresist supply pipe 3 丨 is supplied to the surface of the substrate w via the slit-shaped discharge port 34. FIG. 3 is an enlarged view of a lower end portion of the processing liquid supply nozzle 14. As shown in the figure, the treatment liquid supply nozzle 14 is provided with an inclined side surface 39 for minimizing the amount of the photoresist 35 attached thereto. In the figure, the symbol 38 is the lip surface of the outlet 34 87695 -12- 200414277. This lip surface 38 constitutes the lower end of the side surface 39. Next, the coating operation of applying a photoresist to a substrate by the substrate processing device will be described. Fig. 4 is a view showing the coating operation of the photoresist on the substrate W by the substrate processing device. Fig. H is based on the description of τ. The movement of the processing liquid supply nozzle 14 is performed by the nozzle moving mechanism 5 described above. In a state before the photoresist coating operation is performed, the processing liquid supply nozzle M is disposed at a position opposite to the nozzle cleaning device 18 related to the present invention. The state of the processing liquid supply nozzle 14 and the like at this time will be described in detail later. When the coating operation of the photoresist is started in this state, the processing liquid supply nozzle 14 is switched from the standby state in the nozzle cleaning device, as shown by arrow ①, and the processing liquid = nozzle 丨 continuous nozzle cleaning device 18 is moved to a distance The side of the substrate w 上方 is above one end. Next, the substrate w is arranged on the coating layer 4 by the chuck lifting mechanism. At this time, the interval between the surface of the substrate w and the outlet 34 of the processing liquid supply nozzle 4 is formed to a specific value suitable for coating photoresistance. In this state, the photoresist is discharged from the slit-shaped discharge port 34 in the processing liquid supply nozzle 14, and at the same time, the processing liquid supply nozzle 14 is moved horizontally along the substrate w = plane as shown by arrow ②. In this state, as shown in FIG. 2, the photoresist 35 discharged from the slit-shaped discharge port 34 in the processing liquid supply jet 14 is coated on the surface of the substrate w in a thin film form. When the slit-shaped ejection outlet 34 in the processing liquid supply nozzle 14 moves to the position with the substrate W. Sasaki, the photoresist is stopped from being ejected from the slit-shaped soil outlet 34 in the processing liquid supply nozzle 14 and moves to Above the nozzle cleaning device 18. Next, the configuration of the nozzle cleaning device 8 related to the present invention will be described. Fig. 5 is a side view of 87695 -13-200414277 showing the nozzle cleaning device 18 and the standby cylinder 36 related to the present invention at the same time. The nozzle cleaning device 18 includes a technical frame 42 that can be moved along a rail 41 that is arranged in parallel with the processing liquid supply nozzle 14; a motor 44 that rotates a timing belt 43 connected to the consumption frame 42 back and forth In this way, the wire 42 and the processing hard supply nozzle 14 are moved in a parallel manner; As will be described later, the wiping portion 45 is used for wiping the slit-shaped discharge opening 34 in the treatment liquid supply nozzle ". The wiping portion 45 is driven by a motor, and is shown in solid lines in FIG. The two-point lock line moves back and forth between the positions shown on the other hand. On the other hand, #machine barrel member 36 is in the state where no photoresist is applied, and is used to prevent light in the liquid supply nozzle 14 near the slit-shaped discharge port 34. Those who are resistant to drying and deteriorate. Inside the standby cylinder member 36, for example, a solvent for dissolving photoresist is stored. The standby cylinder member 36 is formed by driving the cylinder 37 to form the upper end which can be shown by a two-point lock line in FIG. The opening portion is configured to be raised and lowered between the raised position 'and the lowered position shown by a solid line in the slit-shaped discharge port 34 in the treatment liquid supply nozzle 14. Therefore, the treatment liquid supply nozzle 14 is cleaned by the nozzle. In the standby state above M, when the standby cylinder 36 is in the raised position, the outlet 34 of the processing liquid supply nozzle M is exposed in a space closed by the standby cylinder. At this time, 'the space is filled with a gas containing solvent vapor. , So it prevents light near the outlet 34 Resistance to drying. Next, 'the structure of the above-mentioned wiping portion 45 is described. FIG. 6 is a W view of the wiping portion 45, and FIG. 7 is a side cross-sectional view of the wiping portion 45. FIG. 8 is a top view of the wiping portion 45. In FIG. 8, the illustration of a part of the wiping member 52 is omitted for convenience of explanation. 87695 -14- 200414277 = The wiping member 45 includes: a housing 51, a transmission wave 52 wound with a long-time member 52, and a winding roller 53 to send it out. The winding roller 54 of the wiping member 52 supplies the cleaning liquid to the cleaning liquid supply nozzles 55,%, and the first and second cleaning mechanisms 57 and 58 of the wiping member 52. Then, a thin plate-shaped " Porous materials. Such porous materials f can be made of paper such as filter paper or non-woven cloth or resin. A gear 62 is attached to the shaft 61 of the transfer drum 53. The gear 62 is interposed between the gear 63 and the tension of the rotary damper. The generating member 64 is connected. Therefore, the transfer roller 53 rotates in a state with a specific resistance. As shown in FIG. 9, the transfer roller 53 is provided to restrict rotation of the transfer roller 53 below the gear attached to the shaft 61 of the transfer roller 53. Rotation limit Structure 67. The rotation restriction mechanism 67 includes a rack member 65 connected to a cylinder rod of the cylinder 66. The rack member 65 is driven up and down between a standby position 'shown by a solid line in Fig. 9 and a limit position shown by a hypothetical line by driving the cylinder 66. In a state where the rack member 65 is disposed at the restricted position, the rack member 65 and the gear 62 mesh with each other to restrict the rotation of the transfer roller 53. Referring again to FIGS. 6 to 8, the shaft 71 of the winding drum 54 is interposed with the clutch 72 and connected to the shaft 74 of the motor 73. Therefore, the winding drum 54 is rotated by the driving motor 73. A first cleaning mechanism 57 is provided at a position below the wiping member 52 from the transfer drum 53 to the winding drum 54, that is, between the transfer drum 53 and the winding drum 54 in the moving path of the wiping member 52. The wiping member 52 is brought into contact with the processing liquid supply nozzle 14 by pressing the wiping member 52 toward the processing liquid supply nozzle 14. 87695 -15- 200414277 The structure of the first cleaning mechanism 57 will be described below. Fig. 10 is an explanatory view showing the configuration of the first cleaning mechanism 57, and Fig. 11 is a perspective view showing the main part. Then FIG. 10 (a) is a plan view of the casing 75 of the first cleaning mechanism 57, FIG. 10 (b) is a longitudinal sectional view of the first cleaning mechanism 57, and FIG. 10 (c) is a view of the i cleaning mechanism 57. Side view. In addition, in Fig. 11, a case 7 5 of the first cleaning mechanism 5 7 is represented by a hypothetical line. The first cleaning mechanism 57 is configured to clean the processing liquid supply nozzle 14 by abutting the wiping member 52 sent out from the transfer drum 53 against the processing liquid supply nozzle 14. The cleaning mechanism 57 includes a casing 75 and the lower end portion is housed in the casing 75. One of the pair is the first pressing member 76, the second pressing member 77 whose lower end portion is housed in the case 75, and the support plate 80. A cleaning liquid supply nozzle 55 (see Fig. 8) for supplying a cleaning liquid to the wiping member 52 is disposed above the first cleaning mechanism 57. In other words, the first pressing member 7 6 is used for abutting the wiping member 5 2 against the lip surface 38 of the processing liquid supply nozzle 14. The head of the first pressing member 76 is formed into a curved shape that is chamfered into a round shape. The cleaning step of the processing liquid supply nozzle 4 described later is used to alleviate the impact when it comes into contact with the processing liquid supply nozzle 14. Then, it can be set to push shape instead of curved shape. A pair of springs 82 are provided between the lower surface of the first indentation member 76 and the support plate 80 to urge the first pressing member 76 to the direction of the wiping member 52. A convex portion 81 is formed at the lower end portion of the first pressing member 76 to prevent the first pressing member 76 from coming out of the housing. The second pressing member 77 is used for abutting the wiping member 52 against the side surface 39 of the processing liquid supply nozzle 14. The second pressing member 77 is formed with a recess 78 corresponding to the shape of the side surface 39 of the processing liquid supply nozzle 14. In addition, the second pushing 87695 -16- 200414277 U of the member 77 is also formed into a curved shape with a chamfered round shape, and is used to ease the contact with the processing liquid supply nozzle in the cleaning step of the processing liquid supply nozzle u described later. The shock of time. Between the lower surface of the second pressing member 77 and the support plate 80, a direction in which the second pressing member 77 is elastically swiveled to the swiping member 52—a pair of springs 8 is provided, and a lower end portion of the second pressing member 77 is formed for A projection 84 that prevents the second pressing member 77 from coming out of the case 75. Furthermore, a pair of moving members 85 is provided inside the housing 75 to slide the housing 75, and a pair of springs 86 are arranged between the moving member 85 and the second pressing member ". 6 and the action of the moving member 85 support the second pressing member 77 in a movable manner. That is, the movement direction of the wiper 45 in the cleaning step described later is taken as a figure by the action of the spring 83, the%, and the moving member. 10 and the X Fang Xiaori Temple shown in Fig. 11 support the second pressing member 77 so as to be movable to the γ direction and the z direction. Thus, even if the first cleaning mechanism 57 and the processing liquid supply nozzle 14m are positioned When there is an error in accuracy, it can still reliably contact the recessed portion 78 formed on the second pressing member 77 and the side surface 39 of the processing liquid supply nozzle 14. The upper end portion of the second pressing member 77 is formed with a pair of guide portions 79. This A pair of guides 79 is used to guide both ends of the wiping member 52 rolled out by the take-up roller 53. That is, as shown in FIG. 12 (a), the pair of guides 77 are arranged to each other It is spaced approximately the same distance as the width of the wiping member 52, and has a structure in contact with both ends of the wiping member 52 Therefore, it is possible to effectively prevent the wiping member 52 from being detached from the upper portion of the second pressing member 77 by the action of these guides. Then, in a cleaning step described later, the treatment liquid supply nozzle 14 and the second pressing member 77 are interposed. When the wiping member 52 is placed in the abutting state, as shown in FIG. I2 (b), 87695 -17- 200414277 is pressed by the side 39 of the processing liquid supply nozzle 14 to push the wiping member U into the second pressing member 7 In the recess 7 7 in 7. Referring to FIGS. 6 to 8 again, a second cleaning mechanism 58 is provided at a position between the third cleaning mechanism 57 and the winding roller 54 in the moving path of the wiping member 52, The second cleaning mechanism is configured to press the wiping member 52 temporarily contacted with the processing liquid supply nozzle 14 toward the processing liquid supply nozzle 14 again, so that the wiping member 52 is brought into contact with the processing liquid supply nozzle 14. The second cleaning mechanism 58 is provided with a fixed guide roller 87 and a lifting guide roller 88 for guiding the wiping member 52. The fixed guide roller ^ is rotatably supported at the outside 51. On the other hand, the cylinder 90 is driven to lift and lower in a rotatable manner. Guide roll Qi 88 support Approximately the front end of the L-shaped scrambler 89. Therefore, the lifting guide roller 88 is driven between the cleaning position indicated by a solid line in FIG. 6 and the retreated position indicated by a hypothetical line by driving the cylinder 90. Here, the cleaning The position is that the raising and lowering guide roller 88 abuts the wiping member 52 against the lip surface 38 of the treatment liquid supply nozzle 14 and cleans the position there by the wiping member 52. Then, it is used to supply the cleaning liquid to the wiping member 5 The cleaning liquid supply nozzle 56 of 2 is disposed on the side of the elevating guide roller 88. Then, the first and second cleaning mechanisms 57, 58 and the like are conveyed to the cleaning roller 45 in the same manner as described above. Removable cassette mechanism is used at the same time around the rollers 5 4 and the like. Next, the cleaning operation of the processing liquid supply nozzle 14 of the nozzle cleaning device 8 related to the present invention will be described. When the cleaning operation of the processing liquid supply nozzle 14 is performed by using the nozzle cleaning device, in a state where the processing liquid supply nozzle 14 is located above the cleaning mechanism 18, the standby cylinder 36 is lowered from the rising position shown by the two-point lock line to The solid line table shows the descending position indicated by 87695 -18- 200414277. Further, the wiping portion 45 is stopped at the right end (position) of the movement stroke indicated by the hypothetical line in FIG. 5. This position is a position where the wiping member 45 is disposed at the side end of the conveying roller M. Then, by the drive motor 44, the wiping portion 45 and The creel 42 starts to move to the left of π I in FIG. 5 at the same time. This direction is parallel to the slit-shaped discharge opening 34 in the processing liquid supply nozzle 14 and is wound around the scooping member of the winding drum 54. The direction is the same. When the wiping member 52 is moved to the left, the lifting guide roller 88 of the second cleaning mechanism 58 is arranged at the cleaning position shown by a solid line in FIG. 6. When the wiping portion 45 is continuously moved in this state, First, the lip surface 38 of the processing liquid supply nozzle M and the wiping member 52 are brought into contact by the lifting guide roller 884 in the second cleaning mechanism 58, and the lip surface of the processing liquid supply nozzle 14 is cleaned in advance by the wiping member 52. 38. In this pre-cleaning step, the cleaning liquid is supplied from the cleaning liquid supply nozzle 56 to the wiping member 52 as necessary. At this time, the wiping member 52 used in the pre-cleaning will be described later, and it is the former. Cleaning steps, It has been used to clean the processing liquid supply nozzle 14 < lip surface 38 and the side surface 39 by the first cleaning mechanism 57. Therefore, the wiping member 52 used for the pre-cleaning has been contaminated to some extent due to light resistance, but Since the cleaning by the first cleaning mechanism 57 is performed thereafter, contamination to this extent does not cause a problem in the cleaning step in advance. Then, when the wiper section 45 is further moved, the processing liquid supply nozzle M and the wiper member 52 pass through the first丨 The cleaning mechanism 57 abuts, and the treatment liquid supply nozzle 14 is officially cleaned by the wiping member 52. The cleaning operation of the cleaning mechanism 57 will be described in detail with reference to Fig. 87. 87695 -19- 200414277 Fig. 13 shows the first 1 cleaning mechanism 57 model diagram. The cleaning action of the physical fluid supply nozzle 14 and the movement of the cleaning brush 45, the processing fluid supply nozzle M and the cleaning mechanism y 'change from the state shown in FIG. 13 (a) to FIG. In the state of (b) ^ ^ The lip surface 38 of the knife treatment liquid supply nozzle 14 and the wiping member 52 are brought into contact with the 54-side "pushing structure" by the winding roller, and are cut green by the wiping member. Scanning supply nozzle 14 (Iv) the lip. In this state, the wound roll (iv)
側（第1推壓構件76推壓在處理液供應嘴嘴14而下降H 如上述’由於第1推壓構件76之頭部形成㈣成圓狐形之彎 曲形，因此可緩和第丨推壓構件76和處理液供應噴嘴14接觸 時之衝擊。 從孩狀態進一步移動拂拭部45，處理液供應噴嘴Μ和第1 清掃機構57之配設關係變成圖13(c)所示之狀態時，處理液 供應喷嘴14之側面39和拂拭構件52藉由第2推壓構件”之作 用抵接，而藉由拂拭構件52清掃處理液供應噴嘴14之側面 3 9。於该狀悲，將第2推壓構件7 7推壓在處理液供應噴嘴μ 而下降。然後，如上述，由於第2推壓構件77之頭部亦形成 倒角成圓弧形之彎曲形，因此可緩和第2推壓構件77和處理 液供應喷嘴14接觸時之衝擊。 此時，如上述，由於以可移動至γ方向及ζ方向之方式支 持第2推壓:構件77 ’即使第1清掃機構57和處理液供應噴嘴j 4 之位置精確度有誤差，仍可確實地抵接形成在第2推壓構件77 之凹部78和處理液供應喷嘴14之側面39。因此，可確實地抵 接處理液供應喷嘴14之側面39和拂拭構件52，而藉由拂拭構 87695 -20- 200414277 件52確實地清掃處理液供應14之側面39。 、進一步移動拂拭部45,處理液供應噴嘴14和第！清掃機構57 mu & 8113⑷所示之狀態時’處理液供應噴嘴14 之唇緣面38和拂拭構件52藉由傳送滾筒洲之第1推壓構件 76^作用再度抵接，而藉由拂拭構件叫度清掃處理液供應 喷嘴14〈唇緣面38。於該狀態，將捲繞滾筒54側之第i推壓 構件76推壓在處理液供應噴嘴14而下降。然後，由於該第} 推壓構件76之頭部㈣成倒角成圓狐形之f曲形，因此可緩 和第1推壓構件76和處理液供應噴嘴14接觸時之衝擊。 於清掃上述第丨清掃機構57之處理液供應噴嘴“時，對應 必要而從洗淨液供應噴嘴55將洗淨液供應至拂拭構件52: 且於巧掃上述第1清掃機構57之處理液供應噴嘴14時，藉 1力馬達7j以低速旋轉捲繞滾筒54。因此，可藉由新的 拂拭構件52清潔地清掃處理液供應噴嘴14之唇緣㈣及側面 39 A後’藉由第1清掃機構57而已使用於清掃後的拂拭構 件52如上述，再利用於第2清掃機構58之預先清掃。 然後，處理液供應噴嘴14中的開縫狀吐出口 34之長度方向 之長度車乂釔時，亦可不旋轉捲繞滾筒54，而清掃處理液供應 噴嘴14之唇緣面3 8及側面3 9。 藉由以上動作，拂拭部45從於圖5以假設線表示之掃描行 程右端之位置移動至於圖5以實線表示之移動行程左端之位 置時’藉由馬達44之驅動，拂拭部45和托架42同時地移動至 圖5所示之右方。該方向係與處理液供應噴嘴“中的開縫狀 吐出口34平行之方向，且係與捲繞滾筒54之拂拭構件52之捲 87695 •21- 200414277 繞方向反方向。 泫拂拭構件52朝向左方移動時，由於第丨清掃機構57之作 用，而藉由拂拭構件52再度清掃處理液供應噴嘴14之唇緣面 38及側面39。但是，該拂拭構件52朝向左方移動時，第2清 掃機構5 8之升降引導滾筒8 8係配設在圖6以假設線表示之退 避位置。因此，清掃後之處理液供應噴嘴14之唇緣面38及側 面39不會和已使用於預先清掃之拂拭構件52抵接而污染。 且，於该拂拭構件52朝向左方移動時，圖9所示之旋轉限 制機構67之齒條構件65係配設在限制位置，限制旋轉傳送滾 筒53。因此，拂拭構件52朝向左方移動時，由於拂拭構件“ 和處理液供應噴嘴14之間的摩擦力而拉動拂拭構件52時，亦 不會逆轉傳送滾筒53。 然後’拂拭部45移動至於圖5以假設線表示之移動行程右 端之位置時，即完成處理液供應噴嘴14之清掃動作。但是， 亦可使拂拭部45複數次來回而清掃處理液供應噴嘴14。 然後，於上述實施型態，已說明關於使本發明相關之噴嘴 清掃裝置18適用於基板處理裝置之情形，該基板處理裝置係 藉由處理液供應噴嘴14將光阻塗佈在基板w之後，藉由旋轉 夾頭13旋轉該基板W之構成，但亦可使本發明相關之噴嘴清 掃裝置適用於藉由處理液供應噴嘴14將處理液供應至基板w 後，不旋轉基板W之型態的基板處理裝置。 且，於上述貫施型態，已說明關於在第丨清掃機構5 7配設 複數個第1推壓構件76之情形，但亦可在第丨清掃機構57配設 複數個第2推壓構件77。 87695 -22- 200414277 /請專利範圍第丨項、第2項、第12項、第13項及第14項之 各月由於使使用於藉由拂拭構件中的第丨清掃機構清掃處 理液供應喷嘴之區域，可使用於藉由第2清掃機構預先清掃 處=液供應噴嘴’因此可__面降低拂拭構件之消耗量，一面 確實地清掃處理液供應噴嘴。 中請專利範圍第3項之發明由於第2清掃機構僅㈣拭部移 動至與捲繞滾筒之拂拭構件的捲繞方向同—方向時，將拂拭 構件抵接在處理液供應噴嘴，因此可防止已使用於預先清掃 、拂拭構件再度抵接在處理液供應噴嘴而污染處理液供應喷 嘴。 " 申印專利範圍第4項之發明由於旋轉機構係於拂拭部移動 至與捲之拂拭構件之捲繞方向同一方向時旋轉滾筒， 因此可藉由新的拂拭構件清潔地清掃處理液供應喷嘴。 申叫專利範圍第5項之發明由於具備於拂拭部移動至與捲 、、:^滾同 <拂拭構件的捲繞方向反方向時限制捲繞滾筒旋轉之 旋轉限制機構，因此於拂拭構件移動時，可確實地防止因為 拂拭構件和處理液供應噴嘴之間的摩擦力而逆轉傳送滾筒。 申請專利範圍第6項之發明由於使第丨清掃機構包含使拂拭 構件抵接在處理液供應噴嘴之唇緣面的第丨推壓構件，和使 拂拭構件抵接在處理液供應噴嘴之側面的第2推壓構件，因 此可確實地清掃處理液供應噴嘴之唇緣面和側面。 申請專利範圍第7項之發明由於第丨清掃機構具備複數個第 1推壓構件或第2推壓構件，因此可更確實地清掃處理液供應 噴嘴之唇緣面或側面。 87695 -23- 200414277 _请專利Ιέ園第8項之發明由於第2推壓構件 理液供應噴嘴側面之形狀的凹部，同時進一步具=、處 万式支持該第2推壓構件之支持機構 動 理液供應噴嘴之位置精確度有⑽争仍二^機構和處 … 差時，仍可確實地抵接來Λ 在第2推壓構件之凹部和處理液供應噴嘴之側面。 " 令請專利範圍第9之發明由於支持機構係由將拂拭部之移 力万向當作X方向時，以可移動至γ方向和ζ方向之 第2推壓構件之複數彈簧所構成，即使第丨清掃機構和處理液 供應噴嘴<位置精確度有誤差時，仍可確實地抵接形成在第 2推壓構件之凹邵和處理液供應噴嘴之側面。 _請專利範圍第1()項之發明由於第2推壓構件具有引導藉 由捲出滾筒捲出之拂拭構件之兩端的引導部，因此可有㈣ 防止拂拭構件從第2推壓構件上部之位置脫離。 申請專利範圍第U項之發明由於具備將洗淨液供應至拂拭 構件《洗淨液供應機構，因此可利用洗淨液確實地清掃處理 液供應噴嘴。 【圖式簡單說明】 圖1係週用本發明相關之噴嘴清掃裝置之基板處理裝置概 要圖。 圖2係以模型方式表示處理液供應噴嘴14之光阻供應動作 說明圖。 圖3係處理液供應噴嘴14之下端部放大圖。 圖4係表示藉由基板處理裝置在基板▽塗佈光阻之塗佈動 作說明圖。 87695 -24- 200414277 圖5係同時地表示本發明相關之噴嘴清掃裝置1 8和待機筒 件36之側視圖。 圖6係拂拭部45之前視圖。 圖7係拂拭部45之側視圖。 圖8係拂拭部4 5之俯視圖。 圖9係同時地表示旋轉限制機構67和齒輪62之前視圖。 圖1〇係表示第1清掃機構57之構成之說明圖。 圖11係表示第1清掃機構57之主要部之立體圖。 圖12係表示第2推壓構件刃和拂拭構件52之關係之說明 圖。 圖丨3係表π第丨清掃機構57之處理液供應噴嘴μ之清掃動 作模型圖。 【圖式代表符號說明】 11 、 44 、 73 12 、 61 、 71 、 74 13 14 15 16 17 18 21 22 23 馬達 軸 旋轉夹頭 處理液供應嘴嘴 噴嘴移動機構 光阻供應機構 光阻捕獲用杯件 噴嘴清掃裝置 移動導件 移動框 噴嘴支持臂 87695 -25- 200414277 24 加壓槽 25 光阻槽 27 加壓配管 28 三通閥 29 調節器 31 光阻供應配管 33 開閉閥 34 吐出口 35 光阻 36 待機筒件 37、 66 > 90 汽筒 38 唇緣面 39 側面 41 軌條 42 托架 43 同步皮帶 45 拂拭部 5卜 75 外殼 52 拂拭構件 53 傳送滾筒、捲出滾筒 54 捲繞滾筒 55 ^ 56 洗净液供應噴嘴 57 弟1清掃機構 58 第2清掃機構 95 -26- 200414277 62 ^ 63 齒輪 64 張力產生部 65 齒條構件 67 旋轉限制機構 72 耦合器 76 第1推壓構件 77 第2推壓構件 78 凹部 79 引導部 80 支持板 81、84 凸部 82 、 83 、 86 彈簧 85 移動構件 87 固定引導滾筒 88 升降引導滚筒 89 托架 W 基板 87695 -27 -Side (the first pressing member 76 is pressed against the processing liquid supply nozzle 14 and descends H as described above, because the head of the first pressing member 76 is formed into a curved shape of a round fox shape, the first pressing member 76 can be relieved The impact when the member 76 is in contact with the processing liquid supply nozzle 14. When the wiping part 45 is further moved from the child state, and the arrangement relationship between the processing liquid supply nozzle M and the first cleaning mechanism 57 becomes the state shown in FIG. The side surface 39 of the liquid supply nozzle 14 and the wiping member 52 are in contact with each other by the action of the second pressing member, and the side surface 39 of the processing liquid supply nozzle 14 is cleaned by the wiping member 52. In this state, the second pushing The pressing member 7 7 is pushed down by the processing liquid supply nozzle μ. Then, as described above, since the head of the second pressing member 77 also forms a curved shape with a chamfered arc shape, the second pressing member can be relaxed. 77 The impact when contacting the processing liquid supply nozzle 14. At this time, as described above, since the second pushing is supported so as to be movable to the γ direction and the ζ direction, the member 77 'even the first cleaning mechanism 57 and the processing liquid supply nozzle There is an error in the position accuracy of j 4, but it can still reliably abut the shape. It is formed in the recessed portion 78 of the second pressing member 77 and the side surface 39 of the processing liquid supply nozzle 14. Therefore, the side surface 39 of the processing liquid supply nozzle 14 and the wiping member 52 can be reliably abutted, and the wiping structure 87695 -20- 200414277 Piece 52 cleans the side 39 of the processing liquid supply 14 surely. Move the wiper 45 further, the processing liquid supply nozzle 14 and the first! The cleaning mechanism 57 mu & 8113⑷ in the state shown by the 'processing liquid supply nozzle 14' The surface 38 and the wiping member 52 abut again by the action of the first pressing member 76 ^ of the transfer roller, and the cleaning treatment liquid supply nozzle 14 <lip surface 38 is called by the wiping member. In this state, the winding The i-th pressing member 76 on the side of the drum 54 is pushed down by the processing liquid supply nozzle 14. Then, since the head of the} -th pressing member 76 is chamfered into a f-curved shape of a round fox, it can be relaxed. The impact when the first pressing member 76 is in contact with the processing liquid supply nozzle 14. When cleaning the processing liquid supply nozzle "of the above-mentioned cleaning mechanism 57", the cleaning liquid is supplied from the cleaning liquid supply nozzle 55 to the wiper when necessary. Element 52: and the first cleaning above When the processing liquid supply nozzle 14 of the structure 57 is rotated at a low speed by a force motor 7j, the winding roller 54 is rotated at a low speed. Therefore, the lip ㈣ and the side surface 39 A of the processing liquid supply nozzle 14 can be cleaned cleanly by a new wiping member 52. 'The wiping member 52 which has been used for cleaning by the first cleaning mechanism 57 is used as described above, and is used for pre-cleaning of the second cleaning mechanism 58. Then, the length direction of the slit-shaped discharge port 34 in the processing liquid supply nozzle 14 is used. In the case of a long length of yttrium, the lip surface 38 and the side surface 39 of the treatment liquid supply nozzle 14 can be cleaned without rotating the winding drum 54. With the above operation, the wiping portion 45 is indicated by a hypothetical line in FIG. When the position of the right end of the scanning stroke is moved to the position of the left end of the moving stroke shown by a solid line in FIG. 5, the wiper 45 and the bracket 42 are simultaneously moved to the right shown in FIG. 5 by the drive of the motor 44. This direction is parallel to the slit-shaped discharge port 34 in the processing liquid supply nozzle ", and is opposite to the winding direction of the wiping member 52 of the winding drum 5487695 • 21- 200414277. 泫 The wiping member 52 faces to the left During the side movement, the lip surface 38 and the side surface 39 of the treatment liquid supply nozzle 14 are cleaned again by the wiping member 52 due to the action of the second cleaning mechanism 57. However, when the wiping member 52 is moved to the left, the second cleaning is performed. The lifting guide roller 88 of the mechanism 58 is arranged at the retreat position indicated by the hypothetical line in FIG. 6. Therefore, the lip surface 38 and the side surface 39 of the cleaning liquid supply nozzle 14 after cleaning will not be the same as those used for pre-cleaning. The wiping member 52 abuts and contaminates. When the wiping member 52 moves to the left, the rack member 65 of the rotation restricting mechanism 67 shown in FIG. 9 is disposed at the restricted position to restrict the rotation of the transfer roller 53. Therefore, When the wiping member 52 is moved to the left, even when the wiping member 52 is pulled due to the frictional force between the wiping member "and the processing liquid supply nozzle 14, the transfer roller 53 is not reversed. Then, when the 'swipe portion 45 moves to the position at the right end of the movement stroke indicated by the hypothetical line in FIG. 5, the cleaning operation of the processing liquid supply nozzle 14 is completed. However, the wiping unit 45 may be repeatedly moved back and forth to clean the processing liquid supply nozzle 14. Then, in the above embodiment, the case where the nozzle cleaning device 18 related to the present invention is applied to a substrate processing device has been described. The substrate processing device applies a photoresist to the substrate w through the processing liquid supply nozzle 14. The substrate W is rotated by the rotating chuck 13, but the nozzle cleaning device related to the present invention can also be applied to the type in which the substrate W is not rotated after the processing liquid is supplied to the substrate w through the processing liquid supply nozzle 14. Substrate processing device. Moreover, in the above-mentioned implementation form, the case where a plurality of first pressing members 76 are provided in the cleaning mechanism 57 has been described, but a plurality of second pressing members may be provided in the cleaning mechanism 57 77. 87695 -22- 200414277 / Please apply for each month of items 丨 2, 2, 12, 13 and 14 because the cleaning solution supply nozzle is cleaned by the cleaning mechanism in the wiping member This area can be used for pre-cleaning by the second cleaning mechanism = liquid supply nozzle '. Therefore, the consumption of the wiping member can be reduced, and the processing liquid supply nozzle can be cleaned with certainty. The invention in claim 3 of the patent claim, since the second cleaning mechanism moves only the wiping part to the same direction as the winding direction of the wiping member of the winding drum, and abuts the wiping member against the processing liquid supply nozzle, so it can prevent It has been used for cleaning and wiping members in advance to abut the processing liquid supply nozzle again and contaminate the processing liquid supply nozzle. " The invention of claim 4 in the scope of the patent application, because the rotating mechanism rotates the roller when the wiper moves to the same direction as the winding direction of the winding wiper member, the processing liquid supply nozzle can be cleaned by the new wiper member. . The invention claimed in item 5 of the patent scope is provided with a rotation restricting mechanism for restricting the rotation of the winding drum when the wiping part moves to the opposite direction to the winding direction of the roll, and: ^ roll, so the wiping member moves. In this case, it is possible to reliably prevent the transfer roller from being reversed due to the friction between the wiping member and the processing liquid supply nozzle. The invention in the 6th aspect of the patent application is because the cleaning mechanism includes a pressing member that abuts the wiper member against the lip surface of the processing liquid supply nozzle, and a wiper member that abuts the side of the processing liquid supply nozzle. The second pressing member can reliably clean the lip surface and the side surface of the processing liquid supply nozzle. Since the invention of claim 7 in the scope of the patent application includes a plurality of first pressing members or second pressing members, the lip surface or side surface of the treatment liquid supply nozzle can be cleaned more reliably. 87695 -23- 200414277 _ Please patent No. 8 invention of the invention. Due to the shape of the concave portion on the side of the liquid supply nozzle of the second pressing member, the supporting mechanism of the second pressing member supports the movement of the second pressing member. The accuracy of the position of the physical fluid supply nozzle is in conflict with the mechanism and the place ... When it is poor, it can still abut against the concave portion of the second pressing member and the side of the processing fluid supply nozzle. " The invention in the ninth scope of the patent, since the support mechanism is composed of a plurality of springs which are second pushing members that can move to the γ direction and the ζ direction when the displacement force universal of the wiping part is taken as the X direction, Even if there is an error in the positional accuracy of the cleaning mechanism and the processing liquid supply nozzle, the recess formed on the second pressing member and the side of the processing liquid supply nozzle can be reliably abutted. _Please invent the invention in item 1 (). Since the second pressing member has a guide portion that guides both ends of the wiping member rolled out by the take-up roller, it can prevent the wiping member from coming from the upper part of the second pressing member. Out of position. The invention claimed in item U of the patent scope includes a cleaning liquid supply mechanism for supplying the cleaning liquid to the wiping member, so that the processing liquid supply nozzle can be reliably cleaned by the cleaning liquid. [Brief description of the drawings] FIG. 1 is a schematic diagram of a substrate processing apparatus of a nozzle cleaning apparatus related to the present invention. Fig. 2 is an explanatory view showing a photoresist supply operation of the processing liquid supply nozzle 14 in a model manner. FIG. 3 is an enlarged view of a lower end portion of the processing liquid supply nozzle 14. Fig. 4 is an explanatory view showing a coating operation of applying a photoresist to a substrate ▽ by a substrate processing apparatus. 87695 -24- 200414277 FIG. 5 is a side view showing the nozzle cleaning device 18 and the standby cylinder 36 related to the present invention simultaneously. FIG. 6 is a front view of the wiping portion 45. FIG. 7 is a side view of the wiping portion 45. FIG. 8 is a plan view of the wiping portion 45. FIG. 9 is a front view of the rotation restricting mechanism 67 and the gear 62 simultaneously. FIG. 10 is an explanatory diagram showing the configuration of the first cleaning mechanism 57. FIG. 11 is a perspective view showing a main part of the first cleaning mechanism 57. FIG. 12 is an explanatory diagram showing the relationship between the second pressing member blade and the wiping member 52. FIG. Fig. 3 is a model diagram of the cleaning operation of the processing liquid supply nozzle µ of the cleaning mechanism 57 of the? [Illustration of Symbols in the Drawings] 11, 44, 73, 12, 12, 61, 71, 74 13 14 15 16 17 18 21 22 23 Motor shaft rotation chuck processing liquid supply nozzle nozzle moving mechanism photoresist supply mechanism photoresist capture cup Pieces Nozzle cleaning device Moving guide Moving frame Nozzle support arm 87695 -25- 200414277 24 Pressure tank 25 Photoresistor slot 27 Pressure piping 28 Three-way valve 29 Regulator 31 Photoresistance supply pipe 33 On-off valve 34 Ejection outlet 35 Photoresist 36 Stand-by tube 37, 66 &90; Cylinder 38 Lip surface 39 Side 41 Rail 42 Bracket 43 Timing belt 45 Wiping part 5 Bulb 75 Housing 52 Wiping member 53 Conveying roller, unwinding roller 54 Winding roller 55 ^ 56 Cleaning liquid supply nozzle 57 Brother 1 cleaning mechanism 58 2nd cleaning mechanism 95 -26- 200414277 62 ^ 63 gear 64 tension generating portion 65 rack member 67 rotation restricting mechanism 72 coupler 76 first pressing member 77 second pressing Member 78 Concave portion 79 Guide portion 80 Support plate 81, 84 Convex portion 82, 83, 86 Spring 85 Moving member 87 Fixed guide roller 88 Lifting guide W substrate carrier drum 89 87695-27--