JP3503512B2 - Glass substrate cleaning apparatus and cleaning method - Google Patents
Glass substrate cleaning apparatus and cleaning methodInfo
- Publication number
- JP3503512B2 JP3503512B2 JP03835399A JP3835399A JP3503512B2 JP 3503512 B2 JP3503512 B2 JP 3503512B2 JP 03835399 A JP03835399 A JP 03835399A JP 3835399 A JP3835399 A JP 3835399A JP 3503512 B2 JP3503512 B2 JP 3503512B2
- Authority
- JP
- Japan
- Prior art keywords
- pressing
- glass substrate
- tape
- cleaning
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 title claims description 80
- 239000000758 substrate Substances 0.000 title claims description 60
- 238000004140 cleaning Methods 0.000 title claims description 57
- 238000000034 method Methods 0.000 title claims description 25
- 238000003825 pressing Methods 0.000 claims description 66
- 238000010586 diagram Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶パネルなどの
ガラス基板の縁部をクリーニングするガラス基板のクリ
ーニング装置およびクリーニング方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate cleaning apparatus and a cleaning method for cleaning an edge of a glass substrate such as a liquid crystal panel.
【０００２】[0002]
【従来の技術】液晶パネルなどのガラス基板の製造工程
では、ガラス基板の縁部に形成された電極部にサブ基板
を接続することが行われる。この接続の方法として異方
性導電材によってガラス基板の電極部にサブ基板を接合
する方法が用いられる。この接合に先立って、ガラス基
板の縁部の表面に付着した異物を除去するためのクリー
ニングが行われる。このクリーニングは接着剤の接合性
の向上や、電極部に設けられた認識マークの異物による
誤認識を防止することなどを目的として行われるもので
ある。2. Description of the Related Art In a process of manufacturing a glass substrate such as a liquid crystal panel, a sub substrate is connected to an electrode portion formed on an edge portion of the glass substrate. As a method of this connection, a method of joining the sub-board to the electrode part of the glass board by an anisotropic conductive material is used. Prior to this bonding, cleaning is performed to remove foreign matter attached to the surface of the edge of the glass substrate. This cleaning is performed for the purpose of improving the bondability of the adhesive and preventing erroneous recognition of the recognition mark provided on the electrode portion due to foreign matter.
【０００３】以下、従来のガラス基板のクリーニング装
置について図面を参照して説明する。図５は従来のガラ
ス基板のクリーニング装置の部分断面図である。図５に
おいて、ガラス基板１は上下２枚のガラス板１Ａ，１Ｂ
より成り、ガラス板１Ａの縁部はガラス板１Ｂの外縁よ
り張り出しており、この縁部の表面にはサブ基板との接
続用の電極が形成されている。この電極部にサブ基板を
異方性導電材によって接合するに先立って、縁部のクリ
ーニングが行われる。このクリーニングは、クリーニン
グローラ２Ａ，２Ｂとガイドローラ３にクリーニング用
のワイパーテープ４を周回させ、クリーニングローラ２
Ａ，２Ｂの間に縁部を位置させてクリーニングローラ２
Ａ，２Ｂをクリーニング対象部位である縁部の表裏両面
に押し付けることにより行っていた。A conventional glass substrate cleaning apparatus will be described below with reference to the drawings. FIG. 5 is a partial sectional view of a conventional glass substrate cleaning device. In FIG. 5, the glass substrate 1 is composed of two upper and lower glass plates 1A and 1B.
The glass plate 1A has an edge portion protruding from the outer edge of the glass plate 1B, and an electrode for connecting to the sub-board is formed on the surface of the edge portion. Prior to joining the sub-substrate to the electrode portion with the anisotropic conductive material, the edge portion is cleaned. In this cleaning, the cleaning rollers 2A and 2B and the guide roller 3 are wound around the wiper tape 4 for cleaning, and the cleaning roller 2
The cleaning roller 2 is provided with an edge portion between A and 2B.
This is done by pressing A and 2B on both the front and back surfaces of the edge portion, which is the portion to be cleaned.
【０００４】[0004]
【発明が解決しようとする課題】表面のクリーニング
は、縁部をクリーニングローラ２Ａ，２Ｂに対して相対
的にスライドさせることにより、ワイパーテープ４によ
ってガラス板１Ａの表裏面の付着物を拭き取るものであ
る。しかしながら従来のようにクリーニングローラを用
いる方法では、クリーニングローラの外周がＲ形状であ
ることから、ガラス板１Ｂの端面付近の段差部近傍には
ワイパーテープ４を押し付けることができず、この段差
近傍が充分にクリーニングされないままとなり、必要な
クリーニング品質を確保することができないという問題
点があった。To clean the surface, the edge of the glass plate 1A is slid relative to the cleaning rollers 2A and 2B to wipe off the deposits on the front and back surfaces of the glass plate 1A. is there. However, in the conventional method using the cleaning roller, since the outer periphery of the cleaning roller is R-shaped, the wiper tape 4 cannot be pressed near the step portion near the end face of the glass plate 1B, and the vicinity of this step is There is a problem in that the cleaning cannot be sufficiently performed and the required cleaning quality cannot be ensured.
【０００５】 そこで本発明は、クリーニング品質を確
保することができるガラス基板のクリーニング装置およ
びクリーニング方法を提供することを目的とする。[0005] The present invention, Oyo cleaning apparatus for a glass substrate which can ensure the cleaning quality
And cleaning method .
【０００６】[0006]
【課題を解決するための手段】本発明のガラス基板のク
リーニング装置は、ガラス基板の縁部の表面付着物をワ
イパーテープによって除去するガラス基板のクリーニン
グ装置であって、前記縁部の表裏両面に上下２つの押し
付け部材により前記ワイパーテープを押し付けるテープ
押し付け手段と、このテープ押し付け手段を前記ガラス
基板に対して相対的に移動させ位置決めする位置決め手
段と、前記テープ押し付け手段に対してワイパーテープ
を送給するテープ送給手段と、前記押し付け部材の間に
配設され前記押し付け部材に対して送給されたワイパー
テープをガイドして前記押し付け部材のガラス基板に対
する押し付け面に位置させるガイド部材と、このガイド
部材を前記押し付け部材の間で移動させる移動手段とを
備えた。The glass substrate cleaning apparatus of the present invention is a glass substrate cleaning apparatus for removing surface deposits on the edge of a glass substrate with a wiper tape, and is provided on both sides of the edge. With respect to the tape pressing means, a tape pressing means for pressing the wiper tape by two upper and lower pressing members, a positioning means for relatively moving and positioning the tape pressing means with respect to the glass substrate. A tape feeding means for feeding a wiper tape and a guide which is arranged between the pressing member and guides the wiper tape fed to the pressing member to position it on the pressing surface of the pressing member against the glass substrate. A member and a moving means for moving the guide member between the pressing members are provided.
【０００７】本発明によれば、ワイパーテープをガラス
基板の縁部に押し付ける押し付け部材の間に配設される
ガイド部材を移動させる移動手段を設けることにより、
押し付け部材の形状を段差部に応じたエッジ形状とした
場合においても、ワイパーテープ送り時にエッジにワイ
パーテープが引掛ることがない。According to the present invention, by providing the moving means for moving the guide member arranged between the pressing members for pressing the wiper tape against the edge of the glass substrate,
Even when the pressing member has an edge shape corresponding to the stepped portion, the wiper tape does not catch on the edge when the wiper tape is fed.
【０００８】[0008]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１は本発明の一実施の形態のガラ
ス基板のクリーニング装置の側面図、図２は同ガラス基
板のクリーニング装置の部分平面図、図３（ａ），
（ｂ），（ｃ）、図４（ａ），（ｂ），（ｃ）は同ガラ
ス基板のクリーニング方法の工程説明図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a glass substrate cleaning device according to an embodiment of the present invention, FIG. 2 is a partial plan view of the glass substrate cleaning device, and FIG.
4B, 4C, and 4A, 4B, and 4C are process explanatory views of the method for cleaning the glass substrate.
【０００９】まず図１、図２を参照してガラス基板のク
リーニング装置について説明する。図１において、上下
２枚のガラス板１Ａ，１Ｂより成るガラス基板１は保持
部６上に載置されている。ガラス板１Ａ，１Ｂの表面に
は保護膜５が形成されている。ガラス板１Ａの縁部はガ
ラス板１Ｂの縁部より張り出しており、ガラス板１Ａの
縁部の表面にはサブ基板との接続用の電極が形成されて
いる。この電極が形成された縁部はサブ基板との接続に
先立って表面付着物を除去するためのクリーニングが行
われる。ガラス基板１を保持する保持部６は、駆動部７
によって水平方向に移動し、これによりガラス基板１は
位置決めされる。First, a glass substrate cleaning device will be described with reference to FIGS. In FIG. 1, a glass substrate 1 composed of two upper and lower glass plates 1A and 1B is placed on a holder 6. A protective film 5 is formed on the surfaces of the glass plates 1A and 1B. The edge of the glass plate 1A projects from the edge of the glass plate 1B, and an electrode for connecting to the sub-board is formed on the surface of the edge of the glass plate 1A. The edge portion on which the electrode is formed is cleaned to remove surface deposits prior to connection with the sub-board. The holding unit 6 that holds the glass substrate 1 is a driving unit 7
Is moved in the horizontal direction, and the glass substrate 1 is positioned thereby.
【００１０】ガラス基板１の側方にはクリーニングユニ
ット１０が配設されている。クリーニングユニット１０
はチャック動作を行う２つのチャック爪１１ａを備えた
チャック機構１１を有しており、チャック爪１１ａには
押し付け部材１２が装着されている。チャック爪１１ａ
は先端部に設けられた平面部１２ａを対向させる向きに
装着されており、平面部１２ａの先端はエッジ形状の突
部１２ｂとなっている。押し付け部材１２には、上方に
配設されたテープ送給手段であるワイパーテープの供給
リール１６Ａよりガイドローラ１４，１５を介してワイ
パーテープ４が送給される。A cleaning unit 10 is arranged on the side of the glass substrate 1. Cleaning unit 10
Has a chuck mechanism 11 having two chuck claws 11a for performing a chucking operation, and a pressing member 12 is attached to the chuck claws 11a. Chuck claw 11a
Is mounted in such a direction that the flat surface portion 12a provided at the front end portion faces each other, and the front end of the flat surface portion 12a is an edge-shaped protruding portion 12b. The wiper tape 4 is fed to the pressing member 12 from the wiper tape supply reel 16A, which is a tape feeding means arranged above, via the guide rollers 14 and 15.
【００１１】ワイパーテープ４は、上側の押し付け部材
１２の外周に沿って送られ、押し付け部材１２の間に配
設されたガイド１３を周回して下側の押し付け部材１２
の外周に沿って導出される。この後、ワイパーテープ４
はガイドローラ１４，１５を介して回収リール１６Ｂに
回収される。押し付け部材１２の上方には洗浄剤の吐出
ヘッド１９が配設されており、吐出ヘッド１９のノズル
２０からはエタノールなどの洗浄用の液体がワイパーテ
ープ４に対して滴下される。The wiper tape 4 is fed along the outer periphery of the upper pressing member 12 and circulates around a guide 13 arranged between the pressing members 12 to lower the pressing member 12.
Is derived along the outer circumference of. After this, wiper tape 4
Is collected by the collecting reel 16B via the guide rollers 14 and 15. A cleaning agent discharge head 19 is disposed above the pressing member 12, and a cleaning liquid such as ethanol is dropped from the nozzle 20 of the discharge head 19 onto the wiper tape 4.
【００１２】駆動部７を駆動することにより、ガラス基
板１は水平移動しクリーニング対象部位であるガラス板
１Ａの縁部を押し付け部材１２の間に位置決めすること
ができる。この状態でチャック機構１１を駆動すること
により押し付け部材１２は閉じ、平面部１２ａによって
ワイパーテープ４をガラス板１Ａの縁部の表裏両面に押
し付ける。すなわちチャック機構１１および押し付け部
材１２はテープ押し付け手段となっている。また駆動部
７はこのテープ押し付け手段をガラス基板１に対して相
対的に位置決めする位置決め手段となっている。By driving the driving unit 7, the glass substrate 1 is horizontally moved, and the edge portion of the glass plate 1A, which is the portion to be cleaned, can be positioned between the pressing members 12. In this state, the pressing member 12 is closed by driving the chuck mechanism 11, and the flat portion 12a presses the wiper tape 4 on both the front and back surfaces of the edge of the glass plate 1A. That is, the chuck mechanism 11 and the pressing member 12 are tape pressing means. The drive unit 7 serves as a positioning unit that positions the tape pressing unit relative to the glass substrate 1.
【００１３】押し付け部材１２の間に配設されたガイド
１３は、図２に示すようにシリンダ１７のロッド１７ａ
に固着されたブロック１８に装着されている。シリンダ
１７のロッド１７ａを突没させることにより、ガイド１
３は上下２つの押し付け部材１２の間で水平移動する。
ロッド１７ａが没入した状態では図１に示すようにガイ
ド１３はワイパーテープ４をガイドして押し付け部材１
２の平面部１２ａ、すなわちガラス板１Ａに対する押し
付け面に位置させる。ロッド１７ａが突出した状態で
は、ガイド１３は押し付け部材１２の先端部より外に位
置する。したがってシリンダ１７はガイド１３を移動さ
せる移動手段となっている。The guide 13 disposed between the pressing members 12 has a rod 17a of a cylinder 17 as shown in FIG.
It is attached to the block 18 fixed to the. The rod 17a of the cylinder 17 is projected and retracted to guide the guide 1.
3 horizontally moves between the upper and lower pressing members 12.
When the rod 17a is retracted, as shown in FIG. 1, the guide 13 guides the wiper tape 4 to press the pressing member 1.
The second flat portion 12a, that is, the pressing surface against the glass plate 1A is positioned. In the state where the rod 17a projects, the guide 13 is located outside the tip of the pressing member 12. Therefore, the cylinder 17 serves as a moving unit that moves the guide 13.
【００１４】このガラス基板のクリーニング装置は上記
の様に構成され、以下動作について図３、図４を参照し
て説明する。まず図３（ａ）において、保持部６上にガ
ラス基板１を載置する。このとき、クリーニングユニッ
ト１０の押し付け部材１２に沿ってワイパーテープ４が
送給され、ワイパーテープ４はガイド１３にガイドされ
て押し付け部材１２の平面部１２ａに沿って位置してい
る。This glass substrate cleaning device is constructed as described above, and its operation will be described below with reference to FIGS. 3 and 4. First, in FIG. 3A, the glass substrate 1 is placed on the holder 6. At this time, the wiper tape 4 is fed along the pressing member 12 of the cleaning unit 10, and the wiper tape 4 is guided by the guide 13 and is positioned along the flat surface portion 12 a of the pressing member 12.
【００１５】次いで駆動部（図外）を駆動して保持部６
上のガラス基板１を移動させ、クリーニング対象部位で
あるガラス板１Ａの縁部を押し付け部材１２の間に位置
決めする。そしてチャック機構１１を駆動することによ
り、押し付け部材１２によってワイパーテープ４をガラ
ス板１Ａの縁部の表裏両面に押し付ける。この状態でガ
ラス基板１を水平移動させることにより、ガラス板１Ａ
の縁部の表面付着物はワイパーテープ４によって除去さ
れ、クリーニングが行われる。このとき、押し付け部材
１２の押し当て面である平面部１２ａの先端はエッジ形
状の突部１２ｂとなっているため、ガラス板１Ａ上のガ
ラス板１Ｂとの段差部までワイパーテープ４を押し当て
ることができ、従来のローラを用いてワイパーテープを
押し付ける方法と比較して、未クリーニング部分を生じ
ることなく良好なクリーニングを行うことができる。Next, the driving unit (not shown) is driven to hold the holding unit 6.
The upper glass substrate 1 is moved to position the edge of the glass plate 1A, which is the cleaning target portion, between the pressing members 12. Then, by driving the chuck mechanism 11, the pressing member 12 presses the wiper tape 4 against both the front and back surfaces of the edge of the glass plate 1A. By horizontally moving the glass substrate 1 in this state, the glass plate 1A
The surface deposits on the edges of the are removed by the wiper tape 4 and cleaning is performed. At this time, since the tip end of the flat surface portion 12a, which is the pressing surface of the pressing member 12, is the edge-shaped protrusion 12b, the wiper tape 4 should be pressed against the step portion between the glass plate 1A and the glass plate 1B. As compared with the conventional method of pressing the wiper tape using the roller, good cleaning can be performed without producing an uncleaned portion.
【００１６】この後、当該部分のクリーニングが完了す
ると、図４（ａ）に示すように押し付け部材１２を開
き、ワイパーテープ４の押し当て状態を解除する。次い
で、図４（ｂ）に示すようにガラス基板１を移動させて
ガラス基板１Ａを押し付け部材１２の外部に位置させる
とともに、シリンダ１７のロッド１７ａ（図２）を突出
させる。この結果、図４（ｃ）に示すようにガイド１３
は押し付け部材１２の外側に位置する。そしてこの状態
で回収リール１６Ｂを駆動してワイパーテープ４を所定
ピッチだけ巻き取る。これにより前述のクリーニング動
作によって汚れたワイパーテープ４が回収されるととも
に、新しい未使用のワイパーテープ４が送給される。After that, when the cleaning of the portion is completed, the pressing member 12 is opened as shown in FIG. 4 (a) to release the pressing state of the wiper tape 4. Next, as shown in FIG. 4B, the glass substrate 1 is moved to position the glass substrate 1A outside the pressing member 12, and the rod 17a (FIG. 2) of the cylinder 17 is projected. As a result, as shown in FIG.
Is located outside the pressing member 12. Then, in this state, the recovery reel 16B is driven to wind the wiper tape 4 by a predetermined pitch. As a result, the dirty wiper tape 4 is collected by the above-described cleaning operation, and a new unused wiper tape 4 is fed.
【００１７】このワイパーテープ４の送給動作におい
て、ワイパーテープ４は押し付け部材１２の外側に沿っ
て送られるのみであり、ワイパーテープ４が押し付け部
材１２の先端部を周回する必要がない。したがって先端
部の突部１２ｂを鋭角的に周回する場合に生じるワイパ
ーテープ４への損傷が発生することなく、常に安定して
ワイパーテープ４を送給することができる。In the feeding operation of the wiper tape 4, the wiper tape 4 is only fed along the outside of the pressing member 12, and the wiper tape 4 does not have to go around the tip of the pressing member 12. Therefore, the wiper tape 4 can always be stably fed without causing damage to the wiper tape 4 that occurs when the protrusion 12b at the tip portion orbits at an acute angle.
【００１８】[0018]
【発明の効果】本発明によれば、ワイパーテープをガラ
ス基板の縁部に押し付ける押し付け部材の間に配設され
るガイド部材を移動させる移動手段を設けたので、押し
付け部材の形状をガラス基板の段差部に応じたエッジ形
状とした場合においても、ワイパーテープ送り時にエッ
ジにワイパーテープが引掛ることがない。したがって、
常に安定してワイパーテープを送りながら未クリーニン
グ部の少ない良好なクリーニングを行うことができる。According to the present invention, since the moving means for moving the guide member arranged between the pressing members for pressing the wiper tape against the edge of the glass substrate is provided, the shape of the pressing member is changed to that of the glass substrate. Even when the edge shape is formed according to the stepped portion, the wiper tape does not catch on the edge when the wiper tape is fed. Therefore,
Good cleaning can be performed with few uncleaned portions while constantly feeding the wiper tape.
【図１】本発明の一実施の形態のガラス基板のクリーニ
ング装置の側面図FIG. 1 is a side view of a glass substrate cleaning device according to an embodiment of the present invention.
【図２】本発明の一実施の形態のガラス基板のクリーニ
ング装置の部分平面図FIG. 2 is a partial plan view of a glass substrate cleaning device according to an embodiment of the present invention.
【図３】（ａ）本発明の一実施の形態のガラス基板のク
リーニング方法の工程説明図
（ｂ）本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図
（ｃ）本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図FIG. 3A is a process explanatory diagram of a glass substrate cleaning method according to an embodiment of the present invention. FIG. 3B is a process explanatory diagram of a glass substrate cleaning method according to an embodiment of the present invention. Process explanatory drawing of the glass substrate cleaning method of one embodiment
【図４】（ａ）本発明の一実施の形態のガラス基板のク
リーニング方法の工程説明図
（ｂ）本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図
（ｃ）本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図FIG. 4A is a process explanatory diagram of a glass substrate cleaning method according to an embodiment of the present invention. FIG. 4B is a process explanatory diagram of a glass substrate cleaning method according to an embodiment of the present invention. Process explanatory drawing of the glass substrate cleaning method of one embodiment
【図５】従来のガラス基板のクリーニング装置の部分断
面図FIG. 5 is a partial sectional view of a conventional glass substrate cleaning device.
１ ガラス基板 ４ ワイパーテープ ７ 駆動部 １０ クリーニングユニット １１ チャック機構 １２ 押し付け部材 １３ ガイド １６Ａ 供給リール １７ シリンダ 1 glass substrate 4 wiper tape 7 Drive 10 Cleaning unit 11 Chuck mechanism 12 Pressing member 13 Guide 16A supply reel 17 cylinders
Claims (4)
テープによって除去するガラス基板のクリーニング装置
であって、前記縁部の表裏両面に上下２つの押し付け部
材により前記ワイパーテープを押し付けるテープ押し付
け手段と、このテープ押し付け手段を前記ガラス基板に
対して相対的に移動させ位置決めする位置決め手段と、
前記テープ押し付け手段に対してワイパーテープを送給
するテープ送給手段と、前記押し付け部材の間に配設さ
れ前記押し付け部材に対して送給されたワイパーテープ
をガイドして前記押し付け部材のガラス基板に対する押
し付け面に位置させるガイド部材と、このガイド部材を
前記押し付け部材の間で移動させる移動手段とを備えた
ことを特徴とするガラス基板のクリーニング装置。 1. A glass substrate cleaning device for removing surface deposits on an edge portion of a glass substrate by a wiper tape, wherein tape pressing means presses the wiper tape on both front and back surfaces of the edge portion by two pressing members. Positioning means for moving and positioning the tape pressing means relative to the glass substrate,
A tape feeding unit that feeds a wiper tape to the tape pressing unit, and a glass substrate of the pressing member that is disposed between the pressing members and guides the wiper tape that is fed to the pressing member. An apparatus for cleaning a glass substrate, comprising: a guide member positioned on a pressing surface against the pressing member; and a moving unit that moves the guide member between the pressing members.
付けられる平面部と、この平面部の先端にあってガラスThe flat part to be attached and the glass at the tip of this flat part
基板の段差部までワイパーテープを押し当てるエッジ形Edge type that presses the wiper tape to the stepped part of the board
状の突部を有することを特徴とする請求項１記載のガラ2. The glass according to claim 1, characterized in that it has a protrusion.
ス基板のクリーニング装置。Substrate cleaning device.
基板に対する押し付け面に位置させ、また前記押し付けLocated on the pressing surface against the substrate,
部材の先端部より外に位置させることを特徴とする請求It is characterized in that it is located outside the tip of the member.
項１又は２記載のガラス基板のクリーニング装置。Item 3. A glass substrate cleaning device according to item 1 or 2.
基板のクリーニング装置を用いるガラス基板のクリーニGlass substrate cleaner using substrate cleaning device
ング方法であって、Method, 押し付け部材に沿ってワイパーテープを送給し、ワイパFeed the wiper tape along the pressing member and
ーテープをガイド部材にガイドさせて押し付け部材の平ー Guide the tape to the guide member and
面部に沿って位置させる工程と、Positioning along the surface, ガラス基板の縁部を上下２つの押し付け部材の間に位置Position the edge of the glass substrate between the upper and lower pressing members
決めし、押し付け部材によってワイパーテープをガラスThe wiper tape to the glass
基板の縁部の表裏両面に押し付ける工程と、The process of pressing both sides of the board edge, 位置決め手段により押し付け手段をガラス基板に対してThe pressing means is pressed against the glass substrate by the positioning means.
相対的に水平移動させることにより縁部の表面付着物をRelative horizontal movement will remove surface deposits on the edges.
ワイパーテープによって除去してクリーニングする工程Process of removing and cleaning with wiper tape
と、When, クリーニングが完了したならば、押し付け部材を開いてWhen cleaning is completed, open the pressing member and
ワイパーテープの押し当て状態を解除する工程と、A process of releasing the pressing state of the wiper tape, ガラス基板を押し付け部材の外部に位置させるとともWhen the glass substrate is placed outside the pressing member,
に、移動手段によりガイド部材を押し付け部材の外側にThen, the guide member is pressed by the moving means to the outside of the member.
位置させ、その状態でワイパーテープを巻き取る工程Position and wind the wiper tape in that state
と、When, を含むことを特徴とするガラス基板のクリーニング方Cleaning method for glass substrate characterized by including
法。Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03835399A JP3503512B2 (en) | 1999-02-17 | 1999-02-17 | Glass substrate cleaning apparatus and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03835399A JP3503512B2 (en) | 1999-02-17 | 1999-02-17 | Glass substrate cleaning apparatus and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000237699A JP2000237699A (en) | 2000-09-05 |
| JP3503512B2 true JP3503512B2 (en) | 2004-03-08 |
Family
ID=12522928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03835399A Expired - Fee Related JP3503512B2 (en) | 1999-02-17 | 1999-02-17 | Glass substrate cleaning apparatus and cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3503512B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009136728A (en) * | 2007-12-04 | 2009-06-25 | Panasonic Corp | Substrate cleaning device, and substrate cleaning method |
| US8025737B2 (en) | 2008-10-31 | 2011-09-27 | Panasonic Corporation | Substrate cleaning apparatus and method employed therein |
| CN102596434A (en) * | 2009-11-04 | 2012-07-18 | 夏普株式会社 | Wiping device and wiping method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6526947B2 (en) * | 2014-04-30 | 2019-06-05 | 株式会社半導体エネルギー研究所 | Wiping device and laminate manufacturing apparatus |
| JP6151303B2 (en) * | 2015-05-21 | 2017-06-21 | 日鉄住金ドラム株式会社 | Dirty wiper for drums |
-
1999
- 1999-02-17 JP JP03835399A patent/JP3503512B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009136728A (en) * | 2007-12-04 | 2009-06-25 | Panasonic Corp | Substrate cleaning device, and substrate cleaning method |
| US8025737B2 (en) | 2008-10-31 | 2011-09-27 | Panasonic Corporation | Substrate cleaning apparatus and method employed therein |
| CN102596434A (en) * | 2009-11-04 | 2012-07-18 | 夏普株式会社 | Wiping device and wiping method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000237699A (en) | 2000-09-05 |
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