JP2000237699A - Cleaning apparatus of glass substrate - Google Patents

Cleaning apparatus of glass substrate

Info

Publication number
JP2000237699A
JP2000237699A JP11038353A JP3835399A JP2000237699A JP 2000237699 A JP2000237699 A JP 2000237699A JP 11038353 A JP11038353 A JP 11038353A JP 3835399 A JP3835399 A JP 3835399A JP 2000237699 A JP2000237699 A JP 2000237699A
Authority
JP
Japan
Prior art keywords
glass substrate
pressing
tape
cleaning
wiper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11038353A
Other languages
Japanese (ja)
Other versions
JP3503512B2 (en
Inventor
秀彦 ▲高▼田
Hidehiko Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP03835399A priority Critical patent/JP3503512B2/en
Publication of JP2000237699A publication Critical patent/JP2000237699A/en
Application granted granted Critical
Publication of JP3503512B2 publication Critical patent/JP3503512B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning apparatus of glass substrate capable of ensuring cleaning quality. SOLUTION: The cleaning apparatus of glass substrates is adapted in order to remove adherend to the surface of the edge portion of a glass substrate 1 by a wiper tape 4. In this case, a guide 13 for guiding the wiper tape 4 to position the same on the pressing surfaces 12a of pressing members 12 is provided between the pressing members 12 for pressing the wiper taper 4 to both surfaces of a glass plate 1A to be moved between two upper and lower pressing members 12. By this constitution, even when the shapes of the pressing members 12 are formed into edge shapes provided with projected parts 12b corresponding to the stepped part of the glass substrate 1, the wiper tape 4 is not hooked with the projected parts 12b at a time of the feeding of the wiper tape 4 and the wiper tape 4 can be sent stably.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、液晶パネルなどの
ガラス基板の縁部をクリーニングするガラス基板のクリ
ーニング装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate cleaning apparatus for cleaning an edge of a glass substrate such as a liquid crystal panel.

【0002】[0002]

【従来の技術】液晶パネルなどのガラス基板の製造工程
では、ガラス基板の縁部に形成された電極部にサブ基板
を接続することが行われる。この接続の方法として異方
性導電材によってガラス基板の電極部にサブ基板を接合
する方法が用いられる。この接合に先立って、ガラス基
板の縁部の表面に付着した異物を除去するためのクリー
ニングが行われる。このクリーニングは接着剤の接合性
の向上や、電極部に設けられた認識マークの異物による
誤認識を防止することなどを目的として行われるもので
ある。
2. Description of the Related Art In a process of manufacturing a glass substrate such as a liquid crystal panel, a sub-substrate is connected to an electrode portion formed at an edge of the glass substrate. As a method of this connection, a method of joining a sub-substrate to an electrode portion of a glass substrate using an anisotropic conductive material is used. Prior to this bonding, cleaning is performed to remove foreign substances adhering to the surface of the edge of the glass substrate. This cleaning is performed for the purpose of improving the adhesiveness of the adhesive and preventing erroneous recognition of the recognition mark provided on the electrode portion due to foreign matter.

【0003】以下、従来のガラス基板のクリーニング装
置について図面を参照して説明する。図5は従来のガラ
ス基板のクリーニング装置の部分断面図である。図5に
おいて、ガラス基板1は上下2枚のガラス板1A,1B
より成り、ガラス板1Aの縁部はガラス板1Bの外縁よ
り張り出しており、この縁部の表面にはサブ基板との接
続用の電極が形成されている。この電極部にサブ基板を
異方性導電材によって接合するに先立って、縁部のクリ
ーニングが行われる。このクリーニングは、クリーニン
グローラ2A,2Bとガイドローラ3にクリーニング用
のワイパーテープ4を周回させ、クリーニングローラ2
A,2Bの間に縁部を位置させてクリーニングローラ2
A,2Bをクリーニング対象部位である縁部の表裏両面
に押し付けることにより行っていた。
Hereinafter, a conventional glass substrate cleaning apparatus will be described with reference to the drawings. FIG. 5 is a partial sectional view of a conventional glass substrate cleaning apparatus. In FIG. 5, a glass substrate 1 includes upper and lower glass plates 1A and 1B.
The edge of the glass plate 1A protrudes from the outer edge of the glass plate 1B, and an electrode for connection with the sub-substrate is formed on the surface of the edge. Prior to joining the sub-substrate to this electrode portion with an anisotropic conductive material, the edge portion is cleaned. In this cleaning, the cleaning rollers 2A and 2B and the guide roller 3 are caused to rotate the wiper tape 4 for cleaning.
A, 2B with the edge positioned between
A and 2B are pressed against both the front and back surfaces of the edge, which is the site to be cleaned.

【0004】[0004]

【発明が解決しようとする課題】表面のクリーニング
は、縁部をクリーニングローラ2A,2Bに対して相対
的にスライドさせることにより、ワイパーテープ4によ
ってガラス板1Aの表裏面の付着物を拭き取るものであ
る。しかしながら従来のようにクリーニングローラを用
いる方法では、クリーニングローラの外周がR形状であ
ることから、ガラス板1Bの端面付近の段差部近傍には
ワイパーテープ4を押し付けることができず、この段差
近傍が充分にクリーニングされないままとなり、必要な
クリーニング品質を確保することができないという問題
点があった。
The cleaning of the front surface is performed by wiping off the deposits on the front and back surfaces of the glass plate 1A with the wiper tape 4 by sliding the edges relatively to the cleaning rollers 2A and 2B. is there. However, in the conventional method using a cleaning roller, the wiper tape 4 cannot be pressed near the step near the end face of the glass plate 1B because the outer periphery of the cleaning roller is R-shaped. There is a problem that the cleaning is not sufficiently performed, and the required cleaning quality cannot be ensured.

【0005】そこで本発明は、クリーニング品質を確保
することができるガラス基板のクリーニング装置を提供
することを目的とする。
Accordingly, an object of the present invention is to provide a glass substrate cleaning apparatus capable of ensuring cleaning quality.

【0006】[0006]

【課題を解決するための手段】本発明のガラス基板のク
リーニング装置は、ガラス基板の縁部の表面付着物をワ
イパーテープによって除去するガラス基板のクリーニン
グ装置であって、前記縁部の表裏両面に押し付け部材に
より前記ワイパーテープを押し付けるテープ押し付け手
段と、このテープ押し付け手段を前記ガラス基板に対し
て相対的に移動させ位置決めする位置決め手段と、前記
テープ押し付け手段に対してワイパーテープを送給する
テープ送給手段と、前記押し付け部材の間に配設され前
記押し付け部材に対して送給されたワイパーテープをガ
イドして前記押し付け部材のガラス基板に対する押し付
け面に位置させるガイド部材と、このガイド部材を前記
押し付け部材の間で移動させる移動手段とを備えた。
A glass substrate cleaning apparatus according to the present invention is a glass substrate cleaning apparatus for removing adhering substances on the edge of a glass substrate with a wiper tape. A tape pressing means for pressing the wiper tape by a pressing member; a positioning means for moving and positioning the tape pressing means relative to the glass substrate; and a tape feeder for feeding the wiper tape to the tape pressing means. Feeding means, a guide member disposed between the pressing members and guiding a wiper tape fed to the pressing member to position the pressing member on a pressing surface of the pressing member against the glass substrate; and Moving means for moving between the pressing members.

【0007】本発明によれば、ワイパーテープをガラス
基板の縁部に押し付ける押し付け部材の間に配設される
ガイド部材を移動させる移動手段を設けることにより、
押し付け部材の形状を段差部に応じたエッジ形状とした
場合においても、ワイパーテープ送り時にエッジにワイ
パーテープが引掛ることがない。
According to the present invention, by providing a moving means for moving a guide member disposed between pressing members for pressing the wiper tape against the edge of the glass substrate,
Even when the shape of the pressing member is an edge shape corresponding to the step portion, the wiper tape does not catch on the edge when the wiper tape is fed.

【0008】[0008]

【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図1は本発明の一実施の形態のガラ
ス基板のクリーニング装置の側面図、図2は同ガラス基
板のクリーニング装置の部分平面図、図3(a),
(b),(c)、図4(a),(b),(c)は同ガラ
ス基板のクリーニング方法の工程説明図である。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view of a glass substrate cleaning apparatus according to an embodiment of the present invention, FIG. 2 is a partial plan view of the glass substrate cleaning apparatus, and FIGS.
4 (b), (c) and FIGS. 4 (a), (b), (c) are process explanatory views of the glass substrate cleaning method.

【0009】まず図1、図2を参照してガラス基板のク
リーニング装置について説明する。図1において、上下
2枚のガラス板1A,1Bより成るガラス基板1は保持
部6上に載置されている。ガラス板1A,1Bの表面に
は保護膜5が形成されている。ガラス板1Aの縁部はガ
ラス板1Bの縁部より張り出しており、ガラス板1Aの
縁部の表面にはサブ基板との接続用の電極が形成されて
いる。この電極が形成された縁部はサブ基板との接続に
先立って表面付着物を除去するためのクリーニングが行
われる。ガラス基板1を保持する保持部6は、駆動部7
によって水平方向に移動し、これによりガラス基板1は
位置決めされる。
First, a glass substrate cleaning apparatus will be described with reference to FIGS. In FIG. 1, a glass substrate 1 composed of two upper and lower glass plates 1A and 1B is placed on a holding unit 6. A protective film 5 is formed on the surfaces of the glass plates 1A and 1B. The edge of the glass plate 1A protrudes from the edge of the glass plate 1B, and an electrode for connection to the sub-substrate is formed on the surface of the edge of the glass plate 1A. Prior to connection with the sub-substrate, the edge on which the electrode is formed is subjected to cleaning for removing surface deposits. The holding unit 6 for holding the glass substrate 1 includes a driving unit 7
, The glass substrate 1 is positioned.

【0010】ガラス基板1の側方にはクリーニングユニ
ット10が配設されている。クリーニングユニット10
はチャック動作を行う2つのチャック爪11aを備えた
チャック機構11を有しており、チャック爪11aには
押し付け部材12が装着されている。チャック爪11a
は先端部に設けられた平面部12aを対向させる向きに
装着されており、平面部12aの先端はエッジ形状の突
部12bとなっている。押し付け部材12には、上方に
配設されたテープ送給手段であるワイパーテープの供給
リール16Aよりガイドローラ14,15を介してワイ
パーテープ4が送給される。
A cleaning unit 10 is provided on the side of the glass substrate 1. Cleaning unit 10
Has a chuck mechanism 11 having two chuck claws 11a for performing a chucking operation, and a pressing member 12 is mounted on the chuck claws 11a. Chuck claw 11a
Are mounted so as to face the flat portion 12a provided at the front end portion, and the front end of the flat portion 12a is an edge-shaped projection 12b. The wiper tape 4 is fed to the pressing member 12 via guide rollers 14 and 15 from a feed reel 16A of the wiper tape, which is a tape feeding means disposed above.

【0011】ワイパーテープ4は、上側の押し付け部材
12の外周に沿って送られ、押し付け部材12の間に配
設されたガイド13を周回して下側の押し付け部材12
の外周に沿って導出される。この後、ワイパーテープ4
はガイドローラ14,15を介して回収リール16Bに
回収される。押し付け部材12の上方には洗浄剤の吐出
ヘッド19が配設されており、吐出ヘッド19のノズル
20からはエタノールなどの洗浄用の液体がワイパーテ
ープ4に対して滴下される。
The wiper tape 4 is fed along the outer periphery of the upper pressing member 12 and circulates around a guide 13 disposed between the pressing members 12 to rotate around the lower pressing member 12.
Is derived along the outer circumference of. After this, wiper tape 4
Is collected on the collection reel 16B via the guide rollers 14 and 15. A cleaning agent ejection head 19 is disposed above the pressing member 12, and a cleaning liquid such as ethanol is dropped onto the wiper tape 4 from a nozzle 20 of the ejection head 19.

【0012】駆動部7を駆動することにより、ガラス基
板1は水平移動しクリーニング対象部位であるガラス板
1Aの縁部を押し付け部材12の間に位置決めすること
ができる。この状態でチャック機構11を駆動すること
により押し付け部材12は閉じ、平面部12aによって
ワイパーテープ4をガラス板1Aの縁部の表裏両面に押
し付ける。すなわちチャック機構11および押し付け部
材12はテープ押し付け手段となっている。また駆動部
7はこのテープ押し付け手段をガラス基板1に対して相
対的に位置決めする位置決め手段となっている。
By driving the driving unit 7, the glass substrate 1 moves horizontally and the edge of the glass plate 1 A, which is the cleaning target, can be positioned between the pressing members 12. By driving the chuck mechanism 11 in this state, the pressing member 12 is closed, and the wiper tape 4 is pressed against the front and back surfaces of the edge of the glass plate 1A by the flat portion 12a. That is, the chuck mechanism 11 and the pressing member 12 are tape pressing means. The drive section 7 is a positioning means for positioning the tape pressing means relative to the glass substrate 1.

【0013】押し付け部材12の間に配設されたガイド
13は、図2に示すようにシリンダ17のロッド17a
に固着されたブロック18に装着されている。シリンダ
17のロッド17aを突没させることにより、ガイド1
3は上下2つの押し付け部材12の間で水平移動する。
ロッド17aが没入した状態では図1に示すようにガイ
ド13はワイパーテープ4をガイドして押し付け部材1
2の平面部12a、すなわちガラス板1Aに対する押し
付け面に位置させる。ロッド17aが突出した状態で
は、ガイド13は押し付け部材12の先端部より外に位
置する。したがってシリンダ17はガイド13を移動さ
せる移動手段となっている。
The guide 13 disposed between the pressing members 12 is provided with a rod 17a of a cylinder 17 as shown in FIG.
Is mounted on a block 18 fixed to the block 18. By moving the rod 17a of the cylinder 17 up and down, the guide 1
3 moves horizontally between the upper and lower pressing members 12.
In a state where the rod 17a is immersed, the guide 13 guides the wiper tape 4 and pushes the pressing member 1 as shown in FIG.
The second flat portion 12a, that is, the pressing portion against the glass plate 1A. With the rod 17a protruding, the guide 13 is located outside the distal end of the pressing member 12. Therefore, the cylinder 17 is a moving means for moving the guide 13.

【0014】このガラス基板のクリーニング装置は上記
の様に構成され、以下動作について図3、図4を参照し
て説明する。まず図3(a)において、保持部6上にガ
ラス基板1を載置する。このとき、クリーニングユニッ
ト10の押し付け部材12に沿ってワイパーテープ4が
送給され、ワイパーテープ4はガイド13にガイドされ
て押し付け部材12の平面部12aに沿って位置してい
る。
This glass substrate cleaning apparatus is configured as described above. The operation of the apparatus will be described below with reference to FIGS. First, in FIG. 3A, the glass substrate 1 is placed on the holding unit 6. At this time, the wiper tape 4 is fed along the pressing member 12 of the cleaning unit 10, and the wiper tape 4 is guided by the guide 13 and is located along the flat portion 12 a of the pressing member 12.

【0015】次いで駆動部(図外)を駆動して保持部6
上のガラス基板1を移動させ、クリーニング対象部位で
あるガラス板1Aの縁部を押し付け部材12の間に位置
決めする。そしてチャック機構11を駆動することによ
り、押し付け部材12によってワイパーテープ4をガラ
ス板1Aの縁部の表裏両面に押し付ける。この状態でガ
ラス基板1を水平移動させることにより、ガラス板1A
の縁部の表面付着物はワイパーテープ4によって除去さ
れ、クリーニングが行われる。このとき、押し付け部材
12の押し当て面である平面部12aの先端はエッジ形
状の突部12bとなっているため、ガラス板1A上のガ
ラス板1Bとの段差部までワイパーテープ4を押し当て
ることができ、従来のローラを用いてワイパーテープを
押し付ける方法と比較して、未クリーニング部分を生じ
ることなく良好なクリーニングを行うことができる。
Next, a driving unit (not shown) is driven to hold the holding unit 6.
The upper glass substrate 1 is moved, and the edge of the glass plate 1A, which is the cleaning target site, is positioned between the pressing members 12. By driving the chuck mechanism 11, the pressing member 12 presses the wiper tape 4 on both the front and back surfaces of the edge of the glass plate 1 </ b> A. By horizontally moving the glass substrate 1 in this state, the glass plate 1A
Is removed by the wiper tape 4 and cleaning is performed. At this time, since the front end of the flat portion 12a, which is the pressing surface of the pressing member 12, is an edge-shaped projection 12b, the wiper tape 4 is pressed to the step between the glass plate 1A and the glass plate 1B. As compared with the conventional method of pressing the wiper tape using a roller, good cleaning can be performed without generating an uncleaned portion.

【0016】この後、当該部分のクリーニングが完了す
ると、図4(a)に示すように押し付け部材12を開
き、ワイパーテープ4の押し当て状態を解除する。次い
で、図4(b)に示すようにガラス基板1を移動させて
ガラス基板1Aを押し付け部材12の外部に位置させる
とともに、シリンダ17のロッド17a(図2)を突出
させる。この結果、図4(c)に示すようにガイド13
は押し付け部材12の外側に位置する。そしてこの状態
で回収リール16Bを駆動してワイパーテープ4を所定
ピッチだけ巻き取る。これにより前述のクリーニング動
作によって汚れたワイパーテープ4が回収されるととも
に、新しい未使用のワイパーテープ4が送給される。
Thereafter, when the cleaning of the portion is completed, the pressing member 12 is opened as shown in FIG. 4A, and the pressed state of the wiper tape 4 is released. Next, as shown in FIG. 4B, the glass substrate 1 is moved to position the glass substrate 1A outside the pressing member 12, and the rod 17a (FIG. 2) of the cylinder 17 is made to protrude. As a result, as shown in FIG.
Are located outside the pressing member 12. Then, in this state, the recovery reel 16B is driven to wind up the wiper tape 4 at a predetermined pitch. Thus, the wiper tape 4 contaminated by the above-described cleaning operation is collected, and a new unused wiper tape 4 is fed.

【0017】このワイパーテープ4の送給動作におい
て、ワイパーテープ4は押し付け部材12の外側に沿っ
て送られるのみであり、ワイパーテープ4が押し付け部
材12の先端部を周回する必要がない。したがって先端
部の突部12bを鋭角的に周回する場合に生じるワイパ
ーテープ4への損傷が発生することなく、常に安定して
ワイパーテープ4を送給することができる。
In the feeding operation of the wiper tape 4, the wiper tape 4 is merely fed along the outside of the pressing member 12, and the wiper tape 4 does not need to go around the tip of the pressing member 12. Therefore, the wiper tape 4 can always be fed stably without causing damage to the wiper tape 4 that occurs when the tip 12b orbits the projecting portion 12b at an acute angle.

【0018】[0018]

【発明の効果】本発明によれば、ワイパーテープをガラ
ス基板の縁部に押し付ける押し付け部材の間に配設され
るガイド部材を移動させる移動手段を設けたので、押し
付け部材の形状をガラス基板の段差部に応じたエッジ形
状とした場合においても、ワイパーテープ送り時にエッ
ジにワイパーテープが引掛ることがない。したがって、
常に安定してワイパーテープを送りながら未クリーニン
グ部の少ない良好なクリーニングを行うことができる。
According to the present invention, since the moving means for moving the guide member disposed between the pressing members for pressing the wiper tape against the edge of the glass substrate is provided, the shape of the pressing member can be reduced. Even in the case of an edge shape corresponding to the stepped portion, the wiper tape does not catch on the edge when the wiper tape is fed. Therefore,
Good cleaning with few uncleaned portions can be performed while always feeding the wiper tape stably.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態のガラス基板のクリーニ
ング装置の側面図
FIG. 1 is a side view of a glass substrate cleaning apparatus according to an embodiment of the present invention.

【図2】本発明の一実施の形態のガラス基板のクリーニ
ング装置の部分平面図
FIG. 2 is a partial plan view of the glass substrate cleaning apparatus according to one embodiment of the present invention.

【図3】(a)本発明の一実施の形態のガラス基板のク
リーニング方法の工程説明図 (b)本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図 (c)本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図
FIG. 3A is a diagram illustrating a process of a method for cleaning a glass substrate according to an embodiment of the present invention. FIG. 3B is a diagram illustrating a process of a method for cleaning a glass substrate according to an embodiment of the present invention. Process explanatory diagram of the glass substrate cleaning method of one embodiment

【図4】(a)本発明の一実施の形態のガラス基板のク
リーニング方法の工程説明図 (b)本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図 (c)本発明の一実施の形態のガラス基板のクリーニン
グ方法の工程説明図
FIG. 4A is a diagram illustrating a process of a method for cleaning a glass substrate according to an embodiment of the present invention. FIG. 4B is a diagram illustrating a process of a method for cleaning a glass substrate according to an embodiment of the present invention. Process explanatory diagram of the glass substrate cleaning method of one embodiment

【図5】従来のガラス基板のクリーニング装置の部分断
面図
FIG. 5 is a partial cross-sectional view of a conventional glass substrate cleaning device.

【符号の説明】[Explanation of symbols]

1 ガラス基板 4 ワイパーテープ 7 駆動部 10 クリーニングユニット 11 チャック機構 12 押し付け部材 13 ガイド 16A 供給リール 17 シリンダ Reference Signs List 1 glass substrate 4 wiper tape 7 drive unit 10 cleaning unit 11 chuck mechanism 12 pressing member 13 guide 16A supply reel 17 cylinder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ガラス基板の縁部の表面付着物をワイパー
テープによって除去するガラス基板のクリーニング装置
であって、前記縁部の表裏両面に押し付け部材により前
記ワイパーテープを押し付けるテープ押し付け手段と、
このテープ押し付け手段を前記ガラス基板に対して相対
的に移動させ位置決めする位置決め手段と、前記テープ
押し付け手段に対してワイパーテープを送給するテープ
送給手段と、前記押し付け部材の間に配設され前記押し
付け部材に対して送給されたワイパーテープをガイドし
て前記押し付け部材のガラス基板に対する押し付け面に
位置させるガイド部材と、このガイド部材を前記押し付
け部材の間で移動させる移動手段とを備えたことを特徴
とするガラス基板のクリーニング装置。
1. An apparatus for cleaning a glass substrate, which removes surface deposits on an edge of the glass substrate with a wiper tape, and a tape pressing means for pressing the wiper tape on both front and back surfaces of the edge by a pressing member;
Positioning means for moving and positioning the tape pressing means relative to the glass substrate, tape feeding means for feeding a wiper tape to the tape pressing means, and the pressing member are provided. A guide member that guides the wiper tape fed to the pressing member and is positioned on a pressing surface of the pressing member against the glass substrate; and a moving unit that moves the guide member between the pressing members. An apparatus for cleaning a glass substrate.
JP03835399A 1999-02-17 1999-02-17 Glass substrate cleaning apparatus and cleaning method Expired - Fee Related JP3503512B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03835399A JP3503512B2 (en) 1999-02-17 1999-02-17 Glass substrate cleaning apparatus and cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03835399A JP3503512B2 (en) 1999-02-17 1999-02-17 Glass substrate cleaning apparatus and cleaning method

Publications (2)

Publication Number Publication Date
JP2000237699A true JP2000237699A (en) 2000-09-05
JP3503512B2 JP3503512B2 (en) 2004-03-08

Family

ID=12522928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03835399A Expired - Fee Related JP3503512B2 (en) 1999-02-17 1999-02-17 Glass substrate cleaning apparatus and cleaning method

Country Status (1)

Country Link
JP (1) JP3503512B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055471A1 (en) * 2009-11-04 2011-05-12 シャープ株式会社 Wiping device and wiping method
WO2015166363A1 (en) * 2014-04-30 2015-11-05 株式会社半導体エネルギー研究所 Wiping device, and laminate fabricating device
JP2016215143A (en) * 2015-05-21 2016-12-22 日鉄住金ドラム株式会社 Stain wiping-off device for drum can

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4946837B2 (en) * 2007-12-04 2012-06-06 パナソニック株式会社 Substrate cleaning apparatus and cleaning method
WO2010050217A1 (en) 2008-10-31 2010-05-06 パナソニック株式会社 Substrate cleaning apparatus and method employed therein

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055471A1 (en) * 2009-11-04 2011-05-12 シャープ株式会社 Wiping device and wiping method
JP5285783B2 (en) * 2009-11-04 2013-09-11 シャープ株式会社 Wiping cleaning device and wiping cleaning method
WO2015166363A1 (en) * 2014-04-30 2015-11-05 株式会社半導体エネルギー研究所 Wiping device, and laminate fabricating device
US10343191B2 (en) 2014-04-30 2019-07-09 Semiconductor Energy Laboratory Co., Ltd. Wiping device and stack manufacturing apparatus
JP2016215143A (en) * 2015-05-21 2016-12-22 日鉄住金ドラム株式会社 Stain wiping-off device for drum can

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