JP2006167554A - Cleaning apparatus and cleaning method of substrate - Google Patents

Cleaning apparatus and cleaning method of substrate Download PDF

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JP2006167554A
JP2006167554A JP2004361718A JP2004361718A JP2006167554A JP 2006167554 A JP2006167554 A JP 2006167554A JP 2004361718 A JP2004361718 A JP 2004361718A JP 2004361718 A JP2004361718 A JP 2004361718A JP 2006167554 A JP2006167554 A JP 2006167554A
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Prior art keywords
cleaning
substrate
cleaning unit
unit
facing
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JP4402579B2 (en
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Shigeru Sakata
滋 坂田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2004361718A priority Critical patent/JP4402579B2/en
Priority to PCT/JP2005/016792 priority patent/WO2006064596A1/en
Priority to CN2005800430066A priority patent/CN101080283B/en
Priority to KR1020077012476A priority patent/KR20070085666A/en
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    • B08B1/20—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus which can efficiently and surely clean the side periphery of substrates. <P>SOLUTION: This cleaning apparatus for cleaning upper and lower faces of at least one pair of facing side peripheries of a substrate, is provided with a first cleaning unit 100A for cleaning upper and lower faces of one side periphery of the substrate, a second cleaning unit 100B disposed facing to the first cleaning unit and for cleaning the side periphery of the other side facing the one side periphery of the substrate at the same time of cleaning the one side periphery, and a placing table 104 for carrying the substrate in the direction crossing the facing direction of these cleaning units between the facing first and second cleaning units. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明はたとえば液晶パネルなどの基板に形成された電極を清掃するための清掃装置及び清掃方法に関する。   The present invention relates to a cleaning device and a cleaning method for cleaning an electrode formed on a substrate such as a liquid crystal panel.

液晶パネルやプラズマディスプレイパネルなどの基板は、その基板の側辺部に電極が設けられ、この電極上にＴＣＰ（Tape Carrier Package）やＩＣチップなどの電子部品を圧着装置によって加圧加熱して接続する。     Substrates such as liquid crystal panels and plasma display panels are provided with electrodes on the sides of the substrates, and electronic components such as TCP (Tape Carrier Package) and IC chips are connected to the electrodes by applying pressure and heat using a crimping device. To do.

上記電極と電子部品とは通常、異方性導電部材を介して電気的に接続される。そのため、接続部分において、電気的に良好な導通状態を得るためには、上記電極面がゴミの付着などによって汚れていないことが必要となる。   The electrode and the electronic component are usually electrically connected via an anisotropic conductive member. Therefore, in order to obtain an electrically conductive state at the connection portion, it is necessary that the electrode surface is not soiled due to dust or the like.

上記電極は通常、基板の上面に形成されている。しかしながら、その電極に電子部品を圧着する際、基板の下面にゴミが付着していると、圧着時に基板を損傷する虞がある。したがって、基板の電極面に異方性導電部材を貼付する前に、その電極面を清掃装置によって清掃するということが行なわれている。   The electrode is usually formed on the upper surface of the substrate. However, when the electronic component is crimped to the electrode, if the dust adheres to the lower surface of the substrate, the substrate may be damaged during the crimping. Therefore, before the anisotropic conductive member is attached to the electrode surface of the substrate, the electrode surface is cleaned by a cleaning device.

上記清掃装置は、基板を所定方向に沿って搬送するテーブルを有し、このテーブルの上方には供給リールと巻き取りリールとに張設されてテープ状の清掃部材が設けられている。この清掃部材にはノズルからアルコールなどの揮発性の溶剤を滴下させて染み込ませ、この溶剤が染み込んだ部分を所定位置まで移動させ、搬送される基板の縁部の電極面に所定の圧力で接触させることで、上記電極面を清掃するようにしている。   The cleaning device includes a table for transporting the substrate along a predetermined direction, and a tape-shaped cleaning member is provided above the table so as to be stretched between a supply reel and a take-up reel. The cleaning member is dripped with a volatile solvent such as alcohol from a nozzle, and the part soaked with the solvent is moved to a predetermined position and brought into contact with the electrode surface at the edge of the substrate to be conveyed with a predetermined pressure. By doing so, the electrode surface is cleaned.

上記基板が高精細用の液晶パネルやプラズマディスプレイパネルの場合、基板には２つの辺だけでなく、３つの辺や４つの辺に電極が形成されることがある。そのような基板を清掃する場合、従来は上記清掃装置によって上記基板の一辺を清掃したならば、基板が載置されたテーブルを９０度ずつ順次回転させることで、上記基板の残りの辺を清掃するということが行われていた。
このような従来の清掃装置は特許文献１に示されている。
特開２００３−５３２８１号公報 When the substrate is a high-definition liquid crystal panel or plasma display panel, electrodes may be formed on three or four sides as well as two sides on the substrate. When cleaning such a substrate, conventionally, if one side of the substrate is cleaned by the cleaning device, the table on which the substrate is placed is sequentially rotated by 90 degrees to clean the remaining side of the substrate. It was done.
Such a conventional cleaning device is disclosed in Patent Document 1.
JP 2003-53281 A

たとえば、基板の４つの辺に電極が形成されている場合、この基板を従来の清掃装置で清掃するには清掃作業を４回繰り返さなければならなかった。つまり、基板の一辺を清掃したならば、この基板を９０度回転させて上記一辺と隣り合う辺を清掃するという作業を清掃する辺の数に応じて繰り返すようにしていた。
そのため、基板を清掃するために要するタクトタイムが長くなるから、生産性の低下を招く一因となっていた。 For example, when electrodes are formed on four sides of the substrate, the cleaning operation has to be repeated four times in order to clean the substrate with a conventional cleaning device. That is, when one side of the substrate is cleaned, the operation of rotating the substrate 90 degrees to clean the side adjacent to the one side is repeated according to the number of sides to be cleaned.
For this reason, the tact time required for cleaning the substrate becomes long, which is a cause of a decrease in productivity.

また、基板の一側辺だけを清掃すると、清掃時に清掃部材との摩擦抵抗によって基板に回転モーメントが発生し、基板が回転方向にずれることがある。その場合、清掃部材が基板の一側辺から外れ、その側辺を確実に清掃できなくなるということがある。   If only one side of the substrate is cleaned, a rotational moment may be generated in the substrate due to frictional resistance with the cleaning member during cleaning, and the substrate may be displaced in the rotation direction. In that case, the cleaning member may come off from one side of the substrate and the side cannot be reliably cleaned.

この発明は、基板の複数の側辺を清掃する場合に、従来に比べてタクトタイムを短縮することができ、しかも基板に回転モーメントが発生して回転方向にずれることがないようにした基板の清掃装置及び清掃方法を提供することにある。   According to the present invention, when cleaning a plurality of sides of a substrate, the tact time can be shortened as compared with the prior art, and a rotation moment is not generated in the substrate so that it does not shift in the rotation direction. It is providing the cleaning apparatus and the cleaning method.

この発明は、基板の少なくとも対向する一対の側辺の上下面を清掃する清掃装置であって、
上記基板の一方の側辺の上下面を清掃する第１の清掃ユニットと、
この第１の清掃ユニットと対向して配置され上記基板の上記一方の側辺に対向する他方の側辺を上記一方の側辺と同時に清掃する第２の清掃ユニットと、
対向する第１の清掃ユニットと第２の清掃ユニットの間をこれら清掃ユニットの対向方向と交差する方向に沿って上記基板を搬送する搬送手段と
を具備したことを特徴とする基板の清掃装置にある。 This invention is a cleaning device for cleaning the upper and lower surfaces of at least a pair of opposing sides of a substrate,
A first cleaning unit for cleaning the upper and lower surfaces of one side of the substrate;
A second cleaning unit disposed opposite to the first cleaning unit and cleaning the other side facing the one side of the substrate simultaneously with the one side;
A substrate cleaning apparatus comprising: a transport unit configured to transport the substrate between a first cleaning unit and a second cleaning unit facing each other along a direction intersecting a facing direction of the cleaning units. is there.

上記第１、第２の清掃ユニットの上記基板の搬送方向上流側には、上記基板の側辺を清掃する前にその側辺部に付着した塵埃を吸引除去する吸引手段が設けられていることが好ましい。   A suction means for sucking and removing dust adhering to the side of the substrate before cleaning the side of the substrate is provided upstream of the first and second cleaning units in the transport direction of the substrate. Is preferred.

清掃する基板の幅寸法に応じて上記第１の清掃ユニットと第２の清掃ユニットの対向間隔を調整する間隔調整手段が設けられていることが好ましい。   It is preferable that interval adjusting means for adjusting the facing interval between the first cleaning unit and the second cleaning unit according to the width dimension of the substrate to be cleaned is provided.

この発明は、基板の少なくとも対向する一対の側辺の上下面を清掃する清掃方法であって、
上記基板を所定方向に搬送する工程と、
搬送される上記基板の搬送方向と交差する方向に位置する一方の側辺とこの一方の側辺に対向する他方の側辺とを同時に清掃する工程と
を具備したことを特徴とする基板の清掃方法にある。 This invention is a cleaning method for cleaning the upper and lower surfaces of at least a pair of opposing sides of a substrate,
Transporting the substrate in a predetermined direction;
Cleaning the substrate, comprising: simultaneously cleaning one side located in a direction intersecting the transport direction of the substrate to be transported and the other side facing the one side. Is in the way.

この発明によれば、基板の対向する一対の側辺を同時に清掃するため、一側辺ずつ清掃する場合に比べてタクトタイムを短縮することができるばかりか、清掃時に基板が回転方向に動くことがないから、各側辺を確実に清掃することが可能となる。   According to the present invention, since a pair of opposing sides of the substrate are simultaneously cleaned, the tact time can be shortened as compared with the case where each side is cleaned, and the substrate moves in the rotation direction during cleaning. Therefore, each side can be reliably cleaned.

以下、この発明を図面を参照しながら説明する。   The present invention will be described below with reference to the drawings.

図１はこの発明の一実施の形態を示す清掃装置の正面図、図２は側面図であって、この清掃装置はベース１０１を備えている。このベース１０１上の幅方向一端部には第１の清掃ユニット１００Ａ、他端部上面には第２の清掃ユニット１００Ｂがそれぞれ上記ベース１０１の幅方向である、同図に矢印Ｘで示す方向に沿って移動可能に設けられている。   FIG. 1 is a front view of a cleaning device according to an embodiment of the present invention, FIG. 2 is a side view, and the cleaning device includes a base 101. The first cleaning unit 100A is disposed at one end in the width direction on the base 101, and the second cleaning unit 100B is disposed at the upper surface of the other end in the width direction of the base 101. It is provided so that it can move along.

上記ベース１０１の幅方向一端には上記第１の清掃ユニット１００ＡをＸ方向に駆動する第１のＸ駆動源１０２ａが設けられ、他端には上記第２の清掃ユニット１００ＢをＸ方向に駆動する第２のＸ駆動源１０２ｂが設けられている。したがって、一対の清掃ユニット１００Ａ，１００Ｂは互いの対向間隔を調整できるようになっている。上記第１のＸ駆動源１０２ａ，第２のＸ駆動源１０２ｂは一対の清掃ユニット１００Ａ，１００ＢのＸ方向に沿う間隔を調整する間隔調整手段を構成している。   A first X driving source 102a for driving the first cleaning unit 100A in the X direction is provided at one end in the width direction of the base 101, and the second cleaning unit 100B is driven in the X direction at the other end. A second X drive source 102b is provided. Therefore, the pair of cleaning units 100A and 100B can adjust the facing distance. The first X drive source 102a and the second X drive source 102b constitute interval adjusting means for adjusting the interval along the X direction of the pair of cleaning units 100A, 100B.

上記ベース１０１上の上記第１の清掃ユニット１００Ａと第２の清掃ユニット１００Ｂとの間の部分には支持体１０３が上記Ｘ方向と交差するＹ方向に沿って設けられている。この支持体１０３の上面には支持体１０３の長手方向、つまりＹ方向に沿って移動可能に載置テーブル１０４が設けられている。この載置テーブル１０４は上記支持体１０３の長手方向一端に設けられたＹ駆動源１０５によってＹ方向に沿って駆動されるようになっている。   A support 103 is provided on the base 101 between the first cleaning unit 100A and the second cleaning unit 100B along the Y direction that intersects the X direction. A mounting table 104 is provided on the upper surface of the support 103 so as to be movable along the longitudinal direction of the support 103, that is, the Y direction. The mounting table 104 is driven along the Y direction by a Y drive source 105 provided at one end in the longitudinal direction of the support 103.

上記載置テーブル１０４の上面には液晶パネルやプラズマディスプレイパネルなどの基板Ｗの下面を吸着保持する保持部１０６が設けられている。この保持部１０６は図示しないθ駆動源によって回転方向に駆動されるようになっている。   On the upper surface of the mounting table 104, a holding unit 106 that sucks and holds the lower surface of the substrate W such as a liquid crystal panel or a plasma display panel is provided. The holding unit 106 is driven in the rotational direction by a θ drive source (not shown).

図４に示すように上記基板Ｗは矩形状であって、この実施の形態では４つの側辺Ｗ１〜Ｗ４の上面にそれぞれ複数の電極１０７が所定間隔で設けられている。なお、基板Ｗは上記保持部１０６に比べて十分に大きな矩形状であって、その周辺部を保持部１０６の外周面から突出させて保持される。   As shown in FIG. 4, the substrate W has a rectangular shape. In this embodiment, a plurality of electrodes 107 are provided at predetermined intervals on the upper surfaces of the four side edges W1 to W4. The substrate W has a rectangular shape that is sufficiently larger than the holding portion 106 and is held with its peripheral portion protruding from the outer peripheral surface of the holding portion 106.

つぎに、上記第１の清掃ユニット１００Ａと第２の清掃ユニット１００Ｂについて説明する。第１、第２の清掃ユニット１００Ａ，１００Ｂは同じ構成であるので、そのうちの一方について図２を参照して説明する。すなわち、この清掃ユニット１００Ａ，１００Ｂは本体１を備えている。   Next, the first cleaning unit 100A and the second cleaning unit 100B will be described. Since the first and second cleaning units 100A and 100B have the same configuration, one of them will be described with reference to FIG. That is, the cleaning units 100 </ b> A and 100 </ b> B include a main body 1.

この本体１の前面には、上記保持部１０６に保持された基板Ｗの１つの側辺の上面に対向位置する上部清掃部１１と、下面に対向位置する下部清掃部１２とが設けられている。各清掃部１１，１２は上下対称に設けられた供給リール１３ａ，１３ｂと巻取りリール１４ａ，１４ｂを有する。各供給リール１３ａ，１３ｂには耐磨耗性に優れた柔らかなテープ状の布地からなる清掃部材１５が巻回されている。各清掃部材１５はそれぞれ第１乃至第３の中継ローラ１６ａ〜１６ｃと１つの巻取りローラ１７を介して各巻取りリール１４ａ，１４ｂに巻き取られるようになっている。   On the front surface of the main body 1, there are provided an upper cleaning unit 11 that faces the upper surface of one side of the substrate W held by the holding unit 106 and a lower cleaning unit 12 that faces the lower surface. . Each of the cleaning units 11 and 12 has supply reels 13a and 13b and take-up reels 14a and 14b provided symmetrically in the vertical direction. A cleaning member 15 made of a soft tape-like cloth excellent in wear resistance is wound around each supply reel 13a, 13b. Each cleaning member 15 is wound around each take-up reel 14a, 14b via first to third relay rollers 16a-16c and one take-up roller 17, respectively.

上記供給リール１３ａ，１３ｂと巻取りリール１４ａ，１４ｂとにはそれぞれ清掃部材１５に適度な張力を与えるモータ１８ａ，１８ｂ及び１９ａ，１９ｂが連結され、上記巻取りローラ１７には、この巻取りローラ１７を駆動するための駆動モータ２１ａ，２１ｂが連結されている。   The supply reels 13a, 13b and the take-up reels 14a, 14b are connected to motors 18a, 18b and 19a, 19b, respectively, which apply an appropriate tension to the cleaning member 15, and the take-up roller 17 is connected to the take-up roller 17. Drive motors 21a and 21b for driving 17 are connected.

したがって、上部清掃部１１と下部清掃部１２との清掃部材１５は、駆動モータ２１ａ，２１ｂが作動することで、供給リール１３ａ，１３ｂから巻取りリール１４ａ，１４ｂに巻き取られるようになっている。
なお、各モータは本体１の内部に設けられ、各ローラ及びリールは本体１の前面に回転可能に設けられている。 Therefore, the cleaning member 15 of the upper cleaning unit 11 and the lower cleaning unit 12 is wound around the take-up reels 14a and 14b from the supply reels 13a and 13b when the drive motors 21a and 21b are operated. .
Each motor is provided inside the main body 1, and each roller and reel are rotatably provided on the front surface of the main body 1.

上記第２の中継ローラ１６ｂと第３の中継ローラ１６ｃとの間には押付けローラ２２ａ，２２ｂが設けられている。各押付けローラ２２ａ，２２ｂは上下シリンダ２３ａ，２３ｂによって基板Ｗの板面に対して接離する方向に駆動されるようになっている。それによって、図３に示すように各押付けローラ２２ａ，２２ｂは保持部１０６によって位置決め保持された基板Ｗの側辺に対し、清掃部材１５を上方向及び下方向から所定の圧力で押付けることになる。   Pressing rollers 22a and 22b are provided between the second relay roller 16b and the third relay roller 16c. Each of the pressing rollers 22a and 22b is driven in a direction in which the upper and lower cylinders 23a and 23b make contact with and separate from the plate surface of the substrate W. As a result, as shown in FIG. 3, each pressing roller 22a, 22b presses the cleaning member 15 against the side of the substrate W positioned and held by the holding unit 106 from above and below with a predetermined pressure. Become.

清掃部材１５の第１の中継ローラ１６ａと第２の中継ローラ１６ｂとの間の部分にはそれぞれ上部ノズル２４ａと下部ノズル２４ｂとが先端を下側にむけて配置されている。各ノズル２４ａ，２４ｂはアルコールなどの溶剤が収容された容器２５に供給チューブ２６を介して接続されている。この供給チューブ２６の中途部にはポンプ２７が設けられている。このポンプ２７は上記チューブ２６の中途部を回転するローラによって間歇的に所定方向に沿って圧縮するようになっており、それによって上記容器２５の溶剤を上記各ノズル２４ａ，２４ｂから滴下させるようになっている。   An upper nozzle 24a and a lower nozzle 24b are disposed at the portion between the first relay roller 16a and the second relay roller 16b of the cleaning member 15 with their tips facing downward. Each nozzle 24a, 24b is connected via a supply tube 26 to a container 25 that contains a solvent such as alcohol. A pump 27 is provided in the middle of the supply tube 26. The pump 27 is intermittently compressed along a predetermined direction by a roller that rotates in the middle of the tube 26, so that the solvent in the container 25 is dropped from the nozzles 24a and 24b. It has become.

溶剤は上記上部ノズル２４ａと下部ノズル２４ｂとから清掃部材１５に向かって滴下する。それによって、各ノズル２４ａ，２４ｂから滴下した溶剤はそれぞれ清掃部材１５に染み込むことになる。つぎに、駆動モータ２１ａ，２１ｂが駆動され、清掃部材１５の溶剤が滴下された部分が押し付けローラ２２ａ，２２ｂとの間に位置決めされる。それによって、上記清掃部材１５によって基板Ｗの側辺を清掃することができる。
なお、上記本体１の上部には制御装置２９が設けられている。この制御装置２９は上記第１、第２のＸ駆動源１０２ａ，１０２ｂやＹ駆動源１０５の駆動を制御する。 The solvent is dropped from the upper nozzle 24a and the lower nozzle 24b toward the cleaning member 15. As a result, the solvent dropped from the nozzles 24a and 24b soaks into the cleaning member 15, respectively. Next, the drive motors 21a and 21b are driven, and the portion of the cleaning member 15 where the solvent is dropped is positioned between the pressing rollers 22a and 22b. Thereby, the side of the substrate W can be cleaned by the cleaning member 15.
A control device 29 is provided on the upper portion of the main body 1. The control device 29 controls the driving of the first and second X drive sources 102 a and 102 b and the Y drive source 105.

上記載置テーブル１０４の保持部１０６に保持された基板Ｗは図２と図３に矢印Ｙで示す方向に搬送される。上部清掃部１１の上記基板Ｗの搬送方向上流側にはその基板Ｗの側辺部に対向して吸引手段を構成する吸引ダクト３１が配置されている。この吸引ダクト３１は図示しない吸引ポンプに接続されている。それによって、基板Ｗの側辺の上面に設けられた電極１０７が上部清掃部１１によって清掃される前に、その側辺部に付着したゴミを上記気吸引ダクト３１によって吸引除去できるようになっている。   The substrate W held by the holding unit 106 of the placement table 104 is transported in the direction indicated by the arrow Y in FIGS. A suction duct 31 that constitutes suction means is disposed on the upstream side of the upper cleaning unit 11 in the transport direction of the substrate W so as to face the side portion of the substrate W. The suction duct 31 is connected to a suction pump (not shown). Thereby, before the electrode 107 provided on the upper surface of the side of the substrate W is cleaned by the upper cleaning unit 11, dust attached to the side can be sucked and removed by the air suction duct 31. Yes.

なお、基板Ｗの下面の側辺部に付着したゴミのほとんどは落下するが、吸引ダクト３１を下部清掃部１２の上流側にも設け、側辺部の下面に付着残留したゴミを吸引除去するようにしてもよい。   Although most of the dust adhering to the side portion of the lower surface of the substrate W falls, a suction duct 31 is also provided on the upstream side of the lower cleaning portion 12 to suck and remove the dust remaining on the lower surface of the side portion. You may do it.

つぎに、上記構成の清掃装置によって基板Ｗを清掃する手順を説明する。
まず、第１の清掃ユニット１００Ａと第２の清掃ユニット１００Ｂとを第１のＸ駆動源１０２ａと第２のＸ駆動源１０２ｂによってＸ方向に駆動し、これら清掃ユニット１００Ａ，１００Ｂの前面に設けられた各上下清掃部１１，１２の押付けローラ２２ａ，２２ｂの間隔が図４にＢで示す上記基板Ｗの一方の幅寸法とほぼ同じになるよう設定する。 Next, a procedure for cleaning the substrate W by the cleaning apparatus having the above configuration will be described.
First, the first cleaning unit 100A and the second cleaning unit 100B are driven in the X direction by the first X driving source 102a and the second X driving source 102b, and are provided in front of these cleaning units 100A and 100B. Further, the interval between the pressing rollers 22a and 22b of the upper and lower cleaning portions 11 and 12 is set to be substantially the same as one width dimension of the substrate W indicated by B in FIG.

つまり、基板Ｗを保持した保持部１０６を中心にして第１の清掃ユニット１００Ａと第２の清掃ユニット１００Ｂを基板Ｗの幅寸法Ｂに応じて対称に位置決めする。   That is, the first cleaning unit 100 </ b> A and the second cleaning unit 100 </ b> B are positioned symmetrically according to the width dimension B of the substrate W around the holding unit 106 that holds the substrate W.

つぎに、Ｙ駆動源１０５を作動させて載置テーブル１０４をＹ方向、つまり基板Ｗが図２と図３に矢印Ｙで示す方向に進行するよう駆動する。それと同時に、各清掃ユニット１００Ａ，１００Ｂの上部清掃部１１と下部清掃部１２との上下シリンダ２３ａ，２３ｂを作動させ、各一対の押付けローラ２２ａ，２２ｂを接近する方向に駆動する。   Next, the Y driving source 105 is operated to drive the mounting table 104 so that the substrate W advances in the Y direction, that is, the direction indicated by the arrow Y in FIGS. At the same time, the upper and lower cylinders 23a and 23b of the upper cleaning unit 11 and the lower cleaning unit 12 of each cleaning unit 100A and 100B are actuated to drive the pair of pressing rollers 22a and 22b in the approaching direction.

Ｙ方向に搬送される基板Ｗは、対向する一対の側辺Ｗ１，Ｗ２の上面と下面とが押付けローラ２２ａ，２２ｂに対向する位置に到達する前に、その上面は吸引ダクト３１の下方を通過する。それによって、基板Ｗの両側辺Ｗ１，Ｗ２にゴミが付着していれば、そのゴミは上記吸引ダクト３１によって吸引除去されることになる。   The substrate W transported in the Y direction passes below the suction duct 31 before the upper and lower surfaces of the pair of opposing sides W1 and W2 reach the positions facing the pressing rollers 22a and 22b. To do. Accordingly, if dust adheres to both sides W1 and W2 of the substrate W, the dust is sucked and removed by the suction duct 31.

吸引ダクト３１の下方を通過した基板Ｗの対向する一対の側辺Ｗ１，Ｗ２の上面と下面とは清掃部材１５の押付けローラ２２ａ，２２ｂによって押圧された部分で擦られる。清掃部材１５には溶剤が供給されているから、その溶剤によって基板Ｗの一対の側辺Ｗ１，Ｗ２の上面と下面とが清掃されることになる。上面には電極１０７が設けられているから、その電極１０７が清掃され、下面には電極１０７が設けられていないから、基板Ｗの一対の側辺Ｗ１，Ｗ２の下面に付着しているゴミなどが清掃除去されることになる。   The upper and lower surfaces of the pair of opposing sides W1 and W2 of the substrate W that have passed under the suction duct 31 are rubbed by the portions pressed by the pressing rollers 22a and 22b of the cleaning member 15. Since the cleaning member 15 is supplied with a solvent, the upper surface and the lower surface of the pair of sides W1 and W2 of the substrate W are cleaned by the solvent. Since the electrode 107 is provided on the upper surface, the electrode 107 is cleaned, and since the electrode 107 is not provided on the lower surface, dust or the like adhering to the lower surfaces of the pair of side edges W1 and W2 of the substrate W, etc. Will be removed by cleaning.

このように、基板Ｗの対向する一対の側辺Ｗ１，Ｗ２を同時に清掃すれば、一方の側辺Ｗ１を清掃部材１５が摩擦することで発生する回転モーメントと、他方の側辺Ｗ２を清掃部材１５が摩擦することで発生する回転モーメントが相殺される。   Thus, if the pair of opposing sides W1 and W2 of the substrate W are simultaneously cleaned, the rotational moment generated by the cleaning member 15 rubbing the one side W1 and the other side W2 are cleaned. The rotational moment generated by the friction of 15 is canceled out.

そのため、載置テーブル１０４の保持部１０６に保持された基板Ｗが回転方向にずれ動くのが防止されるから、この基板Ｗの対向する一対の側辺Ｗ１，Ｗ２を全長にわたって確実に清掃することができる。   Therefore, since the substrate W held by the holding unit 106 of the mounting table 104 is prevented from shifting in the rotation direction, the pair of opposing sides W1 and W2 of the substrate W are reliably cleaned over the entire length. Can do.

このようにして、基板Ｗの一対の側辺Ｗ１，Ｗ２を清掃したならば、一対の清掃ユニット１００Ａ，１００ＢをＸ方向の間隔が広くなる方向に駆動した後、載置テーブル１０４をＹ方向に後退させる。ついで、保持部１０６を９０度回転させて基板Ｗの残りの対向する一対の側辺Ｗ３，Ｗ４を基板Ｗの搬送方向であるＹ方向に沿うよう位置決めする。   After the pair of side edges W1 and W2 of the substrate W are thus cleaned, the pair of cleaning units 100A and 100B are driven in the direction in which the interval in the X direction is widened, and then the mounting table 104 is moved in the Y direction. Retreat. Next, the holding unit 106 is rotated by 90 degrees to position the remaining pair of opposing sides W3 and W4 of the substrate W along the Y direction which is the transport direction of the substrate W.

ついで、一対の清掃ユニット１００Ａ，１００Ｂの前面に設けられた各上下清掃部１１，１２の押付けローラ２２ａ，２２ｂの間隔が上記基板Ｗの図４にＡで示す幅寸法とほぼ同じになるよう設定する。   Next, the interval between the pressing rollers 22a and 22b of the upper and lower cleaning portions 11 and 12 provided on the front surfaces of the pair of cleaning units 100A and 100B is set to be substantially the same as the width dimension indicated by A in FIG. To do.

そして、Ｙ駆動源１０５を作動させて載置テーブル１０４をＹ方向に駆動すれば、基板Ｗの一対の側辺Ｗ３，Ｗ４の上面に付着するゴミが吸引ダクト３１によって吸引除去された後、上記側辺Ｗ３，Ｗ４の上下面が清掃部材１５によって清掃される。   Then, when the Y drive source 105 is operated to drive the mounting table 104 in the Y direction, dust adhering to the upper surfaces of the pair of side edges W3 and W4 of the substrate W is removed by suction by the suction duct 31, and then The upper and lower surfaces of the side edges W3 and W4 are cleaned by the cleaning member 15.

基板Ｗの一対の側辺Ｗ３，Ｗ４を清掃する場合も、基板Ｗが回転方向にずれることがないから、一対の側辺Ｗ３，Ｗ４を全長にわたった確実に清掃することができる。
しかも、基板Ｗの４つの側辺Ｗ１〜Ｗ４を２回の清掃工程で清掃することができるから、一辺ずつ清掃する場合に比べて半分のタクトタイムで清掃することができる。 Even when cleaning the pair of side edges W3 and W4 of the substrate W, the substrate W is not displaced in the rotation direction, so that the pair of side edges W3 and W4 can be reliably cleaned over the entire length.
In addition, since the four side edges W1 to W4 of the substrate W can be cleaned in two cleaning steps, cleaning can be performed with half the tact time compared to the case of cleaning one side at a time.

上記一実施の形態では基板の４つの辺に電極が形成されている場合について説明したが、たとえば３つの側辺に電極が形成されている場合であってもよく、要は４つの側辺のうち、少なくとも対向する一対の側辺に電極が形成されている場合であれば、この発明の清掃装置によって２つの側辺を同時に清掃することが可能となるから、基板を回転方向にずれることなく一対の側辺を確実に、しかも能率よく清掃することが可能となる。   In the above embodiment, the case where the electrodes are formed on the four sides of the substrate has been described. However, for example, the electrodes may be formed on the three sides. Of these, if electrodes are formed on at least a pair of opposing sides, the cleaning device of the present invention can simultaneously clean the two sides, so that the substrate is not displaced in the rotational direction. It becomes possible to clean the pair of side sides reliably and efficiently.

基板の３つの側辺に電極が形成されている場合、対向する一対の側辺を同時に清掃した後、電極が設けられた残りの１つの側辺だけを清掃するようにしてもよいが、電極が設けられた側辺と、電極が設けられていない側辺とを一緒に清掃してもよい。そうすれば、電極が設けられた側辺だけでなく、電極が設けられていない側辺の上下面も清掃することができるばかりか、清掃時に基板が回転方向にずれるのを防止することもできる。   When electrodes are formed on the three sides of the substrate, the pair of opposing sides may be cleaned at the same time, and then only the remaining one side provided with the electrodes may be cleaned. You may clean the side provided with and the side provided with no electrode together. Then, not only the side where the electrode is provided, but also the upper and lower surfaces of the side where the electrode is not provided can be cleaned, and the substrate can be prevented from shifting in the rotation direction during cleaning. .

また、基板の側辺には電極が上面に設けられている場合だけでなく、１つの側辺には上面で、その側辺と対向する側辺や隣り合う側辺には下面に電極が設けられていることもあり、さらには電極が上下両面に設けられていることもあり、そのような場合であってもこの発明を適用することができることは勿論である。   In addition to the case where an electrode is provided on the upper surface of the side of the substrate, an electrode is provided on the upper surface of one side, and on the lower surface of the side opposite to or adjacent to that side. Of course, the electrodes may be provided on both the upper and lower surfaces, and it is a matter of course that the present invention can be applied even in such a case.

この発明の清掃装置を示す正面図。The front view which shows the cleaning apparatus of this invention. 一対の清掃ユニットのうちの一方の清掃ユニットの前面を示す側面図。The side view which shows the front surface of one cleaning unit of a pair of cleaning units. 清掃ユニットの前面に設けられた上部清掃部と下部清掃部を示す拡大図。The enlarged view which shows the upper cleaning part and lower cleaning part which were provided in the front surface of the cleaning unit. ４つの側辺に電極が形成された基板の平面図。The top view of the board | substrate with which the electrode was formed in four sides.

符号の説明Explanation of symbols

３１…吸引ダクト（吸引手段）、１００Ａ…第１の清掃ユニット、１００Ｂ…第２の清掃ユニット、１０４…載置テーブル（搬送手段）、１０５…Ｙ駆動源（搬送手段）、１０２ａ…第１のＸ駆動源（間隔調整手段）、１０２ｂ…第２のＸ駆動源（間隔調整手段）。   31 ... Suction duct (suction means), 100A ... first cleaning unit, 100B ... second cleaning unit, 104 ... mounting table (conveyance means), 105 ... Y drive source (conveyance means), 102a ... first X drive source (interval adjusting means), 102b... Second X drive source (interval adjusting means).

Claims (4)

基板の少なくとも対向する一対の側辺の上下面を清掃する清掃装置であって、
上記基板の一方の側辺の上下面を清掃する第１の清掃ユニットと、
この第１の清掃ユニットと対向して配置され上記基板の上記一方の側辺に対向する他方の側辺を上記一方の側辺と同時に清掃する第２の清掃ユニットと、
対向する第１の清掃ユニットと第２の清掃ユニットの間をこれら清掃ユニットの対向方向と交差する方向に沿って上記基板を搬送する搬送手段と
を具備したことを特徴とする基板の清掃装置。 A cleaning device for cleaning the upper and lower surfaces of at least a pair of opposing sides of a substrate,
A first cleaning unit for cleaning the upper and lower surfaces of one side of the substrate;
A second cleaning unit disposed opposite to the first cleaning unit and cleaning the other side facing the one side of the substrate simultaneously with the one side;
A substrate cleaning apparatus comprising: a transport unit configured to transport the substrate between a first cleaning unit and a second cleaning unit facing each other along a direction intersecting a facing direction of the cleaning units. 上記第１、第２の清掃ユニットの上記基板の搬送方向上流側には、上記基板の側辺を清掃する前にその側辺部に付着した塵埃を吸引除去する吸引手段が設けられていることを特徴とする請求項１記載の基板の清掃装置。   A suction means for sucking and removing dust adhering to the side of the substrate before cleaning the side of the substrate is provided upstream of the first and second cleaning units in the transport direction of the substrate. The substrate cleaning apparatus according to claim 1. 清掃する基板の幅寸法に応じて上記第１の清掃ユニットと第２の清掃ユニットの対向間隔を調整する間隔調整手段が設けられていることを特徴とする請求項１記載の基板の清掃装置。   2. The substrate cleaning apparatus according to claim 1, further comprising an interval adjusting means for adjusting an opposing interval between the first cleaning unit and the second cleaning unit according to a width dimension of the substrate to be cleaned. 基板の少なくとも対向する一対の側辺の上下面を清掃する清掃方法であって、
上記基板を所定方向に搬送する工程と、
搬送される上記基板の搬送方向と交差する方向に位置する一方の側辺とこの一方の側辺に対向する他方の側辺とを同時に清掃する工程と
を具備したことを特徴とする基板の清掃方法。 A cleaning method for cleaning the upper and lower surfaces of at least a pair of opposing sides of a substrate,
Transporting the substrate in a predetermined direction;
Cleaning the substrate, comprising: simultaneously cleaning one side located in a direction intersecting the transport direction of the substrate to be transported and the other side facing the one side. Method.
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009157247A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
CN102909185A (en) * 2012-10-26 2013-02-06 世成电子(深圳)有限公司 Cleaning machine
CN103611694A (en) * 2013-11-22 2014-03-05 日商株式会社雷恩工业 Workpiece surface wiping device and workpiece surface wiping method
TWI626091B (en) * 2016-10-28 2018-06-11 旭東機械工業股份有限公司 Panel cleaning system
CN109013425A (en) * 2018-09-10 2018-12-18 山东联诚电力工程有限公司 A kind of superimposed sheet cleaning systems and method
CN113284424A (en) * 2021-07-26 2021-08-20 深圳鼎晶科技有限公司 Positioning device and attaching carrying platform

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193197A (en) * 1987-10-05 1989-04-12 Fujitsu Ltd Substrate cleaning mechanism
JPH09139375A (en) * 1995-11-16 1997-05-27 Dainippon Screen Mfg Co Ltd Substrate edge processor
JP2001015896A (en) * 1999-07-01 2001-01-19 Shibaura Mechatronics Corp Cleaning device of substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05228450A (en) * 1992-02-19 1993-09-07 Hitachi Ltd Frame washing apparatus
JP3278590B2 (en) * 1996-08-23 2002-04-30 株式会社東芝 Ultrasonic cleaning device and ultrasonic cleaning method
JP3379512B2 (en) * 1999-06-30 2003-02-24 セイコーエプソン株式会社 Cleaning apparatus, cleaning method, and method of manufacturing liquid crystal device
JP4523195B2 (en) * 2001-04-16 2010-08-11 芝浦メカトロニクス株式会社 Substrate cleaning apparatus and method
JP4414116B2 (en) * 2001-08-21 2010-02-10 芝浦メカトロニクス株式会社 Substrate cleaning apparatus and substrate cleaning method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193197A (en) * 1987-10-05 1989-04-12 Fujitsu Ltd Substrate cleaning mechanism
JPH09139375A (en) * 1995-11-16 1997-05-27 Dainippon Screen Mfg Co Ltd Substrate edge processor
JP2001015896A (en) * 1999-07-01 2001-01-19 Shibaura Mechatronics Corp Cleaning device of substrate

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CN101080283A (en) 2007-11-28
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KR20070085666A (en) 2007-08-27
JP4402579B2 (en) 2010-01-20

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