JP2011039116A - Device and method for mounting fpd panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that there is a risk of re-attaching dusts or glass pieces from the surface because, in the conventional back surface wiping, the back surface is wiped by a cleaning tape after wiping the surface, in consideration of the higher frequency of occurrence of defections caused by the attached foreign matter on the back surface of the substrate in accordance with the thinning of an FPD display substrate and the sharpening of a joint process. <P>SOLUTION: Upon parts-mounting joint processing of a display apparatus, dust and contamination attached to a terminal part of the display substrate is wiped with the surface of a cleaning tape and, at the same time, the back surface of a terminal part of the display substrate is wiped with the back surface of the cleaning tape by which a terminal part of other display substrate is already wiped. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention includes mounting of a driving IC around a display substrate of an FPD (Flat Panel Display) such as liquid crystal or plasma, so-called TAB (Tape Automated Bonding) connection such as COF (Chip on Film), FPC (Flexible Printed Circuit), and the like. The present invention relates to a mounting apparatus for mounting a peripheral board (PCB, Printed Circuit Board) and a display board module assembly line including the mounting apparatus. More specifically, for example, a mounting apparatus and mounting method having a substrate cleaning mechanism suitable for processing operations for mounting TAB and IC, and a display substrate module assembly line or display substrate module configured based on the mounting apparatus or mounting method The present invention relates to an assembling method.

  The display substrate module assembly line is a process substrate for FPD display substrates such as liquid crystal and plasma (hereinafter, simply abbreviated as a substrate, and clearly described as a PCB substrate in the case of a PCB, for example). Is a device for mounting a driving IC, a TAB, a PCB substrate, and the like around the substrate by sequentially performing the above.

  For example, as an example of the processing step, (1) a terminal cleaning step for cleaning the TAB attachment portion at the substrate end, (2) an anisotropic conductive film (ACF, Anisotropic Conductive Film) is attached to the substrate end after cleaning. (3) A mounting step in which the TAB or IC is positioned and mounted at the position where the ACF is pasted on the substrate. (4) A pressing step in which the mounted TAB or IC is fixed by ACF by thermocompression bonding. (5) A PCB process (consisting of a plurality of processes) for attaching and mounting a PCB substrate on which an ACF is previously bonded to the side opposite to the TAB substrate side is included. Note that the ACF only needs to be attached in advance to either one of the members to be joined. As another example of the above processing steps, a configuration in which the ACF is attached in advance to the TAB or IC side is also possible. Furthermore, the number of each processing apparatus or a processing apparatus for rotating the substrate is required depending on the number of sides of the substrate to be processed and the number of TABs and ICs to be processed.

  Through such a series of processes, electrical connection is made through conductive particles inside the ACF by thermocompression bonding between the electrode on the substrate and the electrode provided on the TAB, IC, or the like. . At the same time, the substrate and TAB, IC, etc. are also mechanically bonded by curing of the ACF base resin.

  In order to securely attach the ACF to the electrode on the substrate, it is essential to clean the terminal portion. For example, as described in Japanese Patent No. 3564491, a ribbon-shaped cleaning tape is impregnated with a cleaning liquid, and the terminal is wiped off. (Patent Document 1).

  Furthermore, in order to wipe off the back surface of the substrate while saving the amount of the cleaning tape used, for example, as described in Japanese Patent No. 3445709, when the cleaning tape is folded back, the back surface of the substrate is wiped off. A method of wiping two surfaces with a cleaning tape is also known (Patent Document 2).

Japanese Patent No. 3564491 Japanese Patent No. 3445709

In recent manufacturing of FPD liquid crystal panels and the like, a thinner glass substrate tends to be used in order to reduce the weight of the glass substrate. Furthermore, the adoption of ACF that can be fully cured in a short time is being promoted to improve productivity. However, the short-curing type ACF has a lower adhesive strength at a lower temperature than that of the conventional type, and when ACF is applied. There is a tendency for the pressure to be increased when mounting parts. As a result, due to dust adhesion on the back side of the glass substrate, the glass substrate is subjected to an unbalanced load and the frequency of defects that cause the glass substrate to break is increasing.
In view of such a situation, the demand for dust adhering to the back surface of the glass substrate is increasing more than ever.

  On the other hand, as the selling price of the liquid crystal panel decreases, there is an increasing demand for cost reduction in the manufacturing process, and it is also important to reduce the amount of cleaning tape used as a consumable member.

  In the method of Patent Document 1, only one side of the display panel can be wiped off, and if the back side is wiped off, it is necessary to separately provide a wiping device on the opposite side, which increases the amount of cleaning tape used. There are challenges.

  On the other hand, in the method of Patent Document 2, the cleaning tape that wipes off the front side is turned back and the back side is wiped at the same time, so that the back surface of the substrate is also cleaned without the need for additional cleaning tape. However, in this method, the cleaning tape that wiped the front side comes into contact with the back surface at the time of the next wiping, so there is a possibility that the dust removed from the front side is reattached to the back side. Furthermore, in this method, there is a possibility that the cleaning tape will rub the edge portion of the glass substrate, and if the chamfering processing of the edge portion of the glass substrate is not sufficiently performed, the glass piece peeled off from the edge portion is rubbed on the back surface. There was a risk of attaching. In order to avoid this, there is a method that does not use cleaning tape that may be contaminated with dust on the surface or glass fragments at the end by sending extra cleaning tape, but the amount of cleaning tape used increases. Problems arise.

  Therefore, an object of the present invention is to solve the following problems. First, dust and glass pieces adhering to the cleaning tape by wiping the front side of the glass substrate should not be reattached when wiping the back side of the glass substrate. Second, in order to wipe off the back surface of the glass substrate, an extra cleaning tape is used to increase the amount of use of the cleaning tape, which is a consumable item, without increasing the manufacturing cost.

  In order to achieve the first object described above, the cleaning of the cleaning tape in the terminal cleaner device is carried out by pulling the tape whose surface is wiped outward from the outer edge of the glass substrate, and then twisting the cleaning tape to turn the front and back Inverted and wiped the back surface of the glass substrate. As a result, dust and glass pieces adhering to the surface of the glass substrate do not penetrate the back surface of the cleaning tape, so that there is no fear of reattaching to the glass substrate when wiping the back surface of the glass substrate.

  In order to achieve the second object, the cleaning tape feeding operation performed after wiping the glass substrate is set to a feeding amount sufficient to wipe the surface of the glass substrate with a new cleaning tape. The back side was wiped off using the back side of the used cleaning tape. As a result, the cleaning tape can effectively utilize both the front and back surfaces, and the both surfaces of the glass substrate can be wiped without increasing the amount of the cleaning tape used.

  According to the present invention, dust and glass fragments on the surface of the glass substrate are removed from the back surface of the glass substrate while wiping the front and back surfaces of the glass substrate with the required cleanliness without increasing the amount of cleaning tape used compared to the prior art. Wiping can be performed without fear of re-adhering. Thereby, it is possible to avoid an increase in process cost while avoiding a decrease in mounting yield in the mounting process of the FPD panel.

1 is a floor layout diagram showing an entire display substrate module assembly line according to an embodiment of the present invention. It is a perspective view which shows the external appearance of the terminal cleaning head which is the 1st Embodiment of this invention. It is a perspective view which shows the wiping state of the terminal cleaning head which is the 1st Embodiment of this invention. It is a schematic diagram which shows the operation | movement in the wiping state of the terminal cleaning head which is the 1st Embodiment of this invention. It is an elevational view showing the appearance of a terminal cleaning head that is a second embodiment of the present invention. It is a perspective view which shows the other Example of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a floor map showing an entire display substrate module assembly line 1 according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an appearance of a terminal cleaning head according to the first embodiment of the present invention.

  The apparatus shown in FIG. 1 includes a substrate holding means 12 for holding a substrate P and a transfer device including a transfer arm 11 for transferring the substrate to the position of an adjacent mounting apparatus. This is a line device that performs various processing operations on the peripheral part of the substrate while sequentially transporting, and performs mounting and assembly operations such as IC and TAB. FIG. 1 (a) shows the first half and FIG. 1 (b) shows the second half. Show. Although it is actually a connected mounting line, it is divided into two for convenience of drawing. The apparatus shown in FIG. 1 is covered with a housing 13 that also serves as a safety cover for each functional unit, and each has a transfer arm 11. Since the transfer is performed to an arbitrary station of the apparatus, the movement range is movable from the own apparatus to the next apparatus. Further, since the transfer arm 11 needs to change the direction of the substrate P, it can be turned in units of 90 degrees.

  In FIG. 1A, the terminal cleaner 14S is supplied with the substrate P by an external transfer device (not shown). The substrate P is stably held by the substrate holding means 12 and wiped off by the terminal cleaning head 14a. At this time, since the terminal cleaning head 14a wipes the entire area while moving along the processing side by the rail 14b, the short side terminal of the substrate P cleans the terminal having the short side at once.

  Similarly, the next terminal cleaner 14L has a substrate holding means 12 for holding the substrate P supplied by the transfer arm 11 of the preceding terminal cleaner 14S, a terminal cleaning head 14c, and a rail 14d. Clean the side terminals.

  In the next ACF sticking apparatus, since the ACF sticking process is sequentially performed for each component mounting position, a process that takes a long processing time is performed. Here, it is assumed that the electronic component 3C, which is two IC chips, is attached to the short side, and the electronic component 3T, which is four COFs, is attached to the long side. The process time required to attach one ACF is almost the same for both IC and COF. Therefore, in order to achieve tact balance, the ACF attachment head on the long side must be attached to the short side. It is appropriate to prepare about twice the head. In the present embodiment, one ACF adhering head 15a is provided in the short-side ACF adhering device 15S, and two ACF adhering heads 15C are provided in the long-side ACF adhering device 15L. The ACF adhering heads 15a and 15c are installed on independent rails 15b and 15d, respectively, and can be attached by moving the processing side of the two substrate holding means 12 respectively. Further, each of these ACF attaching devices 15S and 15L includes one transfer arm 11 and can load and unload the substrate P with respect to an arbitrary substrate holding means 12.

  Next is the TAB / IC mounting device 16 shown at the left end of FIG. Here, first, a TAB mounting device 16L on the long side is provided. This is because the immediately preceding ACF sticking device 15L is on the long side, and the transport time is shortened by aligning the direction with this. Similarly, in order to mount four electronic components 3T, two electronic component mounting heads 16a are provided, and each is mounted on a rail 16b. Each of the electronic component mounting heads 16a is provided with two substrate holding means 12. Each electronic component mounting head 16a is provided with two COF punching supply devices 16c. Actually, there are two COF punching and feeding devices so as not to cause a wait at the time of reel replacement, and one of them is in operation. In addition, one transport arm 11 is mounted on the TAB mounting device 16L.

  Next, the main crimping device 17L on the long side is also provided. Again, the conveyance time is shortened by aligning the processing side with the immediately preceding apparatus. Also, the mounting process just before is temporary mounting using the adhesive property of ACF, and since the adhesive strength is weak, it does not give extra conveyance vibration and is quickly firmly fixed by the main crimping process, resulting in reduced accuracy and COF peeling. This is also because it is necessary to prevent defects caused by. Since the crimping tool (not shown) capable of pressurizing and heating the electronic components 3T, which are four COFs, is provided in the present crimping apparatus 17L, the process time itself is long, but the total process time is short. A single processing head may be used. The main crimping device 17L is also provided with a single transfer arm 11.

  Next, an IC mounting device 16S which is a TAB / IC mounting device 16 on the short side is provided. Here, only the electronic component 3C, which is two ICs, is mounted, and one electronic component mounting head 16d is provided, and each is mounted on the rail 16e. Two substrate holding means 12 are installed, and one IC supply device 16f is installed on the back. Since many ICs are charged in a state where a large number of ICs are aligned on a resin-made IC chip tray, the time required for replacing the tray is negligible, and it is not necessary to provide an extra supply unit as compared with the COF punching supply device. In addition, one transfer arm 11 is mounted on the IC mounting device 16S.

  Subsequently, a short crimping device 17S on the short side is provided. The crimping device 17S is provided with a crimping tool (not shown) that can pressurize and heat the electronic components 3C, which are two ICs, so that the process time itself is long, but the total process time is short. One processing head is sufficient. The main crimping device 17S is also provided with one transport arm 11.

  FIG. 1 shows a state in which the substrate P is placed on each substrate holding means 12, but each processing has a certain allowance time, but the substrate is transferred synchronously.

  Next, FIG. 2 shows a detailed external view of the terminal cleaning head 14a of the terminal cleaner 14S schematically shown in FIG. Actually, the terminal cleaning head 14c of the terminal cleaner 14L has the same structure. The state of FIG. 2 shows a state where the cleaned substrate P is discharged and waiting for the next substrate P to be supplied.

  The ribbon-shaped cleaning tape 20 is supplied while being wound around a new reel 21. The cleaning tape 20 is drawn out by winding a drawing roller 22. The pull-out roller 22 is a component in which two pull-out free rollers on the drawer side and the collection side are arranged on the same axis, and depends on the remaining amount of the cleaning tape 20 on the new reel 21 and the amount collected on the collection reel 30. Even when the unwinding position or the winding position varies, the pulling angle is regulated so that the handling of the cleaning tape 20 is not affected.

  The cleaning tape 20 around which the drawing roller 22 is wound next winds the drum roller 23 disposed obliquely. At this time, the drum roller 23 is a drum-shaped free roller attached coaxially to an arm 38 attached to an arm base 39, and has a function of switching the drawing direction of the cleaning tape 20 diagonally.

  The cleaning tape 20 drawn in the oblique direction by the drum roller 23 is then wound in the horizontal direction by a guide roller 24 with a hook. Since the lower end surface of the guide roller 24 and the upper surface of the next capstan roller 25 are substantially at the same height, the cleaning tape 20 is kept substantially horizontal between the two.

  The capstan roller 25 is a roller with a hook and a slip stopper. Since the capstan roller 25 is disposed in the rear direction in FIG. 2, a specified amount of feed drive is performed by a feed motor 44 (not shown). If the cleaning tape 20 slips during the feeding operation, the feed amount becomes inaccurate, so that the tread surface of the capstan roller 25 is subjected to anti-slip processing, and further, the pinch roller 26 makes contact with the tread surface of the capstan roller 25. In the meantime, the cleaning tape 20 is sandwiched so as to apply a vertical drag, thereby preventing slippage.

  The cleaning tape 20 around which the capstan roller 25 is wound winds a guide roller 27 with a hook for limiting twisting provided next. At this time, the cleaning tape 20 is twisted between the two rollers so that the front and back are reversed. By winding the guide roller 27, the twist of the cleaning tape 20 is prevented from moving to another part during use. The upper surface of the guide roller 27 is located above a substantially horizontal path formed by the upper surface of the next guide roller 28 and the lower surface of the capstan roller 25 and at a position lower than the work surface height through which the substrate P passes later. No tension is lost even during standby or during wiping work, and the torsional part does not move to another part.

  The cleaning tape 20 around which the guide roller 27 is wound is wound around a guide roller 28 with a flange. Here, the trajectory of the cleaning tape 20 from the guide roller 24 toward the capstan roller 25 and the trajectory of the cleaning tape 20 from the guide roller 27 toward the guide roller 28 are substantially parallel to each other, although there is a vertical separation. Both inner surfaces of the supply reel face downward, and obliquely cross a space formed by the upper cleaning pad 31 and the lower cleaning pad 33 facing each other. This is an arrangement that allows the front and back surfaces of the cleaning tape 20 to be pressed against the front and back surfaces of the substrate P when the upper and lower cleaning pads 31 and 33 sandwich the substrate P, as shown in FIG.

  The cleaning tape 20 around which the guide roller 29 is wound is bent in the drawing direction by the drum roller 29 and becomes a direction toward the paper surface depth direction. The drum roller 29 is also a drum-shaped free roller, like the drum roller 23 shown above, and is coaxially attached to an arm 38 attached to an arm base 39.

  The cleaning tape 20 whose direction has been changed by the drum roller 29 is then wound around the collection reel 30 while the pulling roller 22 is wound and the pulling position is maintained. The new reel 21 may be provided with a clutch brake to follow the feed amount of the cleaning tape 20 by the capstan roller 25 and maintain a constant tension, but the recovery reel 30 is driven from the capstan roller 25. It is necessary to wind the cleaning tape 20 with a certain tension, and the cleaning tape 20 is driven by a winding motor 45 (not shown) with a tension control.

  Since the cleaning tape 20 is impregnated with a solvent at the time of wiping, the vicinity of the wiping portion is covered with a hood 35 (in the figure, the twisted portion of the cleaning tape 20 is shown to be shifted to the right from the original position). It is connected to a bellows-like and flexible exhaust duct 37 via a joint 36, and finally connected to an organic exhaust duct in a factory.

  These mechanisms are attached to the frames 41, 42, and 43, are further fixed to the turning stage 41, and are further installed on the linear motion stage 40 provided on the rail 14b. Adjustment operation and movement along the side of the end having the terminals of the substrate P can be performed.

  The state of this wiping operation is shown in FIG. In FIG. 2, in order to make the state of the terminal cleaning head 14 a easy to see, the substrate P is shown transparent, and the holding table for the substrate P is omitted. When the substrate P is set on the terminal cleaner 14S, the terminal cleaning head 14a moves to the right end in the figure, and the wiping range formed by the upper cleaning pad 31 and the lower cleaning pad 33 facing each other is the position facing the right rear of the substrate P. Move up. Thereafter, the lower cylinder 33 rises to the stroke end, and the wiping surface of the lower cleaning pad 33 contacts the back surface of the substrate P via the cleaning tape 20. The stroke end of the lower cylinder 34 is adjusted in advance to the installation height of the substrate P. Immediately after that, the upper cleaning pad 31 is lowered by the upper cylinder 32, and the wiping surface of the upper cleaning pad 31 presses the surface of the substrate P through the cleaning tape 20. The pressing force at this time is a force necessary and sufficient for wiping off the substrate P, and is adjusted to a value that does not push the lower cylinder 34 back from the stroke end. As a result, the cleaning tape 20 is pressed against both the front and back surfaces of the substrate P with a sufficient and sufficient pressing force for wiping, but the forces are antagonistic, and there is no fear of applying an external force that pushes and bends the substrate P.

  In this state, the terminal cleaning head 14a moves on the rail 14b to the left in the figure by the operation of the linear motion stage 40. Since the board | substrate P is hold | maintained so that the rail 14b and the wiping edge may become parallel, the wiping edge of the board | substrate P will be wiped off the front and back with the cleaning tape 20 over the full length. A surface of the cleaning pads 31 and 33 facing the substrate P is pasted with a solvent-resistant fluorine rubber or alcohol-resistant EPDM rubber plate, and the cleaning tape 20 follows the minute undulation of the substrate P. Wiping is done.

  When the terminal cleaning head 14a arrives at the left end of the substrate P, the terminal cleaning head 14a stops moving, the upper cleaning pad 31 and the lower cleaning pad 33 are retracted, and the wiping operation ends. It should be noted that the wiping start position and the wiping end position are performed at positions where the cleaning pads 31 and 33 do not hit the left and right edges of the substrate P. This is because the edge portion of the substrate P is cut and cut from the mother glass, and the edge portion shows a sharp fractured surface, or when fine cracks are left due to damage due to glass cutting, There is a case where a piece is attached, and if this part is carelessly wiped off, the cleaning tape may be broken or fuzzed to generate foreign matter, or the glass piece may be peeled off and spread. is there. If the edge of the substrate P is chamfered in advance, the cleaning tape is less likely to break, but the color filter side glass substrate of the substrate P cannot be edged, so rubbing here should be avoided. It is.

  However, the original terminal cleaning process is intended to wipe off the glass pieces and hard dusty foreign matters that have occurred in the intermediate process on the terminal portion of the substrate P. It is inevitable that foreign matter adheres. Further, the cleaning tape 20 comes into contact with the end portion of the substrate on the color filter side to generate a foreign substance, and this adheres to the cleaning tape 20 occurs at a certain frequency.

  Since these dust and glass pieces do not penetrate the cleaning tape 20 and reach the back surface, the back surface of the cleaning tape 20 is not contaminated with dust and glass pieces. Therefore, the cleaning tape 20 is twisted between the capstan roller 25 and the guide roller 27 so that the front and back are reversed. This state is schematically shown in FIG.

  FIG. 4A shows the arrangement in the standby state. The cleaning tape 20 is held in a U shape by guide rollers 24, 27 and 28 and a capstan roller 25. Although the cleaning tape 20 is twisted between the capstan roller 25 and the guide roller 27, the guide roller 27 is pushed up above the plane formed by the lower surface of the capstan roller 25 and the upper surface of the guide roller 28. The part does not move to other parts. At this time, the upper cleaning pad 31 and the lower cleaning pad 33 are open, and the cleaning tape 20 is not touched, so that the rotation feed of the capstan roller is not hindered.

  Next, as shown in FIG. 4B, immediately before the substrate P is carried in, the upper cleaning pad 31 and the lower cleaning pad 33 are closed, and the cleaning tape 20 is formed by the rubber plate pads 31a and 33a provided on the respective surfaces. Is inserted. The upper cleaning pad 31 has a horseshoe shape, and a dropping nozzle 46 is installed in the gap portion to drop a prescribed amount of solvent. Here, isopropyl alcohol is used. The cleaning tape 20 is a finely woven fabric, and even when dripped on the back side of the cleaning tape 20, it easily penetrates into the cleaning tape 20 on the front side and further on the downstream side pressed against the cleaning tape 20, but is a pad made of fluoro rubber. It does not attack 31a and 33a.

  Thereafter, as shown in FIG. 4C, the upper cleaning pad 31 and the lower cleaning pad 33 are temporarily opened, and the substrate P is arranged in the generated gap. As can be seen from the drawing, the upper surface of the guide roller 27 is lower than the back surface of the substrate P, so that the guide roller 27 does not touch the substrate P when the substrate P is installed.

  Further, as shown in FIG. 4D, the upper cleaning pad 31 and the lower cleaning pad 33 are closed, the substrate P is sandwiched through the cleaning tape 20, and the terminal cleaning head 14a in the illustrated range other than the substrate P is integrated. Then, wiping is performed by moving to the left in the figure. In FIG. 4, since it is shown two-dimensionally, it seems that the substrate P collides with the capstan roller 25. However, the cleaning tape 20 is actually arranged at an angle, and the capstan roller 25 is shifted to the position behind the paper surface. Since it is arranged, the feed movement is possible without colliding with the substrate P.

  After the wiping is completed, the state returns to the state shown in FIG. 4A again, and the cleaning tape 20 does not overlap the portion to be used next by the capstan roller 25 and the pinch roller 26 (not shown). The specified length is fed. Since the cleaning pads 31 and 33 have a narrow rectangle compared to the width of the cleaning tape 20, the feed length of the capstan roller 25 can be shorter than the length of the cleaning pads 31 and 33.

  The cleaning tape 20 used here is a finely woven fabric made of microfibers obtained by forming a twill weave as a fiber in which short fibers of nylon and polyester having a diameter of several microns are integrated, and then removing glue. . A finely woven fabric with less voids, which is peculiar to twill, is further loosened into monofilaments, so it is excellent in wiping and adsorbing fine dust. At the same time, when wiping in a state impregnated with a normal solvent, it can be expected that dust and fine glass pieces do not penetrate into the back surface of the fabric and are captured by a bundle of fibers in the middle.

  For this reason, water-soluble or oil-soluble contaminants such as hand fat and saliva are likely to dissolve in isopropyl alcohol and penetrate the back surface, but do not penetrate particulate foreign matter such as dust or glass fragments. The back surface of 20 can be expected to be free of foreign matter even after wiping. For this reason, turning the cleaning tape 20 upside down and wiping off the back surface of the substrate P reduces the possibility of reattaching particulate foreign matter from the surface to at least the back surface of the substrate P. In addition, contamination due to soluble contamination can be expected to be diluted because it is a very small amount, and even if contamination is transferred from the surface of the substrate P, the contamination of the glass substrate P during the crimping process is expected. It does not cause foreign matter cracking due to stress concentration.

  As described above, as the first embodiment of the present invention, the cleaning tape is disposed obliquely with respect to the outer edge of the substrate P, and is used in the cleaning method in which the cleaning head is moved by wiping by pressing with a flat pad. Although shown, this invention is not limited to this, A various deformation | transformation can be considered in the feeding direction of a cleaning tape, the moving method, and the pressing method to the board | substrate P. FIG. For example, in the first embodiment, a method of cleaning the large substrate and assuming that the substrate P is fixed and the cleaning head 14a runs is shown. In cleaning the small liquid crystal substrate, the cleaning head 14a is not self-propelled, but it is easier to move and wipe the holding member of the smaller substrate P. In such applications, the terminal cleaning head 14a is more moved. The linear motion unit 40 and the rail 14b can be simplified.

  FIG. 5 shows an embodiment in which the cleaning tape 20 is arranged in parallel with the wiping edge of the substrate P, and the upper cleaning pad 31b and the lower cleaning pad 33b are each composed of two rollers.

  The cleaning tape 20 set on the supply reel 21 is wound around a drawing roller 22 a, a guide roller 24, a guide roller 27 with a hook for restricting torsion, a drawing roller 22 b, a capstan roller 25, and a pinch roller 26. Rolled up. In this embodiment, the supply reel 21 and the recovery reel 30 are individually tensioned by a torque motor. In this embodiment, the cleaning tape 20 is twisted between the two guide rollers 27 with a twisting-restricting flange so that the front and back are reversed.

  In this embodiment, the terminal cleaning head 14e is inevitably larger than the substrate P. Therefore, the terminal cleaning head 14e is kept stationary, and the substrate P is wiped while moving in the drawing direction on the right hand side of the drawing. Space efficiency and the advantage that the substrate time can be included in the process time occur. Further, since the frictional force accompanying the wiping coincides with the warp direction of the cleaning tape 20, there is an advantage that even if wiping is performed with a strong frictional force, fiber fraying and fabric deformation are less likely to occur. Further, since a roller is used for the cleaning pad, there is an advantage that friction can be reduced during the feeding operation of the cleaning tape 20 and the generation of foreign matter is reduced.

  Similarly, it is naturally possible to set the running direction of the cleaning tape 20 to be perpendicular to the wiping edge of the substrate P. FIG. 6 shows the appearance. The upper and lower cleaning pads 31c and 33c are composed of a solvent-resistant fluororubber block, and in the figure, a clamping operation is performed vertically by a clamping mechanism disposed on the back side of the frame. The cleaning tape 20 unwound from the supply reel 21 is wound around a drawing roller 22a, a guide roller 24, an upper cleaning pad 31c, a twist-control guide roller 27, a lower cleaning pad 33c, a capstan roller 25, and a drawing roller 22b. It is wound around the collection reel 30. There are two guide rollers 27 for twist control, and the cleaning tape 20 is twisted between them.

  As described above, since the upper cleaning pad 31c and the lower cleaning pad 33c can clamp the substrate P with the upper body with the cleaning tape 20 sandwiched between the front and back, the terminal cleaning head 14f can be run along the rail 14b in this state. The terminal side of the substrate P can be wiped off.

  In this embodiment, since the cleaning pads 31c and 33c can be arranged at right angles to the cleaning tape, there is an advantage that the entire width of the cleaning tape 20 can be used for wiping without gaps.

  In the embodiments described so far, the guide rollers 24, 27, 28, the drawing roller 22 and the like are described as rollers. However, when the winding angle is small, the load on the shaft is small. A smooth finished guide pin can be used instead. In this case, since the structure can be simplified, the cost can be reduced, and the terminal cleaning head can be made smaller.

1: Display substrate module assembly line 2: Transport means
3: electronic components, 11: substrate transfer means,
11: transfer arm, 12: substrate holding means,
12A: Both sides holding part, 12B: Connection holding part,
13: housing,
14: Terminal cleaning device, 15: ACF sticking device,
16: TAB / IC mounting device, 16a: mounting section,
17: This crimping device,
20: cleaning tape, 21: supply reel, 22: drawer roller,
23, 29: drum roller, 24, 27, 28: guide roller,
25: Capstan roller, 26: Pinch roller, 30: Collection reel,
31: Upper cleaning pad, 32: Upper cylinder,
33: Lower cleaning pad, 34: Lower cylinder,
P: Substrate (display substrate).

Claims (7)

  An FPD panel mounting apparatus having an upper pressing member for wiping a terminal portion of a board end for mounting a component with a cleaning tape and a lower pressing member for wiping a rear surface of the board end for mounting a component. An FPD panel mounting apparatus comprising a twist restricting means for twisting the cleaning tape along a path from the member to the lower pressing member.   2. The FPD panel mounting apparatus according to claim 1, wherein the twist restricting means includes a guide roller.   3. The FPD panel mounting apparatus according to claim 1, wherein the cleaning tape is disposed obliquely at an end portion of a board on which components are mounted.   3. The FPD panel mounting apparatus according to claim 1, wherein the cleaning tape is disposed in parallel with an end portion of a board on which components are mounted.   3. The FPD panel mounting apparatus according to claim 1, wherein the cleaning tape is arranged at right angles to a substrate end portion on which a component is mounted.   An FPD panel mounting method comprising: wiping a terminal portion of a substrate end with a surface of a cleaning tape at the time of component mounting, and simultaneously wiping a back surface of a substrate end with a back surface of the cleaning tape.   The FPD panel mounting method according to claim 6, wherein a portion of the cleaning tape that wipes off the back surface of the end portion of the substrate is after the terminal surface of the substrate processed before the substrate on which the component mounting being wiped off is wiped off. An FPD panel mounting method, wherein the FPD panel is mounted on the back side of the part.

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