JP4031625B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method which are used for manufacturing a flat panel display such as a liquid crystal display panel and are suitable for mounting an electronic component on a flat panel.
[0002]
[Prior art]
For example, in manufacturing a liquid crystal display panel, an electronic component mounting apparatus that mounts a TCP (Tape Carrier Package) corresponding to an electronic component on a flat panel (hereinafter referred to as “cell”) corresponding to a substrate is used.
[0003]
The electronic component mounting apparatus will be described. This apparatus is roughly divided into a bonding member sticking apparatus for sticking an anisotropic conductive tape, which is a joining member, to a cell, and TCP is temporarily pressure-bonded to the cell via the anisotropic conductive tape. The apparatus includes a temporary pressure bonding device, a main pressure bonding device that pressurizes the TCP with a pressure tool while the cell is supported by a backup member, and a pressure bonding tool to the cell, and a transport device that transfers the cell between these devices.
[0004]
[Problems to be solved by the invention]
By the way, in the electronic component mounting apparatus described above, as shown in FIG. 5, in particular, in the present crimping apparatus, cell fragments made of glass or the like may adhere to the backup surface 51 of the backup tool 50 as foreign matter 52, Under such conditions, when the pressure bonding of the TCP 54 to the cell 55 using the pressurizing tool 53, the cell 55 is damaged, a product defect occurs, and the product yield is reduced.
[0005]
An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of preventing a product defect that has occurred due to a backup member and improving a product yield.
[0006]
[Means for Solving the Problems]
The present invention provides an electronic component mounting apparatus that mounts an electronic component on the substrate using a pressure tool in a state where the substrate is supported by the backup member, and includes a cleaning device that cleans the backup surface of the backup member, and the cleaning device Is provided with a cleaning member at the end of a rotating arm provided at both longitudinal ends of the backup member, and the cleaning member is positioned at the cleaning position of the backup surface by rotating the rotating arm. And
[0007]
Further, the cleaning of the backup surface by the cleaning device may be performed before the backup member backs up the substrate.
[0008]
The cleaning of the backup surface by the cleaning device may be performed every time one mounting operation by the pressure tool.
[0011]
In an electronic component mounting method in which an electronic component is mounted on the substrate using a pressure tool in a state where the substrate is supported by a backup member, rotation arms provided at both ends in the longitudinal direction of the backup member before the mounting operation. A cleaning member is provided at the end, and the backup surface of the backup member is cleaned using a cleaning device that rotates the rotating arm to position the cleaning member at a cleaning position of the backup surface. .
[0012]
[Action]
According to the mounting apparatus and the mounting method of the present invention, the backup surface of the backup member is cleaned, product defects caused by the backup member are prevented, and the product yield can be improved.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0014]
FIG. 1 is a front view of an embodiment of the present crimping apparatus constituting the electronic component mounting apparatus of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a peripheral part of the cleaning apparatus used in FIG. 2A is a front view, and FIG. 2B is a side view.
[0015]
In addition, in the previous stage of the main crimping apparatus 1 shown in FIG. 1, as in the prior art, a bonding member affixing device for affixing the anisotropic conductive tape 3 as a bonding member to the cell 2 corresponding to the substrate is affixed to the cell. Temporary crimping devices for temporarily crimping TCP4 corresponding to electronic components to the cells 2 via the anisotropic conductive tape 3 are respectively arranged, and the cells 2 temporarily crimped to the TCP4 via the anisotropic conductive tape 3 are It is carried into the main crimping apparatus 1 by a transport device (not shown).
[0016]
In FIG. 1, 2 is a cell carried in from the previous stage, 3 is an anisotropic conductive tape interposed between the cell 2 and the TCP 4, 5 is moved up and down by a driving means (not shown), and is lifted at the time of final press-bonding described later. The back-up member 6 that supports the lower surface corresponding to the main press-bonding portion of the cell 2 and receives pressure is disposed above the cell 2 so as to face the back-up member 5 and is moved up and down by a driving means (not shown). In addition, a pressurizing tool 7 heated by a heater as necessary, and a cleaning device 7 respectively.
[0017]
Here, the cleaning device 7 will be described with reference to FIG.
[0018]
The cleaning device 7 includes a rotating arm 7a that fixes and holds a cylindrical elastic brush 7b that is rotatably supported at both ends in the longitudinal direction of the backup member 5 and has a cleaning member at the other end. A connecting rod 7c is connected to the rod 8a of the cylinder 8 and the other end is connected to the other end of the rotating arm 7a. As a result, when the rod 8a is extended by the operation of the air cylinder 8, the rotating arm 7a is rotated about one end thereof via the connecting rod 7c, and the brush 7b is moved to the backup surface 5a of the backup member 5 by this rotation. It moves while in contact. Note that these operation controls are achieved by a control device (not shown).
[0019]
Next, the operation of the main crimping apparatus 1 will be described.
[0020]
In the main crimping apparatus 1, as described above, the temporarily crimped cell 2 of the TCP 4 is carried by the transport apparatus (not shown) from the temporary crimping apparatus disposed in the preceding stage and is finally crimped. Prior to loading, the cleaning device 7 cleans the backup surface 5a of the backup member 5 as follows.
[0021]
That is, the air cylinder 8 is operated to extend the rod 8a. Then, the rotating arm 7a rotates with one end thereof as a fulcrum, and the brush 7b is moved from the standby position (the position indicated by the solid line in FIG. 3) to the cleaning position of the backup surface 5a of the backup member 5 (indicated by the two-dot chain line in the same figure). Position). In the course of this movement, the backup surface 5a of the backup member 5 is cleaned by the brush 7b, and foreign matters and the like attached to the backup surface 5a are removed.
[0022]
Although the cleaning device 7 according to the above-described embodiment rotates the rotating arm 7a of the brush 7b, the cleaning member such as a brush is moved horizontally along the backup surface 5a of the backup member 5. It may be a thing.
FIG. 4 shows this horizontal movement type cleaning apparatus. In the cleaning device 9 shown in FIG. 4, 10 is a brush, 11 is a holding arm of the brush 10, 12 is an air cylinder for moving the holding arm 11 up and down, 13 is holding the cylinder 12 and is moved in the longitudinal direction of the backup member 5. Each of the translation units is shown.
[0023]
Therefore, in this embodiment, when focusing on the movement of the brush 10, the brush 10 is positioned on one end side of the backup member 5 and below the backup surface 5 a of the backup member 5 (origin position). First, the brush 10 is raised by the air cylinder 12 via the holding arm 11. Next, the brush 10 is moved horizontally from one end side to the other end side of the backup member 5 along the backup surface 5a of the backup member 5 by the operation of the parallel moving portion 13, and then horizontally moved again to one end side and returned. In this horizontal movement, the brush 10 cleans the backup surface 5a of the backup member 5 and removes the foreign matter 52. The brush 10 returned to the one end side is lowered by the air cylinder 12 and returns to the origin position.
[0024]
Instead of reciprocating the brush and returning it to the original position for each cleaning, the brush 10 is lowered after moving beyond the other end of the backup member 5 and waits at that position. Then, the backup member 5 is moved upward at the cleaning timing, horizontally moved to one end side of the backup member 5, and lowered to return to the origin position. When the backup member 5 is horizontally moved from the other end side to the one end side, the backup member is moved. 5 backup surface 5a may be cleaned.
[0025]
In any case, the cleaning operation is performed before the new cell 2 is carried into the main crimping device from the previous stage device or every main crimping operation accompanying the downward movement of the pressurizing tool 6. Each time or the number of cells 2 and the number of crimping operations for which the main crimping operation has been completed are counted with a counter, and the count is set as necessary, for example, when the count reaches a preset value.
[0026]
Now, when the cleaning operation of the backup member 5 is completed as described above, the TCP 2 temporarily crimped cell 2 is positioned so that its main crimping portion faces the pressing tool 6 and the backup member 5 from the previous stage. After being carried in and positioned, the pressure tool 6 is lowered while the backup member 5 supports the lower surface of the cell 2 and the temporary pressure-bonded TCP 4 is finally bonded to the cell 2 in the same manner as in the past.
[0027]
As described above, according to the embodiment described above, since the foreign matter 52 on the backup surface 5a of the backup member 5 is cleaned and removed prior to the main pressure bonding process of the TCP 4 to the cell 2, the pressurizing tool 6 is used. When the TCP 4 is finally pressure-bonded to the substrate 2, it is possible to prevent the problem that the cell 2 is scratched or cracked by the foreign matter 52 as in the prior art, thereby preventing product defects and improving the product yield. be able to.
[0028]
In the above-described embodiment, the cleaning of the backup in the main crimping apparatus performed with a relatively large load in the electronic component mounting apparatus has been described. In the case where a backup member exists even when the electronic component is temporarily crimped, a cleaning device may be provided on the backup member used in the temporary crimping apparatus.
[0029]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the product defect which generate | occur | produced due to the backup member can be prevented, and a product yield can be improved.
[Brief description of the drawings]
FIG. 1 is a front view of an embodiment of a main crimping apparatus constituting an electronic component mounting apparatus according to the present invention.
FIG. 2 is a side view of FIG.
3 shows the periphery of the cleaning device used in FIG. 1. FIG. 3 (a) is a front view and FIG. 3 (b) is a side view.
4 (a) is a front view and FIG. 4 (b) is a side view of another embodiment of the cleaning device according to the present invention.
FIG. 5 is a schematic diagram showing a conventional problem.
[Explanation of symbols]
1 Crimping device 2 Cell (substrate)
3 Anisotropic conductive tape 4 TCP (electronic component)
5 Backup member 5a Backup surface 6 Pressure tool 7 Cleaning device 7a Rotating arm 7b Brush (cleaning member)
7c Connecting rod 8 Air cylinder 8a Rod 9 Cleaning device 10 Brush 11 Holding arm 12 Air cylinder 13 Parallel moving part 52 Foreign matter

Claims (4)

In an electronic component mounting apparatus that mounts electronic components on the substrate using a pressure tool in a state where the substrate is supported by the backup member, a cleaning device that cleans the backup surface of the backup member is provided , and the cleaning device includes the backup device An electronic component characterized in that a cleaning member is provided at the end of a rotating arm provided at both ends in the longitudinal direction of the member, and the cleaning member is positioned at a cleaning position of the backup surface by rotating the rotating arm. Mounting device.   The electronic component mounting apparatus according to claim 1, wherein the cleaning of the backup surface by the cleaning device is performed before the backup member backs up the substrate.   2. The electronic component mounting apparatus according to claim 1, wherein the cleaning of the backup surface by the cleaning apparatus is performed every time one mounting operation by the pressure tool. In an electronic component mounting method in which an electronic component is mounted on the substrate using a pressure tool in a state where the substrate is supported by a backup member, rotation arms provided at both longitudinal ends of the backup member before the mounting operation A cleaning member is provided at the end, and the backup surface of the backup member is cleaned by using a cleaning device that positions the cleaning member at the cleaning position of the backup surface by rotating the rotating arm. Electronic component mounting method.

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