CN101995683A - Apparatus and method for mounting FPD board - Google Patents
Apparatus and method for mounting FPD board Download PDFInfo
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- CN101995683A CN101995683A CN 201010248435 CN201010248435A CN101995683A CN 101995683 A CN101995683 A CN 101995683A CN 201010248435 CN201010248435 CN 201010248435 CN 201010248435 A CN201010248435 A CN 201010248435A CN 101995683 A CN101995683 A CN 101995683A
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Abstract
The present invention relates to an apparatus and method for mounting a FPD board. Due to thinness of a FPD display substrate and high precision of joint processing, a frequency that a foreign body attached to a back face of the substrate is an imperfect cause is high. The previous back face cleaning is that the back face is cleaned by a cleaning belt which surface is cleaned, dust and glass sheet can be attached to the surface again. In a process of loading and joining elements of a display device, dust and stain attached to a terminal part of the display substrate is cleaned by the surface of the cleaning belt, simultaneously, the back face of the terminal part of the display substrate is cleaned by the back face of the cleaning belt which has been used for cleaning the terminal part of another display substrate. Thus, there is non consideration that dust and glass sheet can be brought from the surface to be attached to the back face of the display substrate.
Description
Technical field
The present invention relates to (Flat Panel Display at FPD such as liquid crystal or plasmas, flat-panel monitor) periphery of display base plate loads drive IC and carries out COF (Chip On Film, cover brilliant film), FPC (Flexible Printed Circuit, flexible printed circuit board) so-called TAB (Tape Automated Bonding such as, belt is welded automatically) connect and installation peripheral substrate (PCB, Printed Circuit Board, printed circuit board (PCB)) erecting device and by these substrate module assembly lines that constitutes.More particularly, be about for example, the display substrate module assembly line or the display substrate module assemble method that have the erecting device of substrate wiper mechanism of the processing operation that is fit to load TAB and IC and installation method and constitute based on erecting device or installation method.
Background technology
The display substrate module assembly line be by the display base plate of FPD such as liquid crystal, plasma (below, basically abbreviate substrate as, to other substrates, situation as PCB is illustrated as the PCB substrate) carry out a plurality of treatment components successively, the device of drive IC, TAB and PCB substrate etc. is installed at the periphery of this substrate.
For example, an example as treatment process comprises: the terminal matting of the TAB paste section of (1) cleaning substrate end; (2) the ACF operation of anisotropic conductive film (ACF, Anisotropic Conductive Film) is pasted in the substrate end after cleaning; (3) in the location positioning of the stickup ACF of substrate and load TAB and the loading operation of IC; (4) by adding TAB and the IC that hot bonding is loaded, thus the pressure welding operation of utilizing ACF to fix; (5) paste the PCB operation (constituting) of loading the PCB substrate of having pasted ACF in advance in the side opposite of TAB by a plurality of operations with substrate-side.And, ACF stick in advance the parts that engage any side can, as other examples of above-mentioned treatment process, the structure that ACF is sticked in advance TAB and IC side is also passable.And limit number and the TAB of processing and the quantity of IC etc. according to handled substrate need the quantity of each treating apparatus and the treating apparatus of rotary plate etc.
According to a series of operation of such process, by the electrode on the hot bonding substrate and be located at TAB and the electrode of IC etc. between, and the electroconductive particle by ACF inside forms and is electrically connected.And, meanwhile, utilizing ACF matrix material hardening of resin, substrate and TAB and IC etc. also can be mechanically bonding.
For ACF being sticked on reliably on the electrode on the substrate, it is necessary cleaning the terminal part, and for example No. 3564491 (patent documentation 1) of Jap.P. put down in writing, with the cleaning tape of cleaning fluid infiltration silk ribbon shape, wiping terminal.
In addition, in order to save the use amount of cleaning tape again, the back side of wiping substrate again, for example No. 3445709 (patent documentation 2) of Jap.P. put down in writing, and discloses by turning back and when returning cleaning tape, the back side of wiping substrate is with the mode on a cleaning tape wiping two sides.
In the manufacturing of FPD in recent years,, have the tendency of use than thinner in the past glass substrate for the lightweight of glass substrate with liquid crystal board etc.And, adopt the ACF that can lead sclerosis at short notice to obtain progress for improving productivity, still, the ACF of short time constrictive type compares with the material of existing kind, have in the clinging power of low temperature and reduce, when pasting ACF and the tendency that strengthens of the plus-pressure when loading device.These results because the dust at the glass substrate back side adheres to, apply inclined to one side load and bad frequency that glass substrate splits uprises on glass substrate.
In view of this situation, the requirement of adhering to dust at the back side of glass substrate is higher than in the past.
And, along with the reduction of liquid crystal board price, the requirement of the cost degradation of manufacture process is also become higher, reduce as the use amount of the cleaning tape of consumable part also very important.
In the method for patent documentation 1, face that can only wiping display board one side when rear side is also wanted wiping, need be established wiping arrangement in addition at opposition side, the problem that exists the use amount of cleaning tape to increase.
In addition,,, do not need to increase cleaning tape, cleared up the back side of substrate yet by the cleaning tape that makes wiping the cross face side wiping dorsal part simultaneously that turns back in the method for patent documentation 2.But in the manner, because the cleaning tape that face side is crossed in wiping contacts with the back side when ensuing wiping, so might be with the dust removed from face side once more attached to rear side.And in the method, cleaning tape might be clipped the marginal portion of glass substrate, when not implementing chamfer machining fully in the end of glass substrate, has the danger at the glass sheet scratch back side that comes off from the end.For fear of this danger, have by cleaning tape is transmitted redundantly, do not use possibility by the method for the cleaning tape of the glass sheet of the dust on surface and end pollution, but produced the problem of the use amount increase of cleaning tape.
Summary of the invention
So, the objective of the invention is to solve following problem.The first, during the face side of in the back side of wiping glass substrate, no longer adhering to the wiping glass substrate attached to the dust and the glass sheet of cleaning tape.The second, can not use unnecessary cleaning tape for the back side of wiping glass substrate, increase use amount as the cleaning tape of consumables, increase manufacturing cost.
For reaching above-mentioned first purpose, following structure is adopted in the processing of the cleaning tape in the terminal washer device: the band of wipe surfaces side is drawn out to than the outer rim of glass substrate more in the outer part, afterwards, apply to cleaning tape and to reverse and make the upset of table, the back side, with the back side of wiping glass substrate.Like this, owing to can not be impregnated into the back side of cleaning tape, thereby during the back side of wiping glass substrate, do not invest the misgivings of glass substrate once more attached to the dust on the glass baseplate surface and glass sheet.
In addition, for reaching above-mentioned second purpose, the operational throughput of the conveying operations of the cleaning tape that carries out behind the wiping glass substrate is made as the amount that is enough to the surface of new cleaning tape wiping glass substrate, with the back side of the back side wiping glass substrate of used cleaning tape.Like this, cleaning tape can effectively be applied flexibly table, back of the body two sides, the two sides that the use amount that need not to increase cleaning tape just can the wiping glass substrate.
According to the present invention, compared with prior art, need not to increase the use amount of cleaning tape, can be with the table of required cleanliness wiping glass substrate, back of the body two sides, and do not worry the dust of glass baseplate surface and glass sheet once more attached to the enforcement wiping of glass substrate ground.Like this, can avoid the reduction of the mounting finished product rate in the installation procedure of FPD plate, and avoid the increase of processing cost.
Description of drawings
Fig. 1 is the ground configuration figure of the display substrate module assembly line integral body of expression embodiments of the present invention.
Fig. 2 is the stereographic map of outward appearance of the terminal cleaning head of expression first embodiment of the present invention.
Fig. 3 is the stereographic map of wiping state of the terminal cleaning head of expression first embodiment of the present invention.
Fig. 4 is the mode chart of the action in the wiping state of terminal cleaning head of expression first embodiment of the present invention.
Fig. 5 is the stereographic map of outward appearance of the terminal cleaning head of expression second embodiment of the present invention.
Fig. 6 is the stereographic map of expression other embodiment of the present invention.
Among the figure:
1-display substrate module assembly line, 3-electron device, 11-conveying arm, 12-substrate holding mechanism, the 13-casing, 14-terminal cleaning device, 15-ACF sticker, 16-TAB/IC loading attachment, the 16a-loading part, 17-master's press welding device, the 20-cleaning tape, 21-supplies with reel, the 22-pull roll, 23, the 29-barrel-type roller, 24,27, the 28-guide roller, the 25-capstan roller, the 26-pinch roll, 30-reclaims reel, the last cleaning pad of 31-, 32-casing top half, 33-cleans pad, cylinder under the 34-, P-substrate (display base plate) down.
Embodiment
Below, with Fig. 1 to Fig. 4 one embodiment of the present invention are described.
Fig. 1 is the ground configuration figure of display substrate module assembly line 1 integral body of expression embodiments of the present invention, and Fig. 2 is the stereographic map of outward appearance of the terminal cleaning head of expression first embodiment of the present invention.
The device of Fig. 1 is to utilize by the substrate holding mechanism 12 that keeps substrate P and be used for this substrate is transported to the conveying device that the conveying arm 11 of the erecting device position of adjacency constitutes, conveying substrate successively from left to right in the drawings on one side, periphery at substrate carries out various processing operations on one side, carry out the hookup wire device of the installation assembling operation of IC and TAB etc., Fig. 1 (a) represents first half, and Fig. 1 (b) expression is latter half of.Be actually the hookup wire of connection, but conveniently be divided into two parts mapping in order to map.Device at Fig. 1, cover the casing 13 of double as safety screen at each device of each functional unit, each functional unit has conveying arm 11 respectively, conveying arm 11 is owing to carry to any station of next device from any station of self device, and moving range is can be in the scope that moves to next device from self device.And because conveying arm 11 needs the direction of conversion baseplate P, therefore can carry out with 90 degree is the rotation of unit.
In Fig. 1 (a), terminal washer 14S is by the conveying device supplying substrate P of not shown outside.Substrate P is stably kept by substrate holding mechanism 12, by terminal cleaning head 14a wiping.At this moment, on one side because terminal cleaning head 14a utilizes guide rail 14b to move the side polished gamut along handling the limit, so the terminal with regard to the short brink of cleaning base plate P.
In next ACF sticker,, therefore implement long operation of required processing time owing to load the stickup processing that device position is implemented ACF successively at each.Here hypothesis at the electron device 3C of two IC chips of short brink stickup, is pasted the device of the electron device 3T of four COF at long side.Though since the processing time of pasting a slice ACF and needing be IC with and COF with all much at one, in order to reach the productive temp balance, the ACF of long side is pasted pressure head is prepared as about the twice of stickup pressure head of short brink to appropriately.At present embodiment, at the ACF of short brink sticker 15S an ACF is set and pastes pressure head 15a, at the ACF of long side sticker 15L two ACF are set and paste pressure head 15c.And each ACF pastes pressure head 15a and 15c and is arranged on independently on the guide rail 15b and 15d, can move the processing avris of two stylobate plate maintaining bodies 12 respectively and pastes.In addition, these ACF sticker 15S and 15L respectively possess a conveying arm 11, can be to any substrate holding mechanism 12 access substrate P.
Next be the TAB/IC loading attachment of representing at the left end of Fig. 1 (b) 16.At first be provided with the TAB loading attachment 16L of long side at TAB/IC loading attachment 16.This is because because the ACF sticker 15L of front is a long side, consistent therewith by making direction, time of delivery is shortened in implementation.Owing to load four electron device 3T similarly here, two electron devices are set load pressure head 16a, be separately positioned on the guide rail 16b.And, load pressure head 16a at each electron device two stylobate plate maintaining bodies 12 are set.In addition, load pressure head 16a at each electron device two COF perforation feedway 16c are set.In fact, COF perforation feedway does not have two in order not take place to wait for when changing the operation of reel, running be its any one party.And, be mounted with a conveying arm 11 at TAB loading attachment 16L.
Next, the main press welding device 17L of long side still is set.Here also be by making the processing limit consistent, having shortened time of delivery with the device of front.And it is the interim loading that utilizes the cementability of ACF that the loading of front is handled, because bonding strength is low, is necessary not apply unnecessary conveying vibration, promptly utilizes main pressure welding to handle and firmly fixes, and it is bad to prevent that precision reduction and COF from coming off and causing.Owing to be provided with the bonding tool (not shown) of the electron device 3T of four COF of pressurized, heated simultaneously at main press welding device 17L, though this height of processing time, total processing time is short, handles pressure head for one and just can.This main press welding device 17L also is provided with a conveying arm 11.
Again next, be provided with IC loading attachment 16S as the TAB/IC loading attachment 16 of short brink., just load the electron device 3C of two IC here, an electron device is set loads pressure head 16d, respectively be located on the guide rail 16e.And, two stylobate plate maintaining bodies 12 are set, an IC feedway 16f is set overleaf.Because IC arranges a plurality of state feedings with the IC chip disk of making at resin, the unhelpful time of replacing dish is few, compares with COF perforation feedway, and unnecessary feed unit need not be set.And, be mounted with a conveying arm 11 at IC loading attachment 16S.
The main press welding device 17S of short brink then, is set.Owing to be provided with the bonding tool (not shown) of the electron device 3C of two IC of pressurized, heated simultaneously at main press welding device 17S, though this height of processing time similarly, total processing time is short, handles pressure head for one and just can.This main press welding device 17S also is provided with a conveying arm 11.
In Fig. 1, represented on each substrate holding mechanism 12, to be equipped with the state of substrate P, had certain time more than needed, the conveying of substrate has taken place synchronously though each is handled.
Next, will in Fig. 1, the detailed outward appearance of the terminal cleaning head 14a of the terminal washer 14S of pattern ground expression be illustrated in Fig. 2.In fact the terminal cleaning head 14c of terminal washer 14L also is same structure.The substrate P that the state representation of Fig. 2 is cleaned is discharged from, and waits for the condition of supplying of next substrate P.
The cleaning tape 20 of silk ribbon shape is supplied to the state that twists in new reel 21.This cleaning tape 20 is wound on the pull roll 22 and is drawn.Pull roll 22 is configuration outlet sides and reclaim the device that the dance roller of two band ribs of side forms on coaxial, have since cleaning tape 20 in the surplus of new reel 21 with at the yield that reclaims reel 30, unreel position and take-up position when changing, constraint is drawn angle so that the impregnable effect of the processing of cleaning tape 20.
Next the reel barrel-type roller 23 of tilted configuration of the cleaning tape 20 of pull roll 22 of reeling.At this moment, barrel-type roller 23 is coaxial mounted cydariform dance rollers on the arm 38 that is installed in jib platform 39, has the effect that direction converts inclination to that centers on cleaning tape 20.
The cleaning tape 20 that utilizes barrel-type roller 23 adippings to be introduced into is reeled to horizontal direction by the guide roller 24 of next band rib.Because the lower surface of guide roller 24 and the upper surface of next capstan roller 25 are in roughly the same height, cleaning tape 20 betweens almost keep level.
The cleaning tape 20 of capstan roller 25 of reeling is reeled and is located at the guide roller 27 that following being used to limits the band rib that reverses.At this moment, between both rollers cleaning tape 20 reversed and show, the back side disposes turningly.By this guide roller 27 of reeling, prevent that reversing of cleaning tape 20 from use moving to other parts.And, above the surface level that the upper surface of this guide roller 27 forms than the lower surface by the upper surface of next guide roller 28 and capstan roller 25 is in, and be configured in the low position of height of the scope of operation of passing through than substrate P in the back, no matter still be in the wiping operation in standby, can not lose tension force, can not make the torsional part position move to other parts.
Next the reel guide roller 28 of band rib of the cleaning tape 20 of guide roller 27 of reeling.Here, though to the track of the cleaning tape 20 of guide roller 28 spacing is up and down arranged to the track of the cleaning tape 20 of capstan roller 25 with from guide roller 27 from guide roller 24, but almost parallel, at the medial surface of the supply reel of cleaning tape 20 simultaneously downwards, and, clean pad 31 obliquely in the crosscut and clean the relative and space of formation of pad 33 down.This shown in Figure 3 as in the back, when being configured to clean up and down pad 31,33 clamping substrate P, the table of cleaning tape 20, the back side and can push table, the back side of substrate P respectively.
Reeled the cleaning tape 20 of guide roller 28 by barrel-type roller 29 and crooked and wrap direction become towards the direction in paper direction inwards.This barrel-type roller 29 and the barrel-type roller 23 shown in preceding also are the dance rollers of drum shape similarly, are co-axially mounted on the arm of installing on the jib platform 39 38.
Next the cleaning tape 20 that has been changed direction by barrel-type roller 29 passes through coiling pull roll 22, keeps extraction location, finally furls and reclaims reel 30.New reel 21 keeps certain force of strain for capstan roller 25 operational throughpuies along with cleaning tape 20, possessing clutch brake gets final product, and the driving of reclaiming reel 30 need be gone up the cleaning tape of sending from capstan roller 25 20 with the certain force of strain volume, is therefore driven by motor 45 (not shown) on the volume of belt tension controller.
Because these mechanisms are installed in framework 41,42,43, and be fixed on the universal stage 49, and be arranged on guide rail 14b and go up on the set straight line transfer table 40, therefore when making wiping action, can do the adjustment action of angle and moving along the limit of the end with terminal of substrate P.
The situation of representing this wiping action at Fig. 3.In Fig. 3, in order to observe the state of terminal cleaning head 14a easily, substrate P is expressed as transparent, has omitted the maintenance platform of substrate P.If substrate P locatees on terminal washer 14S, then the right-hand member of terminal cleaning head 14a in figure moves, last clean pad 31 and clean down fill up 33 relative and wiping scope formation moves to the position corresponding to the depths, the right of substrate P.Afterwards, following cylinder 34 rises to end of travel, and the following wiping surface that cleans pad 33 contacts with the back side of substrate P by cleaning tape 20.The end of travel of following cylinder 34 is adjusted to the height that is provided with of substrate P in advance.Afterwards, last cleaning pad 31 utilizes casing top half 32 to descend, and the last wiping surface that cleans pad 31 is pushed the surface of substrate P by cleaning tape 20.At this moment pressing force is necessary and power fully to the wiping substrate P, and be adjusted into can be with the value of descending cylinder 34 to push back from end of travel.Its result, cleaning tape 20 with the necessary of the table of wiping substrate P, back of the body two sides and fully pressing force be pressed, do not have the antagonism of power and apply the misgivings of the such external force of press-bending substrate P.
Under this state, terminal cleaning head 14a action left direction in figure along with straight line transfer table 40 on guide rail 14b moves.Because to be held in guide rail 14b parallel with the wiping limit for substrate P, so the wiping limit of substrate P is cleaned in total length and is with 20 wiping tables, the back side.And on the face relative that cleans pad 31,33, being pasted with the fluororubber of solvent resistance or the EPDM rubber slab of alcohol resistance with substrate P, the small fluctuating of 20 pairs of substrate P of cleaning tape also can followed wiping.
If terminal cleaning head 14a arrives the left end of substrate P, then terminal cleaning head 14a stops to move, and last cleaning pad 31 and the following pad 33 that cleans are return, and wiping action finishes.What here should be noted that a bit is that wiping starting position and wiping end position should not clipped the position of the left and right edges of substrate P at cleaning pad 31,33.This is because exist: the edge part of substrate P has the situation of expression from the sharp keen cut surface of main glass-cutting and the edge part that cuts out; Since the damage when cutting glass, residual minimum cracked situation; Be attached with the situation of glass sheet; If the fracture of cleaning tape and fluffing may take place and produce foreign matter in careless this part of wiping, or the possibility that glass sheet is come off and spread.Implement in advance though the problem of cleaning tape fracture can be lacked,, must avoid clipping here under the situation of chamfer machining of end of substrate P because the glass substrate of the color filter plate side of substrate P can not carry out end face processing.
But terminal matting originally is loaded with the occasion of foreign matter of the dust-like of the glass sheet that comes off that produces in middle operation and hard in the portion of terminal of substrate P, purpose be wiping these, can't avoid on the cleaning tape 20 and adhere to foreign matter.And the substrate end of cleaning tape 20 contact color filter plate sides produces foreign matter, and this foreign matter is attached to being to take place with certain frequency on the cleaning tape 20.
Do not arrive the back side because these dusts and glass sheet can not soak into cleaning tape 20, therefore do not have the pollution of dust and glass sheet at the back side of cleaning tape 20.So with cleaning tape 20 show between capstan roller 25 and guide roller 27, to reverse, the back side disposes turningly.This state of Fig. 4 pattern ground expression.
The configuration of Fig. 4 (a) expression holding state.Cleaning tape 20 utilizes guide roller 24,27,28 and capstan roller 25 to remain the U font.Cleaning tape 20 is reversed between capstan roller 25 and guide roller 27, but because guide roller 27 rises on the plane that the upper surface of the lower surface of capstan roller 25 and guide roller 28 forms, therefore the position of reversing can not move to other parts.And, at this moment go up to clean between pad 31 and the following cleaning pad 33 and open, do not contact with cleaning tape 20, therefore do not hinder the rotation of capstan roller to carry.
Next, shown in Fig. 4 (b), before moving into substrate P, last cleaning pad 31 and the following pad 33 that cleans are closed, and utilize the pad 31a, the 33a that are arranged on each lip-deep rubber slab to sandwich cleaning tape 20.Last cleaning pad 31 is the shape of a hoof, and the crack part is provided with instillation nozzle 46 betwixt, the solvent of instillation ormal weight.Use isopropyl alcohol here.Cleaning tape 20 is the careful textiles of texture, even when the dorsal part of cleaning tape 20 instils, also easily is impregnated into face side and reaches the cleaning tape 20 in the downstream of contact therewith, but can not be dipped into pad 31a, the 33a that is formed by fluororubber.
Afterwards, shown in Fig. 4 (c), in a single day last cleaning pad 31 and the following pad 33 that cleans open the gap configuration substrate P that is producing.The upper surface of guide roller 27 is as from figure as can be seen, and owing to lower than the back side of substrate P, when therefore substrate P being set, guide rollers 27 can not touch substrate P.
And shown in Fig. 4 (d), last cleaning pad 31 and the following pad 33 that cleans are closed, and sandwich substrate P by cleaning tape 20, and the terminal cleaning head 14a of the diagram scope beyond the substrate P moves as one left direction in figure, to carry out wiping.Since at Fig. 4 with having made diagram two-dimensionally, therefore look similarly to be that substrate P is conflicted with capstan roller 25, but, therefore can not carry with conflicting and move with substrate P in fact because cleaning tape 20 disposes obliquely, and capstan roller 25 is configured in to the position of paper back side direction skew.After wiping finishes, return to the state of Fig. 4 (a) again, utilize capstan roller 25 and not shown pinch roll 26, cleaning tape 20 is gone up the conveying of cleaning the specified length that the parts that pad 31 contacts and the part that next will use do not overlap.Since clean pad the 31, the 33rd, the rectangle that width is littler than the width of cleaning tape 20, so the delivered length of capstan roller 25 can be shorter than the length of cleaning pad 31,33.
Here the cleaning tape 20 of Shi Yonging is as diameter is several microns the nylon and the integrated fiber that forms of staple fibre of polyester, make twills after, remove glue and the careful textile of texture that the ultrafine fiber lining (micro fibre) that obtains constitutes.Because the distinctive mesh of twills is dense and fabric that the space is few is further taken into ultimate fibre apart, thus very good to the trickle dust of wiping and absorption.Simultaneously, can expect the wiping under the state that has soaked into common solvent, dust and trickle glass sheet can not be impregnated into fabric the back side and by middle fiber capturing.
Therefore, though it is big that water-soluble or oil-soluble potpourris such as hand fat and saliva dissolve in isopropyl alcohol and are impregnated into the possibility at the back side, but, thereby can expect that the back side of cleaning tape 20 does not have foreign matter yet after wiping owing to the foreign matter of dust and glass sheet isoiony can not soak into.Therefore, with the turn over back side of wiping substrate P of cleaning tape 20, the possibility attached to the back side of substrate P is little once more from the surface with the corpuscular property foreign matter at least.And, the potpourri that deliquescent pollution forms owing to be exactly trace originally, can be expected diluted, even and just in case take place to pollute from the surface of substrate P and shift, can not become in pressure welding is handled yet and to concentrate owing to the stress of glass substrate P and reason that foreign matter destroys.
More than, as the first embodiment of the present invention, represented that cleaning tape disposes obliquely with respect to the outer rim of substrate P, utilize the contact of plane pad and cleaning head is moved and carry out the embodiment of the cleaning method of wiping, but the present invention is not limited to this, for the throughput direction and the moving method of cleaning tape, can consider various distortion to the contact method of substrate P.For example, in first embodiment, represented the cleaning of hypothesis large substrate, fixing base P, the mode of cleaning head 14a walking, but in the cleaning of the medium-sized crystal liquid substrate that is used for notebook computer be used for the cleaning of the small-sized crystal liquid substrate of mobile device, cleaning head 14a is not made self-propelled, but the holding member of more small-sized substrate P is moved carry out wiping more easy, substrate P is moved to simplify straight line mobile unit 40 and the guide rail 14b of terminal cleaning head 14a.
Fig. 5 is that the wiping limit with substrate P disposes cleaning tape 20 abreast, is made of two rollers respectively and goes up the embodiment that cleans pad 31b and clean pad 33b down.
Be positioned at guide roller 27, pull roll 22b, capstan roller 25, pinch roll 26 that the cleaning tape 20 of supplying with reel 21 twines pull roll 22a, guide roller 24, reverses the band rib of restriction usefulness, be recovered reel 30 and furl.In this embodiment, supply with reel 21 and provide tension force by torque motor respectively with recovery reel 30.Exist two the providing to cleaning tape 20 each other of guide roller 27 of band rib of reversing restriction usefulness to reverse in this embodiment, show, the upset at the back side.
In this embodiment, because terminal cleaning head 14e must be bigger than substrate P, therefore by fixed terminal cleaning head 14e, move while the pull-out direction that makes substrate to the drawing right-hand side and to carry out wiping, thereby produce good space efficiency and make bull ladle between the base board unit be contained in advantage in the processing time.And, owing to follow the friction force of wiping consistent, therefore have with strong friction force and carry out the advantage with the distortion of cloth of bursting at the seams that wiping also is difficult to produce fiber with the vertical yarn direction of cleaning tape 20.In addition, owing to use roller, thereby the friction when the conveying action that can alleviate cleaning tape 20 is arranged, produce the advantage of few foreign to cleaning pad.
Similarly, the wiping limit that the direction of travel of cleaning tape 20 is made as with substrate P meets at right angles.In Fig. 6, represent outward appearance.Cleaning pad 31c, 33c are made of the fluororubber piece of solvent resistance up and down, and the clamp system by the rear side that is configured in framework clamps action up and down in the drawings.Fill up 33c, capstan roller 25, pull roll 22b from cleaning tape 20 coiling pull roll 22a, guide roller 24, cleaning pad 31c, the guide roller 27 that reverses the band rib of restriction usefulness, following cleaning that supply reel 21 rolls out, be recovered reel 30 and furl.Two guide rollers 27 that reverse the band rib of restriction usefulness are arranged, between it, reverse to cleaning tape 20.
As mentioned above, because therefore last cleaning pad 31c and clean down pad 33c and can utilize the part at table, back side folder cleaning tape 20 to clamp substrate P makes terminal cleaning head 14f along guide rail 14b walking under this state, terminal limit that can the wiping substrate P.
In this embodiment, owing to can be configured to meet at right angles, therefore has the advantage that the width integral gapless ground of cleaning tape 20 can be used for wiping with cleaning pad 31c, 33c with cleaning tape.
And, in above embodiment, guide roller 24,27,28, pull roll 22 etc. are described as roller, but since little in the little occasion of winding angle to the load of axle, thereby can omit bearing arrangement, become level and smooth guide finger to replace with surface working.This situation can simplified structure, can realize cost degradation, and the terminal cleaning head can be processed into small-sized.
Claims (7)
1. a FPD board mounting assembly is characterized in that,
Have the following contact component that carries out the back side of the last contact component of portion of terminal of the substrate end that device installs and the substrate end that the device installation is carried out in wiping with the cleaning tape wiping,
Arrive on the path of above-mentioned contact component down by contact component on above-mentioned, have to cleaning tape and apply the torsional restraint mechanism of reversing.
2. FPD board mounting assembly according to claim 1 is characterized in that,
Above-mentioned torsional restraint mechanism is made of guide roller.
3. FPD board mounting assembly according to claim 1 and 2 is characterized in that,
Above-mentioned cleaning tape disposes in the mode that tilts with respect to the substrate end of carrying out the device installation.
4. FPD board mounting assembly according to claim 1 and 2 is characterized in that,
Above-mentioned cleaning tape disposes in the mode that is parallel to the substrate end of carrying out the device installation.
5. FPD board mounting assembly according to claim 1 and 2 is characterized in that,
Above-mentioned cleaning tape is to dispose with the rectangular mode in substrate end of carrying out the device installation.
6. a FPD method of plate installation is characterized in that,
When installing device, use the portion of terminal of the surperficial wiping substrate end of cleaning tape, use the back side of the wiping substrate end, the back side of cleaning tape simultaneously.
7. FPD method of plate installation according to claim 6 is characterized in that,
The part of the cleaning tape at the back side of wiping aforesaid substrate end is the rear side that the part after the terminal surface that carries out the substrate handled before the substrate that device installs in wiping is just crossed in wiping.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-183779 | 2009-08-06 | ||
| JP2009183779A JP2011039116A (en) | 2009-08-06 | 2009-08-06 | Device and method for mounting fpd panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101995683A true CN101995683A (en) | 2011-03-30 |
Family
ID=43766977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010248435 Pending CN101995683A (en) | 2009-08-06 | 2010-08-05 | Apparatus and method for mounting FPD board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011039116A (en) |
| CN (1) | CN101995683A (en) |
| TW (1) | TW201105427A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107774596A (en) * | 2016-08-29 | 2018-03-09 | 智璘测试技术（苏州）有限公司 | A kind of non-dust cloth wiping arrangement of mobile phone appearance Full-automatic cleaning machine |
| WO2023019774A1 (en) * | 2021-08-17 | 2023-02-23 | 江苏特丽亮镀膜科技有限公司 | Hot pressing device for acf glue film coupling structure and process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004033970A (en) * | 2002-07-05 | 2004-02-05 | Casio Comput Co Ltd | Terminal arranged section washing device |
| CN1593793A (en) * | 2003-09-10 | 2005-03-16 | 淀川美科株式会社 | Jp2005081297 |
| CN101151104A (en) * | 2005-04-01 | 2008-03-26 | 松下电器产业株式会社 | Substrate terminal cleaning apparatus and substrate terminal cleaning method |
-
2009
- 2009-08-06 JP JP2009183779A patent/JP2011039116A/en active Pending
-
2010
- 2010-07-26 TW TW99124539A patent/TW201105427A/en unknown
- 2010-08-05 CN CN 201010248435 patent/CN101995683A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004033970A (en) * | 2002-07-05 | 2004-02-05 | Casio Comput Co Ltd | Terminal arranged section washing device |
| CN1593793A (en) * | 2003-09-10 | 2005-03-16 | 淀川美科株式会社 | Jp2005081297 |
| CN101151104A (en) * | 2005-04-01 | 2008-03-26 | 松下电器产业株式会社 | Substrate terminal cleaning apparatus and substrate terminal cleaning method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107774596A (en) * | 2016-08-29 | 2018-03-09 | 智璘测试技术（苏州）有限公司 | A kind of non-dust cloth wiping arrangement of mobile phone appearance Full-automatic cleaning machine |
| WO2023019774A1 (en) * | 2021-08-17 | 2023-02-23 | 江苏特丽亮镀膜科技有限公司 | Hot pressing device for acf glue film coupling structure and process thereof |
| US11850834B2 (en) | 2021-08-17 | 2023-12-26 | Jiangsu Telilan Coating Technology Co., Ltd. | Hot-pressing device and process for anisotropic conductive film (ACF) bonding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011039116A (en) | 2011-02-24 |
| TW201105427A (en) | 2011-02-16 |
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