JP2000106479A - Recycling for circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove residual resin efficiently by sliding a cutter held at a cutter holding part movable along a guide rail secured to a table along the guide rail. SOLUTION: A guide rail 2 is secured to a table 1, a cutter holding part up/down mechanism 3 is coupled with the guide rail 2 and a cutter holding part 4 is fixed to the cutter holding part up/down mechanism 3. A slit 41 is made in the cutter holding part 4 and inserted with a cutter 5 such that the cutter 5 abuts, on the side opposite to the forward end side, against the rear side of the slit 41 to be positioned in place. The slit 41 is made in the cutter holding part 4 such that the edge side is in parallel with the table face and the cutter 5 makes an acute angle with respect to the table face. The cutter 5 is slid along the guide rail 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and apparatus for reproducing a circuit board.

[0002]

2. Description of the Related Art A COG method in which an IC such as a semiconductor element is mounted on a circuit board such as a liquid crystal panel by heating and pressing using a resin such as an anisotropic conductive film is used. And a TAB method in which an IC is indirectly mounted on a circuit board via a film carrier.

FIG. 9 is a schematic diagram for explaining the COG method. In the COG method, the driving IC 102 is connected to the liquid crystal panel 1.
01 is mounted at a predetermined position via an adhesive, and is mounted by heating and curing.

FIG. 10 is a schematic diagram for explaining the TAB method. In the TAB method, a driving IC 1 is mounted on a tape carrier.
The TAB 103 on which the liquid crystal panel 02 is mounted is mounted at a predetermined position of the liquid crystal panel 101 via a resin such as an anisotropic conductive film, and is heated and cured to be mounted.

The adhesive used in the COG method or the TAB method is in the form of a film. In particular, an anisotropic conductive film (hereinafter referred to as ACF) in which conductive particles are dispersed in the adhesive is generally used. It is used regularly.

In the case of such a liquid crystal panel, when a defect is found by inspection after mounting, a defective IC or a defective TAB is replaced with a non-defective IC in order to reduce costs.
It may be necessary to exchange for C or a good TAB. For that purpose, a defective IC or a defective TAB is peeled off. FIG. 11 is a schematic diagram showing a residual resin remaining after removing the element in the COG method. FIG.
FIG. 2 is a schematic view showing a residual resin remaining after removing TAB in a TAB method. Bad IC or bad TA
Residual resin 104 adheres to the place where B is peeled off. The remaining resin 104 hinders connection when a good IC or good TAB is mounted again. Therefore, it is necessary to remove the residual resin 104 to expose the terminals. Or later,
The process of removing the defective IC or the defective TAB from the liquid crystal panel and removing the residual resin of the liquid crystal panel is called a regeneration process.

Hereinafter, the conventional reproducing process will be described in detail.

In the case of the COG method, the back surface of the IC to be peeled is heated by a heating tool. When the bonding portion of the IC is sufficiently heated, pressure is applied from the side of the IC to peel the IC. T
In the case of the AB method, the bonded part is heated with a heated iron,
Soften the resin at the bonded part and peel off.

After peeling off an element such as an IC or TAB, a residual resin 104 remains on the circuit board.

As a method for removing the residual resin on the circuit board,
A method and an apparatus for softening the residual resin by swelling the solvent with a solvent and shaving the residual resin with a polishing cloth are disclosed in the claims of JP-A-8-107292.

In the embodiment of Japanese Patent Application Laid-Open No. 9-191029, a method of wiping with a cotton swab containing acetone is disclosed.

[0012]

However, since the above-mentioned residual resin is a cured resin, wiping with a cotton swab containing acetone, which is a method for removing the residual resin, requires a lot of labor and is inefficient. . In addition, the quality of the reproduced circuit board tends to vary.

On the other hand, the method of polishing with a polishing cloth uses a polishing cloth softer than the material used for the wiring of the circuit board in order to prevent disconnection of the wiring of the circuit board. It was time consuming and inefficient.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a method and apparatus for reproducing a circuit board capable of efficiently reproducing a high-quality circuit board. Is to do.

[0015]

According to a first aspect of the present invention, there is provided a method for regenerating a circuit board, comprising: a first step of removing an element mounted on the circuit board by using a resin from the circuit board; And a second step of removing the remaining resin from the circuit board in this order. In the method for regenerating a circuit board, a portion of the circuit board fixed to the table including the portion to which the residual resin is attached is fixed to the table 1. The second step is performed by sliding the blade 5 held by the blade holding unit 4 movable along the guide rail 2 along the guide rail 2.

According to this, since a harder blade can be used than the hardened residual resin, the residual resin can be efficiently removed. In addition, since the blade is fixed to the blade holding portion and always moves along the guide rail, it is possible to eliminate a variation in quality after removing the residual resin due to the skill of the operator in the operation.

Here, it is desirable that the tip side of the blade is held parallel to the table. This is to prevent the circuit board from being damaged.

According to a second aspect of the present invention, there is provided a circuit board reproducing apparatus for regenerating the circuit board by removing a residual resin which may adhere after removing an element from the circuit board, A table, a hitch for fixing a circuit board to the table, a guide rail fixed to the table, and a blade held by a blade holding portion movable along the guide rail. It is characterized by.

According to this, since a harder blade is used than the hardened residual resin, it is extremely effective in removing the hardened residual resin, and therefore, the time required for removing the remaining resin is reduced, and the efficiency is improved. Is improved. Furthermore, since the blade is held by the blade holding portion and is a simple operation of moving along the guide rail, the quality after reproduction is not varied by the operator, and the quality is stable. Since the blade holding portion is supported by the guide rail, the operator can effectively use the force, and the work is less fatigued. Further, since the table is provided with a hit, the necessity of manually holding the circuit board can be eliminated.

Here, the tip side of the blade is held parallel to the table. This is because the tip side of the blade is always fixed parallel to the surface of the circuit board so that the surface of the circuit board is not damaged, and as a result, the quality after reproduction is improved. Furthermore, the blade is 10 ° to 70 ° with respect to the table surface.
And hold at an angle. To remove residual resin, if the angle between the blade and the table surface is 70 ° or more,
When shaving off the remaining resin, the cutting edge is bent by the remaining resin and cannot be cut off. Further, if the angle between the blade and the table surface is 10 ° or less, the blade edge rides on the residual resin when the residual resin is scraped off, so that uncut residues are generated.

The material per degree is preferably a conductive material when the circuit board is a liquid crystal panel.
This is to prevent charging of the liquid crystal panel. further,
It is particularly desirable to use a conductive resin in order to prevent chipping of the liquid crystal panel.

Further, a blade holding unit vertical mechanism may be provided. The mounting of the circuit board on the table can be easily performed by the blade holder vertical mechanism. Furthermore, because the blade can be pressed against the circuit board, the tip side of the blade can be brought into close contact with the circuit board surface, and as a result, the remaining resin is not left uncut and the quality after regeneration is improved.

According to a third aspect of the present invention, in the second aspect of the present invention, there is provided a circuit board regenerating apparatus which extends in a direction perpendicular to the contact surface and is intended to remove residual resin. A blade support plate having a height surface is further provided.

When the blade protrudes from the edge of the circuit board, the edge of the blade does not contact the circuit board in parallel due to the deformation of the blade, so that the remaining resin is left uncut. However, by providing the blade support plate, the blade is provided. Since the tip side is always in parallel with the circuit board, the uncut portion can be prevented. As a result, the quality is improved.

Here, it is necessary that the blade supporting plate has a smooth surface to be hit by the blade. This is because when the blade moves, it does not hinder its movement.

According to a fourth aspect of the present invention, there is provided the apparatus for regenerating a circuit board according to the second or third aspect, further comprising a fluid outlet.

In this way, when shaving the remaining resin, the shaved resin can be blown in a specific direction, so that the remaining resin can be prevented from re-adhering to the circuit board. Therefore, it is not necessary to remove the residue of the residual resin removed from the circuit board, which is effective for cost reduction.

As the fluid, air or nitrogen can be used. The fluid outlet is desirably located near the blade. The fluid is preferably allowed to flow in a direction toward the outside with respect to the circuit board in order to prevent the residual resin residue on the circuit board.

According to a fifth aspect of the present invention, there is provided the circuit board regenerating apparatus according to the second or third aspect, further comprising a fluid inlet.

For this reason, when shaving the residual resin, the shaved residual resin residue is sucked into the fluid suction port 9, so that the residual resin residue can be prevented from re-adhering to the circuit board. Therefore, it is not necessary to remove the residue of the residual resin removed from the circuit board, which is effective for cost reduction.

Here, it is desirable that the fluid suction port is provided near the blade. Thereby, the efficiency of suction of the residual resin residue can be increased. According to a sixth aspect of the present invention, there is provided the circuit board reproducing apparatus according to any one of the second to fifth aspects, further including two blades in the blade holding unit.

For this reason, since the residual resin can be scraped off by reciprocating movement along the guide rail, the number of times the blade is moved along the guide rail can be reduced to half the number of times when one blade is provided. The remaining resin can be scraped off in about half the time. As a result, efficiency is improved, which is effective for cost reduction.

Here, the fluid outlet can be installed near each blade. As a result, the remaining resin residue that has been removed is blown off in the direction in which the fluid is blown out, and does not remain on the circuit board. Therefore, there is no need to remove the shaved residual resin residue, and there is a cost reduction effect.

Further, a fluid inlet can be provided near each blade. As a result, the shaved residual resin residue is sucked into the fluid suction port and does not remain on the circuit board.

Therefore, there is no need to remove the residual resin shavings, which has the effect of reducing costs.

It is also possible to provide two parallel hits extending in the direction perpendicular to the direction in which the guide rail extends. Note that the interval between two parallel degrees is equal to the width of the circuit board. This is because, when the circuit board is installed between two parallel contacts, it is not necessary to hold the circuit board by hand when the blade is reciprocated along the guide rail in order to scrape the residual resin.

Further, a mechanism for adjusting the degree of contact can be provided so that the distance between the two parallel degrees can be changed according to the width of the circuit board. Thereby, it can be used for various types of circuit boards.

According to a seventh aspect of the present invention, in the apparatus for reproducing a circuit board according to any one of the second to sixth aspects, the apparatus for reproducing a circuit board is a reproducing apparatus for a liquid crystal panel. I do.

Since this liquid crystal panel reproducing apparatus uses a blade, it is extremely effective for removing the hardened residual resin, and therefore the efficiency is improved. Further, since the blade is held by the blade holding portion and moves along the guide rail, the quality after reproduction has no difference among operators, and the quality is stable. Since the blade holding portion is supported by the guide rail, the operator can effectively use the force, and the fatigue due to the work is small. Since the table has a hit, the necessity of holding the liquid crystal panel by hand can be eliminated.

Further, since the portion of the liquid crystal panel to which the residual resin is attached is located at the edge of the liquid crystal panel, the blade protrudes from the edge of the circuit board. Since it is in contact with the panel surface in parallel, uncut portions can be prevented.

As a result, the quality is improved.

In the case where the fluid outlet is provided, the shaved residual resin can be blown in a specific direction, so that no residual resin residue remains on the liquid crystal panel. Therefore, it is not necessary to remove the residue of the residual resin removed from the circuit board, which is effective for cost reduction.

In the case where the fluid suction port is provided, when shaving the remaining resin, the shaved residual resin residue is sucked into the fluid suction port, so that the remaining resin residue does not remain on the liquid crystal panel. Therefore, it is not necessary to remove the residue of the residual resin removed from the circuit board, which is effective for cost reduction.

Here, in the case of a liquid crystal panel, the material per degree is preferably a conductive material in order to prevent charging of the liquid crystal panel. Further, it is particularly desirable to use a conductive resin in order to prevent chipping of the liquid crystal panel.

[0045]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a circuit board reproducing apparatus and a circuit board reproducing method according to an embodiment of the present invention;

FIG. 1 is a schematic view showing a circuit board reproducing apparatus according to the embodiment. FIG. 2 is a schematic diagram illustrating a blade holding unit up-and-down mechanism that is a component of the circuit board reproducing apparatus according to the embodiment. FIG. 3 is a schematic diagram illustrating a blade holding unit that is a component of the circuit board reproducing apparatus according to the embodiment.
FIG. 4 is a schematic diagram for explaining a hitting position adjusting mechanism which is one component of the circuit board reproducing apparatus of the embodiment. FIG. 5 is a schematic diagram illustrating the effectiveness of the blade support plate, which is one component of the circuit board reproduction device of the embodiment. FIG. 6 is a schematic diagram illustrating a state in which a suction mechanism is added to the circuit board reproducing device of the embodiment.

FIG. 7 is a schematic diagram showing a state in which two blades are added to the blade holder of the circuit board reproducing apparatus of the embodiment.
FIG. 8 is a schematic diagram illustrating a state in which a liquid crystal panel is installed in the circuit board reproducing apparatus according to the embodiment.

Hereinafter, the structure of the circuit board reproducing apparatus of the embodiment will be described in detail with reference to FIGS.

In FIG. 1, a guide rail 2 is fixed to a table 1. A blade holder vertical mechanism 3 is connected to the guide rail 2, and can be moved along the guide rail 2. The blade holder 4 is attached to the blade holder vertical mechanism 3.

As shown in FIG. 2, the blade holder vertical mechanism 3
Is mounted on the guide rail 2 and can be moved along the guide rail 2. The blade holder vertical mechanism 3 includes a part 32 attached to the guide rail 2, a part 33 to which the blade holder is attached, a spring 35, a guide pin 34, and a handle 31. Normally, the blade holder 4 is raised by the action of the spring 35. When shaving the residual resin, the handle 31 of the blade holder vertical mechanism is pressed by hand until the blade 5 hits the circuit board surface. At this time, in order to make the tip side of the blade parallel to the substrate surface, a guide pin 34 is provided so that the portion 33 to which the blade holding portion is attached does not shake when the blade is moved up and down.

The attachment of the blade holder 4 to the blade holder vertical mechanism 3 can be fixed by insertion.

As shown in FIG. 3A, the blade holding portion 4 has a slit portion 41, and the blade 5 is inserted into the slit portion 41 and fixed. The position of the slit portion is determined by the inserted blade 5 hitting the side opposite to the blade tip side to the back of the slit. Further, the slit of the blade holder 4 is provided such that the blade tip side is parallel to the table surface and the angle of the blade with respect to the table surface is an acute angle. The angle of the blade with respect to the table surface is desirably 10 ° to 70 °.

As shown in FIG. 3 (b), another slit 42 is provided in the blade holder 4, and the blade 5 is provided in both of them.
By attaching 1, the residual resin can be scraped off by the reciprocating movement of the blade holder 4. FIG. 7 is a schematic diagram showing the embodiment.

The fluid outlet 6 can be provided near the tip side of the blade. The fluid outlet 6 is an air hose 61
Through the pressure unit 62. Factory compressed air, nitrogen, or the like can be used as the fluid. The discharge direction of the fluid is a direction along the tip side of the blade. The resin blown out by the blade by the fluid outlet 6 can be immediately blown in a predetermined direction. When the circuit board is a liquid crystal panel, the terminals are located at the edge of the panel, so that the direction in which the residual resin shavings are blown out can be set to the outside of the liquid crystal panel. It is particularly effective in preventing adhesion. The blade holder shown in FIG.
In the case of attaching a single blade, a fluid outlet 51 can also be provided for each blade. Alternatively, the air hose may be divided into two branches, and the end of each air hose may be attached near each blade.

As shown in FIG. 6, a fluid suction port 9 can be provided. The fluid suction port 9 is an air hose 91
To the filter unit and the fluid suction unit 92. A vacuum pump or factory vacuum can be used as the fluid suction unit. Further, a suction unit with a built-in filter unit such as a vacuum cleaner can also be used.
The fluid suction port 9 is installed near the tip side of the blade. FIG. 3 (b)
When two blades are attached to the blade holder, a fluid suction port can also be attached near each blade.

Since the residual resin is sucked by the fluid suction port 9 immediately after being scraped off, it does not scatter on the circuit board, so that re-adhesion can be prevented.

7 are provided on the table 1 per degree. There is no limitation on the material of 7 per degree for a circuit board made of glass epoxy or ceramic, but in the case of a liquid crystal panel, it is desirable to use a conductive material. Thereby, charging of the liquid crystal panel can be prevented. Further, conductive plastic is effective for preventing chipping of the liquid crystal panel.

When two blades are attached to the blade holder shown in FIG. 3B, a hit can be provided on the opposite side of the circuit board.

In this case, it can be fixed to the table according to the size of the circuit board.

Further, it is also possible to provide 71 per degree with a position adjusting mechanism so as to widely correspond to the size of the circuit board. FIG. 4 is a schematic view for explaining an embodiment of a degree 71 with a position adjusting mechanism provided with position adjusting grooves 72 and 73 parallel to the guide rail 2 on the table so that the position can be adjusted in the guide rail direction.

When the blade protrudes from the edge of the board, the blade bends as shown in FIG. 5A, the tip side of the blade becomes not parallel to the circuit board surface, and the remaining resin is left uncut. Would. In order to prevent this, the blade support plate 8 is installed at the portion where the blade beside the circuit board contacts. The blade support plate 8 is the same thickness as the circuit board, and is a smooth plate on the surface where the blade contacts. By providing the blade support plate 8, the blade tip side is kept parallel to the circuit board surface as shown in FIG.
This can prevent uncut parts.

Next, a method for removing the residual resin on the circuit board using the above apparatus will be described with reference to FIG.

As shown in FIG. 8A, the residual resin 10 on the circuit board from which the defective element or the defective TAB is peeled off.
4 is located along the guide rail 2 along the handle 3
The blade 5 is placed on the table 1 so that the tip side of the blade 5 when moving 1 is located on the sweeping trajectory, and one side of the circuit board contacts 7 per degree.

The blade holding portion 4 is positioned so that the portion where the residual resin adheres in the direction of the blade edge of the blade 5.

The handle 31 is grasped, and the blade holding unit
Is lowered, and the blade 5 held by the blade holding unit 4 is copied to the circuit board surface. FIG. 8B shows a state in which the blade holding unit vertical mechanism 3 is lowered, and the blade 5 held by the blade holding unit 4 is made to follow the surface of the circuit board.

By moving the handle 31 along the guide rail 2 in the direction of the blade edge of the blade 5 while keeping the blade 5 held by the blade holder 4 following the surface of the circuit board, The attached residual resin is scraped off from the circuit board.

In an apparatus provided with a fluid outlet, the residual resin shaved off is blown out in the direction of the fluid ejected from the fluid outlet, and does not remain on the circuit board.

In a device having a fluid suction port, the residual resin shaved off is sucked into the fluid suction port and does not remain on the circuit board.

As described above, since the apparatus for regenerating a circuit board of the present invention uses the blade, the cured residual resin can be efficiently removed.

Further, since the tip side of the blade is always fixed parallel to the circuit board surface, the surface of the circuit board is not damaged. Further, the blade is fixed to the apparatus, and the blade holder moves along the guide rail, so that there is no variation among operators. Therefore, the quality after reproduction is improved.

Further, by the effect of the fluid blow-out port or the fluid suction port, the residual resin scraped off the circuit board can be removed at the same time as the residual resin is scraped off.

Therefore, it is not necessary to remove the residue of the residual resin adhered to the circuit board after the residual resin is removed, which is effective for cost reduction.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a circuit board reproducing apparatus according to an embodiment.

FIG. 2 is a schematic diagram illustrating a blade holding unit up-down mechanism that is a component of the circuit board reproducing apparatus according to the embodiment.

FIG. 3 is a schematic diagram illustrating a blade holding unit that is a component of the circuit board reproducing apparatus according to the embodiment.

FIG. 4 is a schematic diagram for explaining a hitting position adjusting mechanism which is a component of the circuit board reproducing apparatus of the embodiment.

FIG. 5 is a schematic diagram illustrating the effectiveness of a blade support plate, which is one component of the circuit board reproduction device of the embodiment.

FIG. 6 is a schematic diagram illustrating a state in which a suction mechanism is added to the circuit board reproducing device of the embodiment.

FIG. 7 is a schematic diagram illustrating a state in which two blades are added to the blade holding unit of the circuit board reproduction device of the embodiment.

FIG. 8 is a schematic diagram illustrating a state in which a liquid crystal panel is installed in the circuit board reproduction device of the embodiment.

FIG. 9 is a schematic diagram illustrating a COG method.

FIG. 10 is a schematic diagram illustrating a TAB method.

FIG. 11 is a schematic view showing a residual resin remaining after removing an element in the COG method.

FIG. 12 is a schematic view showing a residual resin remaining after removing TAB in the TAB method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 table 2 guide rail 4 blade holder 5 blade 6 fluid outlet 7 per degree 8 blade support plate 9 fluid inlet 101 liquid crystal panel 102 IC 103 TAB 104 residual resin

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[Procedure amendment]

[Submission date] October 27, 1999 (1999.10.
27)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

[Title of the Invention] Circuit board reproducing apparatus

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[Correction target item name] Claims

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[Claims]

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[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board reproducing apparatus.
About the installation.

[Procedure amendment 4]

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[Correction contents]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a circuit board reproducing apparatus capable of efficiently reproducing a high-quality circuit board.
Is to provide.

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[0018]

According to a first aspect of the present invention, there is provided a circuit board regenerating apparatus for regenerating the circuit board by removing a residual resin which may adhere after removing an element from the circuit board with a blade. A circuit board reproducing apparatus, comprising: a table; a hitch for fixing the circuit board to the table; and a guide rail fixed to the table.
Bei a movable cutter holder along the guide rail
The blade has an angle of 10 ° to 70 ° with respect to the table surface.
Characterized by being held by the blade holding portion so as to form
And

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Further, a degree adjusting mechanism can be provided so that the distance between the two parallel degrees can be changed according to the width of the circuit board. Thereby, it can be used for various types of circuit boards.

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According to the second aspect of the present invention, there is provided a circuit board reproducing apparatus.
2. The apparatus for regenerating a circuit board according to claim 1, wherein
Has a slit for fixing the blade.
Sign. The circuit board reproducing apparatus according to claim 3 is a contractor.
3. The apparatus for reclaiming a circuit board according to claim 2, wherein
It is characterized in that two slits are formed in the holding portion.

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Claims (7)

[Claims] 1. A first step of removing an element mounted on a circuit board using a resin from the circuit board, and a second step of removing residual resin adhering on the circuit board in this order. In the method of regenerating a circuit board having a portion, a portion including a portion of the circuit board fixed to the table to which the residual resin is adhered is held by a blade holding portion movable along a guide rail fixed to the table. A method for regenerating a circuit board, characterized in that the second step is carried out by sliding a set blade along the guide rail. 2. A circuit board regenerating apparatus for regenerating a circuit board by removing residual resin which may adhere after removing an element from a circuit board, comprising: a table; and a circuit board mounted on the table. A circuit board regenerating apparatus comprising: a hit point for fixing; a guide rail fixed to the table; and a blade held by a blade holding portion movable along the guide rail. . 3. A blade supporting plate according to claim 2, wherein said blade supporting plate extends in a direction perpendicular to said contact surface and has the same height as a surface from which residual resin is to be removed. A circuit board reproducing apparatus, further comprising: 4. The apparatus for regenerating a circuit board according to claim 2, further comprising a fluid outlet. 5. The apparatus for regenerating a circuit board according to claim 2, further comprising a fluid inlet. 6. The apparatus for regenerating a circuit board according to claim 2, further comprising two blades in a blade holder. 7. The circuit board reproducing apparatus according to claim 2, wherein said circuit board reproducing apparatus is a liquid crystal panel reproducing apparatus.