JP2003311202A - Nozzle cleaning mechanism and substrate treating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a nozzle cleaning mechanism for reliably cleaning a cleaning liquid supplying nozzle while reducing the consumption of a wiping member, and to provide an apparatus for treating a substrate using the nozzle cleaning mechanism. <P>SOLUTION: This nozzle cleaning mechanism is provided with a bracket 42 to be moved along a rail 41 arranged in parallel to a resist applying nozzle and a wiping part 45 arranged above the bracket 42. The part 45 is provided with a casing 51, a feed roll 53 around which the long-length wiping member 52 consisting of wiping paper, wiping cloth or the like are wound, a take-up roll 54 for taking-up the member 52 fed from the roll 53, and the cleaning liquid supplying nozzle for supplying a cleaning liquid to the member 52. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle cleaning mechanism for cleaning a processing liquid supply nozzle for supplying a processing liquid to the surface of a substrate, and a substrate processing apparatus equipped with this nozzle cleaning mechanism.

[0002]

2. Description of the Related Art As a substrate processing apparatus for supplying a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus, the processing liquid is discharged from a slit-shaped discharge port. When the processing liquid supply nozzle that supplies the processing liquid to the surface of the substrate by moving relative to the substrate is used, the processing liquid supply nozzle is provided with a slit-shaped ejection opening near the substrate processing. The treatment liquid remains and becomes a pollutant, causing contamination of the treatment liquid supply nozzle. Such contamination is particularly likely to occur when a resist, especially a resist containing a pigment called a color resist or the like is used as the treatment liquid. Therefore, it is necessary to regularly clean the processing liquid supply nozzle by the nozzle cleaning mechanism.

Such a nozzle cleaning mechanism is disclosed, for example, in Japanese Patent Application Laid-Open No. 7-80386. The nozzle cleaning mechanism disclosed in Japanese Unexamined Patent Publication No. 7-80386 has a wiping member for cleaning which is in contact with the entire slit-shaped ejection port of the treatment liquid supply nozzle in the longitudinal direction. And in this nozzle cleaning mechanism,
The tip of the treatment liquid supply nozzle is cleaned by moving the wiping member in a direction orthogonal to the longitudinal direction of the slit-shaped ejection port while the wiping member contains the solvent.

[0004]

In recent years, since the size of the substrate has increased, the total length of the slit-shaped discharge port in the processing liquid supply nozzle also tends to become longer. Therefore, the conventional nozzle cleaning mechanism has the following problems.

That is, when the wiping member is brought into contact with the tip of the treatment liquid supply nozzle, there may be a portion where the wiping member is properly in contact with the treatment liquid supply nozzle in the longitudinal direction and a portion where it is not. In this case, the contaminants attached to the treatment liquid supply nozzle may not be completely removed.

Further, since the wiping member must be brought into contact with the entire slit-shaped discharge port in the longitudinal direction,
It is necessary to prepare a large wiping member. For this reason, the amount of the wiping member consumed becomes large, and the running cost becomes high.

The present invention has been made to solve the above problems, and it is a nozzle cleaning mechanism and a nozzle cleaning mechanism thereof capable of reliably cleaning the processing liquid supply nozzle while reducing the consumption of the wiping member. It is an object of the present invention to provide a substrate processing apparatus using the.

[0008]

According to a first aspect of the present invention, a treatment liquid is ejected onto a surface of the substrate by moving the treatment liquid relative to the substrate while ejecting the treatment liquid from a slit-shaped ejection port. In a nozzle cleaning mechanism for cleaning a processing liquid supply nozzle to be supplied, a dimension of the wiping member in contact with the ejection port in the longitudinal direction of the ejection port is smaller than a dimension of the ejection port in the longitudinal direction. It is characterized in that it is provided with a wiping portion and a moving means for reciprocating the wiping portion in the longitudinal direction of the ejection port.

According to a second aspect of the present invention, in the first aspect of the present invention, the wiping unit includes a feeding roll around which a long wiping member is wound and a wiping member fed out from the feeding roll. A take-up roll and a rotating mechanism for rotating the take-up roll are provided.

According to a third aspect of the present invention, in the second aspect of the present invention, the rotating mechanism rotates the winding roll at an end of a reciprocating stroke of the wiping unit.

According to a fourth aspect of the present invention, in the second aspect of the present invention, there is provided a pressing member that presses the wiping member toward the discharge port.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the wiping unit includes a roller having a wiping member arranged on the surface thereof, and a rotating mechanism for rotating the roller. There is.

According to the invention of claim 6, claim 1
The invention according to any one of claims 1 to 5 further comprises a cleaning liquid supply section for supplying a cleaning liquid to the wiping member or the ejection port.

According to a seventh aspect of the present invention, there is provided a substrate processing apparatus having the nozzle cleaning mechanism according to any one of the first to sixth aspects, wherein a holding unit for holding the substrate and the nozzle for the substrate are provided. And a nozzle moving unit for relatively moving the nozzle.

According to an eighth aspect of the invention, in the invention of the seventh aspect, the treatment liquid is a resist.

According to a ninth aspect of the invention, in the eighth aspect of the invention, the resist is a resist containing a pigment.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First, the nozzle cleaning mechanism 18 according to the present invention.
The configuration of the substrate processing apparatus to which is applied will be described. Figure 1
FIG. 3 is a schematic diagram of a substrate processing apparatus to which the nozzle cleaning mechanism according to the present invention is applied.

This substrate processing apparatus is for applying a resist containing a pigment called a color resist to a substrate W for a liquid crystal panel having a rectangular shape. The substrate W is sucked and held by the motor 11 of the motor 11. A spin chuck 13 that rotates about an axis 12 when driven, and a nozzle 1 for applying a resist to a substrate W held by the spin chuck 13.
4 and a nozzle moving mechanism 15 for moving the nozzle 14.
And a resist supply mechanism 16 for supplying resist to the nozzle 14, and a resist capture mechanism for capturing the resist scattered from the edge of the substrate W when the substrate W after resist application by the spin chuck 13 is rotated. Cup 17
And a nozzle cleaning mechanism 18 according to the present invention.

The spin chuck 13, the shaft 12, and the motor 11 can be moved up and down by a chuck elevating mechanism (not shown). That is, in FIG. 1, the substrate W can be moved up and down between the rotation position shown by the solid line and the coating position shown by the two-dot chain line. The rotation position is a position where the substrate W is accommodated in the cup 17, and the coating position is a position where the substrate W and a discharge port 34 (described later) of the nozzle 14 are set at a predetermined interval.

The nozzle moving mechanism 15 has a moving frame 22 which reciprocates along a horizontally extending moving guide 21.
Equipped with. The nozzle 14 is supported by the moving frame 22 via a nozzle supporting arm 23 so as to be movable in the horizontal direction. Since the nozzle moving mechanism 15 does not include a mechanism that moves in the vertical direction, when the nozzle 14 moves along the movement guide 21, the nozzle 14 and the substrate W are moved.
The distance between and is prevented from fluctuating. For this reason,
When the nozzle 14 is horizontally moved to apply the liquid to the substrate W,
A coating film having a uniform thickness can be formed.

The resist supply mechanism 16 has a pressure tank 24 having a closed structure, and a resist tank 25 housed in the pressure tank 24. The pressure tank 24 is connected to a nitrogen gas or air supply source (not shown) by a pressure pipe 27. A three-way valve 28 for switching supply and discharge of nitrogen gas and a regulator 29 are arranged in the pressurizing pipe 27. Also,
One end of a resist supply pipe 31 that connects the resist tank 25 and the nozzle 14 is inserted into the resist tank 25. An on-off valve 33 is arranged in the resist supply pipe 31.

In the resist supply mechanism 15 having such a structure, when the opening / closing valve 33 is opened, the resist in the resist tank 25 is filled with the pressure tank 24.
The pressure of the nitrogen gas therein causes the resist to be pressure-fed to the nozzle 14 via the resist supply pipe 31, and the opening / closing valve 33 is closed to stop the pressure-feed of the resist.

FIG. 2 is an explanatory view schematically showing the resist supply operation by the nozzle 14. This nozzle 14
It has a slit-shaped ejection port 34 extending in the longitudinal direction (direction perpendicular to the paper surface in FIG. 2). The length of the ejection port 34 in the longitudinal direction is equal to or longer than the length of the short side of the rectangular element formation portion of the substrate W, but here, the length of the short side of the rectangular element formation portion. Is almost equal to. Resist 3 supplied by the resist supply pipe 31
As shown in FIG. 2, 5 is a slit-shaped discharge port 34.
Is supplied to the surface of the substrate W via the.

Next, the substrate W is processed by the above-mentioned substrate processing apparatus.
The coating operation for coating the resist will be described. Figure 3
FIG. 6 is an explanatory diagram showing a coating operation for coating a resist on the substrate W by the substrate processing apparatus. In the following description, the nozzle 14 is moved by the nozzle moving mechanism 15 described above.

In a state before executing the resist coating operation, the nozzle 14 is arranged at a position facing the nozzle cleaning mechanism 18 according to the present invention. The state of the nozzle 14 and the like at this time will be described in detail later.

In this state, when the resist coating operation is started, the nozzle 1 is placed above the nozzle cleaning mechanism 18.
4 from the standby state, the nozzle 1
4 is horizontally moved to a position above one end of the substrate W on the far side with respect to the nozzle cleaning mechanism 18. Next, the substrate W is placed at the coating position by the chuck elevating mechanism. At this time, the surface of the substrate W and the ejection port 34 of the nozzle 14 are at a predetermined distance.

In this state, the resist is discharged from the slit-shaped discharge port 34 of the nozzle 14, and the nozzle 14 is horizontally moved along the surface of the substrate W as shown by the arrow. In this state, as shown in FIG. 2, the resist 35 discharged from the slit-shaped discharge port 34 in the nozzle 14 is applied in a thin film on the surface of the substrate W.

The slit-shaped discharge port 3 in the nozzle 14
When 4 moves to a position facing the other end of the substrate W, the discharge of the resist from the slit-shaped discharge port 34 in the nozzle 14 is stopped, and the nozzle 4 is moved to above the nozzle cleaning mechanism 18.

Next, the nozzle cleaning mechanism 18 according to the present invention.
The configuration of will be described. FIG. 4 is a side view showing the nozzle cleaning mechanism 18 according to the present invention together with the standby pot 36.

The nozzle cleaning mechanism 18 reciprocally rotates a bracket 42 movable along a rail 41 arranged in parallel with the nozzle 14 and a synchronous belt 43 connected to the bracket 42. A motor 44 that reciprocates 42 in parallel with the nozzle 14.
And a wiping portion 45 disposed above the bracket 42. This wiping unit 45 is, as will be described later, the nozzle 1
4 for wiping the slit-shaped discharge port 34. The wiping unit 45 is driven by the motor 44 to reciprocate between a position indicated by a solid line and a position indicated by a chain double-dashed line in FIG.

On the other hand, the standby pot 36 is for preventing the resist in the vicinity of the slit-shaped ejection port 34 of the nozzle 14 from being dried and deteriorated in the state where the resist is not applied. Inside the standby pot 36, for example, a solvent that dissolves the resist is stored. When the air cylinder 37 is driven, the standby pot 36 has an ascending position in which the opening at the upper end thereof, which is indicated by a chain double-dashed line in FIG. It is configured to be able to move up and down. For this reason, when the standby pot 36 takes the raised position with the nozzle 14 standing by above the nozzle cleaning mechanism 18, the discharge port 34 of the nozzle 14 will be in the standby pot 36.
It will be exposed in the closed space. At this time, since the space is filled with the atmosphere containing the solvent vapor, the resist in the vicinity of the ejection port 34 is prevented from being dried.

Next, the structure of the wiping unit 45 described above will be described. 5 is a front view showing the wiping unit 45 together with the standby pot 36, FIG. 6 is a side view of the wiping unit 45, and FIG. 7 is a plan view of the wiping unit 45. In addition, FIG.
5 is an explanatory view showing the swinging motion of FIG.

The wiping unit 45 includes a casing 51, a feeding roll 53 around which a long wiping member 52 is wound, a winding roll 54 for winding the wiping member 52 fed from the feeding roll 53, and a wiping member. The cleaning liquid supply nozzle 52 is provided with four cleaning liquid supply nozzles 55. A sheet-shaped porous material is used for the wiping member 52. Examples of the porous material include paper, cloth, and resin. Specifically, the paper includes filter paper and the cloth includes non-woven fabric.

The shaft 61 of the feed roll 53 has the casing 5
It is connected to the tension generating member 62 connected to No. 1 and rotates with a constant resistance force. On the other hand, the shaft 63 of the take-up roll 54 is connected to the swing member 65 via a one-way clutch 64. This swing member 65
Is urged by the action of a spring (not shown) so that the cam followers 66 disposed at both ends thereof are in the standing posture shown by the solid line in FIG. 8 when the cam followers 66 are not in contact with the cam 67 or the cam 68. . As shown in FIG. 4, the cam 67 and the cam 68 are arranged near both ends of the reciprocating stroke of the wiping unit 45.

When the cam followers 66 disposed at both ends of the swinging member 65 come into contact with the cam 67 or the cam 68 by the wiper 45 traveling near both ends of the reciprocating stroke, the swinging member 65 inclines from the standing posture shown by the solid line in FIG. 8 to the inclined posture shown by the chain double-dashed line in FIG. As a result, the shaft 6 of the winding roll 54 is
3 rotates, and the wiping member 52 is wound around the winding roll 54 against the resistance force of the shaft 61 of the feed roll 53. On the other hand, when the wiping unit 45 starts traveling in the opposite direction, the swinging member 65 returns from the inclined posture shown by the two-dot chain line in FIG. 8 to the standing posture shown by the solid line in FIG. Due to the action of the direction clutch 64, the shaft 63 of the winding roll 54 does not rotate.

Therefore, the swing member 65 and the cams 66 and 67 are
By the action, the winding roll 54 rotates at a predetermined angle at both ends of the reciprocating stroke of the wiping unit 45, and the winding roll 54 winds the wiping member 52 fed from the feeding roll 53 by a certain amount. Become.

Pressing members 56 and 57 for pressing the wiping member 52 toward the slit-shaped discharge port 34 in the nozzle 14 are disposed below the wiping member 52 from the feed roll 53 to the take-up roll 54. ing. Of these pressing members 56 and 57, the pressing member 56 is the wiping member 52.
Is to be pressed toward the lowermost end of the slit-shaped discharge port 34 in the nozzle 14. In addition, the pressing member 57 is for pressing the wiping member 52 toward a position above the lowermost end of the slit-shaped ejection port 34 in the nozzle 14, and as shown in FIG. It is composed of a pair of members that are biased toward each other.

That is, in a state in which the slit-shaped discharge port 34 of the nozzle 14 is not arranged at a position opposed to these pressing members 56 and 57, as shown in FIG. Are arranged so as to abut each other. On the other hand, in the state where the slit-shaped ejection port 34 of the nozzle 14 is arranged at a position facing the pressing members 56 and 57, as shown in FIG.
The pair of pressing members 57 move to positions separated from each other by contacting the tip end portion of the nozzle 14.

In the state shown in FIG. 9B, the pressing member 56 is in contact with the lowermost end of the slit-shaped discharge port 34 of the nozzle 14 through the wiping member 52, and the pressing member 5 is pressed.
7 is in contact with a position above the lowermost end of the slit-shaped discharge port 34 in the nozzle 14 via the wiping member 52. The longitudinal dimension of the ejection port 34 of the wiping member 52 that abuts the slit-shaped ejection port 34 of the nozzle 14 is sufficiently smaller than the longitudinal dimension of the ejection port 34.

Next, the nozzle cleaning mechanism 18 according to the present invention.
The cleaning operation of the nozzle 14 by means of will be described.

Using this nozzle cleaning mechanism, the nozzle 14
When performing the cleaning operation of the
8, the standby pot 36 descends from the raised position indicated by the chain double-dashed line in FIG. 4 to the lowered position indicated by the solid line. Then, by driving the motor 44, the wiping portion 45 moves together with the bracket 42 in a direction parallel to the slit-shaped ejection port 34 of the nozzle 14. Further, along with the movement of the wiping unit 45, or alternatively, the wiping unit 45
Prior to the movement of the cleaning liquid, the cleaning liquid is supplied to the wiping member 52 from the four cleaning liquid supply nozzles 55.

When the wiping unit 45 has moved to a position below the slit-shaped discharge port 34 in the nozzle 14, as shown in FIG. 9 (b), the pressure member 56 interposes the wiping member 52 supplied with the cleaning liquid. Contacting the lowermost end of the slit-shaped discharge port 34 in the nozzle 14,
Through the wiping member 52 supplied with the cleaning liquid, the nozzle 14
It comes into contact with a position above the lowermost end of the slit-shaped discharge port 34. When the wiping unit 45 continues to run in this state, the slit-shaped ejection port 34 of the nozzle 14 is cleaned by the wiping member 52 supplied with the cleaning liquid.

When the wiping unit 45 travels to the end of its travel stroke, the cam followers 66 provided at both ends of the swinging member 65 come into contact with the cam 67 or the cam 68, and the wiping member 52 is wound. A certain amount is wound around 54. Therefore, when the wiping member 45 travels next time, the slit-shaped ejection port 34 in the nozzle 14 is cleaned by the new wiping member 52.

According to the nozzle cleaning mechanism 18 having the above-described structure, the dimension of the wiping member 52 in contact with the slit-shaped ejection port 34 of the nozzle 14 in the longitudinal direction of the ejection port 34 is the longitudinal direction of the ejection port 34. Therefore, when the wiping member 52 is brought into contact with the nozzle 14, there is a portion where the wiping member 52 is appropriately in contact with the nozzle 14 in the longitudinal direction of the nozzle 14 and a portion where it is not so. That's not it. For this reason, it becomes possible to reliably remove the contaminants adhering to the nozzle 14 by washing. Further, unlike the conventional case, since it is not necessary to contact the wiping member 52 over the entire area of the slit-shaped ejection port 34 in the nozzle 14 in the longitudinal direction, it is not necessary to use a large wiping member, and the consumption amount of the wiping member 52 is reduced. There is no problem that the running cost increases as the number increases.

In the above-described embodiment, the cleaning liquid is supplied to the wiping member 52 from the four cleaning liquid supply nozzles 55, but the four cleaning liquid supply nozzles 55 to the slit-shaped discharge ports 34 of the nozzle 14. Alternatively, the cleaning liquid may be directly supplied.

Further, in the above-described embodiment, the wiping member 52 is moved in the longitudinal direction of the slit-shaped discharge port 34 of the nozzle 14 by using the feed roll 53 and the winding roll 54. 52 nozzle 14
You may make it move to the direction which intersects with the slit-shaped discharge port 34 in.

Next, another embodiment of the present invention will be described. FIG. 10 is a schematic diagram showing a wiping unit 70 of a nozzle cleaning mechanism according to another embodiment of the present invention.

The wiping portion 70 of this nozzle cleaning mechanism faces a casing 71, a roller 72 having a wiping member arranged on the surface thereof, and the roller 72 in a direction parallel to the slit-shaped ejection port 34 of the nozzle 14. A rotation mechanism (not shown) that rotates about an axis and a pair of cleaning liquid supply nozzles 73 that supply the cleaning liquid to the surface of the roller 72 are provided. The dimension of the roller 72 in the longitudinal direction of the ejection port 34 is smaller than the dimension of the ejection port 34 in the longitudinal direction. The wiping member arranged on the peripheral surface of the roller 72 is the above-mentioned sheet-like porous material, and is removably wound. Therefore, for example, the wiping member can be replaced after the roller 72 makes one round.

Like the cleaning unit 45 of the nozzle cleaning mechanism according to the above-described embodiment, the cleaning unit 70 of the nozzle cleaning mechanism according to this embodiment can reciprocate in the longitudinal direction of the slit-shaped discharge port 34 of the nozzle 14. Has become. Also,
In the cleaning unit 70 of the nozzle cleaning mechanism according to this embodiment, as with the cleaning unit 45 of the nozzle cleaning mechanism according to the above-described embodiments, if the wiping unit 70 travels to the end of its travel stroke, the roller 72 rotates. Then, a new wiping member is used.

Even when the nozzle cleaning mechanism having such a structure is used, the slit-shaped discharge port 34 of the nozzle 14 is surely secured while reducing the consumption amount of the wiping member as in the case of the above-described embodiment. It becomes possible to wash.

[0052]

According to the first aspect of the invention, the wiping member, which is in contact with the ejection port, has a dimension in the longitudinal direction of the ejection port smaller than the dimension in the longitudinal direction of the ejection port, and a wiping unit. Since the moving means that reciprocates in the longitudinal direction of the ejection port is provided, it is possible to reliably clean the processing liquid supply nozzle while reducing the consumption amount of the wiping member.

According to the second aspect of the invention, the feed roll around which the wiping member having a long wiping portion is wound, the winding roll for winding up the wiping member fed from the feed roll, and the winding roll. Since it is provided with a rotating mechanism that rotates the processing liquid supply nozzle, it is possible to clean the processing liquid supply nozzle with a new wiping member as needed.

According to the third aspect of the invention, since the rotating mechanism rotates the winding roll at the end of the reciprocating stroke of the wiping unit, each time the wiping unit moves to the end of the reciprocating stroke. It becomes possible to supply a new wiping member.

According to the invention described in claim 4, since the pressing member for pressing the wiping member toward the discharge port is provided,
It is possible to reliably clean the discharge port.

According to the fifth aspect of the present invention, since the wiping portion is provided with the roller having the wiping member disposed on the surface thereof and the rotating mechanism for rotating the roller, the wiping member for the surface of the rotating roller is provided. As a result, the discharge port can be reliably cleaned.

According to the sixth aspect of the invention, since the cleaning liquid supply section for supplying the cleaning liquid to the wiping member or the discharge port is provided, the discharge port can be surely cleaned by the action of the cleaning liquid.

According to the invention described in claims 7 to 9, there is provided a substrate processing apparatus having the nozzle cleaning mechanism according to any one of claims 1 to 6, wherein a holding portion for holding the substrate and a nozzle are provided. Since the nozzle moving unit that moves the cleaning liquid relative to the substrate is provided, it is possible to reliably clean the processing liquid supply nozzle while reducing the consumption amount of the wiping member.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus to which a nozzle cleaning mechanism according to the present invention is applied.

FIG. 2 is an explanatory diagram schematically showing a resist supply operation by a nozzle.

FIG. 3 is an explanatory diagram showing a coating operation for coating a resist on a substrate W by a substrate processing apparatus.

FIG. 4 is a side view showing the nozzle cleaning mechanism 18 according to the present invention together with a standby pot 36.

5 is a front view showing the wiping unit 45 together with the standby pot 36. FIG.

FIG. 6 is a side view of the wiping unit 45.

FIG. 7 is a plan view of the wiping unit 45.

FIG. 8 is an explanatory diagram showing a swinging motion of a swinging member 65.

9 is an explanatory diagram showing a relationship between a discharge port 34 and pressing members 56 and 57. FIG.

FIG. 10 is a schematic diagram showing a wiping unit 70 of a nozzle cleaning mechanism according to another embodiment of the present invention.

[Explanation of symbols]

13 Spin chuck 14 nozzles 18 nozzle cleaning mechanism 34 outlet 36 Standby pot 41 rails 42 bracket 43 Synchronous belt 44 motor 45 Wiping unit 52 Wiping member 53 Feed roll 54 winding roll 55 Cleaning liquid supply nozzle 61 axes 62 Tension generating member 63 axes 64 one-way clutch 65 Swing member 66 cam followers 67 cam 68 cam 70 Cleaning section 72 Laura 73 Cleaning liquid supply nozzle W board

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G02F 1/1333 500 G02F 1/1333 500 4F042 H01L 21/304 643 H01L 21/304 643Z (72) Inventor Ogino Shin 1 No. 1 Tenjin Kitamachi, 4-chome, Horikawa-dori Temple, Kamigyo-ku, Kyoto, Japan Inside the Dai Nippon Screen Manufacturing Co., Ltd. (72) Inventor Takayuki Sato 4-chome Tenjin Kitamachi, Kami-cho, Kamigyo-ku, Kyoto No. 1 Dainippon Screen Mfg. Co., Ltd. (72) Inventor Yasuhiro Kawaguchi No. 1 at Tenjin Kitamachi 4-chome, Tenjin Kitamachi, Kamikyo-ku, Kyoto City No. 1 Dainippon Screen Mfg. Co., Ltd. (72) Inventor Yoshinori Takagi 1 Dainippon Screen Mfg. Co., Ltd. at 1 Tenjin Kitamachi 4-chome, Tenjin Kitamachi, Kamikyo-ku, Kyoto In-house (72) Inventor Hiroki Mizuno 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto Dai Nippon Screen Manufacturing Co., Ltd. F-term (Reference) 2H088 FA21 FA30 HA01 MA20 2H090 JB02 JB04 JC19 3B116 AA47 AB53 BA08 BA23 BA35 BB01 3B201 AA47 AB53 BA08 BA23 BA35 BB01 4F041 AA02 AA05 AB02 BA60 CA02 4F042 AA02 AA06 CC08 CC11

Claims (9)

[Claims] 1. A nozzle cleaning for cleaning a processing liquid supply nozzle for supplying the processing liquid to the surface of the substrate by moving the processing liquid relative to the substrate while discharging the processing liquid from a slit-shaped discharge port. In the mechanism, the dimension of the wiping member that abuts the ejection port in the longitudinal direction of the ejection port is smaller than the dimension of the ejection port in the longitudinal direction, and the wiping unit is disposed in the longitudinal direction of the ejection port. A nozzle cleaning mechanism comprising: a moving unit that reciprocates. 2. The nozzle cleaning mechanism according to claim 1, wherein the wiping unit includes a feed roll around which a long wiping member is wound, and a take-up roll around which the wiping member sent out from the feed roll is wound. A nozzle cleaning device comprising: a rotating mechanism that rotates the winding roll. 3. The nozzle cleaning mechanism according to claim 2, wherein the rotating mechanism rotates the winding roll at an end of a reciprocating stroke of the wiping unit. 4. The nozzle cleaning mechanism according to claim 2, further comprising a pressing member that presses the wiping member toward the ejection port. 5. The nozzle cleaning device according to claim 1, wherein the wiping unit includes a roller having a wiping member arranged on a surface thereof, and a rotating mechanism for rotating the roller. 6. The nozzle cleaning mechanism according to claim 1, further comprising a cleaning liquid supply unit that supplies a cleaning liquid to the wiping member or the discharge port. 7. A substrate processing apparatus having the nozzle cleaning mechanism according to claim 1, wherein a holding unit for holding the substrate and a nozzle movement for moving the nozzle relative to the substrate. And a substrate processing apparatus. 8. The substrate processing apparatus according to claim 7, wherein the processing liquid is a resist. 9. The substrate processing apparatus according to claim 8, wherein the resist is a resist containing a pigment.