JP2012504706A5 - - Google Patents
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- Publication number
- JP2012504706A5 JP2012504706A5 JP2011530258A JP2011530258A JP2012504706A5 JP 2012504706 A5 JP2012504706 A5 JP 2012504706A5 JP 2011530258 A JP2011530258 A JP 2011530258A JP 2011530258 A JP2011530258 A JP 2011530258A JP 2012504706 A5 JP2012504706 A5 JP 2012504706A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- microinches
- nickel
- containing metal
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000032683 aging Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10208308P | 2008-10-02 | 2008-10-02 | |
| US61/102,083 | 2008-10-02 | ||
| PCT/US2009/059311 WO2010040016A2 (en) | 2008-10-02 | 2009-10-02 | Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014060229A Division JP2014156393A (ja) | 2008-10-02 | 2014-03-24 | 無電解ニッケルおよび金めっきするための銀ペースト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012504706A JP2012504706A (ja) | 2012-02-23 |
| JP2012504706A5 true JP2012504706A5 (enExample) | 2012-11-22 |
Family
ID=41733973
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011530258A Pending JP2012504706A (ja) | 2008-10-02 | 2009-10-02 | ニッケル−金めっき可能な厚膜銀ペースト、および、低温同時焼成セラミックデバイスのためのめっき方法、および、それから形成されたｌｔｃｃデバイス |
| JP2014060229A Ceased JP2014156393A (ja) | 2008-10-02 | 2014-03-24 | 無電解ニッケルおよび金めっきするための銀ペースト組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014060229A Ceased JP2014156393A (ja) | 2008-10-02 | 2014-03-24 | 無電解ニッケルおよび金めっきするための銀ペースト組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US8609256B2 (enExample) |
| EP (1) | EP2329057A2 (enExample) |
| JP (2) | JP2012504706A (enExample) |
| CN (1) | CN102149847A (enExample) |
| TW (1) | TW201020340A (enExample) |
| WO (1) | WO2010040016A2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2715788A1 (en) | 2011-06-01 | 2014-04-09 | E. I. Du Pont de Nemours and Company | Low temperature co-fired ceramic structure for high frequency applications and process for making same |
| CN102703885B (zh) * | 2012-06-04 | 2014-09-03 | 汕头超声印制板公司 | 一种用于pcb板的镀金工艺 |
| EP2750141B1 (en) | 2012-12-28 | 2018-02-07 | Heraeus Deutschland GmbH & Co. KG | An electro-conductive paste comprising coarse inorganic oxide particles in the preparation of electrodes in MWT solar cells |
| US9949374B2 (en) * | 2013-02-08 | 2018-04-17 | Mitsubishi Electric Corporation | Electroless plating method and ceramic substrate |
| US20140353005A1 (en) * | 2013-06-04 | 2014-12-04 | E I Du Pont De Nemours And Company | Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substrates |
| EP3240673B1 (en) * | 2014-12-31 | 2024-08-07 | Essilor International | Method of mirror coating an optical article and article thereby obtained |
| CN109309000A (zh) * | 2017-07-26 | 2019-02-05 | 天津环鑫科技发展有限公司 | 一种gpp芯片镀金方法 |
| CA3130455A1 (en) * | 2020-02-05 | 2021-08-12 | Ferro Corporation | M7 ltcc-silver system and related dielectric compositions for high frequency applications |
| CN111926314B (zh) * | 2020-08-17 | 2021-10-26 | 广州三孚新材料科技股份有限公司 | 一种晶硅异质结太阳能电池用化学镀锡工艺 |
| CN113652733A (zh) * | 2021-08-18 | 2021-11-16 | 刘智 | 一种用于集成电路生产可节省电镀材料的电路板镀银设备 |
| CN113470864B (zh) * | 2021-09-01 | 2022-03-11 | 西安宏星电子浆料科技股份有限公司 | 一种低尺寸效应的厚膜电阻浆料 |
| CN115338421B (zh) * | 2022-09-19 | 2024-08-23 | 常州聚和新材料股份有限公司 | 太阳能电池正面银浆用Ni-P合金添加剂、制法及应用 |
| US20240105670A1 (en) * | 2022-09-26 | 2024-03-28 | Cyntec Co., Ltd. | Electronic component with high coplanarity and method of manufacturing the same |
| CN115810438B (zh) * | 2022-11-23 | 2024-11-15 | 中国电子科技集团公司第四十三研究所 | 一种用于低温共烧陶瓷的可化镀银浆料及其制备方法 |
| CN118271914B (zh) * | 2024-03-29 | 2024-11-12 | 江苏飞特尔通信有限公司 | 一种用于ltcc的电镀填孔剂及其制备方法与应用 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5580740A (en) * | 1978-12-08 | 1980-06-18 | Matsushita Electric Works Ltd | Glass composition |
| US4536535A (en) * | 1983-06-07 | 1985-08-20 | E. I. Du Pont De Nemours And Company | Castable ceramic compositions |
| JPH07302510A (ja) * | 1994-05-10 | 1995-11-14 | Sumitomo Metal Mining Co Ltd | 導電ペースト組成物 |
| JP3387507B2 (ja) * | 1997-12-18 | 2003-03-17 | 株式会社ジャパンエナジー | 無電解ニッケルめっき用前処理液および前処理方法 |
| TW524786B (en) * | 1998-01-23 | 2003-03-21 | Du Pont | Glass composition, castable dielectric composition and tape composition made therewith |
| US6210805B1 (en) * | 1998-01-29 | 2001-04-03 | Asahi Glass Company Ltd. | Glass plate provided with a conductive layer, method for its production, conductive paste and window for an automobile |
| US6362089B1 (en) * | 1999-04-19 | 2002-03-26 | Motorola, Inc. | Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed |
| US6548327B2 (en) * | 2000-04-24 | 2003-04-15 | Interuniversitair Microelektronica Centrum, Vzw | Low cost electroless plating process for single chips and wafer parts and products obtained thereof |
| JP2003132733A (ja) * | 2001-10-29 | 2003-05-09 | Kyocera Corp | 導体組成物およびこれを用いた配線基板 |
| EP1443029A4 (en) * | 2001-11-05 | 2007-08-01 | Asahi Glass Co Ltd | CERAMIC COMPOSITION |
| US7147804B2 (en) * | 2003-01-24 | 2006-12-12 | E. I. Du Pont De Nemours And Company | Terminal electrode compositions for multilayer ceramic capacitors |
| JP4059133B2 (ja) * | 2003-05-06 | 2008-03-12 | 日立化成工業株式会社 | 無電解ニッケル−金めっき方法 |
| JP2004332036A (ja) * | 2003-05-06 | 2004-11-25 | Hitachi Chem Co Ltd | 無電解めっき方法 |
| US6974776B2 (en) * | 2003-07-01 | 2005-12-13 | Freescale Semiconductor, Inc. | Activation plate for electroless and immersion plating of integrated circuits |
| JP4357901B2 (ja) * | 2003-08-25 | 2009-11-04 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解めっき用パラジウム触媒液及び触媒化処理方法 |
| KR20060112591A (ko) * | 2003-10-17 | 2006-11-01 | 히타치 긴조쿠 가부시키가이샤 | 다층 세라믹 기판 및 그 제조 방법 및 이것을 이용한 전자기기 |
| JP2006124812A (ja) * | 2004-11-01 | 2006-05-18 | Murata Mfg Co Ltd | セラミック基板、及びめっき方法 |
| US7435361B2 (en) * | 2005-04-14 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
| US7516152B2 (en) | 2005-07-05 | 2009-04-07 | International Business Machines Corporation | System and method for generating and selecting data mining models for data mining applications |
| US20070023388A1 (en) * | 2005-07-28 | 2007-02-01 | Nair Kumaran M | Conductor composition for use in LTCC photosensitive tape on substrate applications |
| US7666328B2 (en) * | 2005-11-22 | 2010-02-23 | E. I. Du Pont De Nemours And Company | Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices |
| DE102005061799B4 (de) | 2005-12-23 | 2009-04-23 | Epcos Ag | Verfahren zur Metallisierung von Silberoberflächen und seine Verwendung |
| KR100744930B1 (ko) * | 2006-02-01 | 2007-08-01 | 삼성전기주식회사 | Ｌｔｃｃ 모듈의 제조 방법 |
-
2009
- 2009-10-01 US US12/571,665 patent/US8609256B2/en active Active
- 2009-10-02 WO PCT/US2009/059311 patent/WO2010040016A2/en not_active Ceased
- 2009-10-02 TW TW098133626A patent/TW201020340A/zh unknown
- 2009-10-02 CN CN2009801359451A patent/CN102149847A/zh active Pending
- 2009-10-02 EP EP09793262A patent/EP2329057A2/en not_active Withdrawn
- 2009-10-02 JP JP2011530258A patent/JP2012504706A/ja active Pending
-
2012
- 2012-06-06 US US13/490,103 patent/US20120308717A1/en not_active Abandoned
-
2013
- 2013-12-09 US US14/100,195 patent/US20140186521A1/en not_active Abandoned
-
2014
- 2014-03-24 JP JP2014060229A patent/JP2014156393A/ja not_active Ceased
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