JP2012504706A - ニッケル−金めっき可能な厚膜銀ペースト、および、低温同時焼成セラミックデバイスのためのめっき方法、および、それから形成されたｌｔｃｃデバイス - Google Patents

ニッケル−金めっき可能な厚膜銀ペースト、および、低温同時焼成セラミックデバイスのためのめっき方法、および、それから形成されたｌｔｃｃデバイス Download PDF

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JP2012504706A
JP2012504706A JP2011530258A JP2011530258A JP2012504706A JP 2012504706 A JP2012504706 A JP 2012504706A JP 2011530258 A JP2011530258 A JP 2011530258A JP 2011530258 A JP2011530258 A JP 2011530258A JP 2012504706 A JP2012504706 A JP 2012504706A
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Japan
Prior art keywords
plating
gold
nickel
ltcc
silver
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Pending
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JP2011530258A
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English (en)
Japanese (ja)
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JP2012504706A5 (enExample
Inventor
マニカンタン ナイル クマラン
エー．スクルスキ マイケル
ディー．ボウルトス ジョン
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EIDP Inc
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EI Du Pont de Nemours and Co
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2012504706A publication Critical patent/JP2012504706A/ja
Publication of JP2012504706A5 publication Critical patent/JP2012504706A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Electrochemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Contacts (AREA)
  • Die Bonding (AREA)
  • Glass Compositions (AREA)
JP2011530258A 2008-10-02 2009-10-02 ニッケル−金めっき可能な厚膜銀ペースト、および、低温同時焼成セラミックデバイスのためのめっき方法、および、それから形成されたｌｔｃｃデバイス Pending JP2012504706A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10208308P 2008-10-02 2008-10-02
US61/102,083 2008-10-02
PCT/US2009/059311 WO2010040016A2 (en) 2008-10-02 2009-10-02 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom

Related Child Applications (1)

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JP2014060229A Division JP2014156393A (ja) 2008-10-02 2014-03-24 無電解ニッケルおよび金めっきするための銀ペースト組成物

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Publication Number Publication Date
JP2012504706A true JP2012504706A (ja) 2012-02-23
JP2012504706A5 JP2012504706A5 (enExample) 2012-11-22

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JP2011530258A Pending JP2012504706A (ja) 2008-10-02 2009-10-02 ニッケル−金めっき可能な厚膜銀ペースト、および、低温同時焼成セラミックデバイスのためのめっき方法、および、それから形成されたｌｔｃｃデバイス
JP2014060229A Ceased JP2014156393A (ja) 2008-10-02 2014-03-24 無電解ニッケルおよび金めっきするための銀ペースト組成物

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Country Link
US (3) US8609256B2 (enExample)
EP (1) EP2329057A2 (enExample)
JP (2) JP2012504706A (enExample)
CN (1) CN102149847A (enExample)
TW (1) TW201020340A (enExample)
WO (1) WO2010040016A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014123104A1 (ja) * 2013-02-08 2017-02-02 三菱電機株式会社 無電解めっき方法、及びセラミック基板

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2715788A1 (en) 2011-06-01 2014-04-09 E. I. Du Pont de Nemours and Company Low temperature co-fired ceramic structure for high frequency applications and process for making same
CN102703885B (zh) * 2012-06-04 2014-09-03 汕头超声印制板公司 一种用于pcb板的镀金工艺
EP2750141B1 (en) 2012-12-28 2018-02-07 Heraeus Deutschland GmbH & Co. KG An electro-conductive paste comprising coarse inorganic oxide particles in the preparation of electrodes in MWT solar cells
US20140353005A1 (en) * 2013-06-04 2014-12-04 E I Du Pont De Nemours And Company Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substrates
WO2016108077A1 (en) * 2014-12-31 2016-07-07 Essilor International (Compagnie Generale D'optique) Method of mirror coating an optical article and article thereby obtained
CN109309000A (zh) * 2017-07-26 2019-02-05 天津环鑫科技发展有限公司 一种gpp芯片镀金方法
US20220119315A1 (en) * 2020-02-05 2022-04-21 Ferro Corporation M7 LTCC-Silver System And Related Dielectric Compositions For High Frequency Applications
CN111926314B (zh) * 2020-08-17 2021-10-26 广州三孚新材料科技股份有限公司 一种晶硅异质结太阳能电池用化学镀锡工艺
CN113652733A (zh) * 2021-08-18 2021-11-16 刘智 一种用于集成电路生产可节省电镀材料的电路板镀银设备
CN113470864B (zh) * 2021-09-01 2022-03-11 西安宏星电子浆料科技股份有限公司 一种低尺寸效应的厚膜电阻浆料
CN115338421B (zh) * 2022-09-19 2024-08-23 常州聚和新材料股份有限公司 太阳能电池正面银浆用Ni-P合金添加剂、制法及应用
US20240105670A1 (en) * 2022-09-26 2024-03-28 Cyntec Co., Ltd. Electronic component with high coplanarity and method of manufacturing the same
CN115810438B (zh) * 2022-11-23 2024-11-15 中国电子科技集团公司第四十三研究所 一种用于低温共烧陶瓷的可化镀银浆料及其制备方法
CN118271914B (zh) * 2024-03-29 2024-11-12 江苏飞特尔通信有限公司 一种用于ltcc的电镀填孔剂及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006124812A (ja) * 2004-11-01 2006-05-18 Murata Mfg Co Ltd セラミック基板、及びめっき方法
JP2007524757A (ja) * 2003-07-01 2007-08-30 フリースケール セミコンダクター インコーポレイテッド 活性化プレートを用いる集積回路の無電解及び浸漬メッキ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580740A (en) * 1978-12-08 1980-06-18 Matsushita Electric Works Ltd Glass composition
US4536535A (en) * 1983-06-07 1985-08-20 E. I. Du Pont De Nemours And Company Castable ceramic compositions
JPH07302510A (ja) * 1994-05-10 1995-11-14 Sumitomo Metal Mining Co Ltd 導電ペースト組成物
JP3387507B2 (ja) * 1997-12-18 2003-03-17 株式会社ジャパンエナジー 無電解ニッケルめっき用前処理液および前処理方法
TW524786B (en) * 1998-01-23 2003-03-21 Du Pont Glass composition, castable dielectric composition and tape composition made therewith
US6210805B1 (en) * 1998-01-29 2001-04-03 Asahi Glass Company Ltd. Glass plate provided with a conductive layer, method for its production, conductive paste and window for an automobile
US6362089B1 (en) * 1999-04-19 2002-03-26 Motorola, Inc. Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed
US6548327B2 (en) * 2000-04-24 2003-04-15 Interuniversitair Microelektronica Centrum, Vzw Low cost electroless plating process for single chips and wafer parts and products obtained thereof
JP2003132733A (ja) * 2001-10-29 2003-05-09 Kyocera Corp 導体組成物およびこれを用いた配線基板
KR100850658B1 (ko) * 2001-11-05 2008-08-07 아사히 가라스 가부시키가이샤 글라스 세라믹 조성물
US7147804B2 (en) * 2003-01-24 2006-12-12 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
JP4059133B2 (ja) * 2003-05-06 2008-03-12 日立化成工業株式会社 無電解ニッケル−金めっき方法
JP2004332036A (ja) * 2003-05-06 2004-11-25 Hitachi Chem Co Ltd 無電解めっき方法
JP4357901B2 (ja) * 2003-08-25 2009-11-04 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解めっき用パラジウム触媒液及び触媒化処理方法
WO2005039263A1 (ja) * 2003-10-17 2005-04-28 Hitachi Metals, Ltd. 多層セラミック基板及びその製造方法並びにこれを用いた電子機器
US7435361B2 (en) * 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
US7516152B2 (en) 2005-07-05 2009-04-07 International Business Machines Corporation System and method for generating and selecting data mining models for data mining applications
US20070023388A1 (en) * 2005-07-28 2007-02-01 Nair Kumaran M Conductor composition for use in LTCC photosensitive tape on substrate applications
US7666328B2 (en) * 2005-11-22 2010-02-23 E. I. Du Pont De Nemours And Company Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices
DE102005061799B4 (de) 2005-12-23 2009-04-23 Epcos Ag Verfahren zur Metallisierung von Silberoberflächen und seine Verwendung
KR100744930B1 (ko) * 2006-02-01 2007-08-01 삼성전기주식회사 Ｌｔｃｃ 모듈의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007524757A (ja) * 2003-07-01 2007-08-30 フリースケール セミコンダクター インコーポレイテッド 活性化プレートを用いる集積回路の無電解及び浸漬メッキ
JP2006124812A (ja) * 2004-11-01 2006-05-18 Murata Mfg Co Ltd セラミック基板、及びめっき方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014123104A1 (ja) * 2013-02-08 2017-02-02 三菱電機株式会社 無電解めっき方法、及びセラミック基板
US9949374B2 (en) 2013-02-08 2018-04-17 Mitsubishi Electric Corporation Electroless plating method and ceramic substrate
US10602617B2 (en) 2013-02-08 2020-03-24 Mitsubishi Electric Corporation Electroless plating method and ceramic substrate

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