JP2009135479A5 - - Google Patents

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Publication number
JP2009135479A5
JP2009135479A5 JP2008282666A JP2008282666A JP2009135479A5 JP 2009135479 A5 JP2009135479 A5 JP 2009135479A5 JP 2008282666 A JP2008282666 A JP 2008282666A JP 2008282666 A JP2008282666 A JP 2008282666A JP 2009135479 A5 JP2009135479 A5 JP 2009135479A5
Authority
JP
Japan
Prior art keywords
substrate
mounting structure
electronic component
structure according
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008282666A
Other languages
English (en)
Japanese (ja)
Other versions
JP5202233B2 (ja
JP2009135479A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008282666A priority Critical patent/JP5202233B2/ja
Priority claimed from JP2008282666A external-priority patent/JP5202233B2/ja
Publication of JP2009135479A publication Critical patent/JP2009135479A/ja
Publication of JP2009135479A5 publication Critical patent/JP2009135479A5/ja
Application granted granted Critical
Publication of JP5202233B2 publication Critical patent/JP5202233B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008282666A 2007-11-01 2008-11-04 実装構造体 Expired - Fee Related JP5202233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007284976 2007-11-01
JP2007284976 2007-11-01
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Publications (3)

Publication Number Publication Date
JP2009135479A JP2009135479A (ja) 2009-06-18
JP2009135479A5 true JP2009135479A5 (enExample) 2011-09-15
JP5202233B2 JP5202233B2 (ja) 2013-06-05

Family

ID=40587897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282666A Expired - Fee Related JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Country Status (4)

Country Link
US (1) US8410377B2 (enExample)
JP (1) JP5202233B2 (enExample)
KR (1) KR101011199B1 (enExample)
CN (1) CN101425511B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
WO2011114759A1 (ja) * 2010-03-19 2011-09-22 株式会社安川電機 電子部品の実装方法および電子機器
JP5785760B2 (ja) * 2011-04-11 2015-09-30 日本特殊陶業株式会社 部品実装基板
US10032692B2 (en) * 2013-03-12 2018-07-24 Nvidia Corporation Semiconductor package structure
EP3499554A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung aus zwei bauelementen mit dazwischen befindlichem lot mittels heisspressens unterhalb der schmelztemperatur des lotmaterials einer lotvorform
EP3870389A1 (en) 2018-10-24 2021-09-01 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260592A (ja) * 1989-03-31 1990-10-23 Mitsumi Electric Co Ltd 回路基板
JPH0327441A (ja) 1989-06-23 1991-02-05 Nippon Telegr & Teleph Corp <Ntt> 知識情報処理システムにおけるデータベース利用方式
JP3027441B2 (ja) 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH09214095A (ja) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd 基板および回路モジュールおよび回路モジュールの製造方法
JPH10163605A (ja) 1996-11-27 1998-06-19 Sony Corp 電子回路装置
JPH11177016A (ja) 1997-12-15 1999-07-02 Denso Corp 混成集積回路装置
JP3184491B2 (ja) * 1998-05-20 2001-07-09 松下電子工業株式会社 半導体装置およびその製造方法
JP2001267473A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 半導体装置およびその製造方法
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Industrial Co Ltd Module with embedded electric elements and the manufacturing method thereof
US6680436B2 (en) * 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6608375B2 (en) * 2001-04-06 2003-08-19 Oki Electric Industry Co., Ltd. Semiconductor apparatus with decoupling capacitor
SE520714C2 (sv) * 2001-04-20 2003-08-12 Aamic Ab Mikroreplikerade miniatyriserade elektriska komponenter
US6550665B1 (en) * 2001-06-06 2003-04-22 Indigo Systems Corporation Method for electrically interconnecting large contact arrays using eutectic alloy bumping
US7215022B2 (en) * 2001-06-21 2007-05-08 Ati Technologies Inc. Multi-die module
JP2003297873A (ja) * 2002-03-29 2003-10-17 Hitachi Ltd 半導体装置，構造体及び電子装置
JP2004193404A (ja) * 2002-12-12 2004-07-08 Alps Electric Co Ltd 回路モジュール、及びその製造方法
JP2005011838A (ja) * 2003-06-16 2005-01-13 Toshiba Corp 半導体装置及びその組立方法
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP2005108950A (ja) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd セラミックモジュール部品およびその製造方法
US20070152025A1 (en) * 2004-03-02 2007-07-05 Fuji Electric Holdings Co., Ltd. Electronic part mounting method
JP4383257B2 (ja) * 2004-05-31 2009-12-16 三洋電機株式会社 回路装置およびその製造方法
JP2006100752A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
US7701728B2 (en) * 2004-10-28 2010-04-20 Kyocera Corporation Electronic component module and radio comunications equipment
JP4975342B2 (ja) * 2005-03-15 2012-07-11 パナソニック株式会社 導電性接着剤
CN101232967B (zh) * 2005-08-11 2010-12-08 千住金属工业株式会社 电子部件用无铅焊膏、钎焊方法以及电子部件
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making

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