JP5202233B2 - 実装構造体 - Google Patents

実装構造体 Download PDF

Info

Publication number
JP5202233B2
JP5202233B2 JP2008282666A JP2008282666A JP5202233B2 JP 5202233 B2 JP5202233 B2 JP 5202233B2 JP 2008282666 A JP2008282666 A JP 2008282666A JP 2008282666 A JP2008282666 A JP 2008282666A JP 5202233 B2 JP5202233 B2 JP 5202233B2
Authority
JP
Japan
Prior art keywords
substrate
solder
chip component
sealing resin
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008282666A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135479A5 (enExample
JP2009135479A (ja
Inventor
敦史 山口
秀規 宮川
茂昭 酒谷
行壮 松野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008282666A priority Critical patent/JP5202233B2/ja
Publication of JP2009135479A publication Critical patent/JP2009135479A/ja
Publication of JP2009135479A5 publication Critical patent/JP2009135479A5/ja
Application granted granted Critical
Publication of JP5202233B2 publication Critical patent/JP5202233B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2008282666A 2007-11-01 2008-11-04 実装構造体 Expired - Fee Related JP5202233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007284976 2007-11-01
JP2007284976 2007-11-01
JP2008282666A JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Publications (3)

Publication Number Publication Date
JP2009135479A JP2009135479A (ja) 2009-06-18
JP2009135479A5 JP2009135479A5 (enExample) 2011-09-15
JP5202233B2 true JP5202233B2 (ja) 2013-06-05

Family

ID=40587897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282666A Expired - Fee Related JP5202233B2 (ja) 2007-11-01 2008-11-04 実装構造体

Country Status (4)

Country Link
US (1) US8410377B2 (enExample)
JP (1) JP5202233B2 (enExample)
KR (1) KR101011199B1 (enExample)
CN (1) CN101425511B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
JPWO2011114759A1 (ja) * 2010-03-19 2013-06-27 株式会社安川電機 電子部品の実装方法および電子機器
JP5785760B2 (ja) * 2011-04-11 2015-09-30 日本特殊陶業株式会社 部品実装基板
US10032692B2 (en) * 2013-03-12 2018-07-24 Nvidia Corporation Semiconductor package structure
EP3499554A1 (de) * 2017-12-13 2019-06-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung einer sandwichanordnung aus zwei bauelementen mit dazwischen befindlichem lot mittels heisspressens unterhalb der schmelztemperatur des lotmaterials einer lotvorform
CA3116600C (en) * 2018-10-24 2023-05-09 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260592A (ja) * 1989-03-31 1990-10-23 Mitsumi Electric Co Ltd 回路基板
JPH0327441A (ja) 1989-06-23 1991-02-05 Nippon Telegr & Teleph Corp <Ntt> 知識情報処理システムにおけるデータベース利用方式
JP3027441B2 (ja) 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH09214095A (ja) * 1996-01-30 1997-08-15 Matsushita Electric Ind Co Ltd 基板および回路モジュールおよび回路モジュールの製造方法
JPH10163605A (ja) 1996-11-27 1998-06-19 Sony Corp 電子回路装置
JPH11177016A (ja) 1997-12-15 1999-07-02 Denso Corp 混成集積回路装置
JP3184491B2 (ja) * 1998-05-20 2001-07-09 松下電子工業株式会社 半導体装置およびその製造方法
JP2001267473A (ja) * 2000-03-17 2001-09-28 Hitachi Ltd 半導体装置およびその製造方法
TW569424B (en) * 2000-03-17 2004-01-01 Matsushita Electric Industrial Co Ltd Module with embedded electric elements and the manufacturing method thereof
US6680436B2 (en) * 2000-07-12 2004-01-20 Seagate Technology Llc Reflow encapsulant
US6608375B2 (en) * 2001-04-06 2003-08-19 Oki Electric Industry Co., Ltd. Semiconductor apparatus with decoupling capacitor
SE520714C2 (sv) * 2001-04-20 2003-08-12 Aamic Ab Mikroreplikerade miniatyriserade elektriska komponenter
US6550665B1 (en) * 2001-06-06 2003-04-22 Indigo Systems Corporation Method for electrically interconnecting large contact arrays using eutectic alloy bumping
US7215022B2 (en) * 2001-06-21 2007-05-08 Ati Technologies Inc. Multi-die module
JP2003297873A (ja) * 2002-03-29 2003-10-17 Hitachi Ltd 半導体装置，構造体及び電子装置
JP2004193404A (ja) * 2002-12-12 2004-07-08 Alps Electric Co Ltd 回路モジュール、及びその製造方法
JP2005011838A (ja) * 2003-06-16 2005-01-13 Toshiba Corp 半導体装置及びその組立方法
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP2005108950A (ja) * 2003-09-29 2005-04-21 Matsushita Electric Ind Co Ltd セラミックモジュール部品およびその製造方法
US20070152025A1 (en) * 2004-03-02 2007-07-05 Fuji Electric Holdings Co., Ltd. Electronic part mounting method
JP4383257B2 (ja) * 2004-05-31 2009-12-16 三洋電機株式会社 回路装置およびその製造方法
JP2006100752A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
WO2006046713A1 (ja) * 2004-10-28 2006-05-04 Kyocera Corporation 電子部品モジュール及び無線通信機器
JP4975342B2 (ja) * 2005-03-15 2012-07-11 パナソニック株式会社 導電性接着剤
JP4894758B2 (ja) * 2005-08-11 2012-03-14 千住金属工業株式会社 鉛フリーソルダペーストとその応用
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making

Also Published As

Publication number Publication date
US20090116205A1 (en) 2009-05-07
KR101011199B1 (ko) 2011-01-26
CN101425511B (zh) 2014-10-29
KR20090045016A (ko) 2009-05-07
US8410377B2 (en) 2013-04-02
JP2009135479A (ja) 2009-06-18
CN101425511A (zh) 2009-05-06

Similar Documents

Publication Publication Date Title
TWI230103B (en) Semiconductor module and circuit substrate connecting to semiconductor device
CN104602862B (zh) 无铅焊料球
JP4428448B2 (ja) 鉛フリーはんだ合金
CN103460815B (zh) 安装结构体及其制造方法
JP5422826B2 (ja) 鉛フリーはんだ接続構造体およびはんだボール
JP2009135479A (ja) 実装構造体
CN101030546B (zh) 电容安装方法
CN103958120A (zh) 锡基焊球和包含它的半导体封装
CN100579337C (zh) 封装结构体
US20050036902A1 (en) Lead-free solder alloy
JP4022139B2 (ja) 電子装置及び電子装置の実装方法及び電子装置の製造方法
KR20090086741A (ko) 무연 솔더 및 이를 포함하는 반도체 패키지
JP2009158725A (ja) 半導体装置およびダイボンド材
TWI540015B (zh) Lead free solder ball
CN1953174B (zh) 电子元件内置组件
US7560373B1 (en) Low temperature solder metallurgy and process for packaging applications and structures formed thereby
JP4888096B2 (ja) 半導体装置、回路配線基板及び半導体装置の製造方法
JP2008218483A (ja) 半導体装置及びその製造方法
JP2012019244A (ja) 半導体装置、回路配線基板及び半導体装置の製造方法
HK1204779B (zh) 无铅焊料球

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110803

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110803

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120904

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121018

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121217

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130212

R151 Written notification of patent or utility model registration

Ref document number: 5202233

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160222

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees