JP2012227198A - 積層セラミックコンデンサ - Google Patents
積層セラミックコンデンサ Download PDFInfo
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- JP2012227198A JP2012227198A JP2011090806A JP2011090806A JP2012227198A JP 2012227198 A JP2012227198 A JP 2012227198A JP 2011090806 A JP2011090806 A JP 2011090806A JP 2011090806 A JP2011090806 A JP 2011090806A JP 2012227198 A JP2012227198 A JP 2012227198A
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- ceramic
- ceramic capacitor
- multilayer
- multilayer ceramic
- oxide containing
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 103
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000013078 crystal Substances 0.000 claims abstract description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910008484 TiSi Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 6
- 238000003475 lamination Methods 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000007791 liquid phase Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
- C04B2235/3203—Lithium oxide or oxide-forming salts thereof
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3409—Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/346—Titania or titanates
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- C—CHEMISTRY; METALLURGY
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/60—Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】 積層セラミックコンデンサ1においては、積層体ブロック4とセラミック体6との境界部に、Ba、Siを含む酸化物よりなるシリケート結晶あるいはTiとSiを含む酸化物よりなるシリケート結晶が形成されている。
【選択図】 図3
Description
本実施態様においても、内部電極形成用の導電性ペーストにはニッケルを主成分として含み、平均粒子径100nm未満のBaTiO3が添加されている。
2 セラミック誘電体層
3 内部電極層
4 積層体ブロック
4a、4b 積層セラミックコンデンサの側面
5 カバー層
6 セラミック体
7 外部電極
Claims (4)
- セラミック誘電体層と内部電極とが交互に積み重ねられた積層体ブロックと、前記積層体ブロックの上下に積み重ねられた一対のカバー層と、前記積層体ブロックの両側面に形成されたセラミック体と、前記内部電極と電気的に接続する一対の外部電極とを有する積層セラミックコンデンサにおいて、前記積層体ブロックと前記セラミック体との境界部に、Ba、Siを含む酸化物よりなるシリケート結晶あるいはTiとSiを含む酸化物よりなるシリケート結晶が形成されたことを特徴とする積層セラミックコンデンサ。
- BaとSiを含む酸化物よりなるシリケート結晶あるいはTiとSiを含む酸化物よりなるシリケート結晶が、Ba2TiSi2O7であることを特徴とする請求項1に記載の積層セラミックコンデンサ。
- ニッケルを含む内部電極用の前記導電体ペーストに添加されるBaTiO3の平均粒子径が100nm未満であることを特徴とする請求項1または2に記載の積層セラミックコンデンサ。
- 前記セラミック体を形成する誘電体に含まれるガラス成分の比率が、前記セラミック誘電体層を形成する誘電体に含まれるガラス成分の比率より高いことを特徴とする請求項1ないし3のいずれか1項に記載の積層セラミックコンデンサ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2011090806A JP5313289B2 (ja) | 2011-04-15 | 2011-04-15 | 積層セラミックコンデンサ |
US13/443,167 US8520364B2 (en) | 2011-04-15 | 2012-04-10 | Multi-layer ceramic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011090806A JP5313289B2 (ja) | 2011-04-15 | 2011-04-15 | 積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012227198A true JP2012227198A (ja) | 2012-11-15 |
JP5313289B2 JP5313289B2 (ja) | 2013-10-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011090806A Active JP5313289B2 (ja) | 2011-04-15 | 2011-04-15 | 積層セラミックコンデンサ |
Country Status (2)
Country | Link |
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US (1) | US8520364B2 (ja) |
JP (1) | JP5313289B2 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104835646A (zh) * | 2014-02-10 | 2015-08-12 | 株式会社村田制作所 | 层叠陶瓷电容器、层叠陶瓷电容器阵列和层叠陶瓷电容器的安装结构体 |
JP2017059815A (ja) * | 2015-09-15 | 2017-03-23 | Tdk株式会社 | 積層電子部品 |
JP2017059631A (ja) * | 2015-09-15 | 2017-03-23 | Tdk株式会社 | 積層電子部品 |
KR20170071417A (ko) * | 2015-12-15 | 2017-06-23 | 다이요 유덴 가부시키가이샤 | 적층 세라믹 콘덴서 및 그 제조 방법 |
JP2018098386A (ja) * | 2016-12-14 | 2018-06-21 | Tdk株式会社 | 積層電子部品 |
JP2018098385A (ja) * | 2016-12-14 | 2018-06-21 | Tdk株式会社 | 積層電子部品 |
JP2018148226A (ja) * | 2015-05-29 | 2018-09-20 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP2019021932A (ja) * | 2018-10-04 | 2019-02-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
US11017949B2 (en) | 2015-05-29 | 2021-05-25 | Taiyo Yuden Co., Ltd. | Multi-layer ceramic capacitor and method of producing the same |
JP7428779B2 (ja) | 2019-01-22 | 2024-02-06 | 太陽誘電株式会社 | 積層セラミックコンデンサ及びその製造方法 |
WO2024029188A1 (ja) * | 2022-08-05 | 2024-02-08 | 株式会社村田製作所 | 積層セラミック電子部品 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101320166B1 (ko) * | 2011-04-21 | 2013-10-23 | 삼성전기주식회사 | 세라믹 전자부품용 세라믹 시트 제품, 이를 이용한 적층 세라믹 전자 부품 및 이의 제조방법 |
US9460855B2 (en) | 2013-10-01 | 2016-10-04 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board having the same |
KR20140038912A (ko) * | 2013-10-01 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
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JP6609137B2 (ja) * | 2015-08-11 | 2019-11-20 | 太陽誘電株式会社 | セラミック電子部品、及びその製造方法 |
JP6515758B2 (ja) * | 2015-09-15 | 2019-05-22 | Tdk株式会社 | 積層電子部品 |
US10510487B2 (en) * | 2015-12-25 | 2019-12-17 | Taiyo Yuden Co., Ltd. | Multi-layer ceramic electronic component and method of producing the same |
KR102304250B1 (ko) * | 2018-08-01 | 2021-09-23 | 삼성전기주식회사 | 적층형 커패시터 |
JP2021141131A (ja) * | 2020-03-03 | 2021-09-16 | 太陽誘電株式会社 | セラミック電子部品の製造方法、および金属導電ペースト |
JP7396251B2 (ja) * | 2020-11-11 | 2023-12-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2022136816A (ja) * | 2021-03-08 | 2022-09-21 | Tdk株式会社 | セラミック電子部品 |
Citations (5)
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JP2000277369A (ja) * | 1999-03-29 | 2000-10-06 | Taiyo Yuden Co Ltd | 積層セラミック電子部品とその導電ペースト |
JP2002015939A (ja) * | 2000-06-30 | 2002-01-18 | Kyocera Corp | 積層型電子部品およびその製法 |
JP2002170736A (ja) * | 2000-11-29 | 2002-06-14 | Kyocera Corp | 積層型電子部品およびその製法 |
JP2009032833A (ja) * | 2007-07-26 | 2009-02-12 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサの製造方法及び積層セラミックコンデンサ |
JP2010518651A (ja) * | 2007-02-13 | 2010-05-27 | エプコス アクチエンゲゼルシャフト | 多層素子及び多層素子を製造する方法 |
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JP3275818B2 (ja) * | 1998-02-12 | 2002-04-22 | 株式会社村田製作所 | 積層コンデンサ |
KR101108958B1 (ko) * | 2003-02-25 | 2012-01-31 | 쿄세라 코포레이션 | 적층 세라믹 콘덴서 및 그 제조방법 |
US7206187B2 (en) * | 2004-08-23 | 2007-04-17 | Kyocera Corporation | Ceramic electronic component and its manufacturing method |
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JP2017059631A (ja) * | 2015-09-15 | 2017-03-23 | Tdk株式会社 | 積層電子部品 |
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