JP2011124542A - 積層セラミックキャパシタ - Google Patents
積層セラミックキャパシタ Download PDFInfo
- Publication number
- JP2011124542A JP2011124542A JP2010181104A JP2010181104A JP2011124542A JP 2011124542 A JP2011124542 A JP 2011124542A JP 2010181104 A JP2010181104 A JP 2010181104A JP 2010181104 A JP2010181104 A JP 2010181104A JP 2011124542 A JP2011124542 A JP 2011124542A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer ceramic
- ceramic capacitor
- ceramic
- external electrodes
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- 239000011148 porous material Substances 0.000 claims abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000035515 penetration Effects 0.000 description 6
- 239000002003 electrode paste Substances 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】本発明による積層セラミックキャパシタは、セラミック素体と、上記セラミック素体の内部に形成され、一端が上記セラミック素体の側面に夫々交互に露出される複数の第1及び第2内部電極と、上記セラミック本体の側面に形成され、上記第1及び第2内部電極と電気的に連結され、平均気孔のサイズが2〜5μmである多数の気孔を含有し、気孔率が2〜10%である第1及び第2外部電極とを含む。
【選択図】図2
Description
120a、120b 第1及び第2外部電極
130a、130b 第1及び第2内部電極
Claims (4)
- セラミック素体と、
前記セラミック素体の内部に形成され、一端が前記セラミック素体の側面に夫々交互に露出される複数の第1及び第2内部電極と、
前記セラミック素体の側面に形成され、前記第1及び第2内部電極と夫々電気的に連結され、平均気孔のサイズが2〜5μmである多数の気孔を含有し、気孔率が2〜10%である第1及び第2外部電極と、
を含む積層セラミックキャパシタ。 - 前記第1及び第2外部電極は、平均粒径が0.1〜3μmである導電性金属を含むことを特徴とする請求項1に記載の積層セラミックキャパシタ。
- 前記第1及び第2外部電極は、銅、ニッケル及び銀から成る群から選択される1つ以上の導電性金属を含むことを特徴とする請求項1に記載の積層セラミックキャパシタ。
- 前記第1及び第2外部電極に形成されるニッケルメッキ層と、前記ニッケルメッキ層に形成される錫メッキ層とをさらに含むことを特徴とする請求項1に記載の積層セラミックキャパシタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090122194A KR20110065622A (ko) | 2009-12-10 | 2009-12-10 | 적층 세라믹 커패시터 |
KR10-2009-0122194 | 2009-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011124542A true JP2011124542A (ja) | 2011-06-23 |
JP5156805B2 JP5156805B2 (ja) | 2013-03-06 |
Family
ID=44142654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010181104A Expired - Fee Related JP5156805B2 (ja) | 2009-12-10 | 2010-08-12 | 積層セラミックキャパシタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110141658A1 (ja) |
JP (1) | JP5156805B2 (ja) |
KR (1) | KR20110065622A (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030616A (ja) * | 2011-07-28 | 2013-02-07 | Kyocera Corp | 回路基板およびこれを備える電子装置 |
JPWO2016133090A1 (ja) * | 2015-02-16 | 2017-12-07 | 京セラ株式会社 | チップ型電子部品およびモジュール |
JP2018163934A (ja) * | 2017-03-24 | 2018-10-18 | Tdk株式会社 | 貫通コンデンサ |
JP2020136553A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2021028939A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
JP2021028938A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
WO2024057636A1 (ja) * | 2022-09-12 | 2024-03-21 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP7501564B2 (ja) | 2022-04-14 | 2024-06-18 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP7534987B2 (ja) | 2021-03-08 | 2024-08-15 | Tdk株式会社 | セラミック電子部品 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140039016A (ko) * | 2014-02-27 | 2014-03-31 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR102115955B1 (ko) | 2018-09-03 | 2020-05-27 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61222105A (ja) * | 1985-03-27 | 1986-10-02 | Murata Mfg Co Ltd | チツプ型インダクタ−素子 |
JPH04250607A (ja) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | チップ状電子部品 |
JP2000049034A (ja) * | 1998-07-28 | 2000-02-18 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2000215729A (ja) * | 1998-08-28 | 2000-08-04 | Matsushita Electric Ind Co Ltd | 導電性ペ―スト、およびそれを用いた導電性構造、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
JP2000331866A (ja) * | 1999-03-17 | 2000-11-30 | Hitachi Metals Ltd | 積層型セラミック電子部品 |
JP2001185855A (ja) * | 1999-12-22 | 2001-07-06 | Kyocera Corp | 多層配線基板 |
JP2001244116A (ja) * | 2000-02-29 | 2001-09-07 | Taiyo Yuden Co Ltd | 電子部品及びその製造方法 |
JP2001250740A (ja) * | 2000-03-08 | 2001-09-14 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2002110444A (ja) * | 2000-09-26 | 2002-04-12 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
JP2002198248A (ja) * | 2000-12-25 | 2002-07-12 | Rohm Co Ltd | チップ型電子部品 |
JP2003217969A (ja) * | 2002-01-24 | 2003-07-31 | Nec Tokin Corp | 積層セラミックコンデンサの製造方法 |
JP2005050895A (ja) * | 2003-07-30 | 2005-02-24 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2005216987A (ja) * | 2004-01-28 | 2005-08-11 | Kyocera Chemical Corp | セラミック電子部品用導電性ペーストおよびセラミック電子部品 |
JP2006186316A (ja) * | 2004-11-30 | 2006-07-13 | Kyocera Corp | セラミック電子部品及び積層セラミックコンデンサ |
JP2007234774A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | セラミック電子部品及びその製造方法 |
Family Cites Families (4)
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US4938861A (en) * | 1989-08-01 | 1990-07-03 | Kabushiki Kaisha Riken | Limiting current-type oxygen sensor |
FR2744220B1 (fr) * | 1996-01-31 | 1999-09-10 | Denso Corp | Dispositif de detection de la concentration en oxygene et son procede de fabrication |
JP3397125B2 (ja) * | 1998-03-12 | 2003-04-14 | 株式会社村田製作所 | 電子部品 |
WO2000013190A1 (fr) * | 1998-08-28 | 2000-03-09 | Matsushita Electric Industrial Co., Ltd. | Colle electroconductrice, structure electroconductrice utilisant cette colle, piece electrique, module et carte a circuit, connexion electrique, fabrication de carte a circuit et de piece electronique ceramique |
-
2009
- 2009-12-10 KR KR1020090122194A patent/KR20110065622A/ko not_active Application Discontinuation
-
2010
- 2010-08-06 US US12/852,254 patent/US20110141658A1/en not_active Abandoned
- 2010-08-12 JP JP2010181104A patent/JP5156805B2/ja not_active Expired - Fee Related
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61222105A (ja) * | 1985-03-27 | 1986-10-02 | Murata Mfg Co Ltd | チツプ型インダクタ−素子 |
JPH04250607A (ja) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | チップ状電子部品 |
JP2000049034A (ja) * | 1998-07-28 | 2000-02-18 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2000215729A (ja) * | 1998-08-28 | 2000-08-04 | Matsushita Electric Ind Co Ltd | 導電性ペ―スト、およびそれを用いた導電性構造、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
JP2000331866A (ja) * | 1999-03-17 | 2000-11-30 | Hitachi Metals Ltd | 積層型セラミック電子部品 |
JP2001185855A (ja) * | 1999-12-22 | 2001-07-06 | Kyocera Corp | 多層配線基板 |
JP2001244116A (ja) * | 2000-02-29 | 2001-09-07 | Taiyo Yuden Co Ltd | 電子部品及びその製造方法 |
JP2001250740A (ja) * | 2000-03-08 | 2001-09-14 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2002110444A (ja) * | 2000-09-26 | 2002-04-12 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
JP2002198248A (ja) * | 2000-12-25 | 2002-07-12 | Rohm Co Ltd | チップ型電子部品 |
JP2003217969A (ja) * | 2002-01-24 | 2003-07-31 | Nec Tokin Corp | 積層セラミックコンデンサの製造方法 |
JP2005050895A (ja) * | 2003-07-30 | 2005-02-24 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP2005216987A (ja) * | 2004-01-28 | 2005-08-11 | Kyocera Chemical Corp | セラミック電子部品用導電性ペーストおよびセラミック電子部品 |
JP2006186316A (ja) * | 2004-11-30 | 2006-07-13 | Kyocera Corp | セラミック電子部品及び積層セラミックコンデンサ |
JP2007234774A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | セラミック電子部品及びその製造方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030616A (ja) * | 2011-07-28 | 2013-02-07 | Kyocera Corp | 回路基板およびこれを備える電子装置 |
JPWO2016133090A1 (ja) * | 2015-02-16 | 2017-12-07 | 京セラ株式会社 | チップ型電子部品およびモジュール |
JP2018163934A (ja) * | 2017-03-24 | 2018-10-18 | Tdk株式会社 | 貫通コンデンサ |
JP2020136553A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP7151543B2 (ja) | 2019-02-22 | 2022-10-12 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2021028939A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
JP2021028938A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
JP7358828B2 (ja) | 2019-08-09 | 2023-10-11 | Tdk株式会社 | 電子部品 |
JP7358829B2 (ja) | 2019-08-09 | 2023-10-11 | Tdk株式会社 | 電子部品 |
JP7534987B2 (ja) | 2021-03-08 | 2024-08-15 | Tdk株式会社 | セラミック電子部品 |
JP7501564B2 (ja) | 2022-04-14 | 2024-06-18 | 株式会社村田製作所 | 積層セラミック電子部品 |
WO2024057636A1 (ja) * | 2022-09-12 | 2024-03-21 | 株式会社村田製作所 | 積層セラミック電子部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20110065622A (ko) | 2011-06-16 |
US20110141658A1 (en) | 2011-06-16 |
JP5156805B2 (ja) | 2013-03-06 |
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