JP2012097225A - 硬化性樹脂組成物及び硬化物 - Google Patents

硬化性樹脂組成物及び硬化物 Download PDF

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Publication number
JP2012097225A
JP2012097225A JP2010247655A JP2010247655A JP2012097225A JP 2012097225 A JP2012097225 A JP 2012097225A JP 2010247655 A JP2010247655 A JP 2010247655A JP 2010247655 A JP2010247655 A JP 2010247655A JP 2012097225 A JP2012097225 A JP 2012097225A
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JP
Japan
Prior art keywords
group
ladder
groups
type silsesquioxane
resin composition
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Ceased
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JP2010247655A
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English (en)
Japanese (ja)
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JP2012097225A5 (enExample
Inventor
Keizo Inoue
慶三 井上
Yoshiaki Kamuro
恵明 禿
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Daicel Corp
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Daicel Corp
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Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Priority to JP2010247655A priority Critical patent/JP2012097225A/ja
Priority to EP11837972.6A priority patent/EP2636706A4/en
Priority to MYPI2013000600A priority patent/MY161328A/en
Priority to KR1020137005180A priority patent/KR20140006769A/ko
Priority to US13/813,895 priority patent/US8871890B2/en
Priority to CN201180036220.4A priority patent/CN103003367B/zh
Priority to PCT/JP2011/075063 priority patent/WO2012060322A1/ja
Priority to TW100140055A priority patent/TWI513767B/zh
Publication of JP2012097225A publication Critical patent/JP2012097225A/ja
Publication of JP2012097225A5 publication Critical patent/JP2012097225A5/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2010247655A 2010-11-04 2010-11-04 硬化性樹脂組成物及び硬化物 Ceased JP2012097225A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2010247655A JP2012097225A (ja) 2010-11-04 2010-11-04 硬化性樹脂組成物及び硬化物
EP11837972.6A EP2636706A4 (en) 2010-11-04 2011-10-31 HARDENABLE RESIN COMPOSITION AND HARDENED ARTICLE
MYPI2013000600A MY161328A (en) 2010-11-04 2011-10-31 Curable resin composition and cured article
KR1020137005180A KR20140006769A (ko) 2010-11-04 2011-10-31 경화성 수지 조성물 및 경화물
US13/813,895 US8871890B2 (en) 2010-11-04 2011-10-31 Curable resin composition and cured article
CN201180036220.4A CN103003367B (zh) 2010-11-04 2011-10-31 固化性树脂组合物及固化物
PCT/JP2011/075063 WO2012060322A1 (ja) 2010-11-04 2011-10-31 硬化性樹脂組成物及び硬化物
TW100140055A TWI513767B (zh) 2010-11-04 2011-11-03 硬化性樹脂組成物及硬化物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010247655A JP2012097225A (ja) 2010-11-04 2010-11-04 硬化性樹脂組成物及び硬化物

Publications (2)

Publication Number Publication Date
JP2012097225A true JP2012097225A (ja) 2012-05-24
JP2012097225A5 JP2012097225A5 (enExample) 2014-01-23

Family

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Family Applications (1)

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JP2010247655A Ceased JP2012097225A (ja) 2010-11-04 2010-11-04 硬化性樹脂組成物及び硬化物

Country Status (8)

Country Link
US (1) US8871890B2 (enExample)
EP (1) EP2636706A4 (enExample)
JP (1) JP2012097225A (enExample)
KR (1) KR20140006769A (enExample)
CN (1) CN103003367B (enExample)
MY (1) MY161328A (enExample)
TW (1) TWI513767B (enExample)
WO (1) WO2012060322A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013176238A1 (ja) * 2012-05-25 2013-11-28 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
JP2014129477A (ja) * 2012-12-28 2014-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2022107558A1 (ja) * 2020-11-20 2022-05-27 Jnc株式会社 オルガノポリシロキサンとその製造方法、ならびに、オルガノポリシロキサンを分散剤として含む分散液

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
JP6021605B2 (ja) * 2012-11-19 2016-11-09 新日鉄住金化学株式会社 かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物
CN105008460B (zh) * 2013-02-14 2016-12-14 株式会社大赛璐 固化性树脂组合物、固化物、密封材料及半导体装置
JP5895958B2 (ja) * 2014-02-20 2016-03-30 横浜ゴム株式会社 偏波保持光ファイバー用接着剤組成物
EP3194502A4 (en) * 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
CN104893310A (zh) * 2015-06-29 2015-09-09 山东东岳有机硅材料有限公司 含聚倍半硅氧烷的led封装用液体硅橡胶及其制备方法
CN106609030B (zh) * 2015-10-21 2018-12-25 广东生益科技股份有限公司 一种聚苯醚树脂组合物及其在高频电路基板中的应用
EP3423271A4 (en) * 2016-04-05 2019-01-23 Adaptive Surface Technologies, Inc. HARDENABLE POLYSILOXANE COMPOSITIONS AND ARTICULATING AGENTS, AND COATINGS AND ARTICLES PRODUCED THEREFROM
CN110746783A (zh) * 2019-10-25 2020-02-04 湖南国芯半导体科技有限公司 一种耐高温加成型有机硅凝胶及其制备方法
CN113448157B (zh) 2020-03-24 2023-09-05 台达电子工业股份有限公司 波长转换装置
KR102587608B1 (ko) * 2022-08-02 2023-10-12 주식회사 크레파머티리얼즈 내스크레치성이 우수한 고경도 코팅조성물

Citations (12)

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Publication number Priority date Publication date Assignee Title
JPH07294701A (ja) * 1994-04-21 1995-11-10 Dow Corning Kk 光学素子用樹脂組成物
JP2002265787A (ja) * 2001-03-06 2002-09-18 Shin Etsu Chem Co Ltd 付加硬化型シリコーン樹脂組成物
JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP2002356617A (ja) * 2001-05-30 2002-12-13 Asahi Denka Kogyo Kk 硬化性組成物
JP2004043815A (ja) * 2002-07-09 2004-02-12 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物およびその硬化物
JP2004143361A (ja) * 2002-10-28 2004-05-20 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005162859A (ja) * 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP2005325174A (ja) * 2004-05-12 2005-11-24 Asahi Denka Kogyo Kk ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2007008996A (ja) * 2005-06-28 2007-01-18 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2011202057A (ja) * 2010-03-26 2011-10-13 Gunma Univ ポリシルセスキオキサン化合物、光素子封止材及びその用途

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CN1105678A (zh) * 1994-01-21 1995-07-26 中国科学院化学研究所 显示非线性光学效应和液晶性的梯形聚硅氧烷及功能膜
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US7595113B2 (en) 2002-11-29 2009-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
JP4826160B2 (ja) 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
TWI411648B (zh) * 2006-03-27 2013-10-11 Nippon Steel & Sumikin Chem Co A hardening resin and a hardened resin composition and a molded body thereof
CN101883797B (zh) * 2007-11-30 2012-10-17 昭和电工株式会社 转印材料用固化性组合物和使用该组合物的微细图案形成方法
JP5707607B2 (ja) * 2009-04-24 2015-04-30 Jnc株式会社 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物

Patent Citations (12)

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Publication number Priority date Publication date Assignee Title
JPH07294701A (ja) * 1994-04-21 1995-11-10 Dow Corning Kk 光学素子用樹脂組成物
JP2002265787A (ja) * 2001-03-06 2002-09-18 Shin Etsu Chem Co Ltd 付加硬化型シリコーン樹脂組成物
JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP2002356617A (ja) * 2001-05-30 2002-12-13 Asahi Denka Kogyo Kk 硬化性組成物
JP2004043815A (ja) * 2002-07-09 2004-02-12 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物およびその硬化物
JP2004143361A (ja) * 2002-10-28 2004-05-20 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005162859A (ja) * 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP2005325174A (ja) * 2004-05-12 2005-11-24 Asahi Denka Kogyo Kk ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2007008996A (ja) * 2005-06-28 2007-01-18 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2011202057A (ja) * 2010-03-26 2011-10-13 Gunma Univ ポリシルセスキオキサン化合物、光素子封止材及びその用途

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013176238A1 (ja) * 2012-05-25 2013-11-28 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
JP5667326B2 (ja) * 2012-05-25 2015-02-12 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
TWI485185B (zh) * 2012-05-25 2015-05-21 大賽璐股份有限公司 硬化性樹脂組成物及其硬化物、封裝劑、以及光半導體裝置
EP2857457A4 (en) * 2012-05-25 2015-06-17 Daicel Corp HARDENABLE RESIN COMPOSITION AND CURED PRODUCT, SEALANT AND OPTICAL SEMICONDUCTOR COMPONENT THEREWITH
US9447277B2 (en) 2012-05-25 2016-09-20 Daicel Corporation Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device
JP2014129477A (ja) * 2012-12-28 2014-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2022107558A1 (ja) * 2020-11-20 2022-05-27 Jnc株式会社 オルガノポリシロキサンとその製造方法、ならびに、オルガノポリシロキサンを分散剤として含む分散液
JPWO2022107558A1 (enExample) * 2020-11-20 2022-05-27
JP7704152B2 (ja) 2020-11-20 2025-07-08 Jnc株式会社 オルガノポリシロキサンとその製造方法、ならびに、オルガノポリシロキサンを分散剤として含む分散液

Also Published As

Publication number Publication date
TWI513767B (zh) 2015-12-21
EP2636706A1 (en) 2013-09-11
MY161328A (en) 2017-04-14
US20130131265A1 (en) 2013-05-23
CN103003367B (zh) 2015-09-30
WO2012060322A1 (ja) 2012-05-10
TW201224061A (en) 2012-06-16
EP2636706A4 (en) 2016-01-20
US8871890B2 (en) 2014-10-28
KR20140006769A (ko) 2014-01-16
CN103003367A (zh) 2013-03-27

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