MY161328A - Curable resin composition and cured article - Google Patents
Curable resin composition and cured articleInfo
- Publication number
- MY161328A MY161328A MYPI2013000600A MYPI2013000600A MY161328A MY 161328 A MY161328 A MY 161328A MY PI2013000600 A MYPI2013000600 A MY PI2013000600A MY PI2013000600 A MYPI2013000600 A MY PI2013000600A MY 161328 A MY161328 A MY 161328A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- curable resin
- cured article
- resistance
- ladder
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010247655A JP2012097225A (ja) | 2010-11-04 | 2010-11-04 | 硬化性樹脂組成物及び硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY161328A true MY161328A (en) | 2017-04-14 |
Family
ID=46024436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2013000600A MY161328A (en) | 2010-11-04 | 2011-10-31 | Curable resin composition and cured article |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8871890B2 (enExample) |
| EP (1) | EP2636706A4 (enExample) |
| JP (1) | JP2012097225A (enExample) |
| KR (1) | KR20140006769A (enExample) |
| CN (1) | CN103003367B (enExample) |
| MY (1) | MY161328A (enExample) |
| TW (1) | TWI513767B (enExample) |
| WO (1) | WO2012060322A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5937798B2 (ja) * | 2011-09-07 | 2016-06-22 | 株式会社ダイセル | ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物 |
| CN104321385B (zh) * | 2012-05-25 | 2016-08-24 | 株式会社大赛璐 | 固化性树脂组合物及其固化物、密封剂以及光半导体装置 |
| JP6021605B2 (ja) * | 2012-11-19 | 2016-11-09 | 新日鉄住金化学株式会社 | かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物 |
| JP6059010B2 (ja) * | 2012-12-28 | 2017-01-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| CN105008460B (zh) * | 2013-02-14 | 2016-12-14 | 株式会社大赛璐 | 固化性树脂组合物、固化物、密封材料及半导体装置 |
| JP5895958B2 (ja) * | 2014-02-20 | 2016-03-30 | 横浜ゴム株式会社 | 偏波保持光ファイバー用接着剤組成物 |
| EP3194502A4 (en) * | 2015-04-13 | 2018-05-16 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| CN104893310A (zh) * | 2015-06-29 | 2015-09-09 | 山东东岳有机硅材料有限公司 | 含聚倍半硅氧烷的led封装用液体硅橡胶及其制备方法 |
| CN106609030B (zh) * | 2015-10-21 | 2018-12-25 | 广东生益科技股份有限公司 | 一种聚苯醚树脂组合物及其在高频电路基板中的应用 |
| EP3423271A4 (en) * | 2016-04-05 | 2019-01-23 | Adaptive Surface Technologies, Inc. | HARDENABLE POLYSILOXANE COMPOSITIONS AND ARTICULATING AGENTS, AND COATINGS AND ARTICLES PRODUCED THEREFROM |
| CN110746783A (zh) * | 2019-10-25 | 2020-02-04 | 湖南国芯半导体科技有限公司 | 一种耐高温加成型有机硅凝胶及其制备方法 |
| CN113448157B (zh) | 2020-03-24 | 2023-09-05 | 台达电子工业股份有限公司 | 波长转换装置 |
| EP4249536B1 (en) * | 2020-11-20 | 2025-09-03 | JNC Corporation | Organopolysiloxane and production method therefor, and dispersion containing organopolysiloxane as dispersant |
| KR102587608B1 (ko) * | 2022-08-02 | 2023-10-12 | 주식회사 크레파머티리얼즈 | 내스크레치성이 우수한 고경도 코팅조성물 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1105678A (zh) * | 1994-01-21 | 1995-07-26 | 中国科学院化学研究所 | 显示非线性光学效应和液晶性的梯形聚硅氧烷及功能膜 |
| JP3615784B2 (ja) | 1994-04-21 | 2005-02-02 | ダウ コーニング アジア株式会社 | 光学素子用樹脂組成物及び光学素子 |
| JP4009067B2 (ja) | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| JP2002348473A (ja) * | 2001-05-23 | 2002-12-04 | Asahi Denka Kogyo Kk | 硬化性組成物 |
| JP5225528B2 (ja) * | 2001-05-30 | 2013-07-03 | 株式会社Ａｄｅｋａ | ケイ素含有重合体の製造方法 |
| US6689859B2 (en) * | 2002-03-05 | 2004-02-10 | Dow Corning Corporation | High fracture toughness hydrosilyation cured silicone resin |
| JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| US7595113B2 (en) | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
| JP2004186168A (ja) | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| JP4908736B2 (ja) | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2005162859A (ja) * | 2003-12-02 | 2005-06-23 | Dow Corning Toray Silicone Co Ltd | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
| JP5132027B2 (ja) * | 2004-05-12 | 2013-01-30 | 株式会社Ａｄｅｋａ | ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物 |
| JP2006206721A (ja) | 2005-01-27 | 2006-08-10 | Kansai Electric Power Co Inc:The | 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置 |
| JP5392805B2 (ja) | 2005-06-28 | 2014-01-22 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
| JP4826160B2 (ja) | 2005-07-28 | 2011-11-30 | ナガセケムテックス株式会社 | 光素子封止用樹脂組成物 |
| TWI411648B (zh) * | 2006-03-27 | 2013-10-11 | Nippon Steel & Sumikin Chem Co | A hardening resin and a hardened resin composition and a molded body thereof |
| CN101883797B (zh) * | 2007-11-30 | 2012-10-17 | 昭和电工株式会社 | 转印材料用固化性组合物和使用该组合物的微细图案形成方法 |
| JP5707607B2 (ja) * | 2009-04-24 | 2015-04-30 | Jnc株式会社 | 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物 |
| JP5770975B2 (ja) * | 2010-03-26 | 2015-08-26 | 国立大学法人群馬大学 | ポリシルセスキオキサン化合物、光素子封止材及びその用途 |
-
2010
- 2010-11-04 JP JP2010247655A patent/JP2012097225A/ja not_active Ceased
-
2011
- 2011-10-31 US US13/813,895 patent/US8871890B2/en not_active Expired - Fee Related
- 2011-10-31 KR KR1020137005180A patent/KR20140006769A/ko not_active Withdrawn
- 2011-10-31 EP EP11837972.6A patent/EP2636706A4/en not_active Withdrawn
- 2011-10-31 CN CN201180036220.4A patent/CN103003367B/zh not_active Expired - Fee Related
- 2011-10-31 MY MYPI2013000600A patent/MY161328A/en unknown
- 2011-10-31 WO PCT/JP2011/075063 patent/WO2012060322A1/ja not_active Ceased
- 2011-11-03 TW TW100140055A patent/TWI513767B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI513767B (zh) | 2015-12-21 |
| EP2636706A1 (en) | 2013-09-11 |
| JP2012097225A (ja) | 2012-05-24 |
| US20130131265A1 (en) | 2013-05-23 |
| CN103003367B (zh) | 2015-09-30 |
| WO2012060322A1 (ja) | 2012-05-10 |
| TW201224061A (en) | 2012-06-16 |
| EP2636706A4 (en) | 2016-01-20 |
| US8871890B2 (en) | 2014-10-28 |
| KR20140006769A (ko) | 2014-01-16 |
| CN103003367A (zh) | 2013-03-27 |
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