JP2011527381A5 - - Google Patents

Download PDF

Info

Publication number
JP2011527381A5
JP2011527381A5 JP2011517017A JP2011517017A JP2011527381A5 JP 2011527381 A5 JP2011527381 A5 JP 2011527381A5 JP 2011517017 A JP2011517017 A JP 2011517017A JP 2011517017 A JP2011517017 A JP 2011517017A JP 2011527381 A5 JP2011527381 A5 JP 2011527381A5
Authority
JP
Japan
Prior art keywords
acid
electrolyte solution
electrolyte
phosphonic acid
electrolytic solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011517017A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011527381A (ja
Filing date
Publication date
Priority claimed from DE102008032398A external-priority patent/DE102008032398A1/de
Application filed filed Critical
Publication of JP2011527381A publication Critical patent/JP2011527381A/ja
Publication of JP2011527381A5 publication Critical patent/JP2011527381A5/ja
Withdrawn legal-status Critical Current

Links

JP2011517017A 2008-07-10 2009-07-06 改良された銅−錫電解液及び青銅層の析出方法 Withdrawn JP2011527381A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398.5 2008-07-10
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers

Publications (2)

Publication Number Publication Date
JP2011527381A JP2011527381A (ja) 2011-10-27
JP2011527381A5 true JP2011527381A5 (https=) 2012-08-23

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011517017A Withdrawn JP2011527381A (ja) 2008-07-10 2009-07-06 改良された銅−錫電解液及び青銅層の析出方法

Country Status (10)

Country Link
US (1) US20110174631A1 (https=)
EP (1) EP2310558B1 (https=)
JP (1) JP2011527381A (https=)
KR (1) KR20110031183A (https=)
CN (1) CN102089466B (https=)
AT (1) ATE549434T1 (https=)
DE (1) DE102008032398A1 (https=)
PL (1) PL2310558T3 (https=)
TW (1) TW201014935A (https=)
WO (1) WO2010003621A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010044551A1 (de) * 2010-09-07 2012-03-08 Coventya Gmbh Anode sowie deren Verwendung in einem alkalischen Galvanikbad
DE102011121799B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
MY199306A (en) * 2016-12-28 2023-10-24 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US4289286A (en) * 1978-10-16 1981-09-15 East/West Industries, Inc. Replaceable harness bracket assembly
US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4389286A (en) * 1980-07-17 1983-06-21 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
CN1004010B (zh) * 1986-07-11 1989-04-26 南京大学 无氰仿金电镀液
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
TW577938B (en) 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP2004510053A (ja) * 2000-09-20 2004-04-02 デーエル.−イーエヌゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー 錫−銅合金層を析出させるための電解質及び方法
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
DE10243139A1 (de) * 2002-09-17 2004-03-25 Omg Galvanotechnik Gmbh Dunkle Schichten
ES2531163T3 (es) 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
DE502007002479D1 (de) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Similar Documents

Publication Publication Date Title
JP2011527381A5 (https=)
JP2011527381A (ja) 改良された銅−錫電解液及び青銅層の析出方法
US8211285B2 (en) Copper-tin electrolyte and method for depositing bronze layers
TWI491766B (zh) 青銅的腐蝕防護
TWI425121B (zh) 由三價鉻電鍍浴電鍍鉻之方法
JP2003528218A5 (https=)
JP2018530677A (ja) マグネシウム又はマグネシウム合金用腐食防止剤組成物
EP3186413A1 (en) Composition, use thereof and method for electrodepositing gold containing layers
CN109023461A (zh) 组成调制的锌-铁多层涂层
RU2017133852A (ru) Состав раствора суперконцентрированной присадки
JP2018537854A (ja) 銅エッチング用組成物及び過酸化水素系金属エッチング用組成物
CN101675185B (zh) 电解质和沉积黑钌的装饰技术层的方法
CN103946420B (zh) 无电镀镍镀浴组合物
TW201319318A (zh) 鋁或鋁合金的表面處理方法及經該方法製得的製品
EP2606164A1 (en) Electrolyte and process for the deposition of copper-tin alloy layers
JP5652585B2 (ja) 3価クロムめっき浴
JPH06104914B2 (ja) 地色ないし光沢のある銅・スズ合金被膜を電着させるためのアルカリ性シアン化物浴
WO2013092314A1 (en) Deposition of copper-tin-zink alloys from an electrolyte
TWI421383B (zh) 含有二價鐵離子之水溶液
JP2003253456A (ja) メッキ方法
WO2009093499A1 (ja) 3価クロムめっき浴
JP2006117980A5 (https=)
WO2013092312A1 (en) Deposition of copper-tin-zinc alloys from an electrolyte
EP1930478A1 (en) Electrolyte composition and method for the deposition of quaternary copper alloys
JP4273085B2 (ja) 白金−コバルト合金めっき液及びめっき方法