CN102089466B - 改良的铜-锡电解液和沉积青铜层的方法 - Google Patents

改良的铜-锡电解液和沉积青铜层的方法 Download PDF

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Publication number
CN102089466B
CN102089466B CN2009801264856A CN200980126485A CN102089466B CN 102089466 B CN102089466 B CN 102089466B CN 2009801264856 A CN2009801264856 A CN 2009801264856A CN 200980126485 A CN200980126485 A CN 200980126485A CN 102089466 B CN102089466 B CN 102089466B
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CN
China
Prior art keywords
electrolytic solution
acid
phosphonic acids
salt
carbonate
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Expired - Fee Related
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CN2009801264856A
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English (en)
Chinese (zh)
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CN102089466A (zh
Inventor
K·布朗德
B·威伊米勒
F·奥伯斯特
S·博格
U·曼茨
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Umicore Galvanotechnik GmbH
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Umicore Galvanotechnik GmbH
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
CN2009801264856A 2008-07-10 2009-07-06 改良的铜-锡电解液和沉积青铜层的方法 Expired - Fee Related CN102089466B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032398.5 2008-07-10
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/004879 WO2010003621A1 (en) 2008-07-10 2009-07-06 Improved copper-tin electrolyte and process for the deposition of bronze layers

Publications (2)

Publication Number Publication Date
CN102089466A CN102089466A (zh) 2011-06-08
CN102089466B true CN102089466B (zh) 2012-11-07

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801264856A Expired - Fee Related CN102089466B (zh) 2008-07-10 2009-07-06 改良的铜-锡电解液和沉积青铜层的方法

Country Status (10)

Country Link
US (1) US20110174631A1 (https=)
EP (1) EP2310558B1 (https=)
JP (1) JP2011527381A (https=)
KR (1) KR20110031183A (https=)
CN (1) CN102089466B (https=)
AT (1) ATE549434T1 (https=)
DE (1) DE102008032398A1 (https=)
PL (1) PL2310558T3 (https=)
TW (1) TW201014935A (https=)
WO (1) WO2010003621A1 (https=)

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DE102010044551A1 (de) * 2010-09-07 2012-03-08 Coventya Gmbh Anode sowie deren Verwendung in einem alkalischen Galvanikbad
DE102011121799B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
MY199306A (en) * 2016-12-28 2023-10-24 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Citations (1)

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JP2004510053A (ja) * 2000-09-20 2004-04-02 デーエル．−イーエヌゲー．マックス　シュレッター　ゲーエムベーハー　ウント　ツェーオー．カーゲー 錫−銅合金層を析出させるための電解質及び方法
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Also Published As

Publication number Publication date
ATE549434T1 (de) 2012-03-15
EP2310558B1 (en) 2012-03-14
DE102008032398A1 (de) 2010-01-14
TW201014935A (en) 2010-04-16
EP2310558A1 (en) 2011-04-20
WO2010003621A1 (en) 2010-01-14
CN102089466A (zh) 2011-06-08
PL2310558T3 (pl) 2012-09-28
KR20110031183A (ko) 2011-03-24
JP2011527381A (ja) 2011-10-27
US20110174631A1 (en) 2011-07-21

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