JP2008536011A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008536011A5 JP2008536011A5 JP2008505749A JP2008505749A JP2008536011A5 JP 2008536011 A5 JP2008536011 A5 JP 2008536011A5 JP 2008505749 A JP2008505749 A JP 2008505749A JP 2008505749 A JP2008505749 A JP 2008505749A JP 2008536011 A5 JP2008536011 A5 JP 2008536011A5
- Authority
- JP
- Japan
- Prior art keywords
- electrolyte
- thiadiazole
- tin
- bismuth
- electrolytic solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003792 electrolyte Substances 0.000 claims description 43
- -1 alkyl sulfonic acids Chemical class 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000008151 electrolyte solution Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 13
- 230000008021 deposition Effects 0.000 claims description 13
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 10
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 9
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 8
- 239000002736 nonionic surfactant Substances 0.000 claims description 8
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 150000003460 sulfonic acids Chemical class 0.000 claims description 5
- YEDUAINPPJYDJZ-UHFFFAOYSA-N 2-hydroxybenzothiazole Chemical compound C1=CC=C2SC(O)=NC2=C1 YEDUAINPPJYDJZ-UHFFFAOYSA-N 0.000 claims description 4
- DXYYSGDWQCSKKO-UHFFFAOYSA-N 2-methylbenzothiazole Chemical compound C1=CC=C2SC(C)=NC2=C1 DXYYSGDWQCSKKO-UHFFFAOYSA-N 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims description 4
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical class [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- UHGULLIUJBCTEF-UHFFFAOYSA-N 2-aminobenzothiazole Chemical compound C1=CC=C2SC(N)=NC2=C1 UHGULLIUJBCTEF-UHFFFAOYSA-N 0.000 claims description 3
- 150000004867 thiadiazoles Chemical class 0.000 claims description 3
- QUKGLNCXGVWCJX-UHFFFAOYSA-N 1,3,4-thiadiazol-2-amine Chemical compound NC1=NN=CS1 QUKGLNCXGVWCJX-UHFFFAOYSA-N 0.000 claims description 2
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 claims description 2
- FAYAYUOZWYJNBD-UHFFFAOYSA-N 1,3-benzothiazol-6-amine Chemical compound NC1=CC=C2N=CSC2=C1 FAYAYUOZWYJNBD-UHFFFAOYSA-N 0.000 claims description 2
- ORIIXCOYEOIFSN-UHFFFAOYSA-N 1,3-benzothiazol-6-ol Chemical compound OC1=CC=C2N=CSC2=C1 ORIIXCOYEOIFSN-UHFFFAOYSA-N 0.000 claims description 2
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 claims description 2
- HMPUHXCGUHDVBI-UHFFFAOYSA-N 5-methyl-1,3,4-thiadiazol-2-amine Chemical compound CC1=NN=C(N)S1 HMPUHXCGUHDVBI-UHFFFAOYSA-N 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 150000003557 thiazoles Chemical class 0.000 claims description 2
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 description 27
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 26
- 238000000151 deposition Methods 0.000 description 20
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical class CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 4
- 229940098779 methanesulfonic acid Drugs 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical compound OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- LJYOXSMOJRTHIL-UHFFFAOYSA-N propane-1,2-disulfonic acid Chemical compound OS(=O)(=O)C(C)CS(O)(=O)=O LJYOXSMOJRTHIL-UHFFFAOYSA-N 0.000 description 3
- MGNVWUDMMXZUDI-UHFFFAOYSA-N propane-1,3-disulfonic acid Chemical compound OS(=O)(=O)CCCS(O)(=O)=O MGNVWUDMMXZUDI-UHFFFAOYSA-N 0.000 description 3
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical compound CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- AFAXGSQYZLGZPG-UHFFFAOYSA-L ethane-1,2-disulfonate Chemical compound [O-]S(=O)(=O)CCS([O-])(=O)=O AFAXGSQYZLGZPG-UHFFFAOYSA-L 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- OPUAWDUYWRUIIL-UHFFFAOYSA-L methanedisulfonate Chemical compound [O-]S(=O)(=O)CS([O-])(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-L 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- MSBGPEACXKBQSX-UHFFFAOYSA-N (4-fluorophenyl) carbonochloridate Chemical compound FC1=CC=C(OC(Cl)=O)C=C1 MSBGPEACXKBQSX-UHFFFAOYSA-N 0.000 description 1
- KZHGPDSVHSDCMX-UHFFFAOYSA-N 6-methoxy-1,3-benzothiazol-2-amine Chemical compound COC1=CC=C2N=C(N)SC2=C1 KZHGPDSVHSDCMX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- JALQQBGHJJURDQ-UHFFFAOYSA-L bis(methylsulfonyloxy)tin Chemical compound [Sn+2].CS([O-])(=O)=O.CS([O-])(=O)=O JALQQBGHJJURDQ-UHFFFAOYSA-L 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- MGLUJXPJRXTKJM-UHFFFAOYSA-L bismuth subcarbonate Chemical compound O=[Bi]OC(=O)O[Bi]=O MGLUJXPJRXTKJM-UHFFFAOYSA-L 0.000 description 1
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 1
- MNMKEULGSNUTIA-UHFFFAOYSA-K bismuth;methanesulfonate Chemical compound [Bi+3].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O MNMKEULGSNUTIA-UHFFFAOYSA-K 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- AFAXGSQYZLGZPG-UHFFFAOYSA-N ethanedisulfonic acid Chemical compound OS(=O)(=O)CCS(O)(=O)=O AFAXGSQYZLGZPG-UHFFFAOYSA-N 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical compound OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-M propane-2-sulfonate Chemical compound CC(C)S([O-])(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-M 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200510016819 DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
| DE102005016819.1 | 2005-04-12 | ||
| PCT/EP2006/002183 WO2006108476A2 (de) | 2005-04-12 | 2006-03-09 | Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008536011A JP2008536011A (ja) | 2008-09-04 |
| JP2008536011A5 true JP2008536011A5 (https=) | 2012-03-15 |
| JP5278675B2 JP5278675B2 (ja) | 2013-09-04 |
Family
ID=36527525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008505749A Expired - Lifetime JP5278675B2 (ja) | 2005-04-12 | 2006-03-09 | スズ−ビスマス合金層沈着（析出）のための電解液及び方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5278675B2 (https=) |
| KR (1) | KR20070120592A (https=) |
| DE (1) | DE102005016819B4 (https=) |
| TW (1) | TWI328052B (https=) |
| WO (1) | WO2006108476A2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120006688A1 (en) * | 2009-03-18 | 2012-01-12 | Basf Se | Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids |
| CN102656735A (zh) * | 2009-12-15 | 2012-09-05 | 巴斯夫欧洲公司 | 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物 |
| KR102846661B1 (ko) | 2020-03-26 | 2025-08-18 | 주식회사 엘지에너지솔루션 | 이차전지용 전해액 첨가제, 이를 포함하는 리튬 이차전지용 비수 전해액 및 리튬 이차전지 |
| CN112701351B (zh) * | 2020-12-29 | 2022-08-19 | 中国科学院宁波材料技术与工程研究所 | 一种非水性电解液及其制备方法以及一种锂离子电池 |
| CN113293409B (zh) * | 2021-05-28 | 2022-06-24 | 中南大学 | 一种电解制备致密平整铋金属的方法 |
| CN115029745A (zh) * | 2022-07-08 | 2022-09-09 | 云南锡业集团（控股）有限责任公司研发中心 | 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法 |
| CN119601802B (zh) * | 2025-02-08 | 2025-05-30 | 浙江师范大学 | 一种锰正极电解液及其应用 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0781196B2 (ja) * | 1986-07-04 | 1995-08-30 | 株式会社大和化成研究所 | 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴 |
| US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| ATE105877T1 (de) * | 1988-10-14 | 1994-06-15 | Atochem North America | Elektroniederschlag von zinn-wismut-legierungen. |
| JP3274232B2 (ja) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | 錫−ビスマス合金めっき浴及びそれを使用するめっき方法 |
| JPH1025595A (ja) * | 1996-07-12 | 1998-01-27 | Ishihara Chem Co Ltd | スズ及びスズ合金めっき浴 |
| JP3292055B2 (ja) * | 1996-09-03 | 2002-06-17 | 上村工業株式会社 | 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法 |
| JP2000100850A (ja) * | 1998-09-24 | 2000-04-07 | Ebara Udylite Kk | 低融点金属バンプの形成方法 |
| JP4077119B2 (ja) * | 1999-06-30 | 2008-04-16 | エヌ・イーケムキャット株式会社 | 錫−ビスマス合金電気めっき浴およびめっき方法 |
| JP2001040497A (ja) * | 1999-07-27 | 2001-02-13 | Ne Chemcat Corp | 錫−ビスマス合金めっき皮膜で被覆された電子部品 |
| US6706418B2 (en) * | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
| US6726827B2 (en) * | 2002-01-17 | 2004-04-27 | Lucent Technologies Inc. | Electroplating solution for high speed plating of tin-bismuth solder |
| JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
| JP4441725B2 (ja) * | 2003-11-04 | 2010-03-31 | 石原薬品株式会社 | 電気スズ合金メッキ方法 |
| JP4524483B2 (ja) * | 2004-04-28 | 2010-08-18 | 石原薬品株式会社 | スズ又はスズ合金メッキ方法 |
| JP4389083B2 (ja) * | 2004-08-10 | 2009-12-24 | 石原薬品株式会社 | 鉛フリーのスズ−ビスマス系合金電気メッキ浴 |
| JP4605359B2 (ja) * | 2004-10-20 | 2011-01-05 | 石原薬品株式会社 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
| JP4273266B2 (ja) * | 2005-03-23 | 2009-06-03 | 石原薬品株式会社 | 溶解電流抑制式のスズ合金電気メッキ方法 |
-
2005
- 2005-04-12 DE DE200510016819 patent/DE102005016819B4/de not_active Expired - Lifetime
-
2006
- 2006-03-09 JP JP2008505749A patent/JP5278675B2/ja not_active Expired - Lifetime
- 2006-03-09 KR KR1020077026116A patent/KR20070120592A/ko not_active Withdrawn
- 2006-03-09 WO PCT/EP2006/002183 patent/WO2006108476A2/de not_active Ceased
- 2006-04-12 TW TW095113052A patent/TWI328052B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5642928B2 (ja) | 青銅の電気めっき | |
| KR101992844B1 (ko) | 고온 내성의 은 코팅된 기판 | |
| CN102089466B (zh) | 改良的铜-锡电解液和沉积青铜层的方法 | |
| JP4446040B2 (ja) | 錫−銀合金層を電着させるための電解液および方法 | |
| US4469569A (en) | Cyanide-free copper plating process | |
| KR102174876B1 (ko) | 주석 합금 도금액 | |
| JP2001181889A (ja) | 光沢錫−銅合金電気めっき浴 | |
| TW200303938A (en) | Electroplating solution containing organic acid complexing agent | |
| KR101624759B1 (ko) | 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 | |
| KR102639867B1 (ko) | 주석 도금조 및 기판 표면에 주석 또는 주석 합금을 침착시키는 방법 | |
| JP2011520037A (ja) | 改良された銅−錫電解液及び青銅層の析出方法 | |
| JP2004510053A (ja) | 錫−銅合金層を析出させるための電解質及び方法 | |
| JP5278675B2 (ja) | スズ−ビスマス合金層沈着（析出）のための電解液及び方法 | |
| JP6294421B2 (ja) | ビスマス電気めっき浴及び基材上にビスマスを電気めっきする方法 | |
| JP5407022B2 (ja) | 電気銅メッキ浴、当該浴により電着皮膜を形成した電子部品 | |
| JP2008536011A5 (https=) | ||
| JP4605359B2 (ja) | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 | |
| US7122108B2 (en) | Tin-silver electrolyte | |
| JP4632027B2 (ja) | 鉛フリーのスズ−銀系合金又はスズ−銅系合金電気メッキ浴 | |
| JP3872201B2 (ja) | 錫−銀系合金酸性電気めっき浴 | |
| US20070037005A1 (en) | Tin-silver electrolyte | |
| JP2002339095A (ja) | スズ−ビスマス−銅合金の析出方法 | |
| TW201343979A (zh) | 用於改進滾筒鍍電解質中層厚度分佈之添加物 | |
| KR20200138406A (ko) | 주석 합금 도금액 | |
| CN106498457A (zh) | 一种新型无氰镀铜工艺 |